US20140144610A1 - Heat dissipation module with bent fin tabs attaching fan to fin assembly - Google Patents

Heat dissipation module with bent fin tabs attaching fan to fin assembly Download PDF

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Publication number
US20140144610A1
US20140144610A1 US13/855,642 US201313855642A US2014144610A1 US 20140144610 A1 US20140144610 A1 US 20140144610A1 US 201313855642 A US201313855642 A US 201313855642A US 2014144610 A1 US2014144610 A1 US 2014144610A1
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Prior art keywords
heat dissipation
dissipation module
main body
fin
tab
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US13/855,642
Inventor
Yu-Ching Lin
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Foxconn Technology Co Ltd
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Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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Assigned to FOXCONN TECHNOLOGY CO., LTD. reassignment FOXCONN TECHNOLOGY CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: LIN, YU-CHING
Publication of US20140144610A1 publication Critical patent/US20140144610A1/en
Abandoned legal-status Critical Current

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2215/00—Fins
    • F28F2215/10—Secondary fins, e.g. projections or recesses on main fins
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2275/00—Fastening; Joining
    • F28F2275/12—Fastening; Joining by methods involving deformation of the elements
    • F28F2275/122—Fastening; Joining by methods involving deformation of the elements by crimping, caulking or clinching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

An exemplary heat dissipation module includes a centrifugal fan and a fin assembly located at an air outlet of the centrifugal fan. The centrifugal fan includes a frame. The fin assembly includes fins, each fin is a single monolithic body including a tab. Slits are defined in an end of the frame located at the air outlet. Each tab extends through a corresponding slit and is snapped on the frame thereby attaching the frame on the fin assembly.

Description

    BACKGROUND
  • 1. Technical Field
  • The disclosure relates to heat dissipation modules such as those used for dissipating heat generated from electronic components in electronic devices.
  • 2. Description of the Related Art
  • With the continuing development of electronics technology, many electronic components are nowadays made in a small size but with a high operating frequency capability. For example, electronic packages such as CPUs (central processing units) employed in electronic devices may run at very high speeds and generate much heat. A heat dissipation module is commonly installed in such kinds of electronic devices, in contact with the electronic component for quickly removing the generated heat.
  • The heat dissipation module typically includes a heat absorber soldered to the electronic component, a plurality of fins, a heat pipe connecting the heat absorber and the fins, and a centrifugal fan. In manufacturing, the fins are usually fixed at an air outlet of the centrifugal fan by a reflow soldering process. When soldering the heat absorber to the electronic component, a soldering speed should be controlled and adjusted according to a temperature in a reflow oven and a size of the heat dissipation module. As such, the manufacturing process is complicated, and pollutants are produced as by-products of the process. Furthermore, the solder between the fins and the centrifugal fan is prone to crack and lift when the heat dissipation module has been in service for a long time. When this happens, the fins do not firmly contact the centrifugal fan, and the heat dissipation efficiency of the heat dissipation module is reduced.
  • Therefore, it is desirable to provide a heat dissipation module which can solve the above-described problems.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • Many aspects of the disclosure can be better understood with reference to the drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present heat dissipation module. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the views.
  • FIG. 1 is an exploded view of a heat dissipation module in accordance with an embodiment of the disclosure.
  • FIG. 2 is a preassembled view of the heat dissipation module of FIG. 1.
  • FIG. 3 is a fully assembled view of the heat dissipation module of FIG. 1.
    •  DETAILED DESCRIPTION
  • Referring to FIG. 1 to FIG. 3, a heat dissipation module 100 in accordance with an exemplary embodiment is provided. The heat dissipation module 100 includes a heat absorber 10 to absorb heat generated from an electronic component (not shown), a centrifugal fan 40, a fin assembly 30 mounted on the centrifugal fan 40, and a heat pipe 20 interconnecting the heat absorber 10 and the fin assembly 30. Heat absorbed by the heat absorber 10 is transferred to the fin assembly 30 via the heat pipe 20. Airflow generated by the centrifugal fan 40 flows through the fin assembly 30 to enhance a heat dissipation efficiency of the fin assembly 30.
  • Specifically, the heat absorber 10 is rectangular and flat. A bottom surface of the heat absorber 10 is used to thermally contact the electronic component.
  • The heat pipe 20 is flat and has a generally “C” shaped configuration. The heat pipe 20 includes an evaporation section 21 at one end thereof, a condenser section 22 at an opposite end thereof, and a connecting section 23 interconnecting the evaporation section 21 and the condenser section 22. The evaporation section 21 is straight and attached to a top surface of the heat absorber 10. The condenser section 22 is straight and attached to the fin assembly 30. The connecting section 23 is curved.
  • The fin assembly 30 includes a plurality of fins 31, and a rib 32 disposed on some of the fins 31.
  • Each fin 31 includes a main body 311, a tab 312 extending upwardly from a top end of the main body 311, and two flanges 313. The flanges 313 extend perpendicularly from the top end and a bottom end of the main body 311, respectively, in a same direction.
  • Each main body 311 is an “L” shaped sheet. A cutout 314 is formed at a bottom corner of each main body 311. The main bodies 311 are aligned with each other, and are parallel to and spaced from each other. The cutouts 314 of the fins 31 cooperatively define a channel to receive the condenser section 22 therein. A width of each cutout 314 is equal to the width of the condenser section 22. Alternatively, the cutouts 314 can be omitted. In such case, the condenser section 22 of the heat pipe 20 can contact either the top flanges 313 or the bottom flanges 313 of the plurality of fins 31.
  • Each tab 312 is integrally formed with the corresponding main body 311. That is, the fin 31 is a single monolithic body having the tab 312 extending from the main body 311. In this embodiment, the tab 312 is rectangular. A bottom end of the tab 312 is level with the flange 313 at the top end of the main body 311. A top end of the tab 312 is above the flange 313 at the top end of the main body 311. The tabs 312 are provided for engaging with the centrifugal fan 40 (see below). In alternative embodiments, each tab 312 can instead be formed at a lateral side of the main body 31 or at the bottom end of the main body 31. In such cases, the tabs 312 engage with suitable configurations provided on the centrifugal fan 40.
  • The flanges 313 of each fin 31 abut a neighboring fin 31, and the flanges 313 of the fins 31 are aligned with each other. The bottom flanges 313 of the fins 31 at the cutouts 314 contact the condenser section 22.
  • The rib 32 is arranged on some of the top flanges 313, and is located at a central area of the top end of the fin assembly 30 to resist a part of the centrifugal fan 40. In this embodiment, the rib 32 is an elongated plate. A thickness of the rib 32 is slightly less than or equal to a height of each tab 312.
  • The centrifugal fan 40 includes a frame 41, and an impeller 42 received in the frame 41. The frame 41 includes a base 411, and a top plate 412 covering the base 411. The base 411 and the top plate 412 are engaged together to cooperatively form a receiving space 46.
  • The base 411 includes a bottom plate 413, and a sidewall 414 integrally extending upward from a periphery of the bottom plate 413. A center of the bottom plate 413 is used for supporting the impeller 42. The bottom plate 413, the bottom flanges 313 of the fins 31 and a bottom surface of the heat pipe 20 are aligned with each other, and are substantially coplanar with each other.
  • The sidewall 414 includes an arc-shaped section 415, a flat sideboard 416 extending from an end of the arc-shaped section 415, a tongue 418 extending from an opposite end of the arc-shaped section 415, and a plurality of bulges 417 each with a through hole. The tongue 418 is opposite to the flat sideboard 416. The bulges 417 are arranged on the sidewall 414 at even intervals from each other. In this embodiment, there are four bulges 417. An air outlet 43 is formed at an end of the base 411 between the tongue 418 and the flat sideboard 416. A height of the sidewall 414 is substantially equal to that of the main body 311 of each fin 31. A top end of the sidewall 414 is aligned with and substantially coplanar with top ends of the top flanges 313 of the main body 311.
  • The top plate 412 is flat and disposed opposite to the bottom plate 413. A circular air inlet 44 is defined a center portion of the top plate 412. A plurality of ears 419 each with a through hole is formed on the top plate 412, the ears 419 corresponding to the bulges 417. An end of the top plate 412 located at the air outlet 43 extends out beyond the bottom plate 413 and resists the rib 32. A plurality of slits 45 is defined in the end of the top plate 412, corresponding to the tabs 312. The slits 45 are arranged evenly and spaced from each other. A size of each slit 45 is substantially equal to that of each tab 312, and the number of slits 45 is equal to the number of tabs 312. The tabs 312 penetrate through the slits 45 and are bent to firmly engage with the top plate 412 (see also below). A bottom surface of the top plate 412 is substantially coplanar with a bottom surface of the rib 32.
  • The impeller 42 is received in the receiving space 46. The impeller 42 includes a hub 421, and a plurality of blades extending from a periphery of the hub 421.
  • When the heat dissipation module 100 is assembled, the top plate 412 of the centrifugal fan 40 is attached to the base 411 by connecting the bulges 417 and the ears 419. In detail, screws are extended through and engaged in the through holes of the ears 419 and the bulges 417. The tabs 312 of the fins 31 penetrate through the slits 45 correspondingly to be exposed above the top plate 412, and the end of the top plate 412 resists the rib 32. The exposed portions of the tabs 312 on the top plate 412 are deformed with a press (not shown), so that the exposed portions of the tabs 312 snap on the end of the top plate 412 horizontally and thereby firmly connect the fins 31 and the centrifugal fan 40 together. Thus the tabs 312 are bent and engaged on the end of the top plate 412. Then the heat absorber 40 is attached to the electronic component (not shown). Finally, the evaporation section 21 of the heat pipe 20 is attached to the top surface of the heat absorber 40 with thermal grease, and the condenser section 22 is received in the cutouts 314 of the plurality of fins 31.
  • When the heat dissipation module 100 works, heat generated by the electronic component is conducted to the fins 31 via the heat absorber 10 and the heat pipe 20. Relatively cool air enters the frame 41 via the air inlet 44, an airflow is formed in the frame 41 with the impeller 42 rotating at high speed, and the airflow blows out of the frame 41 via the air outlet 43 to dissipate heat of the fins 31 into the ambient air efficiently.
  • In summary, in the above-described embodiment, a plurality of tabs 312 is formed on the plurality of fins 31 adjacent to the air outlet 43, with the fins 31 extending toward a location of the end of the top plate 412. A plurality of slits 45 is defined in the end of the top plate 412 corresponding to the tabs 312. In assembly, the tabs 312 penetrate through the slits 45 and are then deformed to snap on the end of the top plate 412 horizontally. The fins 31 and the centrifugal fan 40 are engaged together with the above-described interengaging structures thereof, instead of by a traditional soldering process. The heat dissipation module 100 is stable and durable, without creating pollutants during manufacture. Additionally, the tabs 312 in the slits 45 can be bent to their final positions with a press, and thereby a speed of assembly of the heat dissipation module 100 is increased.
  • It is to be understood that the above-described embodiments are intended to illustrate rather than limit the disclosure. Variations may be made to the embodiments without departing from the spirit of the disclosure. The above-described embodiments illustrate the scope of the disclosure but do not restrict the scope of the disclosure.

Claims (20)

What is claimed is:
1. A heat dissipation module comprising:
a centrifugal fan comprising a frame; and
a fin assembly located at an air outlet of the centrifugal fan, the fin assembly comprising a plurality of fins, each fin being a single monolithic body comprising a tab;
wherein a plurality of slits is defined in an end of the frame located at the air outlet, and each tab extends through a corresponding slit and is snapped on the frame thereby attaching the frame on the fin assembly.
2. The heat dissipation module of claim 1, wherein the frame comprises a bottom plate and a top plate opposite to the bottom plate, the slits being defined in an end of the top plate located at the air outlet.
3. The heat dissipation module of claim 1, wherein the number of slits is equal to the number of tabs, and a size of each slit is substantially equal to that of each tab, each tab penetrating through a corresponding slit, with a distal end of the tab deformed and snapped horizontally on the top plate of the frame.
4. The heat dissipation module of claim 2, wherein each fin comprises a main body, the main bodies of the fins being aligned with each other, and being parallel to and spaced from each other, the tab of each fin extending upwardly from a top end of the main body near to the air outlet.
5. The heat dissipation module of claim 4, wherein each main body is an “L” shaped sheet, a cutout being formed at a bottom corner of the main body.
6. The heat dissipation module of claim 4, wherein the frame further comprises a sidewall integrally extending from a periphery of the bottom plate toward the top plate, the end of the top plate located at the air outlet extending out beyond the bottom plate.
7. The heat dissipation module of claim 6, wherein fin assembly further comprises a rib, the rib being located at a central area of a top end of the fin assembly and resisting a part of the centrifugal fan.
8. The heat dissipation module of claim 6, wherein a height of the sidewall is substantially equal to that of the main body of each fin, a top end of the sidewall being aligned with and substantially coplanar with the top end of the main body, a plurality of bulges each with a through hole is provided at a periphery of the top end of the sidewall, a plurality of ears each with a through hole is provided on the top plate corresponding to the bulges, and a plurality of screws is engaged in the through holes of the ears and the bulges thereby connecting the top plate and the sidewall together.
9. The heat dissipation module of claim 6, wherein the centrifugal fan further comprises an impeller, the bottom plate, the sidewall and the top plate being engaged together and cooperatively defining a receiving space therebetween, the impeller being supported on the bottom plate and received in the receiving space.
10. The heat dissipation module of claim 5, further comprising a flat heat pipe and a heat absorber, wherein the heat pipe comprises an evaporation section and a condenser section, the evaporation section being attached on a top surface of the heat absorber, the condenser section being received in a channel cooperatively defined by the cutouts of the fins, the bottom plate, a bottom surface of the heat pipe and bottom ends of the main bodies being aligned with each other.
11. A heat dissipation module comprising:
a fan comprising an impeller, the fan having a cavity receiving the impeller therein, and an air outlet at one side thereof communicating with the cavity; and
a fin assembly located at the air outlet of the fan, the fin assembly comprising a plurality of fins, each fin being a single monolithic body comprising a main body and a tab extending from the main body;
wherein top ends of the tabs are higher than top ends of the fins, a plurality of slits is defined in the fan at the air outlet, and each tab extends through a corresponding slit and is bent and engaged on the fan, thereby attaching the fan on the fin assembly.
12. The heat dissipation module of claim 11, wherein the fan comprises a bottom plate and a top plate opposite to the bottom plate, the slits being defined in an end of the top plate located at the air outlet.
13. The heat dissipation module of claim 11, wherein the number of the slits is equal to the number of the tabs, and a size of each slit is substantially equal to that of each tab, each tab penetrating through a correspondingly slit, with a distal end of the tab deformed and snapped horizontally on the top plate of the frame.
14. The heat dissipation module of claim 12, wherein each fin comprises a main body, the main bodies of the fins being aligned with each other, and being parallel to and spaced from each other, the tab of each fin extending toward the impeller from an end of the main body near to the air outlet.
15. The heat dissipation module of claim 14, wherein the main body is an “L” shaped sheet, a cutout being formed at a bottom corner of each main body.
16. The heat dissipation module of claim 14, wherein the fan comprises a sidewall integrally extending from a periphery of the bottom plate toward the top plate, the end of the top plate located at the air outlet extending out beyond the bottom plate, the bottom plate, the sidewall and the bottom plate being engaged together to form the cavity.
17. The heat dissipation module of claim 16, wherein fin assembly further comprises a rib, the rib being located at a central area of the top end of the fin assembly and resisting a part of the fan.
18. The heat dissipation module of claim 16, wherein a height of the sidewall is substantially equal to that of the main body of each fin, a top end of the sidewall being aligned with and substantially coplanar with top end of the main body, a plurality of bulges each with a through hole is provided at a periphery of the top end of the sidewall, a plurality of ears each with a through hole being provided on the top plate corresponding to the bulges, a plurality of screws being engaged in the through holes of the ears and the bulges thereby connecting the top plate and the sidewall together.
19. The heat dissipation module of claim 16, wherein the impeller is supported on the bottom plate.
20. The heat dissipation module of claim 16, further comprising a flat heat pipe and a heat absorber, wherein the heat pipe comprises an evaporation section and a condenser section, the evaporation section being attached on a top surface of the heat absorber, the condenser section being received in a channel cooperatively defined by the cutouts of the fins, the bottom plate, a bottom surface of the heat pipe, and an bottom end of main body being aligned with each other.
US13/855,642 2012-11-23 2013-04-02 Heat dissipation module with bent fin tabs attaching fan to fin assembly Abandoned US20140144610A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW101143857 2012-11-23
TW101143857A TWI534594B (en) 2012-11-23 2012-11-23 Heat dissipating module

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11425842B2 (en) * 2020-09-14 2022-08-23 Hewlett Packard Enterprise Development Lp Thermal design of an access point

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100307719A1 (en) * 2009-06-04 2010-12-09 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device and method of manufacturing the same
US7952872B1 (en) * 2009-12-25 2011-05-31 Kabushiki Kaisha Toshiba Cooling device and electronic apparatus
US20130118717A1 (en) * 2011-11-16 2013-05-16 Cooler Master Co., Ltd. Heat-dissipating device and method for fabricating the same

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100307719A1 (en) * 2009-06-04 2010-12-09 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device and method of manufacturing the same
US7952872B1 (en) * 2009-12-25 2011-05-31 Kabushiki Kaisha Toshiba Cooling device and electronic apparatus
US20130118717A1 (en) * 2011-11-16 2013-05-16 Cooler Master Co., Ltd. Heat-dissipating device and method for fabricating the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11425842B2 (en) * 2020-09-14 2022-08-23 Hewlett Packard Enterprise Development Lp Thermal design of an access point

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TW201421215A (en) 2014-06-01
TWI534594B (en) 2016-05-21

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AS Assignment

Owner name: FOXCONN TECHNOLOGY CO., LTD., TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:LIN, YU-CHING;REEL/FRAME:030137/0111

Effective date: 20130401

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION