TWI533396B - 電漿處理裝置 - Google Patents
電漿處理裝置 Download PDFInfo
- Publication number
- TWI533396B TWI533396B TW100140364A TW100140364A TWI533396B TW I533396 B TWI533396 B TW I533396B TW 100140364 A TW100140364 A TW 100140364A TW 100140364 A TW100140364 A TW 100140364A TW I533396 B TWI533396 B TW I533396B
- Authority
- TW
- Taiwan
- Prior art keywords
- plasma
- semiconductor wafer
- electrostatic chuck
- focus ring
- electrode
- Prior art date
Links
- 238000012545 processing Methods 0.000 title claims description 64
- 238000001179 sorption measurement Methods 0.000 claims description 31
- 239000000758 substrate Substances 0.000 claims description 16
- 230000007246 mechanism Effects 0.000 claims description 9
- 238000005507 spraying Methods 0.000 claims description 8
- 229910018072 Al 2 O 3 Inorganic materials 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 description 62
- 238000001020 plasma etching Methods 0.000 description 29
- 238000000034 method Methods 0.000 description 14
- 238000005530 etching Methods 0.000 description 13
- 239000003507 refrigerant Substances 0.000 description 13
- 230000008569 process Effects 0.000 description 12
- 229920002120 photoresistant polymer Polymers 0.000 description 7
- 238000009832 plasma treatment Methods 0.000 description 6
- 239000011810 insulating material Substances 0.000 description 4
- 238000009413 insulation Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 239000007921 spray Substances 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 229910052715 tantalum Inorganic materials 0.000 description 2
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 238000009529 body temperature measurement Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 229910001925 ruthenium oxide Inorganic materials 0.000 description 1
- WOCIAKWEIIZHES-UHFFFAOYSA-N ruthenium(iv) oxide Chemical compound O=[Ru]=O WOCIAKWEIIZHES-UHFFFAOYSA-N 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical compound [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/3065—Plasma etching; Reactive-ion etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67069—Apparatus for fluid treatment for etching for drying etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32623—Mechanical discharge control means
- H01J37/32642—Focus rings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32697—Electrostatic control
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32715—Workpiece holder
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32715—Workpiece holder
- H01J37/32724—Temperature
-
- H01L21/205—
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Drying Of Semiconductors (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010250461A JP5503503B2 (ja) | 2010-11-09 | 2010-11-09 | プラズマ処理装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201234519A TW201234519A (en) | 2012-08-16 |
| TWI533396B true TWI533396B (zh) | 2016-05-11 |
Family
ID=46018493
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW100140364A TWI533396B (zh) | 2010-11-09 | 2011-11-04 | 電漿處理裝置 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US8545672B2 (pl) |
| JP (1) | JP5503503B2 (pl) |
| KR (1) | KR101898079B1 (pl) |
| CN (1) | CN102468106B (pl) |
| TW (1) | TWI533396B (pl) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6496579B2 (ja) * | 2015-03-17 | 2019-04-03 | 東京エレクトロン株式会社 | 基板処理方法及び基板処理装置 |
| JP6400771B1 (ja) * | 2017-04-11 | 2018-10-03 | 株式会社石井表記 | ヒータ付き減圧ユニット及び電池製造用装置 |
| KR102511255B1 (ko) * | 2017-10-16 | 2023-03-16 | 엔지케이 인슐레이터 엘티디 | 정전 척 |
| JP7101055B2 (ja) | 2018-06-12 | 2022-07-14 | 東京エレクトロン株式会社 | 静電チャック、フォーカスリング、支持台、プラズマ処理装置、及びプラズマ処理方法 |
| JP7134863B2 (ja) * | 2018-12-27 | 2022-09-12 | 東京エレクトロン株式会社 | プラズマ処理装置およびプラズマ処理方法 |
| US11450545B2 (en) * | 2019-04-17 | 2022-09-20 | Samsung Electronics Co., Ltd. | Capacitively-coupled plasma substrate processing apparatus including a focus ring and a substrate processing method using the same |
| KR102077976B1 (ko) * | 2019-10-15 | 2020-02-14 | 주식회사 기가레인 | 어댑터 및 이를 포함하는 플라즈마 처리 장치 |
| US11972957B2 (en) | 2020-07-31 | 2024-04-30 | Taiwan Semiconductor Manufacturing Company, Ltd. | Gas flow accelerator to prevent buildup of processing byproduct in a main pumping line of a semiconductor processing tool |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR900702292A (ko) * | 1988-05-05 | 1990-12-06 | 베흐 에르빈 | 압축 밀폐된 플러그 커플링 |
| JPH10303288A (ja) | 1997-04-26 | 1998-11-13 | Anelva Corp | プラズマ処理装置用基板ホルダー |
| JP4559595B2 (ja) * | 2000-07-17 | 2010-10-06 | 東京エレクトロン株式会社 | 被処理体の載置装置及びプラズマ処理装置 |
| US6475336B1 (en) * | 2000-10-06 | 2002-11-05 | Lam Research Corporation | Electrostatically clamped edge ring for plasma processing |
| JP2005520337A (ja) * | 2002-03-12 | 2005-07-07 | 東京エレクトロン株式会社 | プラズマ処理のための改良された基板ホルダ |
| KR100657054B1 (ko) * | 2003-01-07 | 2006-12-13 | 동경 엘렉트론 주식회사 | 플라즈마 처리 장치 및 포커스 링 |
| US20040261946A1 (en) * | 2003-04-24 | 2004-12-30 | Tokyo Electron Limited | Plasma processing apparatus, focus ring, and susceptor |
| JP4547182B2 (ja) * | 2003-04-24 | 2010-09-22 | 東京エレクトロン株式会社 | プラズマ処理装置 |
| KR100512745B1 (ko) * | 2003-07-24 | 2005-09-07 | 삼성전자주식회사 | 정전기 척 |
| JP4504061B2 (ja) * | 2004-03-29 | 2010-07-14 | 東京エレクトロン株式会社 | プラズマ処理方法 |
| KR20060079335A (ko) * | 2004-12-30 | 2006-07-06 | 동부일렉트로닉스 주식회사 | 반도체 웨이퍼의 정전척 장치 |
| US20070283891A1 (en) * | 2006-03-29 | 2007-12-13 | Nobuyuki Okayama | Table for supporting substrate, and vacuum-processing equipment |
| JP5317424B2 (ja) * | 2007-03-28 | 2013-10-16 | 東京エレクトロン株式会社 | プラズマ処理装置 |
| US8317969B2 (en) * | 2008-03-25 | 2012-11-27 | Tokyo Electron Limited | Plasma processing apparatus |
| JP5642531B2 (ja) * | 2010-12-22 | 2014-12-17 | 東京エレクトロン株式会社 | 基板処理装置及び基板処理方法 |
-
2010
- 2010-11-09 JP JP2010250461A patent/JP5503503B2/ja not_active Expired - Fee Related
-
2011
- 2011-11-04 TW TW100140364A patent/TWI533396B/zh not_active IP Right Cessation
- 2011-11-07 US US13/290,440 patent/US8545672B2/en active Active
- 2011-11-08 KR KR1020110115722A patent/KR101898079B1/ko active IP Right Grant
- 2011-11-09 CN CN201110353550.8A patent/CN102468106B/zh not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| KR20120049823A (ko) | 2012-05-17 |
| JP2012104579A (ja) | 2012-05-31 |
| JP5503503B2 (ja) | 2014-05-28 |
| TW201234519A (en) | 2012-08-16 |
| US8545672B2 (en) | 2013-10-01 |
| CN102468106A (zh) | 2012-05-23 |
| CN102468106B (zh) | 2014-08-20 |
| US20120111500A1 (en) | 2012-05-10 |
| KR101898079B1 (ko) | 2018-09-12 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |