TWI534594B - 散熱模組 - Google Patents
散熱模組 Download PDFInfo
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- TWI534594B TWI534594B TW101143857A TW101143857A TWI534594B TW I534594 B TWI534594 B TW I534594B TW 101143857 A TW101143857 A TW 101143857A TW 101143857 A TW101143857 A TW 101143857A TW I534594 B TWI534594 B TW I534594B
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
- F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
- F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2215/00—Fins
- F28F2215/10—Secondary fins, e.g. projections or recesses on main fins
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2275/00—Fastening; Joining
- F28F2275/12—Fastening; Joining by methods involving deformation of the elements
- F28F2275/122—Fastening; Joining by methods involving deformation of the elements by crimping, caulking or clinching
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Microelectronics & Electronic Packaging (AREA)
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- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
本發明涉及散熱模組,特別係指一種應用於電子產品散熱的散熱模組。
隨著電子資訊產業的快速發展,中央處理器等發熱電子元件高速、高頻及集成化使其發熱量劇增,如不及時排除這些熱量,將引起發熱電子元件自身溫度的升高,進而導致發熱電子元件的損壞或其性能的降低。因此,業者通常在發熱電子元件上加裝一散熱模組。
通常,該散熱模組包括與該發熱電子元件貼合的吸熱板、散熱鰭片組、連接該吸熱板與散熱鰭片組之間以將吸熱板的熱量傳遞至散熱鰭片組的熱管,及與該散熱鰭片組連接的離心風扇。業界通常採用過回焊爐的錫焊制程將散熱鰭片組結合至離心風扇的出風口處,其錫焊速度需要根據回焊爐內的溫度及散熱模組自身的尺寸大小來控制調整,制程較為複雜,而且散熱模組長時間使用後錫料容易脫落造成散熱鰭片組與離心風扇接觸不夠緊密,結構不夠穩固,進而影響散熱模組的散熱效率。
有鑒於此,有必要提供一種能使散熱鰭片組與離心風扇連接穩固的散熱模組。
一種散熱模組,包括一離心風扇及位於離心風扇的出風口處的一散熱鰭片組,所述離心風扇包括一扇框,所述散熱鰭片組包括複數鰭片,所述扇框位於出風口的邊緣對應鰭片開設複數定位孔,所述鰭片上對應所述定位孔一體延伸形成折片,所述折片穿過對應定位孔並扣合在扇框上。
與習知技術相比,上述散熱模組的扇框位於出風口的邊緣對應每一鰭片開設定位孔,每一鰭片對應每一定位孔一體形成一折片,所述折片穿過定位孔並扣合至扇框上,利用離心風扇與鰭片自身的結構完成離心風扇與散熱鰭片組的連接固定,無需利用錫料採用錫焊制程進行黏合,結構更加穩固,同時折片與定位孔均可預先模具成型,可大幅度提升散熱模組的組裝製造速度。
100‧‧‧散熱模組
10‧‧‧吸熱板
20‧‧‧熱管
30‧‧‧散熱鰭片組
40‧‧‧離心風扇
21‧‧‧蒸發段
22‧‧‧冷凝段
23‧‧‧連接段
31‧‧‧鰭片
32‧‧‧定位板
311‧‧‧本體
312‧‧‧折片
313‧‧‧折邊
314‧‧‧凹陷
41‧‧‧扇框
42‧‧‧葉輪
411‧‧‧底座
412‧‧‧上蓋
413‧‧‧底板
414‧‧‧側壁
415‧‧‧弧形部
416‧‧‧平直側板
417‧‧‧凸耳
418‧‧‧舌部
419‧‧‧凸片
43‧‧‧出風口
44‧‧‧入風口
45‧‧‧定位孔
46‧‧‧收容空間
421‧‧‧輪轂
422‧‧‧扇葉
圖1係本發明一實施方式的散熱模組組裝前的立體分解圖。
圖2係圖1所示散熱模組預組裝狀態的立體示意圖。
圖3係圖1中所示散熱模組組裝後的立體示意圖。
請參閱圖1至圖3,為本發明一實施例的散熱模組100,其包括與發熱電子元件(圖未示)貼合的吸熱板10,與吸熱板10連接的熱管20,與該熱管20連接的散熱鰭片組30,及與該散熱鰭片組30連接的離心風扇40。所述熱管20一端連接該吸熱板10,另一端連接該散熱鰭片組30以將吸熱板10的熱量傳遞至散熱鰭片組30,並藉由離心風扇40散發至周圍空氣中。
具體的,該吸熱板10為一矩形板體,其下表面與發熱電子元件貼
合,並藉由相關固定件(圖未示)連接固定。
該熱管20為扁平熱管,大致呈“C”形,包括位於其一端的一蒸發段21,位於其另一端的冷凝段22,及連接該蒸發段21與冷凝段22的連接段23。該蒸發段21為一平直段,其貼合於該吸熱板10的上表面以吸收吸熱板10的熱量。該冷凝段22亦為一平直段,其與該散熱鰭片組30的下底面貼合。該連接段23為一彎曲段,該連接段23將蒸發段21的熱量傳至冷凝段22。
所述散熱鰭片組30包括複數鰭片31,及形成於鰭片31上的一定位板32。這些鰭片31沿同一方向相互平行抵靠排布。
每一鰭片31包括一本體311、由本體311延伸而出的折片312,及自本體311上下邊緣朝同一方向垂直本體311延伸而出的折邊313。
所述本體311為一縱長平板,其靠近該離心風扇40的一端下邊緣形成一凹陷314,以收容所述熱管20的冷凝段22,即該本體311呈“L”狀。該凹陷314的寬度與該熱管20冷凝段22的寬度相等。可以理解本體311也可不必具有該凹陷314,而熱管20的冷凝段22與本體311的上邊緣或者下邊緣接觸。
每一折片312與對應的本體311一體成型。本實施例中,該折片312呈長條狀,其底端與本體311下邊緣齊平,且其頂端向上延伸超出該本體311的上邊緣。事實上,折片312也可看成係由本體311的上邊緣延伸而出的片體,該折片312由本體311的上邊緣且靠近離心風扇40的一端部延伸而出。該折片312也並非必須在本體311的該靠近離心風扇40的一端部延伸而出,例如可以係在本
體311的該一端部以內的某個上邊緣部分延伸而出。
所述折邊313依次抵接且寬度相等,其中對應該凹陷314中的折邊313與該熱管20的頂面相貼合。
所述定位板32沿該複數鰭片31的排布方向上設置,該定位板32呈長條狀並與部分鰭片31的折邊313貼合。
所述離心風扇40包括一扇框41及收容於該扇框41內的一葉輪42。
所述扇框41包括一底座411及位於底座411上的一上蓋412,所述底座411與該上蓋412圍設成一收容空間46。
該底座411包括一底板413及自該底板413邊緣向上一體延伸的側壁414。該底板413呈平板狀,其中部用以支撐連接所述葉輪42。所述底板413、散熱鰭片組30本體311的下邊緣及熱管20的下表面相齊平。
該側壁414為一半封閉的結構,其包括一弧形部415、自弧形部415的末端延伸的平直側板416及複數設有通孔的凸耳417,該弧形部415與該平直側板416相對處向內凹陷形成一舌部418。該複數凸耳417相互間隔均勻分佈在側壁414上,本實施例中,該凸耳417的數量為4個。該平直側板416及弧形部415靠近該舌部418的一端形成一出風口43。所述側壁414的高度與該散熱鰭片組30的本體311高度相同,且側壁414頂端與該本體311的上邊緣齊平。
所述上蓋412呈平板狀且與該底板413相對設置。該上蓋412的中央設有一圓形的入風口44。該上蓋412對應側壁414的複數凸耳417形成複數設有通孔的凸片419,以利用螺絲(圖未示)穿設該凸片419及凸耳417連接固定該上蓋412及該底座411。所述上蓋
412位於該出風口43側的邊緣向外延伸超出底板413,並抵擋於所述定位板32。該上蓋412位於該出風口43側的邊緣對應所述折片312開設複數定位孔45,所述複數定位孔45相互間隔且與該折片312尺寸相同、數量相等,該折片312穿設該定位孔45超出該上蓋412。
可以理解的,所述複數定位孔45也可形成在底座411的底板413上,對應的,所述底板413位於該出風口43側的邊緣向外延伸超出上蓋412,此時散熱鰭片組30的折片312朝該底板413方向延伸,穿過定位孔45並扣合在底板413上。
所述葉輪42收容於該收容空間46中。該葉輪42包括輪轂421及環設於輪轂421周圍的複數扇葉422。該離心風扇40工作時,外部冷空氣由入風口44進入扇框41內,在葉輪42的高速旋轉的作用下形成氣流從該出風口43向外吹出,以將散熱鰭片組30的熱量擴散至周圍空氣中。
請同時參閱圖2和圖3,組裝時,先將離心風扇40的上蓋412利用螺絲穿設凸耳417及凸片419固定至底座411上。將散熱鰭片組30的折片312穿過對應上蓋412的定位孔45中,所述上蓋412抵擋於所述定位板32。利用模具將該折片312超出該上蓋412的部分水平扣壓至上蓋412上,以連接固定所述散熱鰭片組30與該離心風扇40。再將所述吸熱板10貼合固定至發熱電子元件(圖未示);將熱管20的蒸發段21藉由導熱膏連接固定至吸熱板10上,同時該將冷凝段22收容固定於該散熱鰭片組的凹陷314中,即完成該散熱模組100的組裝。
工作時,發熱電子元件產生熱量,熱量經由吸熱板10及熱管20傳
導至散熱鰭片組30,外部冷空氣由入風口44進入扇框41內,在葉輪42的高速旋轉的作用下形成氣流從該出風口43向外吹出,並將散熱鰭片組30的熱量擴散至周圍空氣中。
本發明中所述散熱鰭片組30位於出風口43側的一端朝該上蓋412方向延伸一體形成複數折片312,該上蓋412位於該出風口43側的邊緣對應所述折片312開設複數定位孔45,所述折片312穿過該定位孔45並利用模具水平扣合至上蓋412上,從而利用散熱鰭片組30與離心風扇40自身的結構連接固定在一起,取代傳統利用錫焊黏合的制程,結構更加穩固,同時也避免了錫焊制程帶來的環境污染。此外,折片312與定位孔45均可預先模具成型,可大幅度提升散熱模組的組裝製造速度。
綜上所述,本發明符合發明專利要件,爰依法提出專利申請。惟,以上所述者僅為本發明之較佳實施例,舉凡熟悉本案技藝之人士,在爰依本發明精神所作之等效修飾或變化,皆應涵蓋於以下之申請專利範圍內。
100‧‧‧散熱模組
10‧‧‧吸熱板
20‧‧‧熱管
30‧‧‧散熱鰭片組
40‧‧‧離心風扇
21‧‧‧蒸發段
22‧‧‧冷凝段
23‧‧‧連接段
31‧‧‧鰭片
32‧‧‧定位板
311‧‧‧本體
312‧‧‧折片
313‧‧‧折邊
314‧‧‧凹陷
411‧‧‧底座
412‧‧‧上蓋
417‧‧‧凸耳
419‧‧‧凸片
44‧‧‧入風口
46‧‧‧收容空間
Claims (7)
- 一種散熱模組,包括一離心風扇及位於離心風扇的出風口處的一散熱鰭片組,所述離心風扇包括一扇框,所述散熱鰭片組包括複數鰭片,其改良在於:所述扇框位於出風口的邊緣對應鰭片開設複數定位孔,所述鰭片上對應所述定位孔一體延伸形成折片,所述折片穿過對應定位孔並扣合在扇框上,所述扇框包括相對設置的底板和上蓋,所述定位孔形成在上蓋位於出風口的邊緣或者底板位於出風口的邊緣,所述鰭片沿同一方向相互平行抵靠排布,所述鰭片包括一本體,所述折片自本體靠近出風口的一端一體延伸而出,且折片穿過定位孔後被彎折扣壓,所述散熱鰭片組還包括一定位板,所述定位板沿鰭片的排布方向設置在鰭片上,所述上蓋位於所述出風口側的邊緣定位抵擋於該定位板。
- 如申請專利範圍第1項所述之散熱模組,其中,所述定位孔與所述折片數量相等且尺寸相同,所述折片穿設該定位孔並超出所述上蓋或底板,所述折片超出所述上蓋或底板的部分被彎折扣合在上蓋或底板上。
- 如申請專利範圍第1項所述之散熱模組,其中,所述本體為一縱長平板,其靠近該出風口的一端下邊緣形成一凹陷,使得該本體呈“L”狀。
- 如申請專利範圍第1項所述之散熱模組,其中,所述離心風扇包括自底板朝上蓋一體延伸形成的側壁,所述上蓋位於該出風口側的邊緣向外延伸超出底板。
- 如申請專利範圍第4項所述之散熱模組,其中,所述側壁的高度與該散熱鰭片組的本體高度相同,且側壁頂端與該本體的上邊緣齊平,所述側壁頂端外緣設置複數帶通孔的凸耳,所述上蓋對應所述複數凸耳設置複數帶通孔的凸片,所述凸耳與凸片藉由螺絲穿設連接組裝所述離心風扇。
- 如申請專利範圍第4項所述之散熱模組,其中,所述離心風扇還包括包一葉輪,所述底板、側壁及上蓋圍設成一收容空間,所述葉輪承載於底板上並收容於該收容空間內。
- 如申請專利範圍第4項所述之散熱模組,其中,所述散熱模組還包括一扁平熱管和一吸熱板,所述熱管包括一蒸發段和一冷凝段,所述蒸發段貼設於該吸熱板的上表面,所述冷凝段收容固定於該凹陷中,所述底板、熱管的下底面及散熱鰭片組本體的下端面相齊平。
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TW101143857A TWI534594B (zh) | 2012-11-23 | 2012-11-23 | 散熱模組 |
US13/855,642 US20140144610A1 (en) | 2012-11-23 | 2013-04-02 | Heat dissipation module with bent fin tabs attaching fan to fin assembly |
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TW101143857A TWI534594B (zh) | 2012-11-23 | 2012-11-23 | 散熱模組 |
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JP4635101B1 (ja) * | 2009-12-25 | 2011-02-23 | 株式会社東芝 | 冷却装置、および電子機器 |
US20130118717A1 (en) * | 2011-11-16 | 2013-05-16 | Cooler Master Co., Ltd. | Heat-dissipating device and method for fabricating the same |
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