TWI502630B - 熱處理裝置 - Google Patents
熱處理裝置 Download PDFInfo
- Publication number
- TWI502630B TWI502630B TW101106709A TW101106709A TWI502630B TW I502630 B TWI502630 B TW I502630B TW 101106709 A TW101106709 A TW 101106709A TW 101106709 A TW101106709 A TW 101106709A TW I502630 B TWI502630 B TW I502630B
- Authority
- TW
- Taiwan
- Prior art keywords
- gas supply
- gas
- heating portion
- heat treatment
- reaction tube
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/34—Nitrides
- C23C16/345—Silicon nitride
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/301—AIII BV compounds, where A is Al, Ga, In or Tl and B is N, P, As, Sb or Bi
- C23C16/303—Nitrides
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/46—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for heating the substrate
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27B—FURNACES, KILNS, OVENS, OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
- F27B17/00—Furnaces of a kind not covered by any preceding group
- F27B17/0016—Chamber type furnaces
- F27B17/0025—Especially adapted for treating semiconductor wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/0262—Reduction or decomposition of gaseous compounds, e.g. CVD
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- General Engineering & Computer Science (AREA)
- Chemical Vapour Deposition (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011049194A JP5645718B2 (ja) | 2011-03-07 | 2011-03-07 | 熱処理装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201303969A TW201303969A (zh) | 2013-01-16 |
TWI502630B true TWI502630B (zh) | 2015-10-01 |
Family
ID=46795880
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW101106709A TWI502630B (zh) | 2011-03-07 | 2012-03-01 | 熱處理裝置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US9039411B2 (ko) |
JP (1) | JP5645718B2 (ko) |
KR (1) | KR101489553B1 (ko) |
CN (1) | CN102677018B (ko) |
TW (1) | TWI502630B (ko) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012172871A (ja) * | 2011-02-18 | 2012-09-10 | Tokyo Electron Ltd | 熱処理装置および熱処理装置の温度測定方法 |
JP5702657B2 (ja) * | 2011-04-18 | 2015-04-15 | 東京エレクトロン株式会社 | 熱処理装置 |
US20170207078A1 (en) * | 2016-01-15 | 2017-07-20 | Taiwan Semiconductor Manufacturing Co., Ltd. | Atomic layer deposition apparatus and semiconductor process |
JP6462161B2 (ja) | 2016-02-09 | 2019-01-30 | 株式会社Kokusai Electric | 基板処理装置および半導体装置の製造方法 |
JP1565116S (ko) * | 2016-02-10 | 2016-12-12 | ||
CN106288792B (zh) * | 2016-08-09 | 2018-11-27 | 宿州市威菱耐火材料有限责任公司 | 一种新型钢包砖热处理装置及处理方法 |
CN106123575B (zh) * | 2016-08-09 | 2018-10-09 | 宿州市威菱耐火材料有限责任公司 | 一种转炉座砖的热处理装置及处理方法 |
CN106247792B (zh) * | 2016-08-09 | 2018-11-23 | 宿州市威菱耐火材料有限责任公司 | 一种出钢口的热处理装置及处理方法 |
CN106247795B (zh) * | 2016-08-09 | 2018-11-27 | 宿州市威菱耐火材料有限责任公司 | 一种耐高温钢包砖的热处理装置及处理方法 |
CN106288793B (zh) * | 2016-08-09 | 2019-04-02 | 宿州市威菱耐火材料有限责任公司 | 一种耐高温出钢口的热处理装置及处理方法 |
CN108570656B (zh) * | 2018-05-16 | 2020-02-18 | 深圳市硅光半导体科技有限公司 | 一种氮化硅膜的制作方法及氮化硅膜 |
JP7055075B2 (ja) * | 2018-07-20 | 2022-04-15 | 東京エレクトロン株式会社 | 熱処理装置及び熱処理方法 |
JPWO2021039270A1 (ko) * | 2019-08-30 | 2021-03-04 | ||
JP1706320S (ko) * | 2021-06-28 | 2022-01-31 | ||
CN114388654B (zh) * | 2021-12-13 | 2023-10-24 | 泰州隆基乐叶光伏科技有限公司 | 一种硅片加热装置及方法 |
Citations (2)
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US6241822B1 (en) * | 1999-01-19 | 2001-06-05 | Nec Corporation | Vertical heat treatment apparatus |
US20090191718A1 (en) * | 2006-12-12 | 2009-07-30 | Hitachi Kokusai Electric Inc. | Substrate processing apparatus, method of manufacturing semiconductor device, and reaction vessel |
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JP5722595B2 (ja) * | 2010-11-11 | 2015-05-20 | 株式会社日立国際電気 | 基板処理装置および半導体装置の製造方法 |
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JP5702657B2 (ja) * | 2011-04-18 | 2015-04-15 | 東京エレクトロン株式会社 | 熱処理装置 |
JP5868619B2 (ja) * | 2011-06-21 | 2016-02-24 | ニチアス株式会社 | 熱処理炉及び熱処理装置 |
JP6026351B2 (ja) * | 2013-04-26 | 2016-11-16 | 東京エレクトロン株式会社 | 成膜装置のクリーニング方法および成膜装置 |
-
2011
- 2011-03-07 JP JP2011049194A patent/JP5645718B2/ja active Active
-
2012
- 2012-03-01 TW TW101106709A patent/TWI502630B/zh active
- 2012-03-01 US US13/409,426 patent/US9039411B2/en active Active
- 2012-03-06 KR KR20120022700A patent/KR101489553B1/ko active IP Right Grant
- 2012-03-07 CN CN201210058464.9A patent/CN102677018B/zh active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6241822B1 (en) * | 1999-01-19 | 2001-06-05 | Nec Corporation | Vertical heat treatment apparatus |
US20090191718A1 (en) * | 2006-12-12 | 2009-07-30 | Hitachi Kokusai Electric Inc. | Substrate processing apparatus, method of manufacturing semiconductor device, and reaction vessel |
Also Published As
Publication number | Publication date |
---|---|
KR101489553B1 (ko) | 2015-02-03 |
JP5645718B2 (ja) | 2014-12-24 |
CN102677018A (zh) | 2012-09-19 |
CN102677018B (zh) | 2015-11-25 |
US20120231407A1 (en) | 2012-09-13 |
KR20120102011A (ko) | 2012-09-17 |
TW201303969A (zh) | 2013-01-16 |
US9039411B2 (en) | 2015-05-26 |
JP2012186367A (ja) | 2012-09-27 |
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