TW201421215A - Heat dissipating module - Google Patents
Heat dissipating module Download PDFInfo
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- TW201421215A TW201421215A TW101143857A TW101143857A TW201421215A TW 201421215 A TW201421215 A TW 201421215A TW 101143857 A TW101143857 A TW 101143857A TW 101143857 A TW101143857 A TW 101143857A TW 201421215 A TW201421215 A TW 201421215A
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
- F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
- F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2215/00—Fins
- F28F2215/10—Secondary fins, e.g. projections or recesses on main fins
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2275/00—Fastening; Joining
- F28F2275/12—Fastening; Joining by methods involving deformation of the elements
- F28F2275/122—Fastening; Joining by methods involving deformation of the elements by crimping, caulking or clinching
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
Description
本發明涉及散熱模組，特別係指一種應用於電子產品散熱的散熱模組。The invention relates to a heat dissipation module, in particular to a heat dissipation module applied to heat dissipation of an electronic product.
隨著電子資訊產業的快速發展，中央處理器等發熱電子元件高速、高頻及集成化使其發熱量劇增，如不及時排除這些熱量，將引起發熱電子元件自身溫度的升高，進而導致發熱電子元件的損壞或其性能的降低。因此，業者通常在發熱電子元件上加裝一散熱模組。With the rapid development of the electronic information industry, high-speed, high-frequency and integration of heat-generating electronic components such as central processing units have caused a rapid increase in heat generation. If these heats are not removed in time, the temperature of the heat-generating electronic components will rise, resulting in Damage to the heat-generating electronic components or degradation of their performance. Therefore, the manufacturer usually installs a heat dissipation module on the heat-generating electronic component.
通常，該散熱模組包括與該發熱電子元件貼合的吸熱板、散熱鰭片組、連接該吸熱板與散熱鰭片組之間以將吸熱板的熱量傳遞至散熱鰭片組的熱管，及與該散熱鰭片組連接的離心風扇。業界通常採用過回焊爐的錫焊制程將散熱鰭片組結合至離心風扇的出風口處，其錫焊速度需要根據回焊爐內的溫度及散熱模組自身的尺寸大小來控制調整，制程較為複雜，而且散熱模組長時間使用後錫料容易脫落造成散熱鰭片組與離心風扇接觸不夠緊密，結構不夠穩固，進而影響散熱模組的散熱效率。Generally, the heat dissipation module includes a heat absorption plate that is bonded to the heat-generating electronic component, a heat dissipation fin group, and a heat pipe that connects the heat absorption plate and the heat dissipation fin group to transfer heat of the heat absorption plate to the heat dissipation fin group, and A centrifugal fan connected to the heat sink fin set. In the industry, the soldering process of the reflow oven is usually used to combine the heat sink fins to the air outlet of the centrifugal fan. The soldering speed needs to be controlled according to the temperature in the reflow furnace and the size of the heat dissipation module itself. It is more complicated, and the solder material is easy to fall off after the long-term use of the heat dissipation module, so that the heat sink fin group and the centrifugal fan are not tightly contacted, and the structure is not stable enough, thereby affecting the heat dissipation efficiency of the heat dissipation module.
有鑒於此，有必要提供一種能使散熱鰭片組與離心風扇連接穩固的散熱模組。In view of this, it is necessary to provide a heat dissipation module that can stabilize the heat sink fin set and the centrifugal fan.
一種散熱模組，包括一離心風扇及位於離心風扇的出風口處的一散熱鰭片組，所述離心風扇包括一扇框，所述散熱鰭片組包括複數鰭片，所述扇框位於出風口的邊緣對應鰭片開設複數定位孔，所述鰭片上對應所述定位孔一體延伸形成折片，所述折片穿過對應定位孔並扣合在扇框上。A heat dissipation module includes a centrifugal fan and a heat dissipation fin set at an air outlet of the centrifugal fan, the centrifugal fan includes a frame, the heat dissipation fin set includes a plurality of fins, and the fan frame is located A plurality of positioning holes are formed in the edge of the air inlet corresponding to the fins. The fins are integrally extended with the positioning holes to form a flap, and the folded piece passes through the corresponding positioning hole and is fastened to the fan frame.
與習知技術相比，上述散熱模組的扇框位於出風口的邊緣對應每一鰭片開設定位孔，每一鰭片對應每一定位孔一體形成一折片，所述折片穿過定位孔並扣合至扇框上，利用離心風扇與鰭片自身的結構完成離心風扇與散熱鰭片組的連接固定，無需利用錫料採用錫焊制程進行黏合，結構更加穩固，同時折片與定位孔均可預先模具成型，可大幅度提升散熱模組的組裝製造速度。Compared with the conventional technology, the fan frame of the heat dissipation module is located at the edge of the air outlet, and each of the fins defines a positioning hole, and each of the fins integrally forms a flap corresponding to each positioning hole, and the folded piece passes through the positioning. The hole is fastened to the fan frame, and the connection between the centrifugal fan and the fin assembly is completed by using the structure of the centrifugal fan and the fin itself, and the solder is not required to be bonded by the soldering process, and the structure is more stable, and the flap and the positioning are simultaneously performed. The holes can be pre-molded, which can greatly improve the assembly and manufacturing speed of the heat-dissipating module.
請參閱圖1至圖3，為本發明一實施例的散熱模組100，其包括與發熱電子元件（圖未示）貼合的吸熱板10，與吸熱板10連接的熱管20，與該熱管20連接的散熱鰭片組30，及與該散熱鰭片組30連接的離心風扇40。所述熱管20一端連接該吸熱板10，另一端連接該散熱鰭片組30以將吸熱板10的熱量傳遞至散熱鰭片組30，並藉由離心風扇40散發至周圍空氣中。Referring to FIG. 1 to FIG. 3 , a heat dissipation module 100 according to an embodiment of the present invention includes a heat absorption plate 10 that is attached to a heat-generating electronic component (not shown), a heat pipe 20 connected to the heat absorption plate 10 , and the heat pipe. 20 connected heat sink fin sets 30, and a centrifugal fan 40 connected to the heat sink fin set 30. One end of the heat pipe 20 is connected to the heat absorbing plate 10, and the other end is connected to the heat dissipation fin group 30 to transfer the heat of the heat absorbing plate 10 to the heat dissipation fin group 30, and is radiated into the surrounding air by the centrifugal fan 40.
具體的，該吸熱板10為一矩形板體，其下表面與發熱電子元件貼合，並藉由相關固定件（圖未示）連接固定。Specifically, the heat absorbing plate 10 is a rectangular plate body, and the lower surface thereof is attached to the heat-generating electronic component, and is fixedly connected by a related fixing member (not shown).
該熱管20為扁平熱管，大致呈“C”形，包括位於其一端的一蒸發段21，位於其另一端的冷凝段22，及連接該蒸發段21與冷凝段22的連接段23。該蒸發段21為一平直段，其貼合於該吸熱板10的上表面以吸收吸熱板10的熱量。該冷凝段22亦為一平直段，其與該散熱鰭片組30的下底面貼合。該連接段23為一彎曲段，該連接段23將蒸發段21的熱量傳至冷凝段22。The heat pipe 20 is a flat heat pipe having a substantially "C" shape, including an evaporation section 21 at one end thereof, a condensation section 22 at the other end thereof, and a connection section 23 connecting the evaporation section 21 and the condensation section 22. The evaporation section 21 is a straight section which is attached to the upper surface of the heat absorbing plate 10 to absorb the heat of the heat absorbing plate 10. The condensation section 22 is also a straight section that fits the lower bottom surface of the heat dissipation fin set 30. The connecting section 23 is a curved section which transfers the heat of the evaporation section 21 to the condensation section 22.
所述散熱鰭片組30包括複數鰭片31，及形成於鰭片31上的一定位板32。這些鰭片31沿同一方向相互平行抵靠排布。The heat dissipation fin set 30 includes a plurality of fins 31 and a positioning plate 32 formed on the fins 31. These fins 31 are arranged in parallel with each other in the same direction.
每一鰭片31包括一本體311、由本體311延伸而出的折片312，及自本體311上下邊緣朝同一方向垂直本體311延伸而出的折邊313。Each of the fins 31 includes a body 311, a flap 312 extending from the body 311, and a flange 313 extending from the upper and lower edges of the body 311 to the main body 311 in the same direction.
所述本體311為一縱長平板，其靠近該離心風扇40的一端下邊緣形成一凹陷314，以收容所述熱管20的冷凝段22，即該本體311呈“L”狀。該凹陷314的寬度與該熱管20冷凝段22的寬度相等。可以理解本體311也可不必具有該凹陷314，而熱管20的冷凝段22與本體311的上邊緣或者下邊緣接觸。The body 311 is an elongated plate, and a recess 314 is formed near the lower edge of the centrifugal fan 40 to receive the condensation section 22 of the heat pipe 20, that is, the body 311 has an "L" shape. The width of the recess 314 is equal to the width of the condensation section 22 of the heat pipe 20. It will be appreciated that the body 311 does not have to have the recess 314, and the condensation section 22 of the heat pipe 20 is in contact with the upper or lower edge of the body 311.
每一折片312與對應的本體311一體成型。本實施例中，該折片312呈長條狀，其底端與本體311下邊緣齊平，且其頂端向上延伸超出該本體311的上邊緣。事實上，折片312也可看成係由本體311的上邊緣延伸而出的片體，該折片312由本體311的上邊緣且靠近離心風扇40的一端部延伸而出。該折片312也並非必須在本體311的該靠近離心風扇40的一端部延伸而出，例如可以係在本體311的該一端部以內的某個上邊緣部分延伸而出。Each flap 312 is integrally formed with a corresponding body 311. In this embodiment, the flap 312 has an elongated shape, and the bottom end thereof is flush with the lower edge of the body 311, and the top end thereof extends upward beyond the upper edge of the body 311. In fact, the flap 312 can also be viewed as a sheet extending from the upper edge of the body 311, the flap 312 extending from the upper edge of the body 311 and adjacent one end of the centrifugal fan 40. The flap 312 does not have to extend from the end of the body 311 near the centrifugal fan 40, and may extend out of the upper edge portion of the body 311, for example.
所述折邊313依次抵接且寬度相等，其中對應該凹陷314中的折邊313與該熱管20的頂面相貼合。The flanges 313 are sequentially abutted and have the same width, wherein the flange 313 corresponding to the recess 314 is in contact with the top surface of the heat pipe 20.
所述定位板32沿該複數鰭片31的排布方向上設置，該定位板32呈長條狀並與部分鰭片31的折邊313貼合。The positioning plate 32 is disposed along the arrangement direction of the plurality of fins 31. The positioning plate 32 has an elongated shape and is attached to the folded edge 313 of the partial fins 31.
所述離心風扇40包括一扇框41及收容於該扇框41內的一葉輪42。The centrifugal fan 40 includes a fan frame 41 and an impeller 42 received in the fan frame 41.
所述扇框41包括一底座411及位於底座411上的一上蓋412，所述底座411與該上蓋412圍設成一收容空間46。The fan frame 41 includes a base 411 and an upper cover 412 on the base 411. The base 411 and the upper cover 412 are surrounded by a receiving space 46.
該底座411包括一底板413及自該底板413邊緣向上一體延伸的側壁414。該底板413呈平板狀，其中部用以支撐連接所述葉輪42。所述底板413、散熱鰭片組30本體311的下邊緣及熱管20的下表面相齊平。The base 411 includes a bottom plate 413 and side walls 414 extending integrally from the edge of the bottom plate 413. The bottom plate 413 has a flat shape, and a middle portion thereof supports the connection of the impeller 42. The bottom plate 413, the lower edge of the body 311 of the heat dissipation fin set 30, and the lower surface of the heat pipe 20 are flush.
該側壁414為一半封閉的結構，其包括一弧形部415、自弧形部415的末端延伸的平直側板416及複數設有通孔的凸耳417，該弧形部415與該平直側板416相對處向內凹陷形成一舌部418。該複數凸耳417相互間隔均勻分佈在側壁414上，本實施例中，該凸耳417的數量為4個。該平直側板416及弧形部415靠近該舌部418的一端形成一出風口43。所述側壁414的高度與該散熱鰭片組30的本體311高度相同，且側壁414頂端與該本體311的上邊緣齊平。The side wall 414 is a semi-closed structure including an arcuate portion 415, a flat side plate 416 extending from the end of the curved portion 415, and a plurality of lugs 417 provided with through holes, the curved portion 415 and the straight portion The side plates 416 are recessed inwardly to form a tongue 418. The plurality of lugs 417 are evenly spaced apart from each other on the side wall 414. In this embodiment, the number of the lugs 417 is four. The flat side plate 416 and the curved portion 415 form an air outlet 43 near one end of the tongue portion 418. The height of the sidewall 414 is the same as the height of the body 311 of the heat dissipation fin set 30, and the top end of the sidewall 414 is flush with the upper edge of the body 311.
所述上蓋412呈平板狀且與該底板413相對設置。該上蓋412的中央設有一圓形的入風口44。該上蓋412對應側壁414的複數凸耳417形成複數設有通孔的凸片419，以利用螺絲（圖未示）穿設該凸片419及凸耳417連接固定該上蓋412及該底座411。所述上蓋412位於該出風口43側的邊緣向外延伸超出底板413，並抵擋於所述定位板32。該上蓋412位於該出風口43側的邊緣對應所述折片312開設複數定位孔45，所述複數定位孔45相互間隔且與該折片312尺寸相同、數量相等，該折片312穿設該定位孔45超出該上蓋412。The upper cover 412 has a flat shape and is disposed opposite to the bottom plate 413. A circular air inlet 44 is provided in the center of the upper cover 412. The upper cover 412 forms a plurality of tabs 419 provided with through holes corresponding to the plurality of lugs 417 of the side wall 414. The upper cover 412 and the base 411 are connected and fixed by screws (not shown) through the tabs 419 and the lugs 417. The edge of the upper cover 412 on the side of the air outlet 43 extends outward beyond the bottom plate 413 and resists the positioning plate 32. The edge of the upper cover 412 on the side of the air outlet 43 defines a plurality of positioning holes 45 corresponding to the flaps 312. The plurality of positioning holes 45 are spaced apart from each other and are equal in size and equal in number to the flaps 312. The positioning hole 45 extends beyond the upper cover 412.
可以理解的，所述複數定位孔45也可形成在底座411的底板413上，對應的，所述底板413位於該出風口43側的邊緣向外延伸超出上蓋412，此時散熱鰭片組30的折片312朝該底板413方向延伸，穿過定位孔45並扣合在底板413上。It can be understood that the plurality of positioning holes 45 can also be formed on the bottom plate 413 of the base 411. Correspondingly, the edge of the bottom plate 413 on the side of the air outlet 43 extends outward beyond the upper cover 412. The flap 312 extends toward the bottom plate 413, passes through the positioning hole 45 and is fastened to the bottom plate 413.
所述葉輪42收容於該收容空間46中。該葉輪42包括輪轂421及環設於輪轂421周圍的複數扇葉422。該離心風扇40工作時，外部冷空氣由入風口44進入扇框41內，在葉輪42的高速旋轉的作用下形成氣流從該出風口43向外吹出，以將散熱鰭片組30的熱量擴散至周圍空氣中。The impeller 42 is received in the accommodating space 46. The impeller 42 includes a hub 421 and a plurality of blades 422 disposed around the hub 421. When the centrifugal fan 40 is in operation, the external cold air enters the fan frame 41 through the air inlet 44, and the airflow is blown out from the air outlet 43 by the high-speed rotation of the impeller 42 to diffuse the heat of the heat dissipation fin group 30. To the surrounding air.
請同時參閱圖2和圖3，組裝時，先將離心風扇40的上蓋412利用螺絲穿設凸耳417及凸片419固定至底座411上。將散熱鰭片組30的折片312穿過對應上蓋412的定位孔45中，所述上蓋412抵擋於所述定位板32。利用模具將該折片312超出該上蓋412的部分水平扣壓至上蓋412上，以連接固定所述散熱鰭片組30與該離心風扇40。再將所述吸熱板10貼合固定至發熱電子元件（圖未示）；將熱管20的蒸發段21藉由導熱膏連接固定至吸熱板10上，同時該將冷凝段22收容固定於該散熱鰭片組的凹陷314中，即完成該散熱模組100的組裝。Referring to FIG. 2 and FIG. 3 at the same time, in assembling, the upper cover 412 of the centrifugal fan 40 is first fixed to the base 411 by using a screw insertion lug 417 and a tab 419. The flaps 312 of the heat dissipation fin set 30 are passed through the positioning holes 45 of the corresponding upper cover 412, and the upper cover 412 is abutted against the positioning plate 32. The portion of the flap 312 beyond the upper cover 412 is horizontally pressed onto the upper cover 412 by a mold to connect and fix the heat dissipation fin set 30 and the centrifugal fan 40. The heat absorbing plate 10 is then fixedly attached to the heat-generating electronic component (not shown); the evaporation section 21 of the heat pipe 20 is fixed to the heat absorbing plate 10 by a heat-conductive paste, and the condensation section 22 is received and fixed to the heat dissipation layer. In the recess 314 of the fin set, the assembly of the heat dissipation module 100 is completed.
工作時，發熱電子元件產生熱量，熱量經由吸熱板10及熱管20傳導至散熱鰭片組30，外部冷空氣由入風口44進入扇框41內，在葉輪42的高速旋轉的作用下形成氣流從該出風口43向外吹出，並將散熱鰭片組30的熱量擴散至周圍空氣中。During operation, the heat generating electronic components generate heat, and the heat is conducted to the heat radiating fin group 30 via the heat absorbing plate 10 and the heat pipe 20, and the external cold air enters the fan frame 41 through the air inlet 44, and the airflow is formed under the high speed rotation of the impeller 42. The air outlet 43 is blown outward and diffuses heat of the heat dissipation fin group 30 into the surrounding air.
本發明中所述散熱鰭片組30位於出風口43側的一端朝該上蓋412方向延伸一體形成複數折片312，該上蓋412位於該出風口43側的邊緣對應所述折片312開設複數定位孔45，所述折片312穿過該定位孔45並利用模具水平扣合至上蓋412上，從而利用散熱鰭片組30與離心風扇40自身的結構連接固定在一起，取代傳統利用錫焊黏合的制程，結構更加穩固，同時也避免了錫焊制程帶來的環境污染。此外，折片312與定位孔45均可預先模具成型，可大幅度提升散熱模組的組裝製造速度。In the present invention, the end of the heat dissipating fin group 30 on the side of the air outlet 43 extends toward the upper cover 412 to form a plurality of flaps 312. The edge of the upper cover 412 on the side of the air outlet 43 defines a plurality of positions corresponding to the flaps 312. The hole 45, the flap 312 passes through the positioning hole 45 and is horizontally fastened to the upper cover 412 by using a mold, so that the heat dissipation fin group 30 is fixedly connected with the centrifugal fan 40 itself, instead of the conventional solder bonding. The process is more stable and avoids the environmental pollution caused by the soldering process. In addition, the flap 312 and the positioning hole 45 can be pre-molded, which can greatly improve the assembly and manufacturing speed of the heat dissipation module.
綜上所述，本發明符合發明專利要件，爰依法提出專利申請。惟，以上所述者僅為本發明之較佳實施例，舉凡熟悉本案技藝之人士，在爰依本發明精神所作之等效修飾或變化，皆應涵蓋於以下之申請專利範圍內。In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. The above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art will be included in the following claims.
100．．．散熱模組100. . . Thermal module
10．．．吸熱板10. . . Heat absorbing plate
20．．．熱管20. . . Heat pipe
30．．．散熱鰭片組30. . . Heat sink fin set
40．．．離心風扇40. . . Centrifugal fan
21．．．蒸發段twenty one. . . Evaporation section
22．．．冷凝段twenty two. . . Condensation section
23．．．連接段twenty three. . . Connection segment
31．．．鰭片31. . . Fin
32．．．定位板32. . . Positioning plate
311．．．本體311. . . Ontology
312．．．折片312. . . Fold
313．．．折邊313. . . Folding
314．．．凹陷314. . . Depression
41．．．扇框41. . . Fan frame
42．．．葉輪42. . . impeller
411．．．底座411. . . Base
412．．．上蓋412. . . Upper cover
413．．．底板413. . . Bottom plate
414．．．側壁414. . . Side wall
415．．．弧形部415. . . Curved part
416．．．平直側板416. . . Straight side panel
417．．．凸耳417. . . Lug
418．．．舌部418. . . Tongue
419．．．凸片419. . . Tab
43．．．出風口43. . . Air outlet
44．．．入風口44. . . Air inlet
45．．．定位孔45. . . Positioning hole
46．．．收容空間46. . . Containing space
421．．．輪轂421. . . Wheel hub
422．．．扇葉422. . . Fan blade
圖1係本發明一實施方式的散熱模組組裝前的立體分解圖。1 is an exploded perspective view of a heat dissipation module according to an embodiment of the present invention before assembly.
圖2係圖1所示散熱模組預組裝狀態的立體示意圖。2 is a perspective view showing the pre-assembled state of the heat dissipation module shown in FIG. 1.
圖3係圖1中所示散熱模組組裝後的立體示意圖。3 is a perspective view of the heat dissipation module shown in FIG. 1 assembled.
100．．．散熱模組100. . . Thermal module
10．．．吸熱板10. . . Heat absorbing plate
20．．．熱管20. . . Heat pipe
30．．．散熱鰭片組30. . . Heat sink fin set
40．．．離心風扇40. . . Centrifugal fan
21．．．蒸發段twenty one. . . Evaporation section
22．．．冷凝段twenty two. . . Condensation section
23．．．連接段twenty three. . . Connection segment
31．．．鰭片31. . . Fin
32．．．定位板32. . . Positioning plate
311．．．本體311. . . Ontology
312．．．折片312. . . Fold
313．．．折邊313. . . Folding
314．．．凹陷314. . . Depression
411．．．底座411. . . Base
412．．．上蓋412. . . Upper cover
417．．．凸耳417. . . Lug
419．．．凸片419. . . Tab
44．．．入風口44. . . Air inlet
46．．．收容空間46. . . Containing space
Claims (10)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW101143857A TWI534594B (en) | 2012-11-23 | 2012-11-23 | Heat dissipating module |
| US13/855,642 US20140144610A1 (en) | 2012-11-23 | 2013-04-02 | Heat dissipation module with bent fin tabs attaching fan to fin assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW101143857A TWI534594B (en) | 2012-11-23 | 2012-11-23 | Heat dissipating module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201421215A true TW201421215A (en) | 2014-06-01 |
| TWI534594B TWI534594B (en) | 2016-05-21 |
Family
ID=50772239
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW101143857A TWI534594B (en) | 2012-11-23 | 2012-11-23 | Heat dissipating module |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US20140144610A1 (en) |
| TW (1) | TWI534594B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11425842B2 (en) * | 2020-09-14 | 2022-08-23 | Hewlett Packard Enterprise Development Lp | Thermal design of an access point |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101909417A (en) * | 2009-06-04 | 2010-12-08 | 富准精密工业(深圳)有限公司 | Radiating device and manufacture method thereof |
| JP4635101B1 (en) * | 2009-12-25 | 2011-02-23 | 株式会社東芝 | Cooling device and electronic device |
| US20130118717A1 (en) * | 2011-11-16 | 2013-05-16 | Cooler Master Co., Ltd. | Heat-dissipating device and method for fabricating the same |
-
2012
- 2012-11-23 TW TW101143857A patent/TWI534594B/en not_active IP Right Cessation
-
2013
- 2013-04-02 US US13/855,642 patent/US20140144610A1/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| TWI534594B (en) | 2016-05-21 |
| US20140144610A1 (en) | 2014-05-29 |
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