TWI536011B - Electronic parts inspection device - Google Patents

Electronic parts inspection device Download PDF

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Publication number
TWI536011B
TWI536011B TW104113898A TW104113898A TWI536011B TW I536011 B TWI536011 B TW I536011B TW 104113898 A TW104113898 A TW 104113898A TW 104113898 A TW104113898 A TW 104113898A TW I536011 B TWI536011 B TW I536011B
Authority
TW
Taiwan
Prior art keywords
electronic component
inspection
observation
unit
electronic
Prior art date
Application number
TW104113898A
Other languages
English (en)
Chinese (zh)
Other versions
TW201602559A (zh
Inventor
Ryouta Tateishi
Kaito Tsuboyama
Original Assignee
Ueno Seiki Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ueno Seiki Co Ltd filed Critical Ueno Seiki Co Ltd
Publication of TW201602559A publication Critical patent/TW201602559A/zh
Application granted granted Critical
Publication of TWI536011B publication Critical patent/TWI536011B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
TW104113898A 2014-06-20 2015-04-30 Electronic parts inspection device TWI536011B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2014/066472 WO2015194048A1 (ja) 2014-06-20 2014-06-20 電子部品検査装置

Publications (2)

Publication Number Publication Date
TW201602559A TW201602559A (zh) 2016-01-16
TWI536011B true TWI536011B (zh) 2016-06-01

Family

ID=54595838

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104113898A TWI536011B (zh) 2014-06-20 2015-04-30 Electronic parts inspection device

Country Status (3)

Country Link
JP (1) JP5812555B1 (ja)
TW (1) TWI536011B (ja)
WO (1) WO2015194048A1 (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017166941A (ja) * 2016-03-16 2017-09-21 日立金属株式会社 ねじ検査装置及びそれを用いたねじの検査方法
JP7377092B2 (ja) * 2019-12-16 2023-11-09 Ｔｏｗａ株式会社 統計データ生成方法、切断装置及びシステム
WO2022213207A1 (en) * 2021-04-07 2022-10-13 Addem Labs Inc. System and method for assembly and/or modification of printed circuit boards (pcbs)
CN113124920A (zh) * 2021-04-22 2021-07-16 立讯电子科技（昆山）有限公司 产品测试方法及产品测试平台
JP7444134B2 (ja) * 2021-05-20 2024-03-06 株式会社村田製作所 電子部品包装体の製造システム

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4025490B2 (ja) * 2000-07-14 2007-12-19 株式会社ルネサステクノロジ 半導体装置の製造方法
JP2005010068A (ja) * 2003-06-20 2005-01-13 Toray Eng Co Ltd 被検査品の外観検査装置及び外観検査方法
JP2005044949A (ja) * 2003-07-25 2005-02-17 Hitachi High-Technologies Corp 半導体チップの選別装置、半導体チップの選別方法、及び半導体チップの製造方法
JP4970852B2 (ja) * 2006-06-06 2012-07-11 株式会社メガトレード 目視検査装置
JP2008076248A (ja) * 2006-09-21 2008-04-03 Micronics Japan Co Ltd 検査システム
JP4970901B2 (ja) * 2006-10-30 2012-07-11 株式会社メガトレード 目視検査装置、および、当該目視検査装置のレビュー機を動作させるためのコンピュータープログラム

Also Published As

Publication number Publication date
JPWO2015194048A1 (ja) 2017-04-20
TW201602559A (zh) 2016-01-16
WO2015194048A1 (ja) 2015-12-23
JP5812555B1 (ja) 2015-11-17

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MM4A Annulment or lapse of patent due to non-payment of fees