TWI518412B - Light can be applied through the substrate method - Google Patents

Light can be applied through the substrate method Download PDF

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Publication number
TWI518412B
TWI518412B TW103122088A TW103122088A TWI518412B TW I518412 B TWI518412 B TW I518412B TW 103122088 A TW103122088 A TW 103122088A TW 103122088 A TW103122088 A TW 103122088A TW I518412 B TWI518412 B TW I518412B
Authority
TW
Taiwan
Prior art keywords
light
permeable substrate
light permeable
photoinitiator
bonding
Prior art date
Application number
TW103122088A
Other languages
English (en)
Chinese (zh)
Other versions
TW201600907A (zh
Inventor
Wan Yu Lee
Yu Chung Lin
Horng Yi Li
Tzu Feng Lin
Original Assignee
Daxin Materials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Daxin Materials Corp filed Critical Daxin Materials Corp
Priority to TW103122088A priority Critical patent/TWI518412B/zh
Priority to JP2015123605A priority patent/JP2016009192A/ja
Priority to CN201510361946.5A priority patent/CN105303967A/zh
Publication of TW201600907A publication Critical patent/TW201600907A/zh
Application granted granted Critical
Publication of TWI518412B publication Critical patent/TWI518412B/zh

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  • Adhesives Or Adhesive Processes (AREA)
  • Liquid Crystal (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
TW103122088A 2014-06-26 2014-06-26 Light can be applied through the substrate method TWI518412B (zh)

Priority Applications (3)

Application Number Priority Date Filing Date Title
TW103122088A TWI518412B (zh) 2014-06-26 2014-06-26 Light can be applied through the substrate method
JP2015123605A JP2016009192A (ja) 2014-06-26 2015-06-19 光透過性カバー部材の貼り付け方法
CN201510361946.5A CN105303967A (zh) 2014-06-26 2015-06-26 光可透过基材的贴合方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW103122088A TWI518412B (zh) 2014-06-26 2014-06-26 Light can be applied through the substrate method

Publications (2)

Publication Number Publication Date
TW201600907A TW201600907A (zh) 2016-01-01
TWI518412B true TWI518412B (zh) 2016-01-21

Family

ID=55201157

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103122088A TWI518412B (zh) 2014-06-26 2014-06-26 Light can be applied through the substrate method

Country Status (3)

Country Link
JP (1) JP2016009192A (ja)
CN (1) CN105303967A (ja)
TW (1) TWI518412B (ja)

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007056162A (ja) * 2005-08-25 2007-03-08 Toagosei Co Ltd 半硬化工程を含む成型品製造用の光硬化性組成物
JP2007293143A (ja) * 2006-04-27 2007-11-08 Epson Imaging Devices Corp 液晶パネルの製造方法および液晶パネル
JP2009285643A (ja) * 2008-06-02 2009-12-10 Fujifilm Corp 積層体とバリア性フィルム基板の製造方法、デバイスおよび光学部材
EP2521116A4 (en) * 2009-12-28 2013-10-02 Asahi Glass Co Ltd METHOD FOR PRODUCING A DISPLAY DEVICE
JP5757292B2 (ja) * 2010-12-08 2015-07-29 旭硝子株式会社 粘着層付き透明面材、表示装置およびそれらの製造方法
JP2012158688A (ja) * 2011-02-01 2012-08-23 Asahi Glass Co Ltd 樹脂硬化物の製造方法、積層体の製造方法および積層体
JP5138820B1 (ja) * 2012-01-25 2013-02-06 デクセリアルズ株式会社 画像表示装置の製造方法
JP2013184997A (ja) * 2012-03-06 2013-09-19 Hitachi Chemical Co Ltd 液状光硬化性樹脂組成物及びそれを用いた画像表示装置、その製造方法
EP2852487B8 (en) * 2012-05-22 2021-01-20 Henkel IP & Holding GmbH Process for binding substrates with a liquid optically clear photo-curable adhesive
JP5994618B2 (ja) * 2012-12-14 2016-09-21 デクセリアルズ株式会社 光硬化性樹脂組成物及びそれを用いた画像表示装置の製造方法

Also Published As

Publication number Publication date
CN105303967A (zh) 2016-02-03
TW201600907A (zh) 2016-01-01
JP2016009192A (ja) 2016-01-18

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