TWI513843B - 蓋體 - Google Patents

蓋體 Download PDF

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Publication number
TWI513843B
TWI513843B TW101101304A TW101101304A TWI513843B TW I513843 B TWI513843 B TW I513843B TW 101101304 A TW101101304 A TW 101101304A TW 101101304 A TW101101304 A TW 101101304A TW I513843 B TWI513843 B TW I513843B
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TW
Taiwan
Prior art keywords
cover body
end surface
joint
container
cover
Prior art date
Application number
TW101101304A
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English (en)
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TW201329274A (zh
Inventor
Shao Kai Pei
Original Assignee
Hon Hai Prec Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hon Hai Prec Ind Co Ltd filed Critical Hon Hai Prec Ind Co Ltd
Priority to TW101101304A priority Critical patent/TWI513843B/zh
Priority to US13/420,552 priority patent/US8714392B2/en
Publication of TW201329274A publication Critical patent/TW201329274A/zh
Application granted granted Critical
Publication of TWI513843B publication Critical patent/TWI513843B/zh

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    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34Sputtering
    • C23C14/46Sputtering by ion beam produced by an external ion source
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/564Means for minimising impurities in the coating chamber such as dust, moisture, residual gases

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Closures For Containers (AREA)

Description

蓋體
本發明涉及一種在離子輔助蒸鍍中使用的蓋體。
在離子輔助蒸鍍鍍膜工藝中,一般將膜料放入鉗鍋內,並經由電子束打擊坩鍋內的膜料表面,使其受熱熔融後冷卻形成平整表面,以供後續真空鍍膜使用。膜料在熔化或鍍膜過程中常常會噴出微小顆粒(副產物),通常會先用蓋體遮住使其不噴發到被鍍基材上。待穩定後再打開蓋體,此時膜料被噴發至被鍍基材上成膜。
當鍍膜時間太長時,蓋體上的膜層由於附著太厚而發生脫膜。脫落的膜層掉落到鉗鍋內而被電子束再次蒸發至被鍍基材上,就會造成鍍膜的品質降低。同時在鍍膜完成後,由於大量水汽灌入腔體,蓋體上的膜層吸收水汽後容易脫落至鉗鍋內,造成鉗鍋的清洗困難。
有鑒於此,有必要提供一種有效防止膜層脫落回鉗鍋的蓋體。
本發明提供一種蓋體,其用於蓋在一裝有膜料的容器上,該蓋體包括與容器相對的第一端面以及沿著徑向延伸的若干分流道,該第一端面上開設一容置腔,該容置腔內固定有一遮擋網,所述遮擋網用於附著從所述容器中噴出的顆粒物,若干分流道用於容置一定溫度範圍的液體,從而保持該蓋體處於預定的溫度範圍內。
使用本發明之蓋體能夠有效附著從所述容器中噴出的顆粒物並形成膜層,同時能夠避免膜層脫落會容器內,進而保證基板鍍膜的品質。
參考圖1,其示意出一種在離子輔助蒸鍍中使用的蓋體1,該蓋體1用於蓋在開設有一腔體20的容器2上方。該腔體20用於放置膜料,如二氧化矽等。在離子輔助蒸鍍鍍膜工藝中,一般將膜料放入容器2的腔體20內,並經由電子束打擊容器2內的膜料表面,使得膜料受熱熔融後冷卻形成平整表面,以供後續鍍膜使用。在熔化膜料或鍍膜過程中,膜料容易噴出微小顆粒物於蓋體1上並形成膜層。本發明的蓋體1能夠有效避免膜層脫落而重新落回容器2內,進而影響基板鍍膜的品質。
一併參考圖2,蓋體1為一體成型且大致呈圓盤狀,包括第一端面11、與第一端面11背對的第二端面12及位於其間的側面13。第一端面11上開設有一容置腔110,其中容置腔110與上述容器2腔體20的形狀和尺寸相對應。該容置腔110內固定有一遮擋網112,用於有效附著從腔體20噴出的微小顆粒物並在其上形成膜層。第二端面12上凸起有一第一接頭120,其中第一接頭120上設有一進口流道122。側面13上凸起有一連接部130和第二接頭132,其中第二接頭132上開設有一出口流道134。連接部130用於方便用戶將蓋體1從容器2上取下。
一併參考圖3和圖4,蓋體1還包括與進口流道122連通的一中間孔14、若干分流道15、及與出口流道134連通的一環流道16。若干分流道15沿著蓋體1的徑向均勻分佈,其兩端分別與上述中間孔14和環流道16連通。
工作時,第一接頭120與裝有一定溫度液體的管道(圖中未示)連接,液體經進口流道122、中間孔14、若干分流道15、環流道16最後流出口流道134,用於使得蓋體1的溫度維持在一定範圍內,進而能夠避免在開蓋或合蓋時蓋體1的溫度急劇上升或下降導致膜層從蓋體1脫落至容器2的腔體20內。
儘管對本發明的優選實施方式進行了說明和描述,但是本領域的技術人員將領悟到,可以作出各種不同的變化和改進,這些都不超出本發明的真正範圍。因此期望,本發明並不局限於所公開的作為實現本發明所設想的最佳模式的具體實施方式,本發明包括的所有實施方式都有所附權利要求書的保護範圍內。
1...蓋體
11...第一端面
110...容置腔
112...遮擋網
12...第二端面
120...第一接頭
122...進口流道
13...側面
130...連接部
132...第二接頭
134...出口流道
14...中間孔
15...分流道
16...環流道
2...容器
20...腔體
圖1係本發明一較佳實施方式蓋體的立體圖。
圖2係圖1所示蓋體蓋設於某一容器上方的立體圖。
圖3係圖1所示蓋體III-III方向上的剖面視圖。
圖4係圖1所示蓋體IV-IV方向上的剖面視圖。
1...蓋體
11...第一端面
110...容置腔
112...遮擋網
12...第二端面
120...第一接頭
122...進口流道
13...側面

Claims (7)

  1. 一種蓋體,用於蓋在一裝有膜料的容器上,該蓋體包括與容器相對的第一端面以及沿著徑向延伸的若干分流道,該第一端面上開設一容置腔,該容置腔內固定有一遮擋網,所述遮擋網用於附著從所述容器中噴出的顆粒物,若干分流道用於容置一定溫度範圍的液體,從而保持該蓋體處於預定的溫度範圍內。
  2. 如申請專利範圍第1項所述之蓋體,其中:所述蓋體為一體成型。
  3. 如申請專利範圍第1項所述之蓋體,其中:所述蓋體還包括與第一端面背對的第二端面,該第二端面凸起有一第一接頭,其中第一接頭上開設有與若干分流道連通的進口流道。
  4. 如申請專利範圍第3項所述之蓋體,其中:所述蓋體還開設有一中間孔,該中間孔分別連通上述進口流道和若干分流道。
  5. 如申請專利範圍第3項所述之蓋體,其中:所述蓋體還包括連接上述若干分流道的環流道。
  6. 如申請專利範圍第5項所述之蓋體,其中:所述蓋體還包括位於第一端面和第二端面之間的側面,該側面上凸起有一第二接頭,該第二接頭上開設有與環流道連通的出口流道。
  7. 如申請專利範圍第6項所述之蓋體,其中:所述側面還包括有一連接部。
TW101101304A 2012-01-12 2012-01-12 蓋體 TWI513843B (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW101101304A TWI513843B (zh) 2012-01-12 2012-01-12 蓋體
US13/420,552 US8714392B2 (en) 2012-01-12 2012-03-14 Lid for use in ion beam assisted deposition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW101101304A TWI513843B (zh) 2012-01-12 2012-01-12 蓋體

Publications (2)

Publication Number Publication Date
TW201329274A TW201329274A (zh) 2013-07-16
TWI513843B true TWI513843B (zh) 2015-12-21

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Application Number Title Priority Date Filing Date
TW101101304A TWI513843B (zh) 2012-01-12 2012-01-12 蓋體

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US (1) US8714392B2 (zh)
TW (1) TWI513843B (zh)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5107990A (en) * 1990-03-14 1992-04-28 Devon Industries, Inc. Rigid closure lid to a disposable container for holding and disposing of used medical sharps and other medical-surgical materials
WO2002046042A2 (en) * 2000-12-04 2002-06-13 Ivex Packaging Corporation Skrinkable trays with attachable lids
EP1559650B1 (en) * 2004-01-23 2007-02-28 Taller Autorema, s.l. Automatic bagging machine of lids in self-adhesive bags
TWM407890U (en) * 2011-01-28 2011-07-21 Ming-Te Lin Container and lid structure thereof

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9123509B2 (en) * 2007-06-29 2015-09-01 Varian Semiconductor Equipment Associates, Inc. Techniques for plasma processing a substrate

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5107990A (en) * 1990-03-14 1992-04-28 Devon Industries, Inc. Rigid closure lid to a disposable container for holding and disposing of used medical sharps and other medical-surgical materials
WO2002046042A2 (en) * 2000-12-04 2002-06-13 Ivex Packaging Corporation Skrinkable trays with attachable lids
EP1559650B1 (en) * 2004-01-23 2007-02-28 Taller Autorema, s.l. Automatic bagging machine of lids in self-adhesive bags
TWM407890U (en) * 2011-01-28 2011-07-21 Ming-Te Lin Container and lid structure thereof

Also Published As

Publication number Publication date
US8714392B2 (en) 2014-05-06
US20130180987A1 (en) 2013-07-18
TW201329274A (zh) 2013-07-16

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