TWI529068B - 具有銅薄層構成之基材的生產方法，印刷電路板之製造方法以及經由上述方法製造之印刷電路板 - Google Patents

具有銅薄層構成之基材的生產方法，印刷電路板之製造方法以及經由上述方法製造之印刷電路板 Download PDF

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Publication number
TWI529068B
TWI529068B TW103102611A TW103102611A TWI529068B TW I529068 B TWI529068 B TW I529068B TW 103102611 A TW103102611 A TW 103102611A TW 103102611 A TW103102611 A TW 103102611A TW I529068 B TWI529068 B TW I529068B
Authority
TW
Taiwan
Prior art keywords
layer
copper
carrier
thin layer
printed circuit
Prior art date
Application number
TW103102611A
Other languages
English (en)
Chinese (zh)
Other versions
TW201438918A (zh
Inventor
全星郁
Original Assignee
Ｙｍｔ股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ｙｍｔ股份有限公司 filed Critical Ｙｍｔ股份有限公司
Publication of TW201438918A publication Critical patent/TW201438918A/zh
Application granted granted Critical
Publication of TWI529068B publication Critical patent/TWI529068B/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/389—Improvement of the adhesion between the insulating substrate and the metal by the use of a coupling agent, e.g. silane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
TW103102611A 2013-02-08 2014-01-24 具有銅薄層構成之基材的生產方法，印刷電路板之製造方法以及經由上述方法製造之印刷電路板 TWI529068B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR20130014519 2013-02-08

Publications (2)

Publication Number Publication Date
TW201438918A TW201438918A (zh) 2014-10-16
TWI529068B true TWI529068B (zh) 2016-04-11

Family

ID=51278996

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103102611A TWI529068B (zh) 2013-02-08 2014-01-24 具有銅薄層構成之基材的生產方法，印刷電路板之製造方法以及經由上述方法製造之印刷電路板

Country Status (3)

Country Link
KR (1) KR101422262B1 (ko)
CN (1) CN103987213B (ko)
TW (1) TWI529068B (ko)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101573913B1 (ko) 2015-03-26 2015-12-03 와이엠티 주식회사 표면에 돌기가 형성된 초박형 무전해 동박 및 이를 이용한 인쇄회로기판의 제조방법
US10091887B2 (en) * 2015-04-02 2018-10-02 Tactotek Oy Multi-material structure with embedded electronics
KR101759288B1 (ko) * 2015-10-15 2017-07-19 와이엠티 주식회사 표면에 돌기가 형성된 초박형 무전해 동박 및 이를 이용한 인쇄회로기판의 제조방법
TWI613939B (zh) * 2016-06-23 2018-02-01 Pomiran Metalization Research Co Ltd 金屬化軟性基板及使用該基板之多層電路板製造方法
CN106888550A (zh) * 2016-10-12 2017-06-23 柏弥兰金属化研究股份有限公司 金属化软性基板及使用该基板的多层电路板制造方法
EP3310137B1 (en) * 2016-10-14 2019-02-27 ATOTECH Deutschland GmbH Method for manufacturing a printed circuit board
KR101809985B1 (ko) 2017-03-30 2017-12-18 와이엠티 주식회사 다공성 구리박의 제조방법 및 이를 이용한 다공성 구리박

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4699261B2 (ja) * 2005-03-31 2011-06-08 新日鐵化学株式会社 多層積層体及びフレキシブル銅張積層基板
JP4927503B2 (ja) * 2005-12-15 2012-05-09 古河電気工業株式会社 キャリア付き極薄銅箔及びプリント配線基板
US7778057B2 (en) * 2007-02-26 2010-08-17 Sandisk Corporation PCB circuit modification from multiple to individual chip enable signals
TWI330798B (en) * 2007-05-01 2010-09-21 Inventec Corp Method for designing printed circuit board
JP4888736B2 (ja) 2008-08-29 2012-02-29 Ｔｄｋ株式会社 配線基板の製造方法
JP4824828B1 (ja) * 2010-11-04 2011-11-30 福田金属箔粉工業株式会社 複合金属箔及びその製造方法並びにプリント配線板

Also Published As

Publication number Publication date
CN103987213B (zh) 2017-04-12
CN103987213A (zh) 2014-08-13
TW201438918A (zh) 2014-10-16
KR101422262B1 (ko) 2014-07-24

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