TWI500789B - Film forming device - Google Patents

Film forming device Download PDF

Info

Publication number
TWI500789B
TWI500789B TW103113674A TW103113674A TWI500789B TW I500789 B TWI500789 B TW I500789B TW 103113674 A TW103113674 A TW 103113674A TW 103113674 A TW103113674 A TW 103113674A TW I500789 B TWI500789 B TW I500789B
Authority
TW
Taiwan
Prior art keywords
film forming
evaporation
film
hearth
forming material
Prior art date
Application number
TW103113674A
Other languages
English (en)
Chinese (zh)
Other versions
TW201444995A (zh
Inventor
Toshiyuki Sakemi
Masaru Miyashita
Hisashi Kitami
Original Assignee
Sumitomo Heavy Industries
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Heavy Industries filed Critical Sumitomo Heavy Industries
Publication of TW201444995A publication Critical patent/TW201444995A/zh
Application granted granted Critical
Publication of TWI500789B publication Critical patent/TWI500789B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/02—Pretreatment of the material to be coated
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3435—Applying energy to the substrate during sputtering
    • C23C14/3442—Applying energy to the substrate during sputtering using an ion beam
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • C23C14/354—Introduction of auxiliary energy into the plasma
    • C23C14/358—Inductive energy
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54—Controlling or regulating the coating process

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Physical Vapour Deposition (AREA)
TW103113674A 2013-05-27 2014-04-15 Film forming device TWI500789B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013110963A JP6054249B2 (ja) 2013-05-27 2013-05-27 成膜装置

Publications (2)

Publication Number Publication Date
TW201444995A TW201444995A (zh) 2014-12-01
TWI500789B true TWI500789B (zh) 2015-09-21

Family

ID=51960072

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103113674A TWI500789B (zh) 2013-05-27 2014-04-15 Film forming device

Country Status (4)

Country Link
JP (1) JP6054249B2 (ko)
KR (2) KR20140139408A (ko)
CN (1) CN104178735A (ko)
TW (1) TWI500789B (ko)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111945117A (zh) * 2019-05-16 2020-11-17 住友重机械工业株式会社 成膜装置
JP2021107570A (ja) * 2019-12-27 2021-07-29 住友重機械工業株式会社 成膜装置
CN111411337B (zh) * 2020-03-31 2021-05-04 中国科学院兰州化学物理研究所 一种励磁调制阳极辅助磁控溅射离子镀膜系统
DE102020124270A1 (de) 2020-09-17 2022-03-17 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung eingetragener Verein Verfahren und Vorrichtung zur anodischen Bogenverdampfung
JP2022119452A (ja) * 2021-02-04 2022-08-17 住友重機械工業株式会社 処理装置

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5240583A (en) * 1992-01-14 1993-08-31 Honeywell Inc. Apparatus to deposit multilayer films
EP0269446B1 (en) * 1986-11-26 1993-10-06 Optical Coating Laboratory, Inc. Apparatus and method for vacuum deposition of thin films
EP0384617B1 (en) * 1989-02-17 1994-05-25 Optical Coating Laboratory, Inc. System and method for vacuum deposition of thin films
TW373029B (en) * 1997-02-19 1999-11-01 Applied Materials Inc Methods and apparatus for forming HDP-CVD PSG film used for advanced pre-metal dielectric layer applications
US6124003A (en) * 1998-04-02 2000-09-26 Nissin Electric Co., Ltd. Film depositing method and film depositing apparatus
TW438901B (en) * 1997-10-09 2001-06-07 Applied Komatsu Technology Inc Apparatus for depositing a film with a four-corners grounded susceptor
TW473865B (en) * 1999-11-10 2002-01-21 Nippon Electric Co Plasma CVD apparatus for large area CVD film
TWI359878B (en) * 2007-03-12 2012-03-11 Kochi Ind Promotion Ct Plasma cvd apparatus and film deposition method

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6347362A (ja) * 1986-08-15 1988-02-29 Toobi:Kk イオンプレ−テイング装置
JP3023747B2 (ja) * 1994-05-31 2000-03-21 住友重機械工業株式会社 イオンプレーティング装置
JP2946402B2 (ja) * 1994-12-28 1999-09-06 住友重機械工業株式会社 プラズマ処理方法及びプラズマ処理装置
US5677012A (en) * 1994-12-28 1997-10-14 Sumitomo Heavy Industries, Ltd. Plasma processing method and plasma processing apparatus
JP3120368B2 (ja) * 1997-05-09 2000-12-25 住友重機械工業株式会社 真空成膜装置
CN1149303C (zh) * 1997-09-26 2004-05-12 住友重机械工业株式会社 离子喷镀装置
JPH11354468A (ja) * 1998-06-09 1999-12-24 Sumitomo Heavy Ind Ltd バリア膜の成膜方法
JP2000026953A (ja) * 1998-07-09 2000-01-25 Sumitomo Heavy Ind Ltd プラズマ処理方法及びプラズマ処理装置
JP2001348662A (ja) 2000-06-05 2001-12-18 Sumitomo Heavy Ind Ltd 成膜方法及び装置
JP2002030426A (ja) * 2000-07-07 2002-01-31 Sumitomo Heavy Ind Ltd 成膜方法及び装置
JP2005042157A (ja) * 2003-07-28 2005-02-17 Sumitomo Heavy Ind Ltd イオンプレーティング装置およびその方法
JP2007154229A (ja) 2005-12-01 2007-06-21 Sumitomo Heavy Ind Ltd 成膜装置
CN101652498B (zh) * 2007-04-24 2011-06-15 佳能安内华股份有限公司 等离子生成设备和使用等离子生成设备的膜形成设备

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0269446B1 (en) * 1986-11-26 1993-10-06 Optical Coating Laboratory, Inc. Apparatus and method for vacuum deposition of thin films
EP0384617B1 (en) * 1989-02-17 1994-05-25 Optical Coating Laboratory, Inc. System and method for vacuum deposition of thin films
US5240583A (en) * 1992-01-14 1993-08-31 Honeywell Inc. Apparatus to deposit multilayer films
TW373029B (en) * 1997-02-19 1999-11-01 Applied Materials Inc Methods and apparatus for forming HDP-CVD PSG film used for advanced pre-metal dielectric layer applications
TW438901B (en) * 1997-10-09 2001-06-07 Applied Komatsu Technology Inc Apparatus for depositing a film with a four-corners grounded susceptor
US6124003A (en) * 1998-04-02 2000-09-26 Nissin Electric Co., Ltd. Film depositing method and film depositing apparatus
EP0947603B1 (en) * 1998-04-02 2007-06-13 Nissin Electric Co., Ltd. Film depositing method and apparatus
TW473865B (en) * 1999-11-10 2002-01-21 Nippon Electric Co Plasma CVD apparatus for large area CVD film
TWI359878B (en) * 2007-03-12 2012-03-11 Kochi Ind Promotion Ct Plasma cvd apparatus and film deposition method

Also Published As

Publication number Publication date
TW201444995A (zh) 2014-12-01
KR20160113534A (ko) 2016-09-29
JP2014227597A (ja) 2014-12-08
KR101773889B1 (ko) 2017-09-01
KR20140139408A (ko) 2014-12-05
CN104178735A (zh) 2014-12-03
JP6054249B2 (ja) 2016-12-27

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