CN101828256A - Electronic component mounting apparatus and mounting method - Google Patents
Electronic component mounting apparatus and mounting method Download PDFInfo
- Publication number
- CN101828256A CN101828256A CN200880112127A CN200880112127A CN101828256A CN 101828256 A CN101828256 A CN 101828256A CN 200880112127 A CN200880112127 A CN 200880112127A CN 200880112127 A CN200880112127 A CN 200880112127A CN 101828256 A CN101828256 A CN 101828256A
- Authority
- CN
- China
- Prior art keywords
- mentioned
- electronic unit
- substrate
- side portion
- aforesaid substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13452—Conductors connecting driver circuitry and terminals of panels
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
Abstract
A mounting apparatus comprising a pressure bonding tool (15) for mounting a TCP under heat and pressure, the TCP being attached to a side section of a substrate, the substrate being held by a backup tool (14) at its bottom surface when it is driven in a downward direction by a Z-direction table driving source (7) of conveying means (2) which drives the substrate upward and downward directions, a cassette (25) being driven by a cassette Z-direction driving source (23) in upward and downward directions, the cassette having a sheet to be interposed between a top surface of the side of the substrate and the pressure bonding tool when mounting the TCP by the pressure bonding tool, and a controlling apparatus which, after ascending the pressure bonding tool by a Z/theta-direction driving source after the TCP is mounted on the substrate by the pressure bonding tool, ascends the cassette by the Z-direction cassette driving source, and at the same time, ascends the substrate at a lower rate than the cassette by the Z/theta-direction driving source, thereby effecting delamination of the sheet adhered to a portion of an anisotropic conductive member of the TCP which is exposed from the TCP upon mounting of the TCP.
Description
Technical field
The present invention relates to electronic unit is pressurizeed and it is crimped onto erecting device and installation method on the substrate.
Background technology
For example, on liquid crystal cells, be crimped with TCP as electronic unit (Tape Carder Package: band carries encapsulation) by anisotropic conductive parts as adhesives as substrate.Constituting of above-mentioned liquid crystal cells by sealant bonding two glass sheets at interval in accordance with regulations, enclosed liquid crystal, and paste polarizer respectively on the outer surface of each glass plate between these glass plates.
And, upper surface in the side portion of liquid crystal cells with said structure, almost to spread all over the mode of this side portion total length, paste above-mentioned anisotropic conductive parts banded, that have the two sides tackness, on these anisotropic conductive parts, after the at interval interim in accordance with regulations a plurality of TCP of crimping, carry out formal crimping.
On liquid crystal cells, when interim crimping or formal crimping TCP, adopt erecting device.As everyone knows, erecting device has apparatus main body, and this apparatus main body is provided with supporting tool, and above this supporting tool, driven along the vertical direction crimping tool.
To be pasted with the lower surface location of side portion of liquid crystal cells of TCP and mounting behind the upper surface of supporting tool by the anisotropic conductive parts, by drive above-mentioned crimping tool along descent direction, with the interim crimping of above-mentioned TCP or formally be crimped onto above-mentioned liquid crystal cells.
When TCP formally is crimped onto above-mentioned liquid crystal cells,, make the heat hardening of anisotropic conductive parts by above-mentioned supporting tool and the crimping tool that heated.Therefore, when TCP when the pressurized heating of crimping tool, have fusion the part of anisotropic conductive parts before hardening, overflow and be attached to the situation of crimping tool from TCP.
If be attached with the anisotropic conductive parts on the crimping tool, then can cause the crimping tool can not be bad to the pressurization that TCP evenly pressurizes, perhaps exist and transfer to TCP attached to the anisotropic conductive parts on the crimping tool and become situations such as pollution cause, these do not wish to take place.
Therefore, when TCP is carried out formal crimping, make to have the formed sheet material of stable on heating material by silicones and fluororesin etc. and be present between TCP and the crimping tool.Like this, when TCP is carried out pressurized, heated, can prevent fusion the anisotropic conductive parts be attached on the crimping tool.
Above-mentioned sheet material is derived from the supply spool that is arranged on the box, and can be wound on the winding reel, and the intermediate portion is present between above-mentioned crimping tool and the TCP.Patent documentation 1 shows such prior art.
When TCP formally is crimped onto liquid crystal cells, be present in sheet material between TCP and the crimping tool by above-mentioned crimping tool, together pressurized at the side portion and the TCP of the liquid crystal cells that is crimped with TCP temporarily.In the side portion of liquid crystal cells, by spreading all over the anisotropic conductive parts that this side portion is being pasted endlong, a plurality of TCP in the interim crimping in compartment of terrain in accordance with regulations.Therefore, spread all over the total length of side portion of above-mentioned liquid crystal cells and the anisotropic conductive parts pasted expose from the part between the adjacent TCP.
If the anisotropic conductive parts expose from the part between the adjacent TCP, when then crimping tool carries out pressurized, heated by sheet material to TCP, be difficult to avoid sheet attaching to the part anisotropic conductive parts, from exposing between the adjacent TCP.
Recently, there is the tendency that maximizes in liquid crystal cells.If liquid crystal cells maximizes, then its side portion is elongated, and the TCP quantity that sticks on side portion also increases.Therefore, also become many from the exposed portions serve of the anisotropic conductive parts that expose between the adjacent TCP, so exist sheet material to stick on the situation of the side portion of liquid crystal cells tightly.
In the past, TCP was installed on the side portion of liquid crystal cells, thereby, aforesaid substrate is descended or make the box rising that is provided with above-mentioned sheet material etc., the sheet material that is pasted on liquid crystal cells side portion is peeled off from liquid crystal cells side portion.
Patent documentation 1: TOHKEMY 2001-28382 communique
In addition, tightly stick at sheet material under the state of side portion of liquid crystal cells, even only by above-mentioned sheet material being risen or making degradation under the liquid crystal cells come side portion releasing sheet from liquid crystal cells, sheet material can not peeled off from liquid crystal cells simply yet, and liquid crystal cells can float from workbench with sheet material.
If liquid crystal cells floats with sheet material, then the own wt owing to liquid crystal cells causes sheet material to be stripped from.But, when sheet material when liquid crystal cells is peeled off because liquid crystal cells floats from workbench, so it will fall.So the impact that is produced by the whereabouts is applied on the liquid crystal cells, thereby there is the situation that causes on liquid crystal cells, producing defective owing to this impact.Particularly when liquid crystal cells maximized as described above, because sheet material sticks on the liquid crystal cells easily, it is more remarkable that this tendency becomes.
Summary of the invention
The invention provides a kind of erecting device and installation method of electronic unit, when using crimping tool the electronic unit that is sticked on substrate side portion by the anisotropic conductive parts to be pressurizeed and installing by sheet material, even above-mentioned sheet attaching is on the anisotropic conductive parts, sheet material also can not lift substrate and make it, and this sheet material can be peeled off from substrate.
For solving above-mentioned problem, the invention provides a kind of erecting device of electronic unit, be used to install the electronic unit that sticks on the upper surface of substrate side portion by the anisotropic conductive parts, it is characterized in that, have: transmission unit, has driver element about in the of the 1st, along continuous straight runs and above-below direction transmission aforesaid substrate; Supporting tool is supported the lower surface that is transmitted the side portion that is pasted with above-mentioned electronic unit of the aforesaid substrate of locating by this transmission unit; Crimping tool, when by above-mentioned about in the of the 1st driver element drive aforesaid substrate along descent direction, and when being supported the lower surface of side portion of aforesaid substrate by above-mentioned supporting tool, the electronic unit that the upper surface of the above-mentioned side portion of aforesaid substrate is pasted carries out pressurized, heated and installs; The feeding sheet materials unit is driven along the vertical direction by driver element about in the of the 2nd, and has sheet material, and when by above-mentioned crimping tool above-mentioned electronic unit being installed, this sheet material is present between the upper surface and above-mentioned crimping tool of side portion of aforesaid substrate; And control unit, above-mentioned electronic unit is installed to aforesaid substrate and makes after above-mentioned crimping tool rises by above-mentioned crimping tool, when by above-mentioned about in the of the 2nd driver element make on the above-mentioned feeding sheet materials unit and rise, and by above-mentioned when driver element rises aforesaid substrate about in the of the 1st, so that aforesaid substrate is risen, the above-mentioned sheet material that sticks on when above-mentioned electronic unit is installed on the part of exposing from above-mentioned electronic unit of above-mentioned anisotropic conductive parts is peeled off.
In addition, the invention provides a kind of installation method of electronic unit, be used to install the electronic unit that sticks on the upper surface of substrate side portion by the anisotropic conductive parts, it is characterized in that, have: support operation, the lower surface of the side portion that is pasted with above-mentioned electronic unit of aforesaid substrate is supported with supporting tool; Installation procedure carries out pressurized, heated to electronic unit and installs with crimping tool, and this electronic unit is pasted on the upper surface of the side portion of the aforesaid substrate that lower surface supported; The feeding sheet materials operation when the upper surface of the side portion that above-mentioned electronic unit is installed to aforesaid substrate, is present between the upper surface and above-mentioned crimping tool of side portion of aforesaid substrate sheet material; And stripping process, by above-mentioned crimping tool above-mentioned electronic unit is installed to after the aforesaid substrate, above-mentioned crimping tool is risen, aforesaid substrate is risen with the speed slower than above-mentioned sheet material, and the above-mentioned sheet material that sticks on when above-mentioned electronic unit is installed on the part of exposing from above-mentioned electronic unit of above-mentioned anisotropic conductive parts is peeled off.
Description of drawings
Fig. 1 is the summary construction diagram of the erecting device of expression an embodiment of the invention.
Fig. 2 is the block diagram of control system.
Fig. 3 is the plane graph that is provided with the liquid crystal panel of TCP at a sidepiece.
Fig. 4 A is the key diagram of the state of expression sheet attaching on the anisotropic conductive parts.
Fig. 4 B is that expression is risen substrate and sheet material, thus the key diagram of the state that sheet material begins to peel off from the anisotropic conductive parts.
Fig. 4 C is that expression further makes substrate rise from the state of Fig. 4 B, thus the key diagram of the state that sheet material is further peeled off from the anisotropic conductive parts.
Embodiment
Followingly one embodiment of the present invention are described with reference to accompanying drawing.
Fig. 1 represents the schematic configuration of erecting device, and this erecting device has apparatus main body 1.This apparatus main body 1 is provided with transmission unit 2.This transmission unit 2 can move along the directions X shown in the arrow, and has: X workbench 4 is driven along directions X by the X drive source 3 that is provided with on the said apparatus main body 1; Y workbench 6 is arranged at this X workbench 4 movably along the Y direction with the directions X quadrature, and is driven by Y drive source 5; Z movable body 9 is arranged at this Y workbench 6, and is driven along the Z direction as above-below direction with Z drive source 7 by workbench; And mounting workbench 8, can be arranged at this Z movable body 9 drivingly along θ direction, and drive along direction of rotation by θ drive source 10 as direction of rotation.Like this, above-mentioned mounting workbench 8 can be driven along X, Y, Z and θ direction.In addition, constitute driver element about in the of the 1st by above-mentioned workbench with Z drive source 7 and Z movable body 9.
Substrate W such as liquid crystal cells so that peripheral part from the upper surface of mounting workbench 8 to the outstanding state in outside, be supplied to and be positioned on the above-mentioned mounting workbench 8, and keep by maintenance methods such as vacuum suction.
As shown in Figure 3, at the sidepiece of aforesaid substrate W,, a plurality of TCP12 as electronic unit with the interim crimping of predetermined distance by anisotropic conductive parts 11.Above-mentioned anisotropic conductive parts 11 spread all over the pasting endlong of side portion of substrate W.Like this, shown in this Figure 11 a, above-mentioned anisotropic conductive parts 11 expose between adjacent TCP12.
Said apparatus main body 1 is provided with supporting tool (backup tool) 14, and this supporting tool 14 is supported the lower surface of the sidepiece of the substrate W that kept by above-mentioned mounting workbench 8 by the upper surface.Be crimped on the TCP12 of the side portion of substrate W, the state so that the lower surface of the side portion of substrate W is supported by the upper surface of above-mentioned supporting tool 14 carries out formal crimping by crimping tool 15 temporarily.
Above-mentioned crimping tool 15 is arranged on the lower surface of polishing head 16.This polishing head 16 with by linear guide portion 17 can along the Z direction shown in the arrow movably mode be set up, and drive along the Z direction with Z drive source 18 by pressurization such as servo motor or line motor.
Below the above-mentioned crimping tool 15 of said apparatus main body 1, and above above-mentioned supporting tool 14, be provided with pair of tracks parts 21 (only illustrating) as installation unit, box (cassette) 25 as narration after the feeding sheet materials unit is installed on it dismantledly, these pair of tracks parts 21 separate with predetermined distance along the Y direction, and flatly are provided with along directions X.
When above-mentioned box 25 being installed to above-mentioned track component 21, at block (not shown) that is arranged at above-mentioned box 25 on the assigned position as shown in Figure 1 and abutting part (not shown) butt that is arranged on the said apparatus main body 1.Thus, above-mentioned box 25 is positioned.
It is one that the both ends of the long side direction at least of pair of tracks parts 21 link by binding parts 22.With the both ends of linking portion, the corresponding part in the both ends of pair of tracks parts 21 just, be respectively arranged with box with Z drive source 23, this box, is made of impulse motor or line motor etc. as driver element about in the of the 2nd with Z drive source 23.Therefore, pair of tracks parts 21 are driven along the Z direction as above-below direction with Z drive source 23 (only illustrating two) by 4 boxes.
In addition, 4 boxes use Z drive source 23 by control device 35 driven in synchronism of narrating afterwards.Therefore, pair of tracks parts 21 are driven along the Z direction with horizontal state.
As shown in Figure 1, four bights of above-mentioned box 25 have link at interval in accordance with regulations by connection shaft 26, rectangular pair of side plates 27 (only illustrating).Pair of side plates 27 is with the big interval of length of the side portion of TCP12 than the interim crimping of aforesaid substrate W and be bonded.
Be provided with in an end of the long side direction of pair of side plates 27 with respect to above-mentioned side plate 27 rotatable and detachable send axle 29, this is sent and is wound with on the axle 29 by the silicones manufacturing or by the fluororesin manufacturing and have stable on heating sheet material 28.
The other end at the long side direction of above-mentioned side plate 27 is provided with wireline reel 32, and this wireline reel 32 is reeled via 31 pairs of above-mentioned sheet materials 28 of sending institute's package on the axle 29 of a plurality of relaying rollers.Be rotated driving by 33 pairs of these wireline reels 32 of coiling motor shown in Figure 2, so that above-mentioned sheet material 28 is wound onto on the above-mentioned wireline reel 32 by every specific length.
As shown in Figure 1, when box 25 is installed on the assigned position of apparatus main body 1, the sheet material of being installed on this box 25 28, in the part of sending between axle 29 and the wireline reel 32, mutually opposed with the upper surface of the side portion that is crimped with TCP12 of substrate W temporarily.
In addition, the driving of Z drive source 23 and above-mentioned coiling motor 33 of above-mentioned X drive source 3, Y drive source 5, workbench Z drive source 7, θ drive source 10, pressurization Z drive source 18, box, Be Controlled by control device shown in Figure 2 35.
Next the situation that the TCP12 of the side portion that temporarily is crimped on substrate W is carried out formal crimping, is described by having the erecting device of said structure.At first, as shown in Figure 1, drive mounting workbench 8 under the state that box 25 is installed on the track component 21 of apparatus main body 1, the side portion that temporarily is crimped with the substrate W of TCP12 is located in the top of the upper surface of supporting tool 14.Then, drive mounting workbench 8, support the lower surface of the side portion of aforesaid substrate W by the upper surface of above-mentioned supporting tool 14 along Z direction below.
Then, workbench is with 7 actions of Z drive source, to Z direction below drive pressure bonding tool 15.Thus, crimping tool 15 is arranged on a plurality of TCP12 on the substrate W side portion by 28 pairs of sheet materials with predetermined distance and heats simultaneously and pressurize, thus 11 fusions of anisotropic conductive parts, and a plurality of TCP12 formally is crimped onto on the substrate W side portion.
When TCP12 formally is crimped onto the side portion of substrate W, be present in the part between adjacent TCP12 between crimping tool 15 and the substrate W side portion, sheet material 28, shown in Fig. 4 A dotted line by crimping tool 15, pressurized and paste anisotropic conductive parts 11, from the part 11a that exposes between the adjacent TCP12.That is to say, on the sheet material 28 and adjacent TCP12 between the corresponding a plurality of positions of quantity in formed gap, paste anisotropic conductive parts 11 from the part 11a that exposes between the adjacent TCP12.
The sheet material 28 from the part 11a that exposes between the adjacent TCP12 that will stick on anisotropic conductive parts 11 is as follows peeled off.That is,, then drive pressurization with Z drive source 18, along ascent direction drive pressure bonding tool 15 by control device 35 if formal crimping finishes.At this moment, the part between adjacent TCP12 of sheet material 28 shown in Fig. 4 A, be pasted on substrate W side portion anisotropic conductive parts 11, on the part of exposing between the adjacent TCP12.
If crimping tool 15 rises to not the position of interfering with box 25, when then driving box 25 with Z drive source 23 along ascent direction by box, workbench is with 7 actions of Z drive source, by mounting workbench 8 along ascent direction driving substrate W.At this moment, the rate of climb that makes substrate W is V1, and the rate of climb of box 25 is V2, by above-mentioned control device 35 these rates of climb of controlling, makes V1＜V2.
And the rising driving of box 25 and the rising of substrate W drive to be carried out synchronously, but box 25 is risen a little, and then the rising of beginning substrate W.
If substrate W is risen with box 25, and the rate of climb V1 that makes substrate W is that the rate of climb of sheet material 28 is slow than box 25, then tension force gently be applied to sheet material 28, paste the part on the anisotropic conductive parts 11, therefore shown in Fig. 4 B, sheet material 28 is peeled off lentamente from the both ends of the Width of the exposed portions serve 11a of anisotropic conductive parts 11.
And then, shown in Fig. 4 C, if the original position when making substrate W from formal crimping rises to height H, then tension force gently is applied on the sheet material 28 constantly, thus, this sheet material 28 is stripped from from major part exposed portions serve 11a, except that the central portion of Width of anisotropic conductive parts 11.And if box 25 is further risen with respect to substrate W, then sheet material 28 is peeled off reliably from the side portion of substrate W.
Like this, when the sheet material on the part that TCP12 exposes 28 substrate W side portion, that stick on anisotropic conductive parts 11 is peeled off, box 25 is risen, substrate W is risen.
Therefore, because the rate of climb between box 25 and the substrate W is poor, make sheet material 28 slowly peel off from part 11a anisotropic conductive parts 11, that expose in the side portion of substrate W, so the sheet material of being pasted on the anisotropic conductive parts 11 28 can not draw substrate W strongly and this substrate W is risen from mounting workbench 8.
Therefore, from anisotropic conductive parts 11 during releasing sheet 28, can not make substrate W float and fall, impact and make it damage so can prevent from substrate W applied from mounting workbench 8.
In addition, according to the adherence force of anisotropic conductive parts 11 with respect to the side portion of substrate W, and substrate W is with respect to the absorption confining force of mounting workbench 8, the rate of climb V1 that can be by 35 couples of substrate W of control device and the rate of climb V2 of box 25 poor (V2-V1) sets, so that substrate W can not float from mounting workbench 8.
Industrial applicibility
According to the present invention, substrate and sheet material are risen, and make the rate of climb of substrate slower than the rate of climb of sheet material, thereby from the side portion of substrate sheet material is peeled off.
Therefore, because the rate of climb between substrate and the sheet material is poor, so that sheet material is slowly peeled off from substrate, so sheet material can not lift substrate, and gently be stripped from from substrate.
Claims (3)
1. the erecting device of an electronic unit is used to the electronic unit that sticks on the upper surface of substrate side portion by the anisotropic conductive parts is installed, and it is characterized in that having:
Transmission unit has driver element about in the of the 1st, along continuous straight runs and above-below direction transmission aforesaid substrate;
Supporting tool is supported the lower surface that is transmitted the side portion that is pasted with above-mentioned electronic unit of the aforesaid substrate of locating by this transmission unit;
Crimping tool, when by above-mentioned about in the of the 1st driver element drive aforesaid substrate along descent direction, and when being supported the lower surface of side portion of aforesaid substrate by above-mentioned supporting tool, the electronic unit that the upper surface of the above-mentioned side portion of aforesaid substrate is pasted carries out pressurized, heated and installs;
The feeding sheet materials unit is driven along the vertical direction by driver element about in the of the 2nd, and has sheet material, and when by above-mentioned crimping tool above-mentioned electronic unit being installed, this sheet material is present between the upper surface and above-mentioned crimping tool of side portion of aforesaid substrate; And
Control unit, above-mentioned electronic unit is installed to aforesaid substrate and makes after above-mentioned crimping tool rises by above-mentioned crimping tool, when by above-mentioned about in the of the 2nd driver element make on the above-mentioned feeding sheet materials unit and rise, and by above-mentioned when driver element rises aforesaid substrate about in the of the 1st, so that aforesaid substrate is risen, the above-mentioned sheet material that sticks on when above-mentioned electronic unit is installed on the part of exposing from above-mentioned electronic unit of above-mentioned anisotropic conductive parts is peeled off.
2. as the erecting device of the electronic unit of claim 1 record, it is characterized in that,
Above-mentioned feeding sheet materials unit is provided with installation portion, and this installation portion is installed dismantledly;
Above-mentioned about in the of the 2nd driver element with above-mentioned feeding sheet materials unit with above-mentioned installation portion, drive along the vertical direction.
3. the installation method of an electronic unit is used to the electronic unit that sticks on the upper surface of substrate side portion by the anisotropic conductive parts is installed, and it is characterized in that having:
Support operation, the lower surface of the side portion that is pasted with above-mentioned electronic unit of aforesaid substrate is supported with supporting tool;
Installation procedure carries out pressurized, heated to electronic unit and installs with crimping tool, and this electronic unit is pasted on the upper surface of the side portion of the aforesaid substrate that lower surface supported;
The feeding sheet materials operation when the upper surface of the side portion that above-mentioned electronic unit is installed to aforesaid substrate, is present between the upper surface and above-mentioned crimping tool of side portion of aforesaid substrate sheet material; And
Stripping process, by above-mentioned crimping tool above-mentioned electronic unit is installed to after the aforesaid substrate, above-mentioned crimping tool is risen, aforesaid substrate is risen with the speed slower than above-mentioned sheet material, and the above-mentioned sheet material that sticks on when above-mentioned electronic unit is installed on the part of exposing from above-mentioned electronic unit of above-mentioned anisotropic conductive parts is peeled off.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007272990A JP5324769B2 (en) | 2007-10-19 | 2007-10-19 | Electronic component mounting apparatus and mounting method |
| JP2007-272990 | 2007-10-19 | ||
| PCT/JP2008/067755 WO2009051004A1 (en) | 2007-10-19 | 2008-09-30 | Electronic component mounting apparatus and mounting method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101828256A true CN101828256A (en) | 2010-09-08 |
| CN101828256B CN101828256B (en) | 2012-06-20 |
Family
ID=40567277
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2008801121275A Expired - Fee Related CN101828256B (en) | 2007-10-19 | 2008-09-30 | Electronic component mounting apparatus and mounting method |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP5324769B2 (en) |
| KR (1) | KR101056100B1 (en) |
| CN (1) | CN101828256B (en) |
| WO (1) | WO2009051004A1 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102229053A (en) * | 2011-06-09 | 2011-11-02 | 苏州光宝康电子有限公司 | LCD (Liquid Crystal Display) workbench |
| CN104488144A (en) * | 2012-04-27 | 2015-04-01 | 雷比诺电力系统 | Method for connecting the conductors of a flexible bonded (equipotential) connection layer, as well as crimping tool, connectors and wiring loom fitted with such connectors |
| CN110654030A (en) * | 2018-06-28 | 2020-01-07 | 松下知识产权经营株式会社 | Component pressure-bonding device, sheet setting unit, and method for mounting sheet setting unit |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW559963B (en) * | 2001-06-08 | 2003-11-01 | Shibaura Mechatronics Corp | Pressuring apparatus of electronic device and its method |
| JP3757868B2 (en) * | 2002-01-17 | 2006-03-22 | 松下電器産業株式会社 | Electronic component thermocompression bonding apparatus and thermocompression bonding method |
| JP2003234373A (en) * | 2002-02-06 | 2003-08-22 | Shibaura Mechatronics Corp | Apparatus and method for mounting electronic component, and apparatus and method for adhering adhesive material |
| JP2007165571A (en) * | 2005-12-14 | 2007-06-28 | Matsushita Electric Ind Co Ltd | Electronic part mounting device |
-
2007
- 2007-10-19 JP JP2007272990A patent/JP5324769B2/en active Active
-
2008
- 2008-09-30 WO PCT/JP2008/067755 patent/WO2009051004A1/en active Application Filing
- 2008-09-30 KR KR1020107010530A patent/KR101056100B1/en not_active IP Right Cessation
- 2008-09-30 CN CN2008801121275A patent/CN101828256B/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102229053A (en) * | 2011-06-09 | 2011-11-02 | 苏州光宝康电子有限公司 | LCD (Liquid Crystal Display) workbench |
| CN102229053B (en) * | 2011-06-09 | 2014-04-09 | 苏州光宝康电子有限公司 | LCD (Liquid Crystal Display) workbench |
| CN104488144A (en) * | 2012-04-27 | 2015-04-01 | 雷比诺电力系统 | Method for connecting the conductors of a flexible bonded (equipotential) connection layer, as well as crimping tool, connectors and wiring loom fitted with such connectors |
| CN110654030A (en) * | 2018-06-28 | 2020-01-07 | 松下知识产权经营株式会社 | Component pressure-bonding device, sheet setting unit, and method for mounting sheet setting unit |
Also Published As
| Publication number | Publication date |
|---|---|
| KR101056100B1 (en) | 2011-08-11 |
| CN101828256B (en) | 2012-06-20 |
| KR20100077198A (en) | 2010-07-07 |
| JP2009105092A (en) | 2009-05-14 |
| JP5324769B2 (en) | 2013-10-23 |
| WO2009051004A1 (en) | 2009-04-23 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102473654A (en) | Tape applying apparatus | |
| JP4267595B2 (en) | ACF supply device | |
| CN101596988B (en) | Adhesive film attaching mechanism | |
| KR102266662B1 (en) | Device manufacturing method | |
| JP4819184B2 (en) | Crimping method | |
| CN102948021A (en) | Tape adhesion device and tape adhesion method | |
| CN101828256B (en) | Electronic component mounting apparatus and mounting method | |
| CN101443896A (en) | Apparatus for adhering adhesive tape | |
| JP5315273B2 (en) | FPD module assembly equipment | |
| JP4724784B2 (en) | Tape sticking device and tape sticking method | |
| JP5125536B2 (en) | Adhesive tape supply unit | |
| CN210029486U (en) | Automatic adhesive tape pasting device based on tension unreeling | |
| CN115489830B (en) | FPC tectorial membrane is mechanism and dyestripping machine in advance | |
| JP2009111253A (en) | Device and method for mounting electronic component | |
| CN102666332A (en) | Tape adhesion device and tape adhesion method | |
| JP6161115B2 (en) | Gluing unit for the perfect binding device | |
| JP4116509B2 (en) | Tape member sticking device | |
| CN101461049A (en) | Device for mounting electronic part | |
| CN109665367B (en) | Device and method for automatically sticking adhesive tape | |
| JP4133926B2 (en) | Mounting device | |
| JP3738603B2 (en) | ACF sticking device | |
| JP4262168B2 (en) | Mounting device | |
| KR101253223B1 (en) | bottom tape attaching device of carrier tape | |
| CN217708269U (en) | Roll equipment of subsides | |
| KR102093856B1 (en) | Automatic carrier film removing apparatus |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120620 Termination date: 20140930 |
|
| EXPY | Termination of patent right or utility model |