TWI516423B - A method for manufacturing a cover for a hermetic seal, an electronic component storage case, and a sealing material for hermetic sealing - Google Patents

A method for manufacturing a cover for a hermetic seal, an electronic component storage case, and a sealing material for hermetic sealing Download PDF

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Publication number
TWI516423B
TWI516423B TW100142851A TW100142851A TWI516423B TW I516423 B TWI516423 B TW I516423B TW 100142851 A TW100142851 A TW 100142851A TW 100142851 A TW100142851 A TW 100142851A TW I516423 B TWI516423 B TW I516423B
Authority
TW
Taiwan
Prior art keywords
layer
thermal expansion
expansion coefficient
electronic component
metal substrate
Prior art date
Application number
TW100142851A
Other languages
English (en)
Chinese (zh)
Other versions
TW201238857A (en
Inventor
Masaharu Yamamoto
Original Assignee
Hitachi Metals Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Metals Ltd filed Critical Hitachi Metals Ltd
Publication of TW201238857A publication Critical patent/TW201238857A/zh
Application granted granted Critical
Publication of TWI516423B publication Critical patent/TWI516423B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
    • H03H9/1014—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
TW100142851A 2011-02-07 2011-11-23 A method for manufacturing a cover for a hermetic seal, an electronic component storage case, and a sealing material for hermetic sealing TWI516423B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011023775 2011-02-07

Publications (2)

Publication Number Publication Date
TW201238857A TW201238857A (en) 2012-10-01
TWI516423B true TWI516423B (zh) 2016-01-11

Family

ID=46638312

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100142851A TWI516423B (zh) 2011-02-07 2011-11-23 A method for manufacturing a cover for a hermetic seal, an electronic component storage case, and a sealing material for hermetic sealing

Country Status (5)

Country Link
JP (1) JPWO2012108083A1 (ja)
KR (1) KR101594231B1 (ja)
CN (1) CN103354950B (ja)
TW (1) TWI516423B (ja)
WO (1) WO2012108083A1 (ja)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101674333B1 (ko) * 2012-11-12 2016-11-22 히타치 긴조쿠 가부시키가이샤 기밀 밀봉용 덮개재 및 전자 부품 수납용 패키지
JP6164538B2 (ja) * 2014-10-30 2017-07-19 日立金属株式会社 気密封止用リッドおよびその製造方法、それを用いた電子部品収納パッケージ
JP6485020B2 (ja) * 2014-12-02 2019-03-20 日立金属株式会社 ガラス接合用材および複層ガラス
TWI686968B (zh) * 2015-02-26 2020-03-01 日商日本電氣硝子股份有限公司 氣密封裝及其製造方法
DE102019119961A1 (de) * 2019-07-24 2021-01-28 Schott Ag Hermetisch verschlossene transparente Kavität und deren Umhäusung
CN113328725B (zh) * 2021-05-21 2024-04-05 武汉衍熙微器件有限公司 声波谐振结构、滤波器及声波谐振结构的制造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0756886B2 (ja) * 1989-05-17 1995-06-14 住友特殊金属株式会社 半導体パッケージの製造方法
CN100365803C (zh) * 2003-02-06 2008-01-30 株式会社新王材料 气密封用盖帽及其制造方法
JP2008271093A (ja) * 2007-04-19 2008-11-06 Daishinku Corp 圧電振動デバイス
JP7056886B2 (ja) * 2015-09-28 2022-04-19 リンテック株式会社 粘着シート、及び粘着シートの製造方法

Also Published As

Publication number Publication date
KR101594231B1 (ko) 2016-02-15
CN103354950B (zh) 2016-12-07
JPWO2012108083A1 (ja) 2014-07-03
TW201238857A (en) 2012-10-01
CN103354950A (zh) 2013-10-16
KR20140001967A (ko) 2014-01-07
WO2012108083A1 (ja) 2012-08-16

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MM4A Annulment or lapse of patent due to non-payment of fees