TWI515318B - 靶材背管之磁鐵配置，包括該磁鐵配置的靶材背管，圓柱狀靶材組件及濺射系統 - Google Patents
靶材背管之磁鐵配置，包括該磁鐵配置的靶材背管，圓柱狀靶材組件及濺射系統 Download PDFInfo
- Publication number
- TWI515318B TWI515318B TW100125162A TW100125162A TWI515318B TW I515318 B TWI515318 B TW I515318B TW 100125162 A TW100125162 A TW 100125162A TW 100125162 A TW100125162 A TW 100125162A TW I515318 B TWI515318 B TW I515318B
- Authority
- TW
- Taiwan
- Prior art keywords
- magnet
- axis
- target
- plane
- arrangement
- Prior art date
Links
- 238000004544 sputter deposition Methods 0.000 title claims description 33
- 210000002381 plasma Anatomy 0.000 description 72
- 239000000758 substrate Substances 0.000 description 43
- 239000000463 material Substances 0.000 description 9
- 238000000034 method Methods 0.000 description 7
- 238000000429 assembly Methods 0.000 description 6
- 230000000712 assembly Effects 0.000 description 6
- 239000007789 gas Substances 0.000 description 5
- 230000008901 benefit Effects 0.000 description 4
- 150000002500 ions Chemical class 0.000 description 4
- 238000000576 coating method Methods 0.000 description 3
- 239000012141 concentrate Substances 0.000 description 3
- 238000000151 deposition Methods 0.000 description 3
- 239000010408 film Substances 0.000 description 3
- 238000005477 sputtering target Methods 0.000 description 3
- 239000013077 target material Substances 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 235000012431 wafers Nutrition 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 239000000446 fuel Substances 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 230000005381 magnetic domain Effects 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000005693 optoelectronics Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- -1 window coatings Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
- H01J37/3405—Magnetron sputtering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3414—Targets
- H01J37/342—Hollow targets
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/345—Magnet arrangements in particular for cathodic sputtering apparatus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/345—Magnet arrangements in particular for cathodic sputtering apparatus
- H01J37/3452—Magnet distribution
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3461—Means for shaping the magnetic field, e.g. magnetic shunts
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP20100169891 EP2407999B1 (en) | 2010-07-16 | 2010-07-16 | Magnet arrangement for a target backing tube, target backing tube including the same, cylindrical target assembly and sputtering system |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201207140A TW201207140A (en) | 2012-02-16 |
| TWI515318B true TWI515318B (zh) | 2016-01-01 |
Family
ID=43383469
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW100125162A TWI515318B (zh) | 2010-07-16 | 2011-07-15 | 靶材背管之磁鐵配置，包括該磁鐵配置的靶材背管，圓柱狀靶材組件及濺射系統 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US9005414B2 (https=) |
| EP (1) | EP2407999B1 (https=) |
| JP (1) | JP5844808B2 (https=) |
| KR (1) | KR101573667B1 (https=) |
| CN (1) | CN103003915B (https=) |
| TW (1) | TWI515318B (https=) |
| WO (1) | WO2012007256A1 (https=) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20140126517A (ko) * | 2013-04-23 | 2014-10-31 | 주식회사 아바코 | 마그넷 유닛 및 이를 구비하는 스퍼터링 장치 |
| KR101913791B1 (ko) * | 2014-07-22 | 2018-11-01 | 어플라이드 머티어리얼스, 인코포레이티드 | 타겟 어레인지먼트, 그를 구비한 프로세싱 장치 및 그의 제조 방법 |
| US11008650B2 (en) | 2016-11-03 | 2021-05-18 | Starfire Industries Llc | Compact system for coupling RF power directly into RF linacs |
| US12211679B2 (en) | 2019-02-25 | 2025-01-28 | Starfire Industries Llc | Method and apparatus for metal and ceramic nanolayering for accident tolerant nuclear fuel, particle accelerators, and aerospace leading edges |
| US11056323B2 (en) * | 2017-11-01 | 2021-07-06 | Ulvac, Inc. | Sputtering apparatus and method of forming film |
| JP7097172B2 (ja) * | 2017-11-21 | 2022-07-07 | キヤノントッキ株式会社 | スパッタリング装置 |
| JP6673590B2 (ja) * | 2017-12-27 | 2020-03-25 | キヤノントッキ株式会社 | スパッタ成膜装置 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4525264A (en) * | 1981-12-07 | 1985-06-25 | Ford Motor Company | Cylindrical post magnetron sputtering system |
| JPH04346662A (ja) * | 1991-05-22 | 1992-12-02 | Ube Ind Ltd | スパッタリング方法およびその装置 |
| EP0805880A4 (en) * | 1995-01-12 | 1998-05-06 | Boc Group Inc | ROTATABLE MICROWAVE WITH CURVED OR SEGMENTED MAGNETS |
| US6306265B1 (en) * | 1999-02-12 | 2001-10-23 | Applied Materials, Inc. | High-density plasma for ionized metal deposition capable of exciting a plasma wave |
| US20020046945A1 (en) * | 1999-10-28 | 2002-04-25 | Applied Materials, Inc. | High performance magnetron for DC sputtering systems |
| DE10336422A1 (de) * | 2003-08-08 | 2005-03-17 | Applied Films Gmbh & Co. Kg | Vorrichtung zur Kathodenzerstäubung |
| EP1825494A1 (en) * | 2004-12-17 | 2007-08-29 | Unaxis Balzers Aktiengesellschaft | Magnetron sputtering apparatus |
-
2010
- 2010-07-16 EP EP20100169891 patent/EP2407999B1/en active Active
- 2010-07-20 US US12/840,021 patent/US9005414B2/en active Active
-
2011
- 2011-06-22 WO PCT/EP2011/060517 patent/WO2012007256A1/en not_active Ceased
- 2011-06-22 CN CN201180034908.9A patent/CN103003915B/zh active Active
- 2011-06-22 KR KR1020137003864A patent/KR101573667B1/ko active Active
- 2011-06-22 JP JP2013519013A patent/JP5844808B2/ja active Active
- 2011-07-15 TW TW100125162A patent/TWI515318B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| WO2012007256A1 (en) | 2012-01-19 |
| CN103003915A (zh) | 2013-03-27 |
| JP2013534568A (ja) | 2013-09-05 |
| TW201207140A (en) | 2012-02-16 |
| EP2407999B1 (en) | 2014-09-03 |
| KR101573667B1 (ko) | 2015-12-02 |
| EP2407999A1 (en) | 2012-01-18 |
| US20120012458A1 (en) | 2012-01-19 |
| US9005414B2 (en) | 2015-04-14 |
| CN103003915B (zh) | 2016-09-07 |
| JP5844808B2 (ja) | 2016-01-20 |
| KR20130038384A (ko) | 2013-04-17 |
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