TWI498208B - Laminating apparatus of plate material - Google Patents

Description

Plate-shaped component bonding device

The present invention relates to a laminating apparatus which is a laminating device which presses a plate-shaped member to another plate-like member by a roller and bonds the two plate-shaped members.

In general, when a first plate-like member such as a liquid crystal panel or a touch panel is bonded to a second plate-like member having a protective glass like a protective glass, it is extremely important that air bubbles are not mixed between the members. The incorporation of air bubbles causes a decrease in display quality and also causes peeling.

Conventionally, the bonding apparatus is attached under vacuum to prevent air bubbles from entering. In this type of bonding apparatus, the first plate-shaped member and the second plate-shaped member are introduced into the vacuum chamber before the bonding, and the vacuum extraction in the room is performed. After the bonding is completed, the vacuum in the room is released and the first plate-shaped member and the second plate-shaped member are taken out. However, this bonding apparatus must be vacuum-extracted every time a large-scale vacuum chamber or the like is performed, and therefore has a so-called low productivity problem.

In order to reduce the above-mentioned problems, the conventional bonding apparatus is disclosed, for example, in the Japanese Patent Publication No. 2009-40617. As shown in FIG. 19, the bonding apparatus has the second plate-shaped member 101 adsorbed on the lower surface of the stage 30 by the suction nozzle 30a. Further, the bonding apparatus has a plurality of adsorbing bodies 31 arranged side by side in the horizontal direction, and the first plate-shaped member 100 is kept adsorbed by the adsorption nozzles 31a on the respective adsorbing bodies 31. Further, before the bonding, the first plate-like member 100 and the second plate-like member 101 are separated by a predetermined interval.

The bonding is performed by pressing the first plate-shaped member 100 against the second plate-like member 101 by the roller 32, and the roller 32 is caused to travel in the direction of the arrow in FIG. As shown in FIG. 19, the absorbing body 31 that hinders the travel of the roller 32 is sequentially retracted in accordance with the travel of the roller 32. Further, the portion of the first plate-shaped member 100 that has not been bonded is held by the adsorbing body 31 and is separated from the second plate-shaped member 101. Therefore, the first plate-shaped member 100 is bonded while being bent.

According to this bonding apparatus, the roller 32 is pressed and pressed while pressing out the air bubbles. Therefore, it is possible to prevent air bubbles from being mixed between the first plate-shaped member 100 and the second plate-like member 101, and no vacuum chamber or the like is required. .

In the bonding apparatus described in Japanese Laid-Open Patent Publication No. 2009-40617, the force of separating the first plate-shaped member 100 from the adsorbing body 31, that is, the bending of the main body of the first plate-shaped member 100 is released during bonding. the power of. This force tends to become larger as the first plate-shaped member 100 becomes smaller. Further, when the force exceeds the suction force generated by the adsorption nozzle 31a, the first plate-like member 100 is separated from the adsorption body 31, and is bonded to the second plate-like member 101 before the roller 32 is pressed.

Therefore, this bonding apparatus is difficult to adhere to the relatively small first plate-shaped member 100 (for example, a liquid crystal panel having a diagonal length of 5 inches or less) while preventing air bubbles from entering.

Accordingly, an object of the present invention is to provide a bonding apparatus which can prevent bubbles from being mixed in when a small plate-shaped member is bonded.

In order to solve the above problems, the bonding apparatus according to the present invention positions a first plate-shaped member placed on a bonding stage and a second plate-shaped member positioned above the first plate-shaped member. After the position, the second plate-shaped member is pressed against the first plate-shaped member by a roller, and the relative position of the roller relative to the first plate-shaped member and the second plate-shaped member is changed in the bonding direction, and The roller travels to bond the second plate member to the first plate member. Wherein, the second plate-shaped member has a pasting end portion and a pasting end portion. The tip end portion is initially attached to one end portion on the side of the first plate member. The attaching terminal portion is finally attached to one end portion on the side of the first plate-shaped member. The sticking end portion supports at least the lower side by a lower and lower bolster portion, and restricts the lower portion from moving, so that the portion of the second plate-shaped member that has not been pressed by the roller does not contact the first plate-shaped member.

In an embodiment of the present invention, the height and the thrust of the pillow portion are controlled so that the roller is moved while the stress applied to the second plate member is minimized so as not to exceed the inherent value of the second plate member. The range of bending stress is allowed, and the necessary bonding angle of the bonding is ensured to be a specified bonding angle of the first plate-shaped member and the second plate-shaped member.

Further, the bonding device cooperates with the progress of the roller, and the height of the pillow portion is lowered in a controlled manner.

Further, the shape of the pillow portion of the bonding device can restrict the shape in which the terminal portion is moved downward and in the bonding direction.

In order to solve the above problems, another bonding apparatus according to the present invention presses a second plate-shaped member to a first plate-like member by a roller, and moves relative to the first plate in the bonding direction. And a relative position of the roller of the second material and the second plate-shaped member, wherein the second plate-shaped member is bonded to the first plate-shaped member, the bonding device includes a first stage, a pillow portion, and a second stage. A roller, a horizontal moving mechanism, a loading platform lifting mechanism, a roller lifting mechanism and a pillow driving mechanism. The first stage can hold the first plate-shaped member from the lower side. The pillow portion is provided on the end side of the first plate-shaped member in the fitting direction. The second stage is located above the first stage, and the second plate-shaped member can be adsorbed from the upper side such that a bonding surface of the second plate-shaped member and the first plate-shaped member are opposed to each other. The roller is disposed on the current side of the bonding direction of the second plate member. The horizontal moving mechanism horizontally moves the roller and the second plate-like member in the fitting direction, or horizontally moves the first stage and the pillow in the opposite direction of the bonding direction. The stage lifting mechanism causes the second stage to move up and down between an approaching position close to the first stage and a stage retracting position located above the approaching position. The roller lifting mechanism causes the roller to move up and down between the pressing position of the second plate-shaped member and the roller retracting position of the first plate-shaped member and the roller retracting position above the pressing position. The occipital driving mechanism changes the thrust toward the upper portion of the occipital portion, and causes the height of the occipital portion to sink at a first position protruding above the abutting surface of the first plate-shaped member that the first stage remains adsorbed A second position changes up and down. Before the start of the bonding, the second stage is at the retracted position of the stage, the roller is at the retracted position of the roller, and the occiput is at the first position. The bonding unit integrates the first plate-shaped member and the second plate-shaped member by changing a relative position of the first stage holding the first plate-shaped member and the second stage holding the second plate-shaped member by the horizontal moving mechanism After the integration, the stage lifting mechanism lowers the second stage to the approximate position, and the second plate portion The end portion of the material is in contact with the pillow portion, and the front end portion of the second plate member is not in contact with the first plate member. Thereafter, the roller lifting mechanism lowers the roller to the pressing position to determine the sticker of the second plate member. The starting end portion is pressed against the first plate-shaped member. After the pressing state, the horizontal moving mechanism changes the relative position of the roller relative to the first plate-shaped member and the second plate-shaped member in the bonding direction. While changing the relative position of the roller, the pillow driving mechanism changes the thrust and height of the pillow portion, and minimizes the stress applied to the second plate member so as not to exceed the allowable bending stress inherent to the second plate member. The range and the required bonding angle of the bonding are the specified bonding angles of the first plate-shaped member and the second plate-shaped member.

According to the above configuration, since the bonding apparatus according to the present invention restricts the sticking end portion of the second plate-shaped member from moving downward by a pillow portion, the second board can be surely prevented before the roller is pressed. The member and the first plate member are brought into contact with each other in a state in which the air bubbles are mixed. Further, according to the present invention, it is possible to quickly perform lamination of a relatively small plate-shaped member without requiring a large-scale vacuum chamber or the like.

Further, according to the present invention, the height and the thrust of the pillow portion can be controlled during the fitting, and therefore, it is possible to prevent the second plate-shaped member from being damaged due to too much bending.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of a bonding apparatus according to the present invention will be described with reference to the related drawings.

[composition]

Fig. 1 is a side schematic view showing the bonding apparatus of the first embodiment. The bonding apparatus 1 is a device in which the second plate-shaped member 101 is bonded to the first plate-shaped member 100. In the present embodiment, the first plate member 100 is a touch panel, and the second plate member 101 is a cover glass made of soda glass having a thickness of 1.0 mm. The first plate-shaped member 100 may be a liquid crystal panel in addition to the above objects. Further, the second plate-shaped member 101 may be a soda glass having a thickness of about 0.5 to 2.0 mm or a resin (for example, polycarbonate or acrylic) having a thickness of about 1.0 to 3.0 mm.

In the present embodiment, the length of the second plate-like member 101 in the bonding direction is longer than that of the first plate-like member 100. Further, the second plate-shaped member 101 has the attachment end portion 101b and the attachment end portion 101c, and the second plate-like member 101 protrudes (the protruding portion) from the first plate-like member 100 in the horizontal direction of either end portion.

As shown in FIG. 1, the bonding apparatus 1 has a stage moving mechanism 4. The stage moving mechanism 4 has a driving mechanism for bonding the stage 6, the pillow portion 7, and the pillow portion 7, a pillow portion driving mechanism 8, a front end 10, and a driving mechanism for the front end 10, and a front end driving mechanism 11. The upper surface of the bonding stage 6 has a driving mechanism for the roller 14 and the roller 14, and a roller driving mechanism 15.

The stage moving mechanism 4 moves along at least the direction in which the bonding direction is opposite (refer to FIG. 1) along the designated rail. The stage moving mechanism 4 is horizontally moved under the control of the control unit 20 described later. When the stage moving mechanism 4 moves in the opposite direction of the bonding direction, the bonding stage 6, the pillow portion 7, and the front end 10 of the device are also moved together, and the bonding stage 6, the pillow portion 7, and the front end 10 are changed. The relative position to the roller 14. That is, the roller 14 is relatively fitted The stage 6, the pillow portion 7, and the front end 10 relatively move in the fitting direction.

The bonding stage 6 has a horizontal mounting surface and a plurality of adsorption nozzles 6a mounted on the mounting surface for placing the first plate-shaped member 100 conveyed from the apparatus of the prior art. Each of the adsorption nozzles 6a is connected to a pump 21 not shown, and under the control of the control unit 20, when the pump 21 is actuated, the first plate-shaped member 100 placed on the mounting surface is held upwardly. Being adsorbed. Further, a transparent adhesive layer 102 is formed on all or a part of the bonding surface of the first plate-shaped member 100, and the first plate-shaped member 100 and the second plate-shaped member 101 are bonded together by the adhesive layer 102.

In addition, the bonding stage 6 can also be moved horizontally separately. Accordingly, the relative position of the first plate-like member 100 held by the bonding on the bonding stage 6 and the second plate-like member 101 placed on the pillow portion 7 and the front end 10 can be finely adjusted.

The pillow portion 7 and the pillow portion driving mechanism 8 are attached to the end side of the bonding stage 6 in the bonding direction. Among them, the pillow portion 7 supports the second plate-like member 101, and restricts the sticking end portion 101c from moving downward. Further, the occipital portion driving mechanism 8 changes the thrust force toward the upper portion of the occipital portion 7, and also causes the height (the amount of protrusion) of the occipital portion 7 to protrude above the adhesive layer 102 of the first plate-like member 100 which is held by the adhering stage 6 The position changes from top to bottom with the position where the adhesive layer 102 sinks. The occipital drive mechanism 8 performs this operation under the control of the control unit 20.

The front end 10 and the front end drive mechanism 11 are disposed on the current side of the bonding stage of the bonding stage 6. Among them, the front end 10 supports the second plate-shaped member 101 and restricts the lower end portion 101b from moving downward. Further, the front end drive mechanism 11 causes the front end 10 to repeatedly move in the up and down direction. The front end drive mechanism 11 performs this operation under the control of the control unit 20.

The roller lift mechanism 15 is disposed between the top of the device not shown and the roller 14. The roller lifting mechanism 15 is mainly configured as a cylinder. Under the control of the control unit 20, as the roller lifting mechanism 15 expands and contracts, the roller 14 also moves up and down. Thereby, the roller 14 is lowered to the pressing position to press the second plate-like member 101 against the first plate-like member 100 (adhesive layer 102) or at the roller retracting position above the pressing position.

Fig. 2 is a block diagram of the bonding apparatus 1 of the first embodiment. As described above, the control unit 20 controls the operations of the stage moving mechanism 4, the pillow driving mechanism 8, the front end driving mechanism 11, the roller lifting mechanism 15, and the pump 21, respectively.

The stage moving mechanism 4 changes, for example, the relative position of the bonding stage 6 (more specifically, the first plate-shaped member 100 and the second plate-shaped member 101 on the bonding stage 6) and the roller 14. The pillow driving mechanism 8 changes the amount of protrusion or thrust of the pillow portion 7. The front end drive mechanism 11 causes the front end 10 to repeatedly move in the up and down direction. The roller lifting mechanism 15 causes the roller 14 to move up and down. Further, the pump 21 operates the adsorption nozzle 6a of the bonding stage 6, and holds the first plate-shaped member 100 on the mounting surface of the bonding stage 6.

[Fitting action]

Next, the bonding operation of the bonding apparatus 1 of the present embodiment will be described with reference to FIG. 3. Further, the bonding is performed in the order of Fig. 3A → Fig. 3B → Fig. 3C.

Fig. 3A shows an initial state before the start of bonding. The first plate-shaped member 100 is held and held on the mounting surface of the bonding stage 6. Further, the second plate-shaped member 101 having the bonding surface 101a downward is placed on the upper surface of the pillow portion 7 and the distal end 10. As shown in FIG. 3A, the heights of the front end 10 and the upper portion of the pillow portion 7 are uniform. Therefore, in the initial state, the second plate-shaped member 101 supported by the distal end 10 and the pillow portion 7 is approximately parallel to the first plate-shaped member 100 held by the bonding stage 6 and adsorbed thereon. Further, the second plate member 101 is spaced apart from the adhesive layer 102 of the first plate member 100 by about 6 mm.

Before the initial state, the relative position of the first plate member 100 and the second plate member 101 is finely adjusted by moving the bonding stage 6. The fine adjustment is measured by the camera looking at the first plate-shaped member 100 and the second plate-shaped member 101, and is adjusted according to the offset amount from the reference position of the first plate-shaped member 100 and the second plate-shaped member 101, respectively.

Fig. 3B shows a state in which the roller lifting mechanism 15 is extended so that the roller 14 is lowered to the pressing position. When the roller 14 is lowered, the pressing end portion 101b of the second plate-like member 101 is pressed downward in the vertical direction to be bonded to the adhesive layer 102 of the first plate-shaped member 100. At this time, the roller lifting mechanism 15 controls the pressing force from the roller 14 to prevent the second plate member 101 and the first plate member 100 from being damaged or the like. When the second plate member 101 is pressed down, the front end 10 also descends. On the other hand, the pillow portion 7 is maintained at a position protruding above the adhesive layer 102. Therefore, the second plate-like member 102 is bent as shown in FIG. 3B.

3C, the stage moving mechanism 4 moves in the opposite direction of the bonding direction, and the relative position of the second plate-shaped member 101 and the first plate-shaped member 100 is relatively changed by the roller 14 in the bonding direction, and the bonding operation is performed. status. When the pressing force is continued, the relative position of the roller 14 in the bonding direction is continuously changed, and the first plate member 100 and the second plate member 101 are continuously bonded from the side of the bonding end portion 101b toward the side of the bonding terminal portion 101c.

In the bonding operation between FIG. 3B and FIG. 3C, the pillow driving mechanism 8 changes the thrust and the height toward the upper side of the pillow portion 7 (the amount of protrusion h, see FIG. 4).

Specifically, the pillow driving mechanism 8 changes the amount of protrusion h of the pillow portion 7 to ensure the specified fitting angle θ. Here, as shown in FIG. 4, the "bonding angle θ" is an angle between the line L1 and the horizontal line L2 that connect the bonding position of the front surface of the roller 4 to the end portion of the second plate-shaped member 101. Empirically, the fit angle θ must be 5 degrees or more. When the bonding angle θ is less than 5 degrees and has not been pressed by the roller 14, the first plate-like member 100 comes into contact with the second plate-like portion 101 first, and is adhered to the air bubbles.

When the length of the first plate-shaped member 100 in the bonding direction is about 60 mm, the upper surface of the pillow portion 7 must be larger than the adhesive layer 102 in order to ensure a 5 degree fitting angle at the start of bonding (to fit the remaining length of 60 mm). More prominently about 6mm above. Further, when the bonding is performed, when the remaining length of the bonding is 30 mm, if the pillow portion 7 is protruded by about 3 mm in advance, a bonding angle of 5 degrees can be secured. That is, the amount of protrusion h of the pillow portion 7 can be continuously reduced in accordance with the progress of the bonding.

Further, the pillow driving mechanism 8 changes the thrust P of the pillow portion 7 so that the bending stress σ of the second plate-like member 101 in the bonding does not exceed the allowable bending stress σ' inherent to the second plate member 101. The specific composition is the bending moment M=the thrust P fits the remaining length l

The bending stress σ = the relationship of the bending by the moment M / the section coefficient Z, and therefore, for example, in the case where the bending stress σ' is allowed to be 1084 MPa, the maximum value P _max of the thrust P of the occipital portion 7 becomes P _max = (1084 megabytes). The profile coefficient Z) / fit the remaining length l. Here, the section coefficient Z means the strength of the material depending on the shape of the section.

As the amount of protrusion h of the pillow portion 7 increases, the curvature of the second plate-like member 101 will also increase, and the force of the second plate-like member 101 to push the pillow portion 7 downward in the vertical direction will also increase. Therefore, in order to resist this force, the thrust P increases. Further, when the thrust P exceeds the above P _max , the second plate member 101 is damaged. Therefore, in order to ensure the control of the bonding angle θ, the pillow driving mechanism 8 reduces the amount of protrusion h of the pillow portion 7 when the thrust P is about to exceed the above P _max , so that the second plate member 101 is prevented from being damaged. Further, the bending of the second plate member 101 is preferably small, and therefore, the pillow driving mechanism 8 performs the above control to minimize the thrust P.

5A, 5B, and 5C are graphs from the start of bonding to the end of bonding: FIG. 5A is a bending stress σ; FIG. 5B is a thrust P of the pillow portion 7; and FIG. 5C is a protruding amount h of the pillow portion 7. With the appropriate control of the thrust P (Fig. 5B), as shown in Fig. 5A, it can be seen that the variation of the bending stress σ does not vary beyond the allowable bending stress σ' (1084 MPa). Further, as shown in Fig. 5C, it can be seen that the amount of protrusion h of the pillow portion 7 is high at the beginning of the bonding, and thereafter has a tendency to slowly continue to decrease.

When the bonding operation is completed, the bonding stage 6 stops sucking the first plate-shaped member 100. Next, the first plate-shaped member 100 and the second plate-shaped member 101 are transferred to a device for subsequent work.

[Second embodiment]

Fig. 6 is a side view showing the bonding apparatus of the second embodiment. In this embodiment, the length of the second plate-shaped member 101 in the bonding direction is the first The plate-shaped member 100 is long. Further, the sticking end portion 101c of the second plate-like member 101 protrudes (with a protruding portion) from the first plate-like member 100, and the leading end portion 101b of the second plate-like member 101 coincides with the end of the first plate-like member 100. There are no prominent parts.

The bonding apparatus 1A has a pillow portion 7A and a front end 10A. The pillow portion 7A supports the sticking end portion 101c of the second plate-shaped member 101, and restricts the sticking end portion 101c from moving downward and in the bonding direction. The front end 10A supports the attachment end portion 101b of the second plate-shaped member 101, and restricts the attachment end portion 101b from moving in the opposite direction to the attachment direction. That is, in the present embodiment, the second plate-like member 101 is embedded in the horizontal direction by the front end 10A and the pillow portion 7A.

The other constitution is the same as that of the bonding apparatus 1 of the first embodiment, and therefore, the description is omitted here.

The bonding of the bonding apparatus 1A of the present embodiment is performed in the order of Fig. 6A → Fig. 6B → Fig. 6C.

Fig. 6B is an initial state shown in Fig. 6A, showing a state in which the roller lifting mechanism 15 is extended to lower the roller 14 to the pressing position. When the roller 14 is lowered, the leading end portion 101b of the second plate member 101 is pressed downward in the vertical direction, and is bonded to the adhesive layer 102 of the first plate member 100. When the second plate member 101 is pressed down, the front end 10A also descends. On the other hand, the pillow portion 7A is maintained at a position protruding above the adhesive layer 102. Therefore, the second plate-like member 102 is bent as shown in FIG. 6B.

The distal end 10A is driven by the distal end drive mechanism 11 under the control of the control unit 20, and presses the proximal end portion 101b of the second plate-shaped member 101 in the bonding direction, and presses the terminal portion 101c against the pillow portion 7A. One side decline. Next, when the initial end portion 101b of the second plate-like member 101 is attached to the adhesive layer 102, the tip end 10A stops pressing the pasting end portion 101b in the bonding direction in accordance with an instruction from the control portion 20.

6C, the stage moving mechanism 4 is moved in the opposite direction of the bonding direction, and the relative position of the second plate member 101 and the first plate member 100 is relatively changed by the roller 14 in the bonding direction, and the display is performed after the bonding operation. status. In the bonding operation performed between FIG. 6B and FIG. 6C, the pillow driving mechanism 8 changes the thrust and the height (the amount of protrusion h) toward the upper side of the pillow portion 7A (see, for example, FIGS. 5A, 5B, and 5C).

When the bonding operation is completed, the bonding stage 6 stops sucking the first plate-shaped member 100. Next, the first plate-shaped member 100 and the second plate-shaped member 101 are transferred to a device for subsequent work.

[Third embodiment]

Figure 7 is a side elevational view of the bonding apparatus of the third embodiment. In the present embodiment, the length of the second plate-like member 101 in the fitting direction is shorter than that of the first plate-like member 100. Further, the protruding portion of the second plate-shaped member 101 with respect to the first plate-shaped member 100 does not exist in either of the attaching end portion 101b and the attaching end portion 101c.

The bonding apparatus 1B has a pillow portion 7B and a front end 10B. The pillow portion 7B supports the sticking end portion 101c of the second plate-shaped member 101, and restricts the sticking end portion 101c from moving downward and in the bonding direction. The front end 10B supports the attachment end portion 101b of the second plate-like member 101, and restricts the attachment end portion 101b from moving in the opposite direction to the attachment direction. That is, in the present embodiment, the second plate-like member 101 is embedded in the horizontal direction by the front end 10B and the pillow portion 7B. Also, the pillow 7B is limited The portion where the labeling terminal portion 101c moves downward is formed to be thinner than the thickness of the adhesive layer 102.

The other configuration is the same as that of the bonding apparatus 1A of the second embodiment, and therefore, the description thereof will be omitted.

The bonding of the bonding apparatus 1B of the present embodiment is performed in the order of Fig. 7A → Fig. 7B → Fig. 7C.

Fig. 7B shows a state in which the roller lifting mechanism 15 is extended so that the roller 14 is lowered to the pressing position from the initial state shown in Fig. 7A. When the roller 14 is lowered, the leading end portion 101b of the second plate member 101 is pressed downward in the vertical direction, and is bonded to the adhesive layer 102 of the first plate member 100. When the second plate member 101 is pressed down, the front end 10B also descends. On the other hand, the pillow portion 7B is maintained at a position protruding above the adhesive layer 102. Therefore, the second plate-like member 102 is bent as shown in Fig. 7B.

The distal end 10B is driven by the distal end drive mechanism 11 under the control of the control unit 20, and presses the proximal end portion 101b of the second plate-shaped member 101 in the bonding direction, and presses the terminal portion 101c against the pillow portion 7B. The steps are falling on one side. Next, when the initial end portion 101b of the second plate-shaped member 101 is attached to the adhesive layer 102, the tip end 10B stops pressing the pasting end portion 101b in the bonding direction in accordance with an instruction from the control unit 20.

7C, the stage moving mechanism 4 is moved in the opposite direction of the bonding direction, and the relative position of the second plate-shaped member 101 and the first plate-shaped member 100 is relatively changed by the roller 14 in the bonding direction, thereby indicating that the bonding operation is completed. status. The bonding operation performed between FIG. 7B and FIG. 7C causes the occipital portion driving mechanism 8 to push the thrust and the height above the pillow portion 7B (see, for example, FIG. 5A, Figures 5B and 5C) are changed. Further, the roller 14 approaches the sticking end portion 101c, and the pillow portion 7 is pushed out by the roller 14 at the final stage of the bonding, or is driven by the pillow driving mechanism 8 under the control of the control unit 20 to move in the bonding direction.

When the bonding operation is completed, the bonding stage 6 stops sucking the first plate-shaped member 100. Next, the first plate-shaped member 100 and the second plate-shaped member 101 are transferred to a device for subsequent work.

The shape of the pillow portion is not limited to the above embodiment, and various modifications are also conceivable. In the modified example, for example, there are pillow portions 7', 7", 7"' as shown in Figs. 8A to 8C. In summary, the shape of the pillow portion can limit the end of the second plate member 101. The shape of the portion 101c moving downward and in the bonding direction may be any shape. However, as in the third embodiment, when the second plate member 101 does not exist with respect to the protruding portion of the first plate member 100, it is necessary to The thickness d is formed to be thinner than the thickness of the adhesive layer 102 in the portion where the fixing end portion 101c is moved downward.

[Fourth embodiment]

[composition]

Fig. 9 is a side schematic view showing the bonding apparatus of the fourth embodiment. As shown in Fig. 9, the bonding apparatus 1C has a base 2 and a base top 3 which are mounted on the ground. The abutment top 3 is the top of the base 2 and is fixed to the base 2 by a post or the like not shown.

The bonding device 1C has a horizontal moving mechanism 4. The horizontal movement mechanism 4 corresponds to the stage moving mechanism 4 of the bonding apparatus 1 in the first embodiment. Therefore, the horizontal movement mechanism 4 has the preparation stage 5 and the first stage 6 (phase The bonding stage 6) of the first embodiment, the pillow portion 7, the pillow driving mechanism 8, the front end 10, and the front end driving mechanism 11. Further, the lower side of the base top 3 has a second stage 12, a stage elevating mechanism 13, a roller 14, and a roller lifting mechanism 15.

The base 2 is provided with a guide rail formed in parallel with the bonding direction. Under the control of the control unit 20, the horizontal moving mechanism 4 moves horizontally along this guide rail. When the horizontal moving mechanism 4 moves in the opposite direction of the bonding direction or the bonding direction, the preparation stage 5, the first stage 6, and the like on which the apparatus is mounted will also move together to change the preparation stage 5 and the first stage 6 The relative position to the second stage 12 and the roller 14 is equal.

The preparation stage 5 has a horizontal placement surface and a plurality of adsorption nozzles 5a mounted on the placement surface, and the placement surface is for placing the second plate-shaped member 101 that has been transferred from the apparatus of the prior art. Each of the adsorption nozzles 5a is connected to a pump 21 (not shown). Under the control of the control unit 20, when the pump 21 is actuated, the second plate-like member 101 placed on the mounting surface is held downward. Being adsorbed.

The first stage 6 has a horizontal mounting surface and a plurality of adsorption nozzles 6a mounted on the mounting surface for placing the first plate-shaped member 100 conveyed from the apparatus of the prior art. Each of the adsorption nozzles 6a is connected to a pump 21 (not shown), and under the control of the control unit 20, when the pump 21 is operated, the first plate-shaped member 100 placed on the mounting surface is held in the facing surface. Being adsorbed.

The pillow portion 7 and the pillow portion driving mechanism 8 are disposed between the first stage 6 and the preparation stage 5. In other words, the pillow portion 7 and the pillow driving mechanism 8 are installed in the first load. The end side of the fitting direction of the table 6. The occipital drive mechanism 8 changes the thrust toward the upper portion of the occipital portion 7C, and also causes the height of the occipital portion 7C to protrude from the first position of the first plate-like member 100 that is held by the first plate 6 The second position where the fitting surface sinks changes up and down. The occipital portion and the drive mechanism 8 perform this operation under the control of the control unit 20.

The front end 10C and the front drive mechanism 11 are disposed on the current side of the bonding direction of the first stage 6. The front end drive mechanism 11 causes the front end 10C to repeatedly move in the up and down direction and the bonding direction. The front end drive mechanism 11 performs this operation under the control of the control unit 20.

The second stage 12 has a horizontal holding surface and a plurality of adsorption nozzles 12a disposed on the holding surface, and the holding surface is for conveying the second plate-shaped member 101 placed on the preparation stage 5. Each of the adsorption nozzles 12a is connected to a pump 21 (not shown). Under the control of the control unit 20, when the pump 21 is operated, the second plate-like member 101 is held in contact with the bonding surface.

The stage lifting mechanism 13 is disposed between the abutment top 3 and the second stage 12. The stage elevating mechanism 13 is mainly configured as a cylinder. Under the control of the control unit 20, when the stage elevating mechanism 13 expands and contracts, the second stage 12 also moves up and down. Thereby, the second stage 12 approaches the first stage 6 or the preparation stage 5, and descends to the stage retracting position above the approaching position and the approaching position.

The roller 14 and the roller lifting mechanism 15 are disposed on the current side of the bonding direction of the second stage 12. Further, the roller lifting mechanism 15 is disposed between the base top 3 and the roller 14. The roller lifting mechanism 15 is mainly configured as a cylinder. Under the control of the control unit 20, as the roller lifting mechanism 15 expands and contracts, the roller 14 also moves up and down. Thereby, the roller 14 is lowered to the pressing position, and the second The plate-shaped member 101 is pressed against the first plate-shaped member 100 and the roller retracting position above the pressing position.

Fig. 10 is a block diagram of the bonding apparatus 1C of the present embodiment. As described above, the control unit 20 controls the operations of the horizontal movement mechanism 4, the pillow drive mechanism 8, the front end drive mechanism 11, the roller lift mechanism 15, the stage elevating mechanism 13, and the pump 21.

The horizontal movement mechanism 4 changes the relative positions of, for example, the first stage 6 and the second stage 12 by horizontal movement. The pillow driving mechanism 8 changes the amount of protrusion or thrust of the pillow portion 7C. The front end drive mechanism 11 causes the front end 10C to repeatedly move in the up and down direction and the bonding direction. The roller lifting mechanism 15 causes the roller 14 to move up and down. The stage lifting mechanism 13 causes the second stage 12 to move up and down. Further, the pump 21 keeps the first plate member 100 or the second plate member 101 adsorbed on the adsorption nozzles 5a, 6a, and 12a of the preparation stage 5, the first stage 6, and the second stage 12, respectively. Further, the adsorption nozzles 5a, 6a, and 12a can also operate independently.

[Fitting action]

Next, the bonding operation of the bonding apparatus 1C of this embodiment is demonstrated. Further, the bonding system is sequentially performed in the order of FIGS. 11A to 11C, FIGS. 12A to 12C, FIGS. 13A to 13C, and FIGS. 14A to 14B.

Fig. 11A shows an initial state before the start of bonding. In the initial state, the second stage 12 is at the stage retracting position, the roller 14 is at the roller retracting position, and the pillow portion 7C is at the first position. The second plate-shaped member 101 is held and adhered to the mounting surface of the preparation stage 5, and the bonding surface 101a of the second plate-shaped member 101 is downward. The first plate-shaped member is adhered to the mounting surface of the first stage 6 100, the bonding surface 100a of the first plate-shaped member 100 is upward. Further, an adhesive layer (not shown) is formed on the bonding surface 100a of the first plate member 100.

11B is a state in which the horizontal movement mechanism 4 moves in the opposite direction of the bonding direction, and the second plate-shaped member 101 is moved to directly below the roller 14 and the second stage 12.

Fig. 11C shows a state in which the stage elevating mechanism 13 is extended, and the second stage 12 is lowered to the approach position, and the operation of the adsorption nozzle 5a is stopped, and the operation of the adsorption nozzle 12a is started. Thereby, the second plate-shaped member 101 that is kept adsorbed on the preparation stage 5 is kept adsorbed on the second stage 12, and thereafter moves simultaneously with the second stage 12.

Fig. 12A shows a state in which the stage elevating mechanism 13 is contracted, the second plate-like member 101 is kept adsorbed, and the second stage 12 is raised to the stage retracting position.

12B shows the movement of the horizontal movement mechanism 4 in the bonding direction so that the first plate-like member 100 held on the first stage 6 and the second plate-like member 101 held on the second stage 12 are integrated. status. Here, "integration" is a positional shift of the first plate-like member 100 and the second plate-like member 101, which means that the alignment described later is completely released to the same state.

Fig. 12C shows a state in which the stage elevating mechanism 13 is extended and the second stage 12 is lowered to a close position. As shown in Fig. 12C, in this state, the end portion 101c (see Fig. 9) of the second plate member 101 is in contact with the surface of the pillow portion 7C, but the end portion 101b of the second plate member 101 (please Referring to Fig. 9), it is not in contact with the first plate-like member 100 (adhesive layer) and is alienated. In this embodiment, the separation distance is about 6 mm.

FIG. 13A shows a state in which the distal end driving mechanism 11 moves the distal end 10C in the bonding direction, and the first plate-shaped member 100 and the second plate-shaped member 101 are aligned. After the front end 10C is moved, the front end portion 101b of the second plate-like member 101 is biased in the bonding direction, and the second plate-shaped member 101 is placed before the end portion 101c contacts the step portion 7a of the pillow portion 7C. Move in the direction of the fit. In other words, the second plate-like member 101 is in a state of being embedded in the horizontal direction by the front end 10C and the side wall of the step portion 7a of the pillow portion 7C. On the other hand, the second plate member 101 is still held by the second stage 12. That is, in the state shown in FIG. 13A, the second plate-like member 101 has a fitting force in the horizontal direction and an adsorption force in the vertical direction. Further, the front end drive mechanism 11 controls the movement of the front end 10C to prevent the second plate-shaped member 101 from being damaged due to excessive embedding force.

FIG. 13B shows a state in which the stage lifting and lowering mechanism 13 is contracted after the second stage 12 stops sucking the second plate-shaped member 101, and the second stage 12 is raised to the stage retracting position. In this state, the second plate-like member 101 is embedded in the horizontal direction only by the front end 10C and the pillow portion 7C, as shown in FIG. 13B, that is, the second plate member 101 is not the first. The plate-like member 100 is in contact and remains in an alienated position.

Fig. 13C shows a state in which the roller lifting mechanism 15 is extended and the roller 14 is lowered to the pressing position. When the roller 14 is lowered, the first plate-like member 101 is pressed downward in the vertical direction, and the leading end portion 101b of the second plate-shaped member 101 is attached to the first plate-like member 100. As shown in Fig. 13C, as soon as the second plate-like member 101 is pressed downward, the leading end 10C also maintains the specified fitting force on the second plate-like member 101 as it descends. Moreover, the roller lifting mechanism 15 controls The pressing force from the roller 14 prevents the second plate member 101 and the first plate member 100 from being damaged.

14A shows that the front end 10C is moved in the opposite direction of the bonding direction by the front end driving mechanism 11, and is retracted from the second plate member 101, and the horizontal moving mechanism 4 moves in the opposite direction of the bonding direction, and changes in the bonding direction. The state of the relative position of the second plate-shaped member 101 and the roller 14 of the first plate-shaped member 100. When the pressing force is continuously pressed, the relative position of the roller 14 in the bonding direction is continuously changed, and the first plate-shaped member 100 and the second plate-shaped member 101 are continuously bonded from the bonding end portion 101b toward the bonding terminal portion 101c. Further, since the distal end 10C is retracted, there is no horizontal direction-embedting force on the second plate-shaped member 101 in the bonding.

In the bonding operation performed between FIG. 13C and FIG. 14A, the pillow driving mechanism 8 changes the thrust and height toward the pillow portion 7 upward (see, for example, FIGS. 5A, 5B, and 5C).

Fig. 14B shows a state in which the pillow driving mechanism 8 lowers the pillow portion 7C to the second position while the roller lifting mechanism 15 is contracted and the roller 14 is raised to the roller retracting position. After this state, the first stage 6 stops sucking the first plate-like member 100. Next, the first plate-shaped member 100 and the second plate-shaped member 101 are transferred to a device for subsequent work.

[Fifth Embodiment]

Fig. 15 is a side schematic view showing the bonding apparatus of the fifth embodiment. In the laminating device 1D, the top 3 of the abutment has a horizontal moving mechanism 4, and along the designated rail on the top of the base 2, the top 3 of the base moves horizontally in the direction of the fitting and the opposite direction, here and Laminating device 1C of the embodiment different. Therefore, with respect to the bonding apparatus 1D of the present embodiment, the base top 3 (horizontal moving mechanism 4) and the second stage 12 or the roller 14 are simultaneously moved, so that the base top 3, the second stage 12, and the roller 14 are moved. The relative position with the preparation stage 5 or the first stage 6 is changed.

Further, in the bonding apparatus 1D of the present embodiment, the camera 22 under the photographing is provided on the lower side of the top portion 3 of the base. Thereby, the position of the first plate-shaped member 100 and the second plate-shaped member 101 can be recognized, and the offset of the bonding can be prevented.

The other configuration is the same as that of the bonding apparatus 1C of the fourth embodiment, and therefore, the description thereof will be omitted.

The bonding of the bonding apparatus 1D of the present embodiment is sequentially performed in the order of FIGS. 16A to 16C, FIGS. 17A to 17C, and FIGS. 18A to 18C. Hereinafter, the description will be made with reference to the drawings, in particular, to the difference from the bonding apparatus of the fourth embodiment.

16A and 16B, the second stage 12 keeps adsorbing the second plate-shaped member 101, and in FIG. 16C and FIG. 17A, the top 3 of the base moves horizontally in the opposite direction of the bonding direction, and the first plate-shaped member 100 is integrated. The second plate member 101. At this time, the camera 22 recognizes the positions of the first plate-shaped member 100 and the second plate-shaped member 101. Next, based on the result of the discrimination, feedback control is performed to finely adjust the position of the top 3 of the base. By performing the position adjustment of the front end 10C and the feedback control using the camera 22, it is possible to surely prevent the offset of the bonding.

In Figs. 18B and 18C, the abutment top 3 is horizontally moved in the fitting direction. Accordingly, the relative position of the roller 14 to the second plate member 101 and the first plate member 100 is changed, and the second plate member 101 is bonded to the first plate member 100.

Although the preferred embodiments of the bonding apparatus of the present invention have been described above, the present invention is not limited to these configurations.

The bonding apparatus of the present invention may be, for example, only one of a touch panel or a protective panel, and may be bonded using another plate-shaped member. In addition, each figure is a schematic view, and the shape of a front end and a pillow part is not limited by the structure shown in figure.

1, 1A, 1B, 1C, 1D‧‧‧ fitting device

2‧‧‧Abutment

3‧‧‧Top of the abutment

4‧‧‧Moving station moving mechanism, horizontal moving mechanism

5‧‧‧Preparation of the stage

5a, 6a, 12a, 31a‧‧‧Adsorption nozzle

6‧‧‧Fixed stage, first stage

7, 7', 7", 7A, 7B, 7C, 7D‧‧‧ occipital

7a‧‧‧

8‧‧‧Pillow drive mechanism

10, 10A, 10B, 10C, 10D‧‧‧ front end

11‧‧‧ Front-end drive mechanism

12‧‧‧Second stage

13‧‧‧Moving platform lifting mechanism

14, 32‧‧‧ Wheels

15‧‧‧Roller lifting mechanism

20‧‧‧Control Department

21‧‧‧

22‧‧‧ camera

30‧‧‧

30a. . . Attracting nozzle

31. . . Adsorbate

100. . . First plate member, touch panel

101. . . Second plate member, protective glass

101a. . . Fitting surface

101b. . . Posting end

101c. . . Post terminal

102. . . Adhesive layer

d. . . thickness

L1. . . line

L2. . . Horizontal line

h. . . Prominent amount

θ. . . Fitting angle

σ. . . Bending stress

σ’. . . Allowable bending stress

D ₁ . . . Fitting direction

D ₂ . . . The direction of the opposite direction

P. . . Fit position

Figure 1 is a side schematic view of the bonding apparatus of the first embodiment;

Figure 2 is a block diagram of a bonding apparatus relating to the first embodiment;

3A, 3B, and 3C are views for explaining the bonding operation of the bonding apparatus of the first embodiment in accordance with the sequence of FIG. 3A → FIG. 3B → FIG. 3C;

Figure 4 is an enlarged side view of the fitting portion by the roller;

5A, 5B, and 5C are diagrams showing an example of the bonding operation: FIG. 5A is a bending stress of the second plate-shaped member; FIG. 5B is a thrust of the pillow portion; FIG. 5C is a protruding amount of the pillow portion;

6A, 6B, and 6C are diagrams for explaining the bonding operation of the bonding apparatus of the second embodiment, in accordance with the sequence of Fig. 6A → Fig. 6B → Fig. 6C;

7A, 7B, and 7C are diagrams for explaining the bonding operation of the bonding apparatus of the third embodiment in accordance with the sequence of Fig. 7A → Fig. 7B → Fig. 7C;

Figure 8 is a view showing a modification of the occiput;

Figure 9 is a side view showing the bonding apparatus of the fourth embodiment;

Figure 10 is a block diagram of a bonding apparatus relating to a fourth embodiment;

11A, 11B, and 11C are diagrams for explaining the bonding operation of the bonding apparatus of the fourth embodiment, in accordance with the sequence of Fig. 11A → Fig. 11B → Fig. 11C;

12A, FIG. 12B, and FIG. 12C are diagrams for explaining the bonding operation of the bonding apparatus according to the fourth embodiment, in accordance with the sequence of FIG. 12A → FIG. 12B → FIG. 12C, and particularly FIG. 12A is a diagram showing FIG. Continue to move;

13A, FIG. 13B and FIG. 13C are diagrams for explaining the bonding operation of the bonding apparatus according to the fourth embodiment, in accordance with the sequence of FIG. 13A → FIG. 13B → FIG. 13C, in particular, FIG. 13A is a diagram showing FIG. 12C. Continue to move;

14A and FIG. 14B are diagrams for explaining the bonding operation of the bonding apparatus according to the fourth embodiment, in accordance with the sequence of FIG. 14A to FIG. 14B, and particularly FIG. 14A is a continuation operation of FIG. 13C;

Fig. 15 is a side schematic view showing the bonding apparatus of the fifth embodiment.

16A, FIG. 16B, and FIG. 16C are diagrams for explaining the bonding operation of the bonding apparatus of the fifth embodiment in accordance with the sequence of FIG. 16A → FIG. 16B → FIG. 16C;

17A, 17B, and 17C are diagrams for explaining the bonding operation of the bonding apparatus according to the fifth embodiment, in accordance with the sequence of Fig. 17A → Fig. 17B → Fig. 17C, and particularly Fig. 17A shows Fig. 16C. Continue to move;

18A, 18B, and 18C are diagrams for explaining the bonding operation of the bonding apparatus according to the fifth embodiment, in accordance with the sequence of Fig. 18A → Fig. 18B → Fig. 18C, and particularly Fig. 18A shows Fig. 17C. The continuation action; and Figure 19 is a side view of a conventional bonding device.

1‧‧‧Fitting device

4‧‧‧Moving station mobile mechanism (horizontal moving mechanism)

6‧‧‧Fixed stage (first stage)

6a‧‧‧Adsorption nozzle

7‧‧‧Pillow

8‧‧‧Pillow drive mechanism

10‧‧‧ front end

11‧‧‧ Front-end drive mechanism

14‧‧‧Roller

15‧‧‧Roller lifting mechanism

100‧‧‧First plate-shaped parts (touch panel)

101‧‧‧Second plate-shaped parts (protective glass)

101a‧‧‧Fitting surface

101b‧‧‧Post start

101c‧‧‧post terminal

102‧‧‧Adhesive layer

D ₁ ‧‧‧Meeting direction

D ₂ ‧‧‧The direction of the opposite direction

Claims (3)

A bonding device is configured to position a first plate-shaped member with a second plate-shaped member located above the first plate-shaped member, and press the second plate-shaped member against the roller member by a roller a first plate-shaped member, and changing a relative position of the roller relative to the first plate-shaped member and the second plate-shaped member in a bonding direction, and the second plate-shaped member is caused by the roller Bonding to the first plate-shaped member; wherein the bonding device comprises: a bonding stage supporting the first plate-shaped member; the roller being disposed above the bonding stage; a front end that supports at least one of the beginning ends of the second plate-shaped member, the front end portion refers to an end portion of the first plate-shaped member that is initially fitted; and a front end driving mechanism that causes the front end to move up and down; a pillow portion supporting at least a terminal portion of the second plate-shaped member, the end portion of the first plate-shaped member being the end portion of the first plate-shaped member; and a pillow driving mechanism for lowering the pillow portion Lifting; and a control unit that controls the front end drive mechanism and the pillow drive The control unit controls the front end driving mechanism and the occipital portion driving mechanism to maintain the height of the urging end portion and maintain the position of the affixing end portion above the affixing end during the running of the roller. Position of the portion, thereby securing the first plate member and the second plate member The specified bonding angle prevents the portion of the second plate-shaped member that has not been pressed by the roller from coming into contact with the first plate-shaped member. The bonding apparatus according to claim 1, wherein the control unit controls the pillow driving mechanism in accordance with the traveling of the roller to lower the height of the pillow portion in stages. The bonding apparatus according to claim 1 or 2, wherein the shape of the pillow portion restricts a shape in which the terminal portion of the patch is moved downward and in the bonding direction.