TWI500789B - Film forming device - Google Patents
Film forming device Download PDFInfo
- Publication number
- TWI500789B TWI500789B TW103113674A TW103113674A TWI500789B TW I500789 B TWI500789 B TW I500789B TW 103113674 A TW103113674 A TW 103113674A TW 103113674 A TW103113674 A TW 103113674A TW I500789 B TWI500789 B TW I500789B
- Authority
- TW
- Taiwan
- Prior art keywords
- film forming
- evaporation
- film
- hearth
- forming material
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/02—Pretreatment of the material to be coated
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3435—Applying energy to the substrate during sputtering
- C23C14/3442—Applying energy to the substrate during sputtering using an ion beam
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
- C23C14/354—Introduction of auxiliary energy into the plasma
- C23C14/358—Inductive energy
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Physical Vapour Deposition (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013110963A JP6054249B2 (ja) | 2013-05-27 | 2013-05-27 | 成膜装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201444995A TW201444995A (zh) | 2014-12-01 |
TWI500789B true TWI500789B (zh) | 2015-09-21 |
Family
ID=51960072
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW103113674A TWI500789B (zh) | 2013-05-27 | 2014-04-15 | Film forming device |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6054249B2 (ko) |
KR (2) | KR20140139408A (ko) |
CN (1) | CN104178735A (ko) |
TW (1) | TWI500789B (ko) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111945117A (zh) * | 2019-05-16 | 2020-11-17 | 住友重机械工业株式会社 | 成膜装置 |
JP2021107570A (ja) * | 2019-12-27 | 2021-07-29 | 住友重機械工業株式会社 | 成膜装置 |
CN111411337B (zh) * | 2020-03-31 | 2021-05-04 | 中国科学院兰州化学物理研究所 | 一种励磁调制阳极辅助磁控溅射离子镀膜系统 |
DE102020124270A1 (de) | 2020-09-17 | 2022-03-17 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung eingetragener Verein | Verfahren und Vorrichtung zur anodischen Bogenverdampfung |
JP2022119452A (ja) * | 2021-02-04 | 2022-08-17 | 住友重機械工業株式会社 | 処理装置 |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5240583A (en) * | 1992-01-14 | 1993-08-31 | Honeywell Inc. | Apparatus to deposit multilayer films |
EP0269446B1 (en) * | 1986-11-26 | 1993-10-06 | Optical Coating Laboratory, Inc. | Apparatus and method for vacuum deposition of thin films |
EP0384617B1 (en) * | 1989-02-17 | 1994-05-25 | Optical Coating Laboratory, Inc. | System and method for vacuum deposition of thin films |
TW373029B (en) * | 1997-02-19 | 1999-11-01 | Applied Materials Inc | Methods and apparatus for forming HDP-CVD PSG film used for advanced pre-metal dielectric layer applications |
US6124003A (en) * | 1998-04-02 | 2000-09-26 | Nissin Electric Co., Ltd. | Film depositing method and film depositing apparatus |
TW438901B (en) * | 1997-10-09 | 2001-06-07 | Applied Komatsu Technology Inc | Apparatus for depositing a film with a four-corners grounded susceptor |
TW473865B (en) * | 1999-11-10 | 2002-01-21 | Nippon Electric Co | Plasma CVD apparatus for large area CVD film |
TWI359878B (en) * | 2007-03-12 | 2012-03-11 | Kochi Ind Promotion Ct | Plasma cvd apparatus and film deposition method |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6347362A (ja) * | 1986-08-15 | 1988-02-29 | Toobi:Kk | イオンプレ−テイング装置 |
JP3023747B2 (ja) * | 1994-05-31 | 2000-03-21 | 住友重機械工業株式会社 | イオンプレーティング装置 |
JP2946402B2 (ja) * | 1994-12-28 | 1999-09-06 | 住友重機械工業株式会社 | プラズマ処理方法及びプラズマ処理装置 |
US5677012A (en) * | 1994-12-28 | 1997-10-14 | Sumitomo Heavy Industries, Ltd. | Plasma processing method and plasma processing apparatus |
JP3120368B2 (ja) * | 1997-05-09 | 2000-12-25 | 住友重機械工業株式会社 | 真空成膜装置 |
CN1149303C (zh) * | 1997-09-26 | 2004-05-12 | 住友重机械工业株式会社 | 离子喷镀装置 |
JPH11354468A (ja) * | 1998-06-09 | 1999-12-24 | Sumitomo Heavy Ind Ltd | バリア膜の成膜方法 |
JP2000026953A (ja) * | 1998-07-09 | 2000-01-25 | Sumitomo Heavy Ind Ltd | プラズマ処理方法及びプラズマ処理装置 |
JP2001348662A (ja) | 2000-06-05 | 2001-12-18 | Sumitomo Heavy Ind Ltd | 成膜方法及び装置 |
JP2002030426A (ja) * | 2000-07-07 | 2002-01-31 | Sumitomo Heavy Ind Ltd | 成膜方法及び装置 |
JP2005042157A (ja) * | 2003-07-28 | 2005-02-17 | Sumitomo Heavy Ind Ltd | イオンプレーティング装置およびその方法 |
JP2007154229A (ja) | 2005-12-01 | 2007-06-21 | Sumitomo Heavy Ind Ltd | 成膜装置 |
CN101652498B (zh) * | 2007-04-24 | 2011-06-15 | 佳能安内华股份有限公司 | 等离子生成设备和使用等离子生成设备的膜形成设备 |
-
2013
- 2013-05-27 JP JP2013110963A patent/JP6054249B2/ja active Active
-
2014
- 2014-04-15 TW TW103113674A patent/TWI500789B/zh active
- 2014-04-18 KR KR20140046566A patent/KR20140139408A/ko active Application Filing
- 2014-04-21 CN CN201410160005.0A patent/CN104178735A/zh active Pending
-
2016
- 2016-09-21 KR KR1020160120702A patent/KR101773889B1/ko active IP Right Grant
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0269446B1 (en) * | 1986-11-26 | 1993-10-06 | Optical Coating Laboratory, Inc. | Apparatus and method for vacuum deposition of thin films |
EP0384617B1 (en) * | 1989-02-17 | 1994-05-25 | Optical Coating Laboratory, Inc. | System and method for vacuum deposition of thin films |
US5240583A (en) * | 1992-01-14 | 1993-08-31 | Honeywell Inc. | Apparatus to deposit multilayer films |
TW373029B (en) * | 1997-02-19 | 1999-11-01 | Applied Materials Inc | Methods and apparatus for forming HDP-CVD PSG film used for advanced pre-metal dielectric layer applications |
TW438901B (en) * | 1997-10-09 | 2001-06-07 | Applied Komatsu Technology Inc | Apparatus for depositing a film with a four-corners grounded susceptor |
US6124003A (en) * | 1998-04-02 | 2000-09-26 | Nissin Electric Co., Ltd. | Film depositing method and film depositing apparatus |
EP0947603B1 (en) * | 1998-04-02 | 2007-06-13 | Nissin Electric Co., Ltd. | Film depositing method and apparatus |
TW473865B (en) * | 1999-11-10 | 2002-01-21 | Nippon Electric Co | Plasma CVD apparatus for large area CVD film |
TWI359878B (en) * | 2007-03-12 | 2012-03-11 | Kochi Ind Promotion Ct | Plasma cvd apparatus and film deposition method |
Also Published As
Publication number | Publication date |
---|---|
TW201444995A (zh) | 2014-12-01 |
KR20160113534A (ko) | 2016-09-29 |
JP2014227597A (ja) | 2014-12-08 |
KR101773889B1 (ko) | 2017-09-01 |
KR20140139408A (ko) | 2014-12-05 |
CN104178735A (zh) | 2014-12-03 |
JP6054249B2 (ja) | 2016-12-27 |
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