KR20100077198A - Electronic component mounting apparatus and mounting method - Google Patents

Electronic component mounting apparatus and mounting method Download PDF

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Publication number
KR20100077198A
KR20100077198A KR1020107010530A KR20107010530A KR20100077198A KR 20100077198 A KR20100077198 A KR 20100077198A KR 1020107010530 A KR1020107010530 A KR 1020107010530A KR 20107010530 A KR20107010530 A KR 20107010530A KR 20100077198 A KR20100077198 A KR 20100077198A
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KR
South Korea
Prior art keywords
substrate
electronic component
sheet
mounting
tool
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KR1020107010530A
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Korean (ko)
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KR101056100B1 (en
Inventor
다케시 아오야마
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시바우라 메카트로닉스 가부시끼가이샤
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Publication of KR20100077198A publication Critical patent/KR20100077198A/en
Application granted granted Critical
Publication of KR101056100B1 publication Critical patent/KR101056100B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13452—Conductors connecting driver circuitry and terminals of panels
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Liquid Crystal (AREA)

Abstract

It is driven in the vertical direction by the table Z drive source 7 of the conveying means 2, and when driven in the downward direction, the TCP attached to the side portion of the substrate on which the lower surface is supported by the backup tool 14 is pressurized and heated. A cassette having a sheet which is mounted in the vertical direction by a crimping tool 15 to be mounted and a Z drive source 23 for a cassette, and is mounted by a crimping tool when the TCP is mounted by the crimping tool. (25) After mounting TCP on the substrate by the crimping tool, the crimping tool is raised by the Z.θ drive source, then the cassette is raised by the Z drive source for the cassette, and the substrate is cassetted by the Z.θ drive source. It is equipped with the control apparatus which raises at a slower speed | rate, and peels the sheet | seat adhering to the part of the anisotropic conductive member exposed from TCP at the time of TCP mounting.

Description

Electronic component mounting apparatus and mounting method {ELECTRONIC COMPONENT MOUNTING APPARATUS AND MOUNTING METHOD}

The present invention relates to a mounting apparatus and a mounting method for pressing and pressing an electronic component onto a substrate.

For example, a tape carrier package (TCP), which is an electronic component, is pressed onto a liquid crystal cell as a substrate through an anisotropic conductive member as an adhesive material. The said liquid crystal cell is comprised by bonding two glass plates at a predetermined space | interval through a sealing compound, sealing a liquid crystal between these glass plates, and bonding a polarizing plate to the outer surface of each glass plate, respectively.

And the anisotropic conductive member which is tape-shaped on the upper surface of the side edge part of the liquid crystal cell of the said structure is adhere | attached over almost the entire length of the side edge part, and a some space | interval predetermined on this anisotropic conductive member is predetermined. After pressing temporarily, the main pressing is performed.

When TCP is press-bonded or main-bonded to a liquid crystal cell, a mounting apparatus is used. The mounting apparatus has an apparatus main body, as is well known, and the apparatus main body is provided with a backup tool and a crimping tool that is driven in the vertical direction above the backup tool.

After positioning the lower side of the side part of the liquid crystal cell bonded with TCP through an anisotropic conductive member on the upper end surface of the backup tool, the TCP is pressed against the liquid crystal cell by driving the pressing tool in the downward direction. It is to be crimped.

When TCP is crimped | bonded to the said liquid crystal cell, the anisotropic conductive member is heat-hardened by the said heated backup tool and a crimping tool. Therefore, when TCP is pressurized and heated by a crimping tool, a part of the molten anisotropic conductive member may protrude from TCP and adhere to a crimping tool before hardening.

If the anisotropic conductive member is attached to the crimping tool, the crimping tool may not be able to pressurize the TCP evenly, or the anisotropic conductive member attached to the crimping tool may be transferred to TCP and become dirty. There is a case, which is not preferable.

Therefore, in the case of main compression of TCP, a sheet formed of a material having heat resistance such as a silicone resin or a fluorine resin is interposed between the TCP and the crimping tool. As a result, when the TCP is pressurized and heated, the molten anisotropic conductive member is prevented from adhering to the pressing tool.

The sheet is drawn out from the supply reel provided in the cassette and is wound on the take-up reel, and the intermediate part is interposed between the pressing tool and the TCP. This prior art is shown in Patent Document 1.

When TCP is crimped | bonded by a liquid crystal cell, the sheet | seat interposed between TCP and a crimping tool will be pressed with TCP by the said crimping tool to the side part of the liquid crystal cell by which TCP was crimped | bonded. A plurality of TCPs are press-bonded to the side edge portion of the liquid crystal cell at predetermined intervals by an anisotropic conductive member bonded over the entire length of the side edge portion. Therefore, the anisotropic conductive member bonded over the entire length of the side part of the said liquid crystal cell is exposed from the part between adjacent TCP.

If the anisotropic conductive member is exposed from the portion between neighboring TCPs, it is inevitable that the sheet adheres to the portion of the anisotropic conductive member exposed between the neighboring TCPs when the crimping tool presses and heats the TCP through the sheet. .

In recent years, the liquid crystal cell tends to be enlarged. When the liquid crystal cell is enlarged, the side portion thereof becomes long, and the number of TCP adhered to the side portion increases. Thereby, since the exposed part of the anisotropic conductive member between adjacent TCPs also increases, a sheet may adhere strongly to the side part of a liquid crystal cell.

Conventionally, by mounting TCP on the side of the liquid crystal cell, the sheet adhered to the side of the liquid crystal cell is peeled off from the side of the liquid crystal cell by lowering the substrate or raising the cassette provided with the sheet. have.

Patent Document 1: Japanese Patent Application Laid-Open No. 2001-28382

By the way, in the state where the sheet is strongly adhered to the side portion of the liquid crystal cell, even if the sheet is peeled off from the side portion of the liquid crystal cell by simply raising the sheet, lowering the liquid crystal cell, or the like, the sheet is not easily peeled off from the liquid crystal cell. Instead, the liquid crystal cell rises from the table with the sheet.

When the liquid crystal cell floats with the sheet, the sheet is peeled off by the weight of the liquid crystal cell. However, when a sheet peels from a liquid crystal cell, since a liquid crystal cell rises from a table, it will fall. For this reason, since the impact by falling is applied to a liquid crystal cell, a crack may arise in a liquid crystal cell by the impact. In particular, when the liquid crystal cell is enlarged as described above, the tendency is prominent because the sheet tends to adhere to the liquid crystal cell.

The problem of the present invention is that when the electronic component bonded to the side edge portion of the substrate by the anisotropic conductive member is mounted by pressing with a crimping tool through the sheet, even if the sheet adheres to the anisotropic conductive member, the substrate is lifted by the sheet. It is providing the electronic component mounting apparatus and mounting method which let the sheet peel from a board | substrate, without falling.

MEANS TO SOLVE THE PROBLEM In order to solve the said subject, this invention is an electronic component mounting apparatus which mounts the electronic component bonded to the upper surface of the side edge part of a board | substrate by the anisotropic conductive member,

A conveying means having a first vertical driving means and conveying the substrate in a horizontal direction and a vertical direction;

A backup tool for supporting a lower surface of the side edge portion to which the electronic component of the substrate to which the conveying position is determined by the conveying means is bonded;

When the substrate is driven in the downward direction by the first vertical drive means and the lower surface of the side edge portion of the substrate is supported by the backup tool, the electronic component bonded to the upper surface of the side edge portion of the substrate is heated and mounted. Crimping tool,

A sheet supply means which is driven in a vertical direction by a second vertical drive means and comprises a sheet interposed between the upper surface of the side edge portion of the substrate and the pressing tool when mounting the electronic component by the pressing tool;

After mounting the electronic component on the substrate by the pressing tool and raising the pressing tool, the sheet supply means is lifted by the second vertical drive means, and the substrate is lifted by the first vertical drive means. Control means for raising the substrate at a slower speed than the sheet supply means to release the sheet adhered to the portion of the anisotropic conductive member exposed from the electronic component during mounting of the electronic component.

It provides an electronic component mounting apparatus comprising a.

Moreover, this invention is an electronic component mounting method which mounts the electronic component bonded by the anisotropic conductive member to the upper surface of the side part part of a board | substrate,

Supporting a lower surface of the side portion of the substrate to which the electronic component is bonded with a backup tool;

Pressing and heating the electronic component bonded to the upper surface of the side edge portion of the substrate on which the lower surface is supported by a pressing tool;

Interposing a sheet between an upper surface of the side portion of the substrate and the crimping tool when the electronic component is mounted on the upper surface of the side portion of the substrate;

After mounting the electronic component on the substrate by the crimping tool, the crimping tool is raised, and then the substrate is raised at a slower speed than the sheet while raising the sheet. Peeling off the sheet bonded to a portion of the anisotropic conductive member exposed from the component

It provides an electronic component mounting method comprising a.

According to the electronic component mounting apparatus and the mounting method of the present invention, even when the sheet adheres to the anisotropic conductive member when the electronic component bonded to the side edge portion of the substrate by the anisotropic conductive member is pressed and mounted with the crimping tool through the sheet, The sheet can be peeled from the substrate without being lifted and dropped by the sheet.

BRIEF DESCRIPTION OF THE DRAWINGS It is a schematic block diagram of the mounting apparatus which shows one Embodiment of this invention.
2 is a block diagram of a control system.
3 is a plan view of a liquid crystal panel in which TCP is provided at one side thereof.
4A is an explanatory diagram showing a state in which a sheet is bonded to an anisotropic conductive member.
4B is an explanatory diagram showing a state in which the sheet begins to peel off from the anisotropic conductive member by raising the substrate and the sheet.
It is explanatory drawing which shows the state which the sheet | seat further peeled from the anisotropic conductive member by raising a board | substrate further from the state of FIG. 4B.

EMBODIMENT OF THE INVENTION Hereinafter, one Embodiment of this invention is described, referring drawings.

1 shows a schematic configuration of a mounting apparatus, which includes the apparatus main body 1. The conveying means 2 is provided in this apparatus main body 1. This conveying means 2 is movable in the X direction shown by the arrow, The X table 4 driven in the X direction by the X drive source 3 provided in the said apparatus main body 1, and this X table 4 The Y table 6 provided to be movable in the Y direction orthogonal to the X direction and driven by the Y drive source 5, and provided in the Y table 6, by the table Z drive source 7. The Z movable body 9 driven in the Z direction and the arrangement table 8 provided in the Z movable body 9 so as to be driven in the rotational direction and driven in the rotational direction by the? Drive source 10 are provided. Have Accordingly, the placement table 8 is driven in the X, Y, Z and θ directions. Moreover, the 1st vertical drive means is comprised by the said table Z drive source 7 and Z movable body 9.

In the arrangement table 8, for example, a substrate W such as a liquid crystal cell is supplied and arranged in a state where the peripheral portion protrudes outward from the upper surface of the placement table 8, and is held by holding means such as vacuum suction.

As shown in FIG. 3, the some side part of the said board | substrate W is press-bonded at predetermined intervals through the anisotropic conductive member 11 and several TCP 12 as an electronic component. The anisotropic conductive member 11 is bonded over the entire length of the side edge portion of the substrate W. As shown in FIG. As a result, the anisotropic conductive member 11 is exposed between neighboring TCPs 12 as indicated by reference numeral 11a in FIG. 3.

The said apparatus main body 1 is provided with the backup tool 14 which supports the lower surface of the one side part of the board | substrate W hold | maintained at the said placement table 8 by the upper end surface. The TCP 12 press-bonded to the side of the substrate W is formed by pressing the TCP (press-bonded to the side of the substrate W while the lower surface of the side of the substrate W is supported by the upper end surface of the backup tool 14. 12) is crimped | bonded by the crimping tool 15. FIG.

The pressing tool 15 is provided on the lower surface of the pressing head 16. The pressurizing head 16 is provided to be movable in the Z direction indicated by the arrow by the linear guide 17, and is driven in the Z direction by a Z driving source 18 for pressurization such as a servo motor or a linear motor. .

A pair of rail members as a mounting portion on which the cassette 25 described later as a sheet supply means is detachably mounted below the crimping tool 15 of the apparatus main body 1 and above the backup tool 14 ( 21) (only one side) is spaced apart at predetermined intervals in the Y direction and provided horizontally along the X direction.

When the cassette 25 is mounted on the rail member 21, a contact portion (not shown) provided with the stopper (not shown) provided in the cassette 25 at the predetermined position shown in FIG. Not used). Accordingly, the cassette 25 is arranged to be positioned.

At least the both ends in the longitudinal direction of the pair of rail members 21 are integrally connected by the connecting member 22. At both ends of the connecting portion, that is, at portions corresponding to both ends of the pair of rail members 21, a cassette Z drive source 23 is provided as a second vertical drive means made of a pulse motor, a linear motor, or the like, respectively. Accordingly, the pair of rail members 21 are driven in the Z direction in the vertical direction by four cassette Z drive sources 23 (only two are shown).

In addition, the four Z drive sources 23 for cassettes are driven synchronously by the control apparatus 35 mentioned later. Accordingly, the pair of rail members 21 are driven in the Z direction in a horizontal state.

As shown in FIG. 1, the cassette 25 has a pair of rectangular side plates 27 (only one shown) having four corner portions connected at predetermined intervals by a connecting shaft 26. As shown in FIG. The pair of side plates 27 are connected at intervals larger than the length of the side edge portion where the TCP 12 of the substrate W is pressed.

At an end in the longitudinal direction of the pair of side plates 27, an feeding shaft 29 on which a sheet 28 having a heat resistance made of silicone resin or fluorine resin is wound is rotatable with respect to the side plate 27. It is also detachably installed.

The winding shaft 32 which winds the sheet | seat 28 wound by the said feed shaft 29 through the some relay roller 31 is provided in the other end part of the said longitudinal direction in the longitudinal direction. This winding shaft 32 is rotationally driven by the winding motor 33 shown in FIG. 2, and winds the said sheet | seat 28 by the predetermined length by the winding shaft 32. As shown in FIG.

As shown in FIG. 1, when the cassette 25 is mounted at a predetermined position of the apparatus main body 1, between the feeding shaft 29 and the winding shaft 32 of the sheet 28 mounted on the cassette 25. The portion located in the upper portion of the substrate W faces the upper side of the side portion on which the TCP 12 is pressed.

The X drive source 3, the Y drive source 5, the Z drive source 7 for the table, the θ drive source 10, the Z drive source 18 for pressurization, the Z drive source 23 for the cassette and the winding motor 33 Is controlled to be controlled by the control device 35 shown in FIG.

Next, the case where the main compression bonding of the TCP 12 pressed against the side part of the board | substrate W by the mounting apparatus of the said structure is demonstrated. First, as shown in FIG. 1, the placement table 8 is driven in the state in which the cassette 25 is mounted on the rail member 21 of the apparatus main body 1, and the board | substrate W by which the TCP 12 was pressed was carried out. The side portion of the top 9) is positioned above the top surface of the backup tool 14. Subsequently, the placement table 8 is driven downward in the Z direction so that the bottom surface of the side edge portion of the substrate W is supported by the top surface of the backup tool 14.

Subsequently, the table Z drive source 7 is operated to drive the crimping tool 15 downward in the Z direction. As a result, the crimping tool 15 presses the plurality of TCPs 12 provided at predetermined intervals in the side portion of the substrate W through the sheet 28 while simultaneously heating and pressurizing the anisotropic conductive member 11. As a result, the plurality of TCPs 12 are main-compressed to the side portions of the substrate W. FIG.

When TCP 12 is crimped | bonded by the side edge part of the board | substrate W, the part located between the adjacent TCP 12 of the sheet | seat 28 interposed between the crimping tool 15 and the side edge part of the board | substrate W. FIG. As shown by the broken line in FIG. 4A, the pressing tool 15 is pressed against the portion 11a of the anisotropic conductive member 11 exposed between the neighboring TCPs 12 by the crimping tool 15. That is, the sheet 28 is made to adhere to the portion 11a of the anisotropic conductive member 11 exposed between the neighboring TCPs 12 with a plurality of portions corresponding to the number of gaps formed between the neighboring TCPs 12. do.

The sheet 28 adhered to the portion 11a of the anisotropic conductive member 11 exposed between neighboring TCPs 12 is peeled off as follows. That is, when main compression is complete | finished, the Z drive source 18 for pressurization is driven by the control apparatus 35, and the crimping tool 15 is driven in an upward direction. At this time, the portion of the sheet 28 positioned between the neighboring TCPs 12 is an anisotropic conductive member 11 exposed between the neighboring TCPs 12 in the side portion of the substrate W as shown in FIG. 4A. It is attached to the part of).

When the crimping tool 15 ascends to a position where it does not interfere with the cassette 25, the cassette Z drive source 23 drives the cassette 25 in the upward direction, and the table Z drive source 7 operates. Thus, the placement table 8 drives the substrate W in the upward direction. At this time, if the rising speed of the substrate W is V1 and the rising speed of the cassette 25 is V2, these rising speeds are controlled by the control device 35 so that V1 <V2.

In addition, although the drive up of the cassette 25 and the drive up of the board | substrate W are performed synchronously, the board | substrate W can be raised after raising the cassette 25 slightly.

Thus, when the board | substrate W is raised with the cassette 25 and the raising speed V1 of the board | substrate W is slower than the raising speed of the cassette 25, ie, the sheet 28, the anisotropic conductive member ( Since the tension is gently applied to the portion of the sheet 28 adhered to 11), as shown in FIG. 4B, the sheet 28 is formed from both ends of the width direction of the exposed portion 11a of the anisotropic conductive member 11. It peels off slowly.

Moreover, when the board | substrate W is raised to the height H from the initial position at the time of main compression as shown in FIG. 4C, the tension | tensile_strength will be added to the sheet | seat 28 continuously, and the sheet | seat 28 will be carried out. Most portions of the anisotropic conductive member 11 except for the widthwise center portion of the exposed portion 11a are peeled off. And if the cassette 25 is further raised with respect to the board | substrate W, the sheet | seat 28 will reliably peel from the side part of the board | substrate W. As shown in FIG.

Thus, when peeling the sheet | seat 28 adhering to the part of the anisotropic conductive member 11 exposed from the TCP 12 in the side part of the board | substrate W, it does not only raise the cassette 25. The substrate W is raised at a speed V1 that is slower than the rising speed V2 of the cassette 25.

Therefore, the sheet 28 is gradually peeled from the portion 11a of the anisotropic conductive member 11 exposed to the side portion of the substrate W due to the difference in the rising speed of the cassette 25 and the substrate W. FIG. Therefore, the sheet 28 adhered to the anisotropic conductive member 11 strongly pulls the substrate W and does not raise the substrate W from the placement table 8.

As a result, when the sheet 28 is peeled off from the anisotropic conductive member 11, the substrate W is not lifted from the placement table 8 and dropped, so that the substrate W is shocked and damaged. You can prevent it.

In addition, the difference V2-V1 between the ascending speed V1 of the substrate W and the ascending speed V2 of the cassette 25 is determined by the adhesion of the anisotropic conductive member 11 to the side portions of the substrate W. The controller 35 can be set so that the substrate W does not float from the placement table 8 in accordance with the suction holding force of the substrate W against the placement table 8.

According to the present invention, the substrate and the sheet are raised, and the rising speed of the substrate is lower than the rising speed of the sheet, thereby peeling the sheet from the side edge portion of the substrate.

For this reason, since a sheet is peeled gradually from a board | substrate by the difference of the rising speed of a board | substrate and a sheet, a sheet peels gently from a board | substrate without lifting a board | substrate.

Claims (3)

An electronic component mounting apparatus for mounting an electronic component bonded to an upper surface of a side edge portion of a substrate by an anisotropic conductive member,
A conveying means having a first vertical driving means and conveying the substrate in a horizontal direction and a vertical direction;
A backup tool for supporting a lower surface of the side edge portion to which the electronic component of the substrate to which the conveying position is determined by the conveying means is bonded;
When the substrate is driven in the downward direction by the first vertical drive means and the lower surface of the side edge portion of the substrate is supported by the backup tool, the electronic component bonded to the upper surface of the side edge portion of the substrate is heated and mounted. Crimping tool,
Sheet supply means which is driven in the vertical direction by second vertical drive means and has a sheet interposed between the upper surface of the side edge portion of the substrate and the pressing tool when mounting the electronic component by the pressing tool;
After mounting the electronic component on the substrate by the pressing tool and raising the pressing tool, the sheet supply means is lifted by the second vertical drive means, and the substrate is lifted by the first vertical drive means. Control means for raising the substrate at a slower speed than the sheet supply means to release the sheet adhered to the portion of the anisotropic conductive member exposed from the electronic component during mounting of the electronic component.
Electronic component mounting apparatus comprising a. The mounting portion according to claim 1, wherein the mounting portion is detachably mounted.
And said second vertical drive means drives said sheet supply means together with said mounting portion in the vertical direction. An electronic component mounting method for mounting an electronic component bonded to an upper surface of a side edge portion of a substrate by an anisotropic conductive member,
Supporting a lower surface of the side portion of the substrate to which the electronic component is bonded with a backup tool;
Pressing and heating the electronic component bonded to the upper surface of the side edge portion of the substrate on which the lower surface is supported by a pressing tool;
Interposing a sheet between an upper surface of the side portion of the substrate and the crimping tool when the electronic component is mounted on the upper surface of the side portion of the substrate;
After mounting the electronic component on the substrate by the crimping tool, the crimping tool is raised, and then the substrate is raised at a slower speed than the sheet while raising the sheet. Peeling off the sheet bonded to a portion of the anisotropic conductive member exposed from the component
Electronic component mounting method comprising a.
KR1020107010530A 2007-10-19 2008-09-30 Electronic component mounting device and mounting method KR101056100B1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2007-272990 2007-10-19
JP2007272990A JP5324769B2 (en) 2007-10-19 2007-10-19 Electronic component mounting apparatus and mounting method
PCT/JP2008/067755 WO2009051004A1 (en) 2007-10-19 2008-09-30 Electronic component mounting apparatus and mounting method

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Publication Number Publication Date
KR20100077198A true KR20100077198A (en) 2010-07-07
KR101056100B1 KR101056100B1 (en) 2011-08-11

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CN (1) CN101828256B (en)
WO (1) WO2009051004A1 (en)

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CN102229053B (en) * 2011-06-09 2014-04-09 苏州光宝康电子有限公司 LCD (Liquid Crystal Display) workbench
FR2990071B1 (en) * 2012-04-27 2014-05-02 Labinal METHOD FOR CONNECTING CONDUCTORS OF AN EQUIPOTENTIAL CONNECTING FLAP, AND CRIMPING TOOL, CONNECTORS, AND HARNESS EQUIPPED WITH SUCH CONNECTORS
JP7182036B2 (en) * 2018-06-28 2022-12-02 パナソニックＩｐマネジメント株式会社 Component crimping device, sheet installation unit and installation method of sheet installation unit

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TW559963B (en) * 2001-06-08 2003-11-01 Shibaura Mechatronics Corp Pressuring apparatus of electronic device and its method
JP3757868B2 (en) * 2002-01-17 2006-03-22 松下電器産業株式会社 Electronic component thermocompression bonding apparatus and thermocompression bonding method
JP2003234373A (en) * 2002-02-06 2003-08-22 Shibaura Mechatronics Corp Apparatus and method for mounting electronic component, and apparatus and method for adhering adhesive material
JP2007165571A (en) * 2005-12-14 2007-06-28 Matsushita Electric Ind Co Ltd Electronic part mounting device

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CN101828256B (en) 2012-06-20
WO2009051004A1 (en) 2009-04-23
KR101056100B1 (en) 2011-08-11
JP5324769B2 (en) 2013-10-23
CN101828256A (en) 2010-09-08
JP2009105092A (en) 2009-05-14

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