JP2009105092A - Electronic component mounting apparatus and mounting method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a mounting apparatus capable of effecting delamination of a sheet adhered to an anisotropic conductive member without damaging a substrate when pressure-bonding a TCP to the substrate. <P>SOLUTION: The mounting apparatus comprises a pressure bonding tool 15 for mounting the TCP under heat and pressure, the TCP being attached to a side section of a substrate, the substrate being held by a backup tool (14) at its bottom surface when it is driven in a downward direction by a Z-direction table driving source (7) of conveying means 2 which drives the substrate upward and downward directions; a cassette 25 which is driven by a cassette Z-direction driving source 23 in upward and downward directions, the cassette having the sheet to be interposed between a top surface of the side of the substrate and the pressure bonding tool when mounting the TCP by the pressure bonding tool; and a controlling apparatus which, after ascending the pressure bonding tool after the TCP is mounted on the substrate by the pressure bonding tool, ascends the cassette, and at the same time, ascends the substrate at a lower rate than the cassette to effect delamination of the sheet adhered to a portion of an anisotropic conductive member of the TCP which is exposed from the TCP upon mounting of the TCP. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a mounting apparatus and a mounting method for pressurizing and pressing an electronic component on a substrate.

  For example, a TCP (Tape Carrier Package) which is an electronic component is pressure-bonded to a liquid crystal cell as a substrate through an anisotropic conductive member as an adhesive material. The liquid crystal cell is configured by adhering two glass plates at a predetermined interval via a sealing agent, enclosing liquid crystal between these glass plates, and attaching a polarizing plate to the outer surface of each glass plate. The

  Then, the anisotropic conductive member having a tape shape on both sides of the liquid crystal cell having the above structure and having adhesiveness on both sides is adhered over almost the entire length of the side portion, and this anisotropic conductive member A plurality of TCPs are temporarily pressure-bonded at predetermined intervals, and then finally pressure-bonded.

  A mounting apparatus is used when TCP is temporarily pressure-bonded to the liquid crystal cell or when the liquid crystal cell is pressure-bonded. As is well known, the mounting apparatus has an apparatus main body, and the apparatus main body is provided with a backup tool and a crimping tool driven in the vertical direction above the backup tool.

  After positioning and mounting the lower surface of the side portion of the liquid crystal cell to which TCP is adhered via an anisotropic conductive member on the upper end surface of the backup tool, the above-mentioned TCP is driven by driving the crimping tool in the downward direction. Is temporarily or permanently bonded to the liquid crystal cell.

  When TCP is finally pressure-bonded to the liquid crystal cell, the anisotropic conductive member is heat-cured by the heated backup tool and pressure-bonding tool. For this reason, when the TCP is pressurized and heated by the crimping tool, the melted anisotropic conductive member may protrude from the TCP and adhere to the crimping tool before being cured.

  If the anisotropic conductive member adheres to the crimping tool, it may cause a press failure that prevents the TCP from being uniformly pressed by the crimping tool, or the anisotropic conductive member adhered to the crimping tool may transfer to the TCP and become dirty. It may cause a problem and is not preferable.

  Therefore, when TCP is finally pressure-bonded, a sheet formed of a heat-resistant material such as silicone resin or fluorine resin is interposed between the TCP and the pressure-bonding tool. Thus, when the TCP is heated under pressure, the molten anisotropic conductive member is prevented from adhering to the crimping tool.

  The sheet is led out from a supply reel provided in the cassette and wound on a take-up reel, and a midway portion is interposed between the crimping tool and the TCP. Such prior art is disclosed in Patent Document 1.

  When TCP is finally pressure-bonded to the liquid crystal cell, the sheet interposed between the TCP and the pressure-bonding tool is pressed together with the TCP to the side portion of the liquid crystal cell to which TCP is temporarily pressure-bonded by the pressure-bonding tool. A plurality of TCPs are temporarily pressure-bonded to the side portion of the liquid crystal cell at predetermined intervals by an anisotropic conductive member attached over the entire length of the side portion. Therefore, the anisotropic conductive member adhered over the entire length of the side portion of the liquid crystal cell is exposed from the portion between adjacent TCPs.

  Therefore, when the pressure bonding tool pressurizes and heats the TCP through the sheet, it is inevitable that the sheet is stuck to a portion exposed from between adjacent TCPs of the anisotropic conductive member.

  Recently, liquid crystal cells tend to be larger. When the liquid crystal cell is increased in size, the side portion becomes longer, and the number of TCPs attached to the side portion also increases. As a result, the exposed portions of the anisotropic conductive member between adjacent TCPs also increase, and the sheet may be strongly adhered to the side part of the liquid crystal cell.

Conventionally, by mounting TCP on the side of the liquid crystal cell, the sheet attached to the side of the liquid crystal cell can be lowered by moving the substrate or raising the cassette provided with the sheet. It is made to peel from the side part of a liquid crystal cell.
JP 2001-28382 A

  By the way, with the sheet strongly adhered to the side part of the liquid crystal cell, the sheet may be peeled off from the side part of the liquid crystal cell by simply raising the sheet or lowering the liquid crystal cell. The sheet does not easily peel off from the liquid crystal cell, and the liquid crystal cell rises from the table together with the sheet.

  When the liquid crystal cell is lifted together with the sheet, the sheet is peeled off by the weight of the liquid crystal cell. However, when the sheet is peeled off from the liquid crystal cell, the liquid crystal cell falls because it is lifted from the table. For this reason, the liquid crystal cell is subjected to an impact caused by dropping, and the impact may cause chipping of the liquid crystal cell. In particular, when the liquid crystal cell is enlarged as described above, the tendency becomes remarkable because the sheet is easily adhered to the liquid crystal cell.

  In the present invention, when the electronic component attached to the side portion of the substrate with the anisotropic conductive member is mounted by pressing with a crimping tool through the sheet, the sheet is attached to the anisotropic conductive member. It is another object of the present invention to provide an electronic component mounting apparatus and mounting method that enable the sheet to be peeled off the substrate without lifting the substrate and dropping it.

The present invention is an electronic component mounting apparatus for mounting an electronic component attached to an upper surface of a side portion of a substrate by an anisotropic conductive member,
Conveying means for conveying the substrate in a horizontal direction and a vertical direction, the first vertical driving means;
A backup tool that supports the lower surface of the side portion to which the electronic component of the substrate that has been transported and positioned by the transport means is attached;
Mounted by pressurizing and heating the electronic component attached to the side portion of the substrate whose lower surface is supported by the backup tool when driven vertically by the first vertical drive means and driven downward. A crimping tool to
Sheet feeding means having a sheet interposed between the upper surface of the side portion of the substrate and the crimping tool when the electronic component is mounted by the crimping tool driven in the vertical direction by the second vertical driving means;
After the electronic component is mounted on the substrate by the crimping tool, the crimping tool is lifted by the first vertical driving means, and then the sheet supply means is lifted by the second vertical driving means. When the substrate is raised by the conveying means, the substrate is raised at a speed slower than that of the sheet supply means, and is adhered to a portion exposed from the electronic component of the anisotropic conductive member when the electronic component is mounted. An electronic component mounting apparatus comprising: a control means for peeling the sheet.

A mounting portion on which the sheet supply means is detachably mounted is provided,
The second vertical driving means preferably drives the sheet feeding means in the vertical direction together with the mounting portion.

This invention is an electronic component mounting method for mounting an electronic component attached to the upper surface of a side portion of a substrate by an anisotropic conductive member,
A step of supporting the lower surface of the side part to which the electronic component of the substrate is attached with a backup tool;
Mounting the electronic component attached to the upper surface of the side portion of the substrate on which the lower surface is supported by pressure heating with a crimping tool; and
Interposing a sheet between the upper surface of the side portion of the substrate and the crimping tool when mounting the electronic component on the upper surface of the side portion of the substrate;
After the electronic component is mounted on the substrate by the crimping tool, the crimping tool is raised, and then the substrate is raised at a slower speed than the sheet while raising the sheet, and when the electronic component is mounted, And a step of peeling off the sheet adhered to the portion of the anisotropic conductive member exposed from the electronic component.

According to the present invention, the substrate and the sheet are lifted together, and the rising speed of the substrate is made slower than the rising speed of the sheet, whereby the sheet is peeled from the side portion of the substrate.
Therefore, since the sheet is gradually peeled from the substrate due to the difference in the rising speed between the substrate and the sheet, the sheet is gently peeled from the substrate without lifting the substrate.

An embodiment of the present invention will be described below with reference to the drawings.
FIG. 1 shows a schematic configuration of a mounting apparatus, and the mounting apparatus includes an apparatus main body 1. The apparatus main body 1 is provided with a conveying means 2. The conveying means 2 is movable in the X direction indicated by the arrow, and is driven in the X direction by the X drive source 3 provided in the apparatus main body 1. The X table 4 is orthogonal to the X direction. A Y table 6 movably provided in the Y direction and driven by a Y drive source 5, a Z movable body 9 provided on the Y table 6 and driven in the Z direction which is the vertical direction by a table Z drive source 7, and this The Z movable body 9 has a mounting table 8 provided so as to be drivable in the θ direction which is the rotation direction and driven in the rotation direction by a θ drive source 10. Thereby, the mounting table 8 is driven in the X, Y, Z and θ directions. The table Z drive source 7 and the Z movable body 9 constitute first vertical drive means.

  For example, a substrate W such as a liquid crystal cell is supplied and mounted on the mounting table 8 with its peripheral portion protruding outward from the upper surface of the mounting table 8 and is held by holding means such as vacuum suction. It has become.

  As shown in FIG. 3, a plurality of TCPs 12 as electronic components are temporarily press-bonded at predetermined intervals to one side portion of the substrate W via an anisotropic conductive member 11. The anisotropic conductive member 11 is adhered over the entire length of the side portion of the substrate W. As a result, the anisotropic conductive member 11 is exposed between adjacent TCPs 12 as indicated by 11a in FIG.

  The apparatus main body 1 is provided with a backup tool 14 that supports the lower surface of one side portion of the substrate W held on the mounting table 8 by the upper end surface. The TCP 12 that is temporarily press-bonded to the side portion of the substrate W has the TCP 12 that is temporarily press-bonded to the side portion of the substrate W while the lower surface of the side portion of the substrate W is supported by the upper end surface of the backup tool 14. 15 is used for final pressure bonding.

  The crimping tool 15 is provided on the lower surface of the pressure head 16. The pressure head 16 is provided so as to be movable in the Z direction indicated by an arrow by a linear guide 17 and is driven in the Z direction by a pressure Z drive source 18 such as a servo motor or a linear motor.

  A pair of rail members 21 (as mounting portions) in which a later-described cassette 25 as a sheet supply means is detachably mounted below the crimping tool 15 of the apparatus main body 1 and above the backup tool 14. Are provided horizontally along the X direction with a predetermined interval in the Y direction.

  When the cassette 25 is mounted on the rail member 21, a stopper (not shown) provided on the cassette 25 at a predetermined position shown in FIG. Abut. Thereby, the cassette 25 is positioned.

  At least both ends in the longitudinal direction of the pair of rail members 21 are integrally connected by a connecting member 22. At both ends of the connecting portion, that is, at portions corresponding to both ends of the pair of rail members 21, cassette Z drive sources 23 as second vertical drive means, each of which includes a pulse motor or a linear motor, are provided. Accordingly, the pair of rail members 21 are driven in the Z direction, which is the vertical direction, by four cassette Z drive sources 23 (only two are shown).

  The four cassette Z drive sources 23 are driven in synchronization by a control device 35 described later. Thereby, the pair of rail members 21 is driven in the Z direction in a horizontal state.

  As shown in FIG. 1, the cassette 25 has a pair of rectangular side plates 27 (only one is shown) whose four corners are connected by a connecting shaft 26 at a predetermined interval. The pair of side plates 27 are connected at a larger interval than the length of the side portion to which the TCP 12 of the substrate W is temporarily bonded.

  A feeding shaft 29 around which a heat-resistant sheet 28 made of silicone resin or fluororesin is wound is provided at one end in the longitudinal direction of the pair of side plates 27 so as to be rotatable and detachable with respect to the side plates 27. .

  A winding shaft 32 for winding the sheet 28 wound around the feeding shaft 29 through a plurality of relay rollers 31 is provided at the other longitudinal end of the side plate 27. The take-up shaft 32 is rotationally driven by a take-up motor 33 shown in FIG. 2, and takes up the sheet 28 around the take-up shaft 32 by a predetermined length.

As shown in FIG. 1, when the cassette 25 is mounted at a predetermined position of the apparatus main body 1, a portion located between the feeding shaft 29 and the winding shaft 32 of the sheet 28 mounted on the cassette 25 is the substrate W. The TCP 12 is positioned so as to be opposed to the upper side of the side part to which the provisional pressure bonding is performed.
The X drive source 3, the Y drive source 5, the table Z drive source 7, the θ drive source 10, the pressurizing Z drive source 18, the cassette Z drive source 23, and the take-up motor 33 are controlled as shown in FIG. The drive is controlled by the device 35.

  Next, a description will be given of a case where the TCP 12 temporarily press-bonded to the side portion of the substrate W by the mounting apparatus having the above configuration is subjected to main pressure bonding. First, as shown in FIG. 1, the mounting table 8 is driven in a state where the cassette 25 is mounted on the rail member 21 of the apparatus main body 1, and the side portion of the substrate W to which the TCP 12 is temporarily bonded is located above the backup tool 14. Positioned above the end face. Next, the mounting table 8 is driven downward in the Z direction, and the lower surface of the side portion of the substrate W is supported by the upper end surface of the backup tool 14.

  Next, the table Z drive source 7 is activated to drive the crimping tool 15 downward in the Z direction. As a result, the crimping tool 15 pressurizes while simultaneously heating the plurality of TCPs 12 provided at predetermined intervals on the side of the substrate W via the sheet 28, so that the anisotropic conductive member 11 is melted and the plurality of TCPs 12 are melted. Will be pressure bonded to the side of the substrate W.

  When the TCP 12 is finally crimped to the side of the substrate W, the portion located between the adjacent TCPs 12 of the sheet 28 interposed between the crimping tool 15 and the side of the substrate W is indicated by a chain line in FIG. As shown, the pressure bonding tool 15 pressurizes and affixes the portion 11 a exposed from between adjacent TCPs 12 of the anisotropic conductive member 11. That is, the sheet 28 is stuck to the portion 11 a exposed from between the adjacent TCPs 12 of the anisotropic conductive member 11 at a plurality of locations corresponding to the number of gaps formed between the adjacent TCPs 12.

  The sheet 28 attached to the portion 11a exposed from between the adjacent TCPs 12 of the anisotropic conductive member 11 is peeled as follows. That is, when the main crimping is completed, the pressurizing Z drive source 18 is driven by the control device 35 and the crimping tool 15 is driven in the upward direction. At this time, the part located between the adjacent TCPs 12 of the sheet 28 is adhered to the part exposed from the adjacent TCPs 12 of the anisotropic conductive member 11 on the side part of the substrate W as shown in FIG. ing.

If the crimping tool 15 is raised to a position where it does not interfere with the cassette 25, the cassette Z drive source 23 drives the cassette 25 in the upward direction, and at the same time, the table Z drive source 7 is activated and the substrate W is moved by the mounting table 8. Is driven in the upward direction. At this time, if the rising speed of the substrate W is V1, and the rising speed of the cassette 25 is V2, these rising speeds are controlled by the control device 35 so that V1 <V2.
Although the raising drive of the cassette 25 and the raising drive of the substrate W are performed in synchronization, the raising of the substrate W may be started after raising the cassette 25 slightly.

  As described above, when the substrate W is raised together with the cassette 25 and the rising speed V1 of the substrate W is slower than the rising speed of the cassette 25, that is, the sheet 28, the portion of the sheet 28 adhered to the anisotropic conductive member 11 Since the tension is gently applied to the sheet 28, the sheet 28 is gradually peeled off from both ends in the width direction of the exposed portion 11a of the anisotropic conductive member 11 as shown in FIG.

  Further, as shown in FIG. 4C, if the substrate W is raised from the initial position at the time of the main press-bonding to the height H, tension is continuously applied to the sheet 28 so that the sheet 28 becomes anisotropic. Most portions excluding the central portion in the width direction of the exposed portion 11a of the conductive member 11 are peeled off. When the cassette 25 is further raised with respect to the substrate W, the sheet 28 is reliably peeled from the side portion of the substrate W.

  As described above, when the sheet 28 attached to the portion exposed from the TCP 12 of the anisotropic conductive member 11 on the side portion of the substrate W is peeled off, not only the cassette 25 is lifted but also the rising speed V2 of the cassette 25. The substrate W was raised at a slower speed V1.

  Therefore, the sheet 28 is gradually peeled off from the portion 11a exposed to the side portion of the substrate W of the anisotropic conductive member 11 due to the difference in the rising speed between the cassette 25 and the substrate W. The sheet 28 adhered to the substrate does not pull the substrate W strongly to raise the substrate W from the mounting table 8.

  Accordingly, when the sheet 28 is peeled off from the anisotropic conductive member 11, the substrate W is not lifted off from the mounting table 8 and dropped, thereby preventing the substrate W from being damaged by being shocked. Can do.

  In addition, the difference (V2−V1) between the rising speed V1 of the substrate W and the rising speed V2 of the cassette 25 is the adhesion force of the anisotropic conductive member 11 to the side portion of the substrate W and the substrate W with respect to the mounting table 8. It can be set by the control device 35 so that the substrate W does not float from the mounting table 8 according to the suction holding force.

BRIEF DESCRIPTION OF THE DRAWINGS The schematic block diagram of the mounting apparatus which shows one embodiment of this invention. The block diagram of a control system. The top view of the liquid crystal panel in which TCP was provided in the one side part. (A)-(c) is explanatory drawing which shows the state from which the sheet | seat stuck on the anisotropic conductive member was peeled one by one.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 2 ... Conveyance means, W ... Board | substrate, 7 ... Table Z drive source (1st vertical drive means), 9 ... Z movable body (1st vertical drive means), 12 ... TCP (electronic component), 14 ... Backup Tool: 15 ... Crimping tool, 23 ... Z drive source for cassette (second vertical drive means), 25 ... Cassette (sheet supply means), 28 ... Sheet, 35 ... Control device.

Claims (3)

An electronic component mounting apparatus for mounting an electronic component attached to an upper surface of a side portion of a substrate by an anisotropic conductive member,
Conveying means for conveying the substrate in a horizontal direction and a vertical direction, the first vertical driving means;
A backup tool that supports the lower surface of the side portion to which the electronic component of the substrate that has been transported and positioned by the transport means is attached;
Mounted by pressurizing and heating the electronic component attached to the side portion of the substrate whose lower surface is supported by the backup tool when driven vertically by the first vertical drive means and driven downward. A crimping tool to
Sheet feeding means having a sheet interposed between the upper surface of the side portion of the substrate and the crimping tool when the electronic component is mounted by the crimping tool driven in the vertical direction by the second vertical driving means;
After the electronic component is mounted on the substrate by the crimping tool, the crimping tool is lifted by the first vertical driving means, and then the sheet supply means is lifted by the second vertical driving means. When the substrate is raised by the conveying means, the substrate is raised at a speed slower than that of the sheet supply means, and is adhered to a portion exposed from the electronic component of the anisotropic conductive member when the electronic component is mounted. An electronic component mounting apparatus comprising: control means for peeling the sheet. A mounting portion on which the sheet supply means is detachably mounted is provided,
2. The electronic component mounting apparatus according to claim 1, wherein the second vertical driving means drives the sheet supply means in the vertical direction together with the mounting portion. An electronic component mounting method for mounting an electronic component attached to an upper surface of a side portion of a substrate by an anisotropic conductive member,
A step of supporting the lower surface of the side part to which the electronic component of the substrate is attached with a backup tool;
Mounting the electronic component attached to the upper surface of the side portion of the substrate on which the lower surface is supported by pressure heating with a crimping tool; and
Interposing a sheet between the upper surface of the side portion of the substrate and the crimping tool when mounting the electronic component on the upper surface of the side portion of the substrate;
After the electronic component is mounted on the substrate by the crimping tool, the crimping tool is raised, and then the substrate is raised at a slower speed than the sheet while raising the sheet, and when the electronic component is mounted, And a step of peeling off the sheet adhered to the portion of the anisotropic conductive member exposed from the electronic component.

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