TWI529068B - 具有銅薄層構成之基材的生產方法,印刷電路板之製造方法以及經由上述方法製造之印刷電路板 - Google Patents
具有銅薄層構成之基材的生產方法,印刷電路板之製造方法以及經由上述方法製造之印刷電路板 Download PDFInfo
- Publication number
- TWI529068B TWI529068B TW103102611A TW103102611A TWI529068B TW I529068 B TWI529068 B TW I529068B TW 103102611 A TW103102611 A TW 103102611A TW 103102611 A TW103102611 A TW 103102611A TW I529068 B TWI529068 B TW I529068B
- Authority
- TW
- Taiwan
- Prior art keywords
- layer
- copper
- carrier
- thin layer
- printed circuit
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/389—Improvement of the adhesion between the insulating substrate and the metal by the use of a coupling agent, e.g. silane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Laminated Bodies (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR20130014519 | 2013-02-08 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201438918A TW201438918A (zh) | 2014-10-16 |
TWI529068B true TWI529068B (zh) | 2016-04-11 |
Family
ID=51278996
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW103102611A TWI529068B (zh) | 2013-02-08 | 2014-01-24 | 具有銅薄層構成之基材的生產方法,印刷電路板之製造方法以及經由上述方法製造之印刷電路板 |
Country Status (3)
Country | Link |
---|---|
KR (1) | KR101422262B1 (ko) |
CN (1) | CN103987213B (ko) |
TW (1) | TWI529068B (ko) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101573913B1 (ko) | 2015-03-26 | 2015-12-03 | 와이엠티 주식회사 | 표면에 돌기가 형성된 초박형 무전해 동박 및 이를 이용한 인쇄회로기판의 제조방법 |
US10091887B2 (en) * | 2015-04-02 | 2018-10-02 | Tactotek Oy | Multi-material structure with embedded electronics |
KR101759288B1 (ko) * | 2015-10-15 | 2017-07-19 | 와이엠티 주식회사 | 표면에 돌기가 형성된 초박형 무전해 동박 및 이를 이용한 인쇄회로기판의 제조방법 |
TWI613939B (zh) * | 2016-06-23 | 2018-02-01 | Pomiran Metalization Research Co Ltd | 金屬化軟性基板及使用該基板之多層電路板製造方法 |
CN106888550A (zh) * | 2016-10-12 | 2017-06-23 | 柏弥兰金属化研究股份有限公司 | 金属化软性基板及使用该基板的多层电路板制造方法 |
EP3310137B1 (en) * | 2016-10-14 | 2019-02-27 | ATOTECH Deutschland GmbH | Method for manufacturing a printed circuit board |
KR101809985B1 (ko) | 2017-03-30 | 2017-12-18 | 와이엠티 주식회사 | 다공성 구리박의 제조방법 및 이를 이용한 다공성 구리박 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4699261B2 (ja) * | 2005-03-31 | 2011-06-08 | 新日鐵化学株式会社 | 多層積層体及びフレキシブル銅張積層基板 |
JP4927503B2 (ja) * | 2005-12-15 | 2012-05-09 | 古河電気工業株式会社 | キャリア付き極薄銅箔及びプリント配線基板 |
US7778057B2 (en) * | 2007-02-26 | 2010-08-17 | Sandisk Corporation | PCB circuit modification from multiple to individual chip enable signals |
TWI330798B (en) * | 2007-05-01 | 2010-09-21 | Inventec Corp | Method for designing printed circuit board |
JP4888736B2 (ja) | 2008-08-29 | 2012-02-29 | Tdk株式会社 | 配線基板の製造方法 |
JP4824828B1 (ja) * | 2010-11-04 | 2011-11-30 | 福田金属箔粉工業株式会社 | 複合金属箔及びその製造方法並びにプリント配線板 |
-
2013
- 2013-12-16 KR KR1020130156508A patent/KR101422262B1/ko active IP Right Grant
-
2014
- 2014-01-24 TW TW103102611A patent/TWI529068B/zh active
- 2014-01-30 CN CN201410085306.1A patent/CN103987213B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
CN103987213B (zh) | 2017-04-12 |
CN103987213A (zh) | 2014-08-13 |
TW201438918A (zh) | 2014-10-16 |
KR101422262B1 (ko) | 2014-07-24 |
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