TWI503537B - 量測測量目標之方法（一） - Google Patents

量測測量目標之方法（一） Download PDF

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Publication number
TWI503537B
TWI503537B TW103104428A TW103104428A TWI503537B TW I503537 B TWI503537 B TW I503537B TW 103104428 A TW103104428 A TW 103104428A TW 103104428 A TW103104428 A TW 103104428A TW I503537 B TWI503537 B TW I503537B
Authority
TW
Taiwan
Prior art keywords
color
solder
illumination
image
information
Prior art date
Application number
TW103104428A
Other languages
English (en)
Chinese (zh)
Other versions
TW201421014A (zh
Inventor
Joong Ki Jeong
Min Young Kim
Hee Wook You
Original Assignee
Koh Young Tech Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020090041514A external-priority patent/KR101059697B1/ko
Priority claimed from KR1020100043731A external-priority patent/KR101215910B1/ko
Application filed by Koh Young Tech Inc filed Critical Koh Young Tech Inc
Publication of TW201421014A publication Critical patent/TW201421014A/zh
Application granted granted Critical
Publication of TWI503537B publication Critical patent/TWI503537B/zh

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G01B11/0608—Height gauges
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G01B11/25—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures by projecting a pattern, e.g. one or more lines, moiré fringes on the object
    • G01B11/2509—Color coding
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G01B11/25—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures by projecting a pattern, e.g. one or more lines, moiré fringes on the object
    • G01B11/2518—Projection by scanning of the object
    • G01B11/2527—Projection by scanning of the object with phase change by in-plane movement of the patern
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G01N2021/8845—Multiple wavelengths of illumination or detection
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N2021/95638—Inspecting patterns on the surface of objects for PCB's
    • G01N2021/95646—Soldering
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/10—Image acquisition modality
    • G06T2207/10024—Color image
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/10—Image acquisition modality
    • G06T2207/10028—Range image; Depth image; 3D point clouds
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30141—Printed circuit board [PCB]
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30152—Solder

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Biochemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Quality & Reliability (AREA)
  • Theoretical Computer Science (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
TW103104428A 2009-05-13 2010-05-12 量測測量目標之方法（一） TWI503537B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR1020090041514A KR101059697B1 (ko) 2009-05-13 2009-05-13 인쇄회로기판상의 측정대상물의 측정방법
KR20100034057 2010-04-14
KR1020100043731A KR101215910B1 (ko) 2010-04-14 2010-05-11 인쇄회로기판 상의 솔더 영역의 측정방법

Publications (2)

Publication Number Publication Date
TW201421014A TW201421014A (zh) 2014-06-01
TWI503537B true TWI503537B (zh) 2015-10-11

Family

ID=46730124

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103104428A TWI503537B (zh) 2009-05-13 2010-05-12 量測測量目標之方法（一）

Country Status (4)

Country Link
JP (1) JP5622816B2 (de)
CN (1) CN102654466B (de)
DE (1) DE102010064640B3 (de)
TW (1) TWI503537B (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI616726B (zh) * 2015-04-10 2018-03-01 Ａｓｍｌ荷蘭公司 用於檢測及度量衡的方法與設備

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104535587A (zh) * 2014-12-23 2015-04-22 安徽科鸣三维科技有限公司 一种基于机器视觉的pcba焊点检测方法
JP6939501B2 (ja) * 2017-12-15 2021-09-22 オムロン株式会社 画像処理システム、画像処理プログラム、および画像処理方法
CN109752392B (zh) * 2018-12-24 2021-08-03 苏州江奥光电科技有限公司 一种pcb板缺陷类型检测系统和方法
CN112122175B (zh) * 2020-08-12 2021-08-10 浙江大学 一种色选机的物料增强特征识别剔选方法
CN112801948B (zh) * 2021-01-14 2023-08-08 广州大学 印刷电路板的板线缺陷检测方法、系统和存储介质

Citations (3)

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TW200720678A (en) * 2005-08-30 2007-06-01 Jsr Corp Circuit board inspection instrument, circuit board inspection method, and anisotropic conductivity connector
TW200731891A (en) * 2005-06-22 2007-08-16 Omron Tateisi Electronics Co Board inspecting apparatus, its parameter setting method and parameter setting apparatus
US20070281380A1 (en) * 2004-09-01 2007-12-06 Oki Electric Industry Co., Ltd. Manufacturing method of an acceleration sensing device

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US5031300A (en) * 1989-06-15 1991-07-16 Corning Incorporated Method of making optical devices
JP3032616B2 (ja) * 1991-08-01 2000-04-17 日立電子株式会社 外観検査方法及び装置
JP3179874B2 (ja) * 1992-07-23 2001-06-25 松下電器産業株式会社 画像検査装置のティーチング方法とティーチング装置
JP3119743B2 (ja) * 1992-11-19 2000-12-25 松下電器産業株式会社 実装検査装置
JP3269516B2 (ja) * 1995-11-02 2002-03-25 オムロン株式会社 実装基板検査装置
JPH09229872A (ja) * 1996-02-27 1997-09-05 Omron Corp はんだ目視検査装置
JP3533050B2 (ja) * 1996-08-21 2004-05-31 日本電信電話株式会社 画像領域分割装置
JP2002163650A (ja) * 2000-11-27 2002-06-07 Matsushita Electric Works Ltd 色抽出画像処理装置および色抽出方法
JP3597484B2 (ja) * 2001-03-23 2004-12-08 シーケーディ株式会社 はんだ印刷検査装置
JP2003121115A (ja) * 2001-10-16 2003-04-23 Nikke Kikai Seisakusho:Kk 外観検査装置および外観検査方法
US7474799B2 (en) * 2002-06-12 2009-01-06 Silicon Optix Inc. System and method for electronic correction of optical anomalies
JP4166587B2 (ja) * 2003-01-24 2008-10-15 株式会社サキコーポレーション 外観検査装置および体積検査方法
JP2005172640A (ja) * 2003-12-12 2005-06-30 Matsushita Electric Ind Co Ltd 実装検査装置および実装検査方法
JP4736764B2 (ja) 2005-01-11 2011-07-27 オムロン株式会社 基板検査装置並びにその検査ロジック設定方法および検査ロジック設定装置
CN101150733A (zh) * 2006-09-22 2008-03-26 华邦电子股份有限公司 影像像素干扰的补偿方法
JP2009036736A (ja) * 2007-08-04 2009-02-19 Djtech Co Ltd 印刷半田検査方法及び装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070281380A1 (en) * 2004-09-01 2007-12-06 Oki Electric Industry Co., Ltd. Manufacturing method of an acceleration sensing device
TW200731891A (en) * 2005-06-22 2007-08-16 Omron Tateisi Electronics Co Board inspecting apparatus, its parameter setting method and parameter setting apparatus
TW200720678A (en) * 2005-08-30 2007-06-01 Jsr Corp Circuit board inspection instrument, circuit board inspection method, and anisotropic conductivity connector

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI616726B (zh) * 2015-04-10 2018-03-01 Ａｓｍｌ荷蘭公司 用於檢測及度量衡的方法與設備
US11580274B2 (en) 2015-04-10 2023-02-14 Asml Netherlands B.V. Method and apparatus for inspection and metrology

Also Published As

Publication number Publication date
JP2013011622A (ja) 2013-01-17
JP5622816B2 (ja) 2014-11-12
CN102654466B (zh) 2014-07-09
DE102010064640B3 (de) 2018-05-09
TW201421014A (zh) 2014-06-01
CN102654466A (zh) 2012-09-05

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