KR20110129267A - Apparatus for manufacturing touch screen panel - Google Patents

Abstract

PURPOSE: A touch screen panel manufacturing apparatus is provided to improve the accuracy of a process by automatically performing the connection process of a gate circuit in a touch electrode panel. CONSTITUTION: A loading unit(2) supplies a panel which is formed on a touch electrode circuit. An ACF(Anisotropic Conductive Film) attaching unit(3) attaches an ACF on the touch electrode circuit. A pre-bonding unit(4) attaches a gate and source operation circuit for operating the touch electrode on the ACF. A main bonding unit(5) bonds the gate operation circuit and the source operation circuit. An unloading unit(6) unloads the boned gate operation circuit and the boned source operation circuit. A vision unit(7) acquires the state information of the panel from an arranged mark which is formed on the touch electrode circuit.

Description

Touch screen panel manufacturing apparatus {Apparatus for Manufacturing Touch Screen Panel}

The present invention relates to a touch screen panel manufacturing apparatus for connecting a driving circuit to the touch screen panel.

A liquid crystal display (LCD) includes a panel and a backlight unit for supplying light to the panel. The panel includes an upper substrate on which a color filter array is formed, a lower substrate on which a thin film transistor (TFT) array is formed, and a liquid crystal layer formed between the upper substrate and the lower substrate. .

Recently, in order to reinforce the competitiveness of the liquid crystal display device, not only a function of displaying an image but also a liquid crystal display device in which various other functions are added has been developed. One kind of liquid crystal display device has been actively developed with a touch screen function that can directly receive input information through a screen.

The liquid crystal display includes a touch electrode for directly receiving input information through a screen, and is manufactured through a process of connecting a driving circuit for driving the touch electrode to a panel on which the touch electrode is formed. While it is possible to perform this process automatically, there is a need for the development of a touch screen panel manufacturing apparatus capable of accurately connecting the driving circuit to the panel on which the touch electrode is formed.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-described needs, and an object of the present invention is to provide a touch screen panel manufacturing apparatus capable of accurately connecting a driving circuit for driving a touch electrode to a panel on which a touch electrode is formed.

In order to achieve the above-mentioned object, the present invention can include the following configuration.

Touch screen panel manufacturing apparatus according to the present invention includes a loading unit for supplying a panel on which the touch electrode is formed on the upper substrate; An ACF attachment part for performing an ACF attachment step of attaching the ACF to the upper substrate of the panel supplied from the loading part; A prebonding unit performing a prebonding process for attaching a gate driving circuit and a source driving circuit for driving the touch electrode on the ACF attached to the upper substrate through the ACF attaching process; A main bonding unit performing a main bonding process of bonding the gate driving circuit and the source driving circuit attached on the ACF through the prebonding process; An unloading unit which unloads a panel bonded with a gate driving circuit and a source driving circuit through the main bonding process; A transfer unit for transferring a panel between the loading unit, the ACF attachment unit, the prebonding unit, the main bonding unit, and the unloading unit; And a vision unit for obtaining status information of the panel from the alignment mark formed on the upper substrate of the panel.

According to the present invention, the following effects can be achieved.

The present invention can automatically perform the process of connecting the gate driving circuit and the source driving circuit for driving the touch electrode to the panel on which the touch electrode is formed, it is possible to obtain the effect of improving the accuracy of this process.

1 and 2 are schematic views of an embodiment of a panel on which a touch electrode is formed
3 and 4 are block diagrams of an apparatus for manufacturing a touch screen panel according to the present invention.
5 is a schematic diagram of a path in which a panel moves in the apparatus for manufacturing a touch screen panel according to the present invention;
6 is a schematic diagram of a path in which a panel is moved in the loading unit;
7 is a schematic plan view of the loading portion and the ACF attachment portion;
8 is a schematic side view of a state in which an ACF is attached to a panel;
9 is a schematic diagram of a path in which a panel is moved in an ACF attachment part;
10 is a schematic plan view of the ACF attachment portion and the prebonding portion;
11 is a schematic side view of a state in which a driving circuit is prebonded to a panel;
12 is a schematic diagram of a path in which a panel is moved in the prebonding unit;
13 is a schematic plan view of a prebonding unit and a main bonding unit;
14 is a schematic side view of a state in which a driving circuit is main bonded to a panel;
15 is a schematic perspective view of a bonding unit
16 is a schematic diagram of a path in which a panel is moved in the main bonding unit;
17 is a schematic plan view of the main bonding portion and the unloading portion;
18 and 19 is a schematic operation state diagram of the ACF inspection unit

The touch screen panel manufacturing apparatus according to the present invention may automatically perform a process of connecting a driving circuit for driving the touch electrode to the panel on which the touch electrode is formed. Hereinafter, an embodiment of the touch screen panel manufacturing apparatus according to the present invention will be described in detail with reference to the accompanying drawings.

1 and 2 are schematic diagrams of an embodiment of a panel on which a touch electrode is formed.

1 and 2, the panel 10 includes an upper substrate 11 having a color filter array, a lower substrate 12 having a thin film transistor array, the upper substrate 11 and the lower substrate 12. The liquid crystal layer 13 formed therebetween, the touch electrode 14 formed on the upper substrate 11, and the sealing member 15 for bonding the upper substrate 11 and the lower substrate 12 may be included. have. The panel 10 may further include an upper polarizing plate 16 coupled to an upper surface of the upper substrate 11, and a lower polarizing plate 17 coupled to a lower surface of the lower substrate 12. In this case, the touch electrode 14 may be formed between the upper polarizing plate 16 and the upper substrate 11.

By the touch screen panel manufacturing apparatus according to the present invention, a driving circuit 20 for driving the touch electrode 14 may be coupled to the upper substrate 11. A plurality of gate lines and a plurality of source lines for driving the touch electrode 14 are formed on the upper substrate 11. The gate lines may be connected to the driving circuit 20 in the first connection region 111 of the upper substrate 11, and the source lines may be connected to the second connection region 112 of the upper substrate 11. It may be connected to the driving circuit 20. The first connection region 111 may be positioned on the side of the first side 11a of the upper substrate 11, and the second connection region 112 may be perpendicular to the first side 11a. It may be located on the side 2b.

The driving circuit 20 may include a gate driving circuit and a source driving circuit. The gate driving circuit may be coupled to the upper substrate 11 to be connected to the gate lines in the first connection region 111. At least one gate driving circuit may be coupled to the first connection region 111. The source driving circuit may be coupled to the upper substrate 11 to be connected to the source lines in the second connection region 112. At least one source driving circuit may be coupled to the second connection region 112. The gate driving circuit and the source driving circuit are respectively connected to the upper substrate 11 to be electrically connected to the gate lines and the source lines through an anisotropic conductive film (hereinafter, referred to as 'ACF'). Can be combined. The gate driver circuit and the source driver circuit may be a flexible printed circuit (FPC).

The touch screen panel manufacturing apparatus according to the present invention may perform a process of connecting the gate driving circuit and the source driving circuit to the panel 10 having the driving circuit 40 coupled to the lower substrate 12. . The touch screen panel manufacturing apparatus according to the present invention may perform the process of connecting the gate driving circuit and the source driving circuit to the panel 10 in which the driving circuit 40 is not coupled to the lower substrate 12. have.

Hereinafter, a preferred embodiment of a touch screen panel manufacturing apparatus according to the present invention will be described in detail with reference to the accompanying drawings.

3 and 4 are block diagrams of an apparatus for manufacturing a touch screen panel according to the present invention, and FIG. 5 is a schematic diagram of a path in which a panel is moved in the apparatus for manufacturing a touch screen panel according to the present invention.

3 to 5, the touch screen panel manufacturing apparatus 1 according to the present invention includes a loading unit 2, an ACF attachment unit 3, a prebonding unit 4, a main bonding unit 5, and an unmounting unit. It may include a loading part 6, a vision part 7, and a conveying part 8. As shown in FIG. 5, the panel 10 is loaded by the loading unit 2, and the ACF attachment unit 3, the prebonding unit 4, and the main bonding unit 5 are connected to each other. After the gate driving circuit and the source driving circuit for driving the touch electrode 14 (shown in FIG. 1) are sequentially coupled, they may be unloaded by the unloading unit 6. The panel 10 is connected to the loading part 2, the ACF attaching part 3, the prebonding part 4, the main bonding part 5, and the unloading part by the transfer part 8. 6) can be transported between. Hereinafter, the loading unit 2, the ACF attachment unit 3, the prebonding unit 4, the main bonding unit 5, the unloading unit 6, the vision unit 7, and the The transfer unit 8 will be described sequentially with reference to the accompanying drawings.

<Loading section 2>

FIG. 6 is a schematic view of a path in which a panel is moved in the loading unit, and FIG. 7 is a schematic plan view of the loading unit and the ACF attachment unit.

1 to 7, the loading unit 2 supplies the panel 10 having the touch electrode 14 formed on the upper substrate 11. The panel 10 may be supplied to the loading unit 2 in a state in which a plurality of panels 10 are accommodated in the storage member 50 (shown in FIG. 6). The panel 10 may be stacked and stored in the storage member 50 up and down. The loading unit 2 may include a loading unit 21 and an ice sheet removing unit 22.

The loading unit 21 moves the storage member 50 to the loading position (2a). The loading position 2a is a position where the panel 10 stands by in the loading section 2 to move from the loading section 2 to the ACF attachment section 3. The loading unit 21 may position the panel 10 at the loading position 2a by moving the storage member 50. The loading unit 21 may include a first storage mechanism 211 and a first transfer mechanism 212.

A plurality of storage members 50 may be stored in the first storage mechanism 211. A plurality of panels 10 are stacked and stored in the storage members 50 in the vertical direction.

The first transfer mechanism 212 may move the storage member 50 from the first storage mechanism 211 to the loading position 2a. The first transport mechanism 212 moves the storage member 50 from the first storage mechanism 211 below the loading position 2a, and then lifts the storage member 50 to the loading position 2a. 50 may be located at the loading position (2a). The first transfer mechanism 212 may move at least one storage member 50 at a time. The first transfer mechanism 212 is a cylinder method using a hydraulic cylinder or a pneumatic cylinder, a gear method using a rack gear and a pinion gear, a ball screw method using a ball screw, a belt method using a pulley and a belt, a conveyor, etc. The storage member 50 can be moved using a method or the like.

The slip sheet removal unit 22 may remove the slip sheets (not shown) from the panel 10 positioned at the loading position 2a. The separator is interposed between the panels 10 stacked on the storage members 50. Accordingly, the separator may prevent scratches and the like from occurring in the panels 10 by blocking direct contact between the panels 10. The ticker sheet may be formed of Teflon. Although not shown, compared to a method of blocking direct contact of the panels 10 by inserting the panel 10 into grooves spaced at predetermined intervals from the storage member 50, manufacturing a touch screen panel according to the present invention. The device 1 may be implemented to accommodate a larger number of panels 10 in one storage member 50 by using the interleaver. Therefore, the touch screen panel manufacturing apparatus 1 according to the present invention can reduce the number of times to move the storage member 50 to position the predetermined number of panels 10 in the loading position (2a), this operation It can shorten the time it takes.

The slip sheet removing unit 22 picks up the sheet of paper from the panel 10 positioned at the loading position 2a and transfers the sheet of paper to the sheet of paper interceptor 60 (shown in FIG. 6) located next to the loading position 2a. can do. A plurality of slip sheets may be stacked and stacked in the slip sheet storage member 60 up and down. Referring to FIG. 7, the slip sheet removing unit 22 may include a first suction nozzle 221 and a first operating mechanism 222.

The first adsorption nozzle 221 may adsorb the Kanji from the panel 10 located at the uppermost side in the storage member 50 (shown in FIG. 6) located at the loading position 2a. The detachment unit 22 may include a plurality of first suction nozzles 221. 7 shows that the first adsorption nozzle 221 is provided with eight, but is not limited thereto, and the number of the liver removal unit 22 is eight or less or nine if the number can stably adsorb the liver paper. The first adsorption nozzle 221 may be included.

The first actuating mechanism 222 may move the first suction nozzle 221 in the X-axis direction, and may move up and down. The first suction nozzle 221 is lifted up and down by the first operating mechanism 222 to pick up the slip sheet from the panel 10 and to the slip sheet 60 (shown in FIG. 6). The slip sheet can be stored. The first suction nozzle 221 may be moved in the X-axis direction by the first operating mechanism 222 to transfer the interlayer paper. Although not shown, the first operating mechanism 222 may move the first suction nozzle 221 in the X-axis direction and the Y-axis direction. The first operating mechanism 222 may be a cylinder method using a hydraulic cylinder or a pneumatic cylinder, a gear method using a rack gear and a pinion gear, a ball screw method using a ball screw, a belt method using a pulley and a belt, and the like. The first adsorption nozzle 221 can be moved and lifted up and down.

3 to 7, the loading unit 2 may further include a first inspection unit 23. The first inspection unit 23 may acquire slip sheet removal information regarding whether slip sheet is removed from the panel 10 positioned at the loading position 2a. The first inspection unit 23 may provide the first sheet removal information 22 and the transfer unit 8 with the obtained sheet removal information. The first sheet removing unit 22 may perform the operation of removing the sheet from the panel 10 located at the loading position 2a based on the sheet removing information obtained by the first inspection unit 23. have. When the first slip sheet removal unit 22 determines that there is slip sheet in the panel 10 located at the loading position 2a from the slip sheet removal information, You can remove the ice sheets. The transfer unit 8 transfers the panel 10 located at the loading position 2a to the ACF attachment unit 3 based on the slip sheet removal information obtained by the first inspection unit 23. can do. When the transfer unit 8 determines that there is no slip sheet in the panel 10 positioned at the loading position 2a from the slip sheet removal information, the transfer unit 8 moves the panel 10 positioned at the loading position 2a to the ACF attachment unit. Can be transferred to (3). The first inspection unit 23 may be installed to be positioned on the panel 10 positioned at the loading position 2a, and may include a CCD camera.

3 to 7, the loading unit 2 may further include a first carrying out unit 24. When the panel 10 is transferred to the ACF attachment part 3 by the transfer part 8 and the storage member 50 (refer to FIG. 6) becomes empty, the first carrying out unit 24 is kept empty. The member 50 can be taken out from the loading position 2a. When the empty storage member 50 is taken out, the loading unit 21 moves the storage member 50 containing the panels 10 to the loading position 2a, and the slip sheet removal unit 22 loads the loading member 21. Remove the slip sheet from the panel 10 positioned at the position 2a, and the transfer section 8 transfers the panel 10 from which the slip sheet has been removed from the loading position 2a to the ACF attachment portion 3; This can be done repeatedly.

<ACF attachment part 3>

8 is a schematic side view of a state in which an ACF is attached to a panel, and FIG. 9 is a schematic diagram of a path in which a panel is moved in an ACF attachment part.

Referring to FIGS. 3, 4, 7 and 9, the ACF attachment part 3 is connected to the ACF on the upper substrate 11 (shown in FIG. 8) of the panel 10 supplied from the loading part 2. ACF attachment step of attaching (30, shown in Figure 8) is performed. The ACF attaching part 3 may attach the ACF 30 to the first connection region 111 (shown in FIG. 2) and the second connection region 112 (shown in FIG. 2), respectively. The ACF attachment unit 3 may include a first support unit 31 and an ACF attachment unit 32.

The first support unit 31 may move the panel 10 supplied from the loading unit 2 to the ACF attachment position 3a. The ACF attachment position 3a is a position where the ACF attachment unit 32 can attach the ACF 30 to the panel 10. The panel 10 may be moved from the loading position 2a to the first support unit 31 by the transfer unit 8 and attached to the ACF while being supported by the first support unit 31. May be moved to position 3a.

The first support unit 31 may adjust the state of the panel 10 based on the first state information provided from the vision unit 7. The first state information may be a position in which the panel 10 is supported in the first support unit 31, a degree of rotation of the panel 10, a size of the panel 10, and the like. The first support unit 31 adjusts the state of the panel 10 based on the first state information so that the ACF 30 (shown in FIG. 8) is shown in the upper substrate 11, FIG. 8. Can be attached in the correct position. Looking specifically at this, it is as follows.

First, vibration, slippage, or the like may occur while the transfer unit 8 transfers the panel 10 to the first support unit 31. Accordingly, the panel 10 may include the first support unit. It may not always be located in the same state at 31. For example, the panel 10 may be supported by the first support unit 31 at different positions in the X-axis direction and the Y-axis direction, and supported by the first support unit 31 in a state of being rotated at a predetermined angle. Can be. That is, the panel 10 may be supported by the first support unit 31 in different states in some cases. Accordingly, when the first support unit 31 moves the panel 10 to the ACF attachment position 3a without adjusting the state of the panel 10, the ACF 30 is shown in FIG. 8. ) Is not attached to the correct position on the upper substrate (11, shown in Figure 8).

In order to solve this problem, the first support unit 31 may adjust the state of the panel 10 based on the first state information provided from the vision unit 7. The first support unit 31 may move the panel 10 in the X-axis direction and the Y-axis direction or rotate the panel 10 based on the first state information. Accordingly, the first support unit 31 may allow the ACF (shown in FIG. 8) to be attached at the correct position on the upper substrate 11 (shown in FIG. 8).

Here, the vision unit 7 may include a first vision unit 71 for acquiring first state information of the panel 10 supported by the first support unit 31. The first vision unit 71 may obtain the first state information from an alignment mark (not shown) formed on the upper substrate 11 of the panel 10. The first vision unit 71 may be installed to be positioned on the panel 10 supported by the first support unit 31. As can be seen from FIG. 1 and FIG. 2 below, the first vision unit 71 is installed above the panel 10 supported by the first support unit 31 to obtain accurate first state information. It is possible to provide accurate first state information to the first support unit (31). FIG. 1 is a still image of an alignment mark obtained when the first vision unit 71 is installed to be positioned below the panel 10 supported by the first support unit 31. FIG. 2 is a still image of an alignment mark obtained when the first vision unit 71 is installed to be positioned above the panel 10 supported by the first support unit 31.

[Figure 1] [Figure 2]

As can be seen from the above Figure 1 and Figure 2, the first vision unit 71 is installed to be positioned on the panel 10 supported by the first support unit 31, the first vision unit 71 Compared with the one installed below the panel 10 supported by the first support unit 31, a clearer still image can be obtained with respect to the alignment mark. Accordingly, the first vision unit 71 may obtain more accurate first status information, and may provide more accurate first status information to the first support unit 31.

Accordingly, the first support unit 31 adjusts the state of the panel 10 more accurately based on the first state information, so that the ACF 30 is attached to the upper substrate 11 in a more accurate position. You can do that. In order to adjust the state of the panel 10 and to move the panel 10 to the ACF attachment position 3a, the first support unit 31 includes a first support mechanism 311 and a first moving mechanism 312. ), And a first rotating mechanism 313.

The first support mechanism 311 supports the panel 10. The first support mechanism 311 may be moved in the X-axis direction and the Y-axis direction by the first movement mechanism 312, and may be rotated about the rotation axis by the first rotation mechanism 313. . Accordingly, the panel 10 may be adjusted in a state such that the ACF 30 may be attached at the correct position on the upper substrate 11 and may be moved to the ACF attachment position 3a. The first support mechanism 311 may be formed in a disk shape as a whole, but is not limited thereto. The first support mechanism 311 may be formed in other shapes such as a square plate shape if the panel 10 is stably supported.

The first moving mechanism 312 may move the panel 10 supported by the first supporting mechanism 311 by moving the first supporting mechanism 311. The first moving mechanism 312 may move the first supporting mechanism 311 such that the panel 10 supported by the first supporting mechanism 311 is positioned at the ACF attachment position 3a. In this case, the first connection region 111 (shown in FIG. 2) and the second connection region 112 (shown in FIG. 2) may be sequentially positioned at the ACF attachment position 3a.

The first moving mechanism 312 may include a first upper member 3121 and a first lower member 3122. The first support mechanism 311 may be coupled to the first upper member 3121 to be movable in the Y-axis direction. The first upper member 3121 may be coupled to the first lower member 3122 so as to be movable in the X-axis direction. As the first upper member 3121 is moved in the X-axis direction, the first support mechanism 311 coupled to the first upper member 3121 may be moved in the X-axis direction. Accordingly, the first support mechanism 311 may be moved in the X-axis direction and the Y-axis direction. Although not shown, the first support mechanism 311 is movably coupled to the first upper member 3121 in the X-axis direction, and the first upper member 3121 is attached to the first lower member 3122. May be coupled to be movable in the Y-axis direction. The first moving mechanism 312 may be a cylinder method using a hydraulic cylinder or a pneumatic cylinder, a gear method using a rack gear and a pinion gear, a ball screw method using a ball screw, a belt method using a pulley and a belt, and the like. The first support mechanism 311 and the first upper member 3121 may be moved by using the same.

The first rotating mechanism 313 may rotate the panel 10 supported by the first supporting mechanism 311 by rotating the first supporting mechanism 311. The first rotating mechanism 313 may rotate the first supporting mechanism 311 to adjust the state of the panel 10 supported by the first supporting mechanism 311. The first rotation mechanism 313 sequentially positions the first connection region 111 (shown in FIG. 2) and the second connection region 112 (shown in FIG. 2) at the ACF attachment position 3a. The first support mechanism 311 may be rotated to make it possible. When the ACF 30 is first attached to the first connection region 111 (shown in FIG. 2), the first rotating mechanism 313 is connected to the second connection region 112 at the ACF attachment position 3a. , The first support mechanism 311 may be rotated to be positioned. When the ACF 30 is first attached to the second connection region 112 (shown in FIG. 2), the first rotating mechanism 313 is located in the ACF attachment position 3a at the first connection region 111. , The first support mechanism 311 may be rotated to be positioned. The first rotating mechanism 313 may be installed on the upper member 3121. The first rotating mechanism 313 may include a motor that provides a rotational force, and the motor is directly connected to the rotating shaft of the first supporting mechanism 311 or through the pulley and the belt. 311) can be connected to the rotation axis.

3, 4, 7 and 8, the ACF attaching unit 32 connects the ACF 30 to the upper substrate 11 of the panel 10 located at the ACF attaching position 3a. Can be attached. The ACF attachment unit 32 may include an ACF supply mechanism 321 (shown in FIG. 4) and an ACF attachment mechanism 322.

The ACF supply mechanism 321 supplies the ACF 30 to the upper substrate 11 located at the ACF attachment position 3a. The ACF 30 may be positioned on the upper substrate 11 by the ACF supply mechanism 321. The ACF 30 may be attached to the first connection region 111 (shown in FIG. 2) and the second connection region 112 (shown in FIG. 2) by the ACF attachment mechanism 322. As described above, the ACF attachment position 3a is shown in the first connection region 111 (shown in FIG. 2) and the second connection region 112 in FIG. 2 by the first rotating mechanism 313. Can be placed sequentially. The ACF 30 may be supplied to the upper substrate 11 positioned at the ACF attachment position 3a while being attached to an ACF protective film (not shown).

Although not shown, the ACF supply mechanism 321 is a reel member on which the ACF protective film to which the ACF 30 is attached is wound, a recovery member for recovering the ACF protective film from which the ACF 30 is removed, and the ACF. A plurality of idle pulleys for placing the ACF protective film (30) attached to the ACF attachment position (3a) in a state where a predetermined tension is maintained, and the ACF protective film to which the ACF 30 is attached In may include a cutter member for cutting the ACF (30) to a predetermined size. When a driving source such as a motor rotates the reel member and the recovery member, the protective film to which the ACF 30 is attached may be moved along a path formed by the reel member, the idle pulleys, and the recovery member. have. Accordingly, the ACF 30 may be supplied to the ACF attachment position 3a, and the ACF protective film from which the ACF 30 is removed may be recovered to the recovery member.

The ACF attachment mechanism 322 may attach the ACF 30 on the upper substrate 11 by applying a force to the ACF 30 located at the ACF attachment position 3a. A portion of the ACF attachment mechanism 322 contacting the ACF 30 may be formed to have a size and a shape substantially coincident with the ACF 30 attached to the upper substrate 11. Although not shown, the ACF attachment mechanism 322 may include a heating device for heating a portion in contact with the ACF 30, so that the ACF 30 is connected to the ACF attachment mechanism 322. It may be attached on the upper substrate 11 by the pressure and heat applied by the. Although not shown, the ACF attachment unit 32 may include an ACF lifting mechanism. The ACF elevating mechanism may raise and lower the ACF attaching mechanism 322 so that the ACF attaching mechanism 322 attaches the ACF 30 to the upper substrate 11.

The ACF attachment mechanism 322 may be coupled to the ACF body 32a to be lowered and lowered. The ACF lifting mechanism and the ACF supply mechanism 321 may be coupled to the ACF body 32a. The ACF attachment mechanism 322 may be coupled to the ACF body 32a so as to be movable in the X axis direction. Accordingly, the ACF attachment mechanism 322 may allow the ACF (30, shown in FIG. 8) to be attached at the correct position on the upper substrate 11 (shown in FIG. 8). The ACF attachment unit 32 may include at least one ACF attachment mechanism 322. When the ACF attachment unit 32 includes a plurality of ACF attachment mechanisms 322, the ACF attachment mechanisms 322 may be moved in the X-axis direction to approach or move away from each other.

Here, the ACF attachment mechanism 322 may be bent on the panel 10 by applying a force to the panel 10 in the process of attaching the ACF 30 on the upper substrate 11. Can be. Accordingly, the ACF 30 may not be attached at the correct position, and deformation may occur in the panel 10. To prevent this, the ACF attachment unit 32 may further include an ACF support member 323.

The ACF support member 323 may support the panel 10 positioned at the ACF attachment position 3a. The ACF support member 323 may support the lower surface of the lower substrate 12 at a position on the same vertical line as the position where the ACF 30 is attached to the upper substrate 11. Accordingly, the ACF support member 323 may allow the ACF 30 to be attached at the correct position, and may prevent deformation of the panel 10. Although not shown, the ACF support member 323 may include a heating device for heating a portion in contact with the lower substrate 12, whereby the ACF 30 may include the ACF attachment mechanism 322. Pressure and heat provided from the heat, and the heat provided from the ACF support member 323 may be attached on the upper substrate (11). A portion of the ACF support member 323 in contact with the lower substrate 12 may be formed in a size and shape substantially coincident with the ACF 30 attached on the upper substrate 11. The ACF support member 323 may be raised or lowered closer to or farther from the panel 10 positioned at the ACF attachment position 3a.

Here, looking at the process of the ACF attaching process for the panel 10, the panel 10 is moved from the loading portion 2 to the ACF attaching portion 3, as shown in FIG. After the ACF is attached to the ACF attachment position 3a and the ACF 30 (shown in FIG. 8) is attached, it may be moved to a position waiting to be moved to the prebonding portion 4. This will be described in detail with reference to FIGS. 3 to 9 as follows.

First, when the transfer unit 8 transfers the panel 10 from the loading unit 2 to the ACF attachment unit 3, the first moving mechanism 312 is the first support mechanism 311. Can be moved to the first seating position (3b). The first seating position 3b is a position at which the transfer part 8 can seat the panel 10 on the first support mechanism 311. The first moving mechanism 312 may position the first supporting mechanism 311 at the first seating position 3b by moving the first supporting mechanism 311 in the X-axis direction and the Y-axis direction. .

Next, when the panel 10 is supported by the first support mechanism 311, the first support unit 31 receives first state information of the panel 10 acquired by the first vision unit 71. The state of the panel 10 can be adjusted as a basis. As described above, the first vision unit 71 is installed to be positioned on the panel 10 supported by the first support unit 31 to obtain accurate first state information, and the first support unit 31 may accurately adjust the state of the panel 10 based on the first state information. In order to adjust the state of the panel 10 according to the first state information, the first moving mechanism 312 may move the first support mechanism 311 in the X-axis direction, Y-axis direction, The first rotating mechanism 313 may rotate the first supporting mechanism 311.

Next, when the state of the panel 10 is adjusted, the first support unit 31 may move the panel 10 to the ACF attachment position 3a. The first moving mechanism 312 may position the panel 10 at the ACF attachment position 3a by moving the first support mechanism 311 in the X-axis direction and the Y-axis direction.

Next, when the panel 10 is positioned at the ACF attachment position 3a, the ACF attachment unit 32 may attach the ACF 30 on the upper substrate 11 of the panel 10. . The first rotating mechanism 313 is configured to attach the ACF 30 to each of the first connection region 111 (shown in FIG. 2) and the second connection region 112 (shown in FIG. 2). 1 The support mechanism 311 can be rotated. For example, when the ACF 30 is first attached to the first connection region 111 (shown in FIG. 2), the first rotation mechanism 313 is located at the ACF attachment position 3a in the second connection region. The first support mechanism 311 may be rotated such that 112 (shown in FIG. 2) is positioned. When the ACF 30 is first attached to the second connection region 112 (shown in FIG. 2), the first rotating mechanism 313 is located at the ACF attachment position 3a in the first connection region 111. , The first support mechanism 311 may be rotated to be positioned.

Next, when the ACF 30 is attached to the upper substrate 11, the first support unit 31 may move the panel 10 to the first standby position 3c. The first standby position 3c is a position at which the transfer part 8 can pick up the panel 10 from the first support mechanism 311. The first moving mechanism 312 may position the panel 10 at the first standby position 3c by moving the first supporting mechanism 311 in the X-axis direction and the Y-axis direction. The transfer unit 8 may transfer the panel 10 on which the ACF attachment process is completed from the ACF attachment unit 3 to the prebonding unit 4.

<Free bonding part 4>

FIG. 10 is a schematic plan view of an ACF attaching part and a prebonding part, FIG. 11 is a schematic side view of a state in which a driving circuit is prebonded to a panel, and FIG.

3, 4, and 10 to 12, the prebonding unit 4 is touch electrode 14 on the ACF 30 attached to the upper substrate 11 through the ACF attaching process. A prebonding process is performed to attach the gate driving circuit 21 (shown in FIG. 11) and the source driving circuit 22 (shown in FIG. The gate driving circuit 21 may be attached to an ACF 30 attached to the first connection region 111 (shown in FIG. 2), and the source driving circuit 22 may be attached to the second connection region ( 112, shown in FIG. 2). The prebonding unit 4 may include a first prebonding unit 41 for attaching the gate driving circuit 21 and a second prebonding unit 42 for attaching the source driving circuit 22. Can be. The first prebonding unit 41 may be installed to be positioned between the ACF attachment portion 3 and the second prebonding unit 42.

Referring to FIGS. 3, 4, 10 and 12, the first prebonding unit 41 may have the gate on the ACF 30 attached to the first connection region 111 (shown in FIG. 2). The drive circuit 21 can be attached. The first prebonding unit 41 may include a second support unit 411 and a first attachment unit 412.

The second support unit 411 may move the panel 10 transferred from the ACF attachment portion 3 to the first attachment position 41a. The first attaching position 41a is a position at which the first attaching unit 412 may attach the gate driving circuit 21 to the ACF 30 attached to the panel 10. The panel 10 may be moved by the transfer unit 8 to the second support unit 411 at the first standby position 3c (shown in FIG. 9), and the second support unit 411 may be moved. It can be moved to the first attachment position (41a) in a state supported on.

The second support unit 411 may adjust the state of the panel 10 based on the second state information provided from the vision unit 7. The second state information may be a position at which the panel 10 is supported by the second support unit 411, a degree of rotation of the panel 10, a size of the panel 10, and the like. The second support unit 411 may adjust the state of the panel 10 based on the second state information, so that the gate driving circuit 21 is attached at the correct position on the ACF 30. . Looking specifically at this, it is as follows.

First, vibration, slippage, or the like may occur while the transfer unit 8 transfers the panel 10 to the second support unit 411. Accordingly, the panel 10 may include the second support unit. 411 may not always be in the same state. For example, the panel 10 may be supported by the second support unit 411 at different positions in the X-axis direction and the Y-axis direction, and is supported by the second support unit 411 in a state of being rotated at a predetermined angle. Can be. That is, the panel 10 may be supported by the second support unit 411 in different states in some cases. Accordingly, when the second support unit 411 moves the panel 10 to the first attaching position 41a without adjusting the state of the panel 10, the gate driving circuit 21 causes the There is a problem in that it is not attached to the correct position on the ACF (30).

In order to solve this problem, the second support unit 411 may adjust the state of the panel 10 based on the second state information provided from the vision unit 7. The second support unit 411 may move the panel 10 in the X-axis direction and the Y-axis direction or rotate the panel 10 based on the second state information. Accordingly, the second support unit 411 may allow the gate driving circuit 21 to be attached at the correct position on the ACF 30.

Here, the vision unit 7 may include a second vision unit 72 for acquiring second state information of the panel 10 supported by the second support unit 411. The second vision unit 72 may obtain the second state information from an alignment mark (not shown) formed on the upper substrate 11 of the panel 10. The second vision unit 72 may be installed to be positioned on the panel 10 supported by the second support unit 411. As can be seen from the above Figure 1 and Figure 2, the second vision unit 72 is installed so as to be positioned on the panel 10 supported by the second support unit 411, the second vision unit 72 Compared to the one installed below the panel 10 supported by the second support unit 411, a clearer still image can be obtained with respect to the alignment mark. Accordingly, the second vision unit 72 may obtain more accurate second state information, and may provide more accurate second state information to the second support unit 411.

Accordingly, the second support unit 411 adjusts the state of the panel 10 more accurately based on the second state information, so that the gate driving circuit 21 is located at a more accurate position on the ACF 30. Can be attached. In order to adjust the state of the panel 10 and to move the panel 10 to the first attachment position 41a, the second support unit 411 includes a second support mechanism 4111 and a second movement mechanism ( 4112, and a second rotating mechanism 4113.

The second supporting mechanism 4111, the second moving mechanism 4112, and the second rotating mechanism 4113 are respectively the first supporting mechanism 311, the first moving mechanism 312, and the first rotating mechanism 4113. Since it can be configured to substantially coincide with the one rotating mechanism 313, only the parts where there are differences will be described below.

The second support mechanism 4111 may be moved in the X-axis direction and the Y-axis direction by the second movement mechanism 4112, and may be rotated about the rotation axis by the second rotation mechanism 4113. . Accordingly, the panel 10 may be adjusted in a state such that the gate driving circuit 21 may be attached at the correct position on the ACF 30 and may be moved to the first attaching position 41a.

The second moving mechanism 4112 may move the second supporting mechanism 4111 such that the panel 10 supported by the second supporting mechanism 4111 is positioned at the first attaching position 41a. In this case, the first connection region 111 (shown in FIG. 2) may be located in the first attachment position 41a. The second moving mechanism 4112 may include a cylinder method using a hydraulic cylinder or a pneumatic cylinder, a gear method using a rack gear and a pinion gear, a ball screw method using a ball screw, a belt method using a pulley and a belt, and the like. By using the second support mechanism 4111 can be moved in the X-axis direction and the Y-axis direction.

The second rotating mechanism 4113 may rotate the panel 10 supported by the second supporting mechanism 4111 by rotating the second supporting mechanism 4111. When the first connection region 111 (shown in FIG. 2) is supported by the second support mechanism 4111 without facing the first attachment position 41a, the second rotation mechanism 4113. The second support mechanism 4111 may rotate to allow the first connection region 111 (shown in FIG. 2) to be positioned at the first attachment position 41a. The second rotating mechanism 4113 may rotate the second supporting mechanism 4111 to adjust the state of the panel 10 supported by the second supporting mechanism 4111. The second rotating mechanism 4113 may include a motor that provides a rotational force, and the motor is directly connected to the rotation shaft of the second supporting mechanism 4111 or through the pulley and the belt. 4111 may be connected to the rotation shaft.

3, 4, and 10 to 12, the first attaching unit 412 attaches the gate driving circuit 21 to the ACF 30 positioned at the first attaching position 41a. You can. The first attachment unit 412 may include a first supply mechanism 4121, a first attachment mechanism 4122, a first driving mechanism 4123, and a first support member 4124 (shown in FIG. 11). Can be.

The first supply mechanism 4121 may supply the gate driving circuit 21 to a first pickup position. The first pick-up position is a position at which the first attaching mechanism 4122 can pick up the gate driving circuit 21. Although not shown, the first supply mechanism 4121 may include a first storage member in which a plurality of gate driving circuits 21 are stored, a first support member supporting the gate driving circuit 21 at the first pick-up position, And a first pickup mechanism for absorbing the gate driving circuit 21 to transfer the gate driving circuit 21 from the first storage member to the first support member. When the first pickup mechanism transfers the gate driving circuit 21 from the first storage member to the first supporting member, the first attaching mechanism 4122 may include a gate driving circuit located at the first supporting member. 21 may be picked up and attached to the ACF 30 positioned at the first attachment position 41a.

Although not shown, the first attachment unit 412 may include a first inspection vision and a first alignment vision.

The first inspection vision may acquire first pickup information regarding whether the first pickup mechanism picks up the gate driving circuit 21. The first pickup mechanism may pick up the gate driver circuit 21 from the first storage member based on the first pickup information, and transfer the picked up gate driver circuit 21 to the first support member. Can be. The first inspection vision may be located above the gate driving circuit 21 picked up by the first pickup mechanism. The first inspection vision may include a CCD camera.

The first alignment vision may obtain first pick-up state information regarding a pickup state of the gate driving circuit 21 picked up by the first attachment mechanism 4122. The first attaching mechanism 4122 may accurately attach the gate driving circuit 21 to the ACF 30 located at the first attaching position 41a based on the first pick-up state information. The first alignment vision may be disposed below the gate driving circuit 21 picked up by the first attachment mechanism 4122. The first alignment vision may include a CCD camera.

3, 4, and 10 to 12, the first attaching mechanism 4122 may transfer the gate driving circuit 21 to the first attaching position 41a, and the first attaching mechanism. By applying a force to the gate driving circuit 21 located at the position 41a, the gate driving circuit 21 can be attached on the ACF 30. Although not shown, the first attachment mechanism 4122 may include a heating device for heating a portion in contact with the gate driving circuit 21, and thus the gate driving circuit 21 and the ACF ( 30 may be attached by pressure and heat applied by the first attaching mechanism 4122.

The first driving mechanism 4123 (shown in FIG. 10) may move the first mounting mechanism 4122 in the X-axis direction and the Y-axis direction, and may raise and lower the first mounting mechanism 4122. have. The first attachment mechanism 4122 is lifted up and down by the first driving mechanism 4123 to pick up the gate driving circuit 21 from the first supporting member, and the gate driving circuit 21 It can attach on the ACF 30 located in the 1st attachment position 41a. The first attaching mechanism 4122 is moved in the X-axis direction and the Y-axis direction by the first driving mechanism 4123 to move the gate driving circuit 21 from the first pick-up position to the first attaching position 41a. ) Can be transferred. The first driving mechanism 4123 may include a cylinder method using a hydraulic cylinder or a pneumatic cylinder, a gear method using a rack gear and a pinion gear, a ball screw method using a ball screw, a belt method using a pulley and a belt, and the like. By using the first attachment mechanism 4122 can be moved, it can be moved up and down.

The first support member 4124 (shown in FIG. 11) may support the panel 10 positioned at the first attachment position 41a. The first supporting member 4124 may support the bottom surface of the lower substrate 12 at a position on the same vertical line as the position where the ACF 30 is attached to the upper substrate 11. Accordingly, the first support member 4124 may allow the gate driving circuit 21 to be attached at the correct position, and may prevent deformation of the panel 10. Although not shown, the first support member 4124 may include a heating device for heating a portion in contact with the lower substrate 12, and thus the gate driving circuit 21 and the ACF 30. ) May be attached by the pressure and heat provided from the first attachment mechanism 4122 and the heat provided from the first support member 4124. A portion of the first supporting member 4124 contacting the lower substrate 12 may be formed in a size and shape that substantially correspond to the ACF 30 attached to the upper substrate 11. The first support member 4124 may be moved up or down to approach or move away from the panel 10 positioned at the first attachment position 41a.

When the gate driving circuit 21 is attached to the panel 10, the panel 10 is transferred from the first prebonding unit 41 to the second prebonding unit 42 by the transfer unit 8. Can be transported.

3, 4, and 10 to 12, the second prebonding unit 42 is disposed on the ACF 30 attached to the second connection region 112 (shown in FIG. 2). The drive circuit 22 can be attached. The second prebonding unit 42 may include a third support unit 421 and a second attachment unit 422.

The third support unit 421 may move the panel 10 transferred from the second support unit 411 to the second attachment position 42a. The second attaching position 42a is a position at which the second attaching unit 422 may attach the source driving circuit 22 to the ACF 30 attached to the panel 10. The panel 10 may be moved from the second support unit 411 to the third support unit 421 by the transfer unit 8, and the panel 10 may be supported by the third support unit 421. The second attachment position 42a may be moved.

The third support unit 421 may adjust the state of the panel 10 based on the third state information provided from the vision unit 7. The third state information may be a position in which the panel 10 is supported by the third support unit 421, a degree of rotation of the panel 10, a size of the panel 10, and the like. The third support unit 421 may adjust the state of the panel 10 based on the third state information, so that the source driving circuit 22 is attached at the correct position on the ACF 30. . Looking specifically at this, it is as follows.

First, vibration, slippage, or the like may occur while the transfer unit 8 transfers the panel 10 to the third support unit 421. Accordingly, the panel 10 may include the third support unit. It may not always be located at the same state at 421. For example, the panel 10 may be supported by the third support unit 421 at different positions in the X-axis direction and the Y-axis direction, and is supported by the third support unit 421 while being rotated at a predetermined angle. Can be. That is, the panel 10 may be supported by the third support unit 421 in different states in some cases. Accordingly, when the third support unit 421 moves the panel 10 to the second attachment position 42a without adjusting the state of the panel 10, the source driving circuit 22 causes the There is a problem in that it is not attached to the correct position on the ACF (30).

In order to solve this problem, the third support unit 421 may adjust the state of the panel 10 based on the third state information provided from the vision unit 7. The third support unit 421 may move the panel 10 in the X-axis direction and the Y-axis direction or rotate the panel 10 based on the third state information. Accordingly, the third support unit 421 may allow the source driving circuit 22 to be attached at the correct position on the ACF 30.

Here, the vision unit 7 may include a third vision unit 73 for acquiring third state information of the panel 10 supported by the third support unit 421. The third vision unit 73 may obtain the third state information from an alignment mark (not shown) formed on the upper substrate 11 of the panel 10. The third vision unit 73 may be installed to be positioned on the panel 10 supported by the third support unit 421. As can be seen from FIG. 1 and FIG. 2, the third vision unit 73 is installed to be positioned on the panel 10 supported by the third support unit 421, thereby allowing the third vision unit 73 to be positioned. Compared to the one installed below the panel 10 supported by the third support unit 421, a clearer still image can be obtained with respect to the alignment mark. Accordingly, the third vision unit 73 may obtain more accurate third state information, and may provide more accurate third state information to the third support unit 421.

Accordingly, the third support unit 421 adjusts the state of the panel 10 more accurately based on the third state information, so that the source driving circuit 22 is located at a more accurate position on the ACF 30. Can be attached. In order to adjust the state of the panel 10 and to move the panel 10 to the second attachment position 42a, the third support unit 421 includes a third support mechanism 4211 and a third movement mechanism ( 4212, and a third rotating mechanism 4213.

The third supporting mechanism 4211, the third moving mechanism 4212, and the third rotating mechanism 4213 are each of the first supporting mechanism 311, the first moving mechanism 312, and the third rotating mechanism 4213. Since it can be configured to substantially coincide with the one rotating mechanism 313, only the parts where there are differences will be described below.

The third support mechanism 4211 may be moved in the X-axis direction and the Y-axis direction by the third movement mechanism 4212, and may be rotated about the rotation axis by the third rotation mechanism 4213. . Accordingly, the panel 10 may be adjusted in a state such that the source driving circuit 22 may be attached at the correct position on the ACF 30, and may be moved to the second attaching position 42a.

The third movement mechanism 4212 may move the third support mechanism 4211 so that the panel 10 supported by the third support mechanism 4211 is positioned at the second attachment position 42a. In this case, the second connection region 112 (shown in FIG. 2) may be located in the second attachment position 42a. The third moving mechanism 4212 may include a cylinder method using a hydraulic cylinder or a pneumatic cylinder, a gear method using a rack gear and a pinion gear, a ball screw method using a ball screw, a belt method using a pulley and a belt, and the like. The third support mechanism 4211 may be moved in the X-axis direction and the Y-axis direction by using the same.

The third rotation mechanism 4213 may rotate the third support mechanism 4211 to rotate the panel 10 supported by the third support mechanism 4211. The third rotation mechanism 4213 may rotate the third support mechanism 4211 so that the second connection region 112 (shown in FIG. 2) can be positioned at the second attachment position 42a. . As shown in FIG. 2, the first connection region 111 (shown in FIG. 2) and the second connection region 112 (shown in FIG. 2) are respectively perpendicular to the sides of the first side 11a. It is located in the second side 11b side. Accordingly, in the panel 10 transferred from the first prebonding unit 41, the first connection area 111 (shown in FIG. 2) faces the second attachment position 42a. It may be supported by the support mechanism 4211. In this case, the third rotation mechanism 4213 rotates the third support mechanism 4211 approximately 90 degrees, thereby allowing the second connection region 112 (shown in FIG. 2) to the second attachment position 42a. The panel 10 can be rotated so that it can be positioned. The third rotating mechanism 4213 may rotate the third supporting mechanism 4211 to adjust a state of the panel 10 supported by the third supporting mechanism 4211. The third rotating mechanism 4213 may include a motor that provides a rotational force, and the motor is directly connected to the rotation shaft of the third supporting mechanism 4211, or the third supporting mechanism (eg, through a pulley and a belt). 4211 may be connected to the rotation axis.

3, 4, and 10 to 12, the second mounting unit 422 attaches the source driving circuit 22 to the ACF 30 positioned at the second mounting position 42a. You can. The second attachment unit 422 may include a second supply mechanism 4221, a second attachment mechanism 4222, a second driving mechanism 4223, and a second support member 4224.

The second supply mechanism 4201 may supply the source driving circuit 22 to a second pickup position. The second pickup position is a position at which the second attachment mechanism 4202 can pick up the source driving circuit 22. Although not shown, the second supply mechanism 4221 may include a second storage member in which a plurality of source driving circuits 22 are stored, a second support member supporting the source driving circuit 22 at the second pick-up position, And a second pickup mechanism for absorbing the source driving circuit 22 and transferring the source driving circuit 22 from the second storage member to the second support member. When the second pick-up mechanism transfers the source driving circuit 22 from the second storage member to the second supporting member, the second attaching mechanism 4202 may be a source driving circuit positioned on the second supporting member. 22 may be picked up and attached to the ACF 30 located at the second attachment position 42a.

Although not shown, the second attachment unit 422 may include a second inspection vision and a second alignment vision.

The second inspection vision may acquire second pickup information on whether the second pickup mechanism picks up the source driving circuit 22. The second pickup mechanism may pick up the source driver circuit 22 from the second storage member based on the second pickup information, and transfer the picked up source driver circuit 22 to the second support member. Can be. The second inspection vision may be installed above the source driving circuit 22 picked up by the second pickup mechanism. The second inspection vision may include a CCD camera.

The second alignment vision may acquire second pick-up state information regarding a pickup state of the source driving circuit 22 picked up by the second attachment mechanism 4222. The second attachment mechanism 4202 may accurately attach the source driving circuit 22 to the ACF 30 located at the second attachment position 42a based on the second pick-up state information. The second alignment vision may be installed below the source driving circuit 22 picked up by the second attachment mechanism 4222. The second alignment vision may include a CCD camera.

3, 4, and 10 to 12, the second attaching mechanism 4422 may transfer the source driving circuit 22 to the second attaching position 42a, and the second attaching mechanism By applying a force to the source driver circuit 22 located at the position 42a, the source driver circuit 22 can be attached on the ACF 30. Although not shown, the second attachment mechanism 4202 may include a heating device for heating a portion in contact with the source driving circuit 22, and thus, the source driving circuit 22 and the ACF ( 30 may be attached by pressure and heat applied by the second attaching mechanism 4422.

The second driving mechanism 4223 (shown in FIG. 10) may move the second mounting mechanism 4202 in the X-axis direction and the Y-axis direction, and may raise and lower the second mounting mechanism 4422. have. The second attachment mechanism 4222 can be lifted up and down by the second driving mechanism 4223 to pick up the source driving circuit 22 from the second supporting member, and to cause the source driving circuit 22 to be moved. It can be attached on the ACF 30 located in the second attachment position 42a. The second attachment mechanism 4222 is moved in the X-axis direction and the Y-axis direction by the second driving mechanism 4223 to move the source driving circuit 22 from the second pickup position to the second attachment position 42a. ) Can be transferred. The second driving mechanism 4223 uses a cylinder method using a hydraulic cylinder or a pneumatic cylinder, a gear method using a rack gear and a pinion gear, a ball screw method using a ball screw, a belt method using a pulley and a belt, and the like. The second attaching mechanism 4422 can be moved and raised and lowered by use.

The second support member 4224 (shown in FIG. 11) may support the panel 10 positioned at the second attachment position 42a. The second support member 4224 may support the bottom surface of the lower substrate 12 at a position on the same vertical line as the position where the ACF 30 is attached to the upper substrate 11. Accordingly, the second support member 4224 may allow the source driving circuit 22 to be attached at the correct position, and may prevent deformation of the panel 10. Although not shown, the second support member 4224 may include a heating device for heating a portion in contact with the lower substrate 12, and thus the source driving circuit 22 and the ACF 30. ) May be attached by the pressure and heat provided from the second attachment mechanism 4222 and the heat provided from the second support member 4224. A portion of the second support member 4224 contacting the lower substrate 12 may be formed in a size and shape that substantially matches the ACF 30 attached to the upper substrate 11. The second support member 4224 may be moved up or down to approach or move away from the panel 10 positioned at the second attachment position 42a.

Here, the process of performing the prebonding process with respect to the panel 10 will be described. As shown in FIG. 12, the panel 10 has the first pre-attach at the ACF attaching part 3 (shown in FIG. After being moved to the bonding unit 41 and moved to the first attaching position 41a, the gate driving circuit 21 (shown in FIG. 11) is attached to the ACF 30 (shown in FIG. 11). In addition, the second prebonding unit 42 may be moved to a position waiting to be moved. In addition, the panel 10 is moved from the first prebonding unit 41 to the second prebonding unit 42, and to the second attachment position 42a to the ACF 30 (FIG. 11). After the source driving circuit 22 (shown in FIG. 11) is attached to the main driving unit 22, the source driving circuit 22 (see FIG. 11) may be moved to a position waiting to be moved to the main bonding unit 5. This will be described in detail with reference to FIGS. 3, 4, and 10 to 12.

First, when the transfer unit 8 transfers the panel 10 from the ACF attachment unit 3 to the first prebonding unit 41, the second moving mechanism 4112 may be configured to provide the second support mechanism. The 4111 can be moved to the second seating position 41b. The second seating position 41b is a position at which the transfer part 8 may seat the panel 10 on the second support mechanism 4111. The second moving mechanism 4112 may position the second supporting mechanism 4111 at the second seating position 41b by moving the second supporting mechanism 4111 in the X-axis direction and the Y-axis direction. .

Next, when the panel 10 is supported by the second support mechanism 4111, the second support unit 411 receives the second state information of the panel 10 acquired by the second vision unit 72. The state of the panel 10 can be adjusted as a basis. As described above, the second vision unit 72 is installed to be positioned on the panel 10 supported by the second support unit 411 to obtain accurate second state information, and the second support unit 411 may accurately adjust the state of the panel 10 based on the second state information. In order to adjust the state of the panel 10 according to the second state information, the second moving mechanism 4112 may move the second support mechanism 4111 in the X-axis direction and the Y-axis direction, The second rotating mechanism 4113 may rotate the second supporting mechanism 4111.

Next, when the state of the panel 10 is adjusted, the second support unit 411 may move the panel 10 to the first attachment position 41a. The second moving mechanism 4112 may position the panel 10 at the first attachment position 41a by moving the second support mechanism 4111 in the X-axis direction and the Y-axis direction.

Next, when the panel 10 is positioned at the first attaching position 41a, the first attaching unit 412 is on the gate driving circuit on the ACF 30 positioned at the first attaching position 41a. (21) can be attached.

Next, when the gate driving circuit 21 is attached to the ACF 30, the second support unit 411 may move the panel 10 to the second standby position 41c. The second standby position 41c is a position at which the transfer part 8 can pick up the panel 10 from the second support mechanism 4111. The second moving mechanism 4112 may position the panel 10 at the second standby position 41c by moving the second supporting mechanism 4111 in the X-axis direction and the Y-axis direction. The transfer unit 8 may transfer the panel 10 to which the gate driving circuit 21 is attached, from the first prebonding unit 41 to the second prebonding unit 42.

Next, when the transfer unit 8 transfers the panel 10 from the first prebonding unit 41 to the second prebonding unit 42, the third moving mechanism 4212 may be configured to include the third transfer mechanism 4212. The support mechanism 4211 can be moved to the third seating position 42b. The third seating position 42b is a position at which the transfer part 8 may seat the panel 10 on the third support mechanism 4211. The third movement mechanism 4212 may move the third support mechanism 4211 in the X-axis direction and the Y-axis direction to position the third support mechanism 4211 at the third seating position 42b. .

Next, when the panel 10 is supported by the third support mechanism 4211, the third rotation mechanism 4213 is shown in the second connection region 112 and the second attachment position 42a in FIG. 2. The third support mechanism 4211 can be rotated approximately 90 degrees.

Next, when the second connection region 112 (shown in FIG. 2) can be positioned at the second attachment position 42a, the third support unit 421 is connected to the third vision unit 73. The state of the panel 10 may be adjusted based on the third state information of the panel 10 obtained by the. As described above, the third vision unit 73 may be installed to be positioned on the panel 10 supported by the third support unit 421 to obtain accurate third state information. 421 may accurately adjust the state of the panel 10 based on the third state information. In order to adjust the state of the panel 10 according to the third state information, the third moving mechanism 4212 may move the third supporting mechanism 4211 in the X-axis direction and the Y-axis direction, The third rotating mechanism 4213 may rotate the third supporting mechanism 4211.

Next, when the state of the panel 10 is adjusted, the third support unit 421 may move the panel 10 to the second attachment position 42a. The third moving mechanism 4212 may position the panel 10 at the second attachment position 42a by moving the third support mechanism 4211 in the X-axis direction and the Y-axis direction.

Next, when the panel 10 is positioned at the second attaching position 42a, the second attaching unit 422 is located on the ACF 30 positioned at the second attaching position 42a. (22) can be attached.

Next, when the source driving circuit 22 is attached to the ACF 30, the third support unit 421 may move the panel 10 to the third standby position 42c. The third standby position 42c is a position at which the transfer part 8 can pick up the panel 10 from the third support mechanism 4211. The third moving mechanism 4212 may position the panel 10 at the third standby position 42c by moving the third supporting mechanism 4211 in the X-axis direction and the Y-axis direction. The transfer unit 8 may transfer the panel 10 to which the gate driver circuit 21 and the source driver circuit 22 are attached, from the prebonding unit 4 to the main bonding unit 5.

<Main bonding part 5>

13 is a schematic plan view of a prebonding unit and a main bonding unit, FIG. 14 is a schematic side view of a state in which a driving circuit is main bonded to a panel, FIG. 15 is a schematic perspective view of a bonding unit, and FIG. 16 is a panel in a main bonding unit. This is a schematic diagram regarding the route to be moved.

3, 4, 13 to 16, the main bonding portion 5 is a gate driving circuit 21, which is attached to the ACF (30, shown in Figure 14) through the pre-bonding process 14) and a main bonding process for bonding the source driving circuit 22 (shown in FIG. 14). The main bonding unit 5 may include a first main bonding unit 51 for bonding the source driving circuit 22 and a second main bonding unit 52 for bonding the gate driving circuit 21. Can be. The first main bonding unit 51 may be installed between the prebonding unit 4 and the second main bonding unit 52.

The first main bonding unit 51 may bond the source driving circuit 22 attached to the second connection region 112 (shown in FIG. 2). The first main bonding unit 51 may include a fourth support unit 511 and a first bonding unit 512.

The fourth support unit 511 may move the panel 10 transferred from the prebonding unit 4 to the first bonding position 51a. The first bonding position 51a is a position at which the first bonding unit 512 may bond the source driving circuit 22 attached to the panel 10. The panel 10 may be moved to the fourth support unit 511 by the transfer unit 8 from the third standby position 42c (shown in FIG. 12), and the fourth support unit 511 may be moved. It can be moved to the first bonding position (51a) in a state supported by.

The fourth support unit 511 may adjust the state of the panel 10 based on the fourth state information provided from the vision unit 7. The fourth state information may be a position in which the panel 10 is supported in the fourth support unit 511, a degree of rotation of the panel 10, a size of the panel 10, and the like. The fourth support unit 511 may adjust the state of the panel 10 based on the fourth state information, so that the source driving circuit 22 may be accurately and firmly bonded. Looking specifically at this, it is as follows.

First, vibration, slippage, or the like may occur in a process in which the transfer unit 8 transfers the panel 10 to the fourth support unit 511. Accordingly, the panel 10 may include the fourth support unit. 511 may not always be located in the same state. For example, the panel 10 may be supported by the fourth support unit 511 at different positions in the X-axis direction and the Y-axis direction, and is supported by the fourth support unit 511 in a state of being rotated at a predetermined angle. Can be. That is, the panel 10 may be supported by the fourth support unit 511 in different states in some cases. Accordingly, when the fourth support unit 511 moves the panel 10 to the first bonding position 51a without adjusting the state of the panel 10, the source driving circuit 22 is correct. There is a problem that can not be firmly bonded.

In order to solve this problem, the fourth support unit 511 may adjust the state of the panel 10 based on the fourth state information provided from the vision unit 7. The fourth support unit 511 may move the panel 10 in the X-axis direction and the Y-axis direction or rotate the panel 10 based on the fourth state information. Accordingly, the fourth support unit 511 may allow the source driving circuit 22 to be accurately and firmly bonded.

Here, the vision unit 7 may include a fourth vision unit 74 for obtaining fourth state information of the panel 10 supported by the fourth support unit 511. The fourth vision unit 74 may obtain the fourth state information from an alignment mark (not shown) formed on the upper substrate 11 of the panel 10. The fourth vision unit 74 may be installed on the panel 10 supported by the fourth support unit 511. As can be seen from the above Figure 1 and Figure 2, the fourth vision unit 74 is installed so as to be positioned on the panel 10 supported by the fourth support unit 511, the fourth vision unit 74 Compared to the one installed below the panel 10 supported by the fourth support unit 511, a clearer still image can be obtained with respect to the alignment mark. Accordingly, the fourth vision unit 74 may obtain more accurate fourth state information, and may provide more accurate fourth state information to the fourth support unit 511.

Accordingly, the fourth support unit 511 may adjust the state of the panel 10 more accurately based on the fourth state information, so that the source driving circuit 22 may be bonded more accurately and firmly. . In order to adjust the state of the panel 10 and to move the panel 10 to the first bonding position 51a, the fourth supporting unit 511 is provided with a fourth supporting mechanism 5111 and a fourth moving mechanism ( 5112, and a fourth rotating mechanism 5113.

The fourth supporting mechanism 5111, the fourth moving mechanism 5112, and the fourth rotating mechanism 5113 may be the first supporting mechanism 311, the first moving mechanism 312, and the first rotating mechanism 5113, respectively. Since it can be configured to substantially coincide with the one rotating mechanism 313, only the parts where there are differences will be described below.

The fourth support mechanism 5111 may be moved in the X-axis direction and the Y-axis direction by the fourth movement mechanism 5112, and may be rotated about the rotation axis by the fourth rotation mechanism 5113. . Accordingly, the panel 10 may be adjusted in a state such that the source driving circuit 22 may be accurately and firmly bonded, and may be moved to the first bonding position 51a.

The fourth moving mechanism 5112 may move the fourth supporting mechanism 5111 such that the panel 10 supported by the fourth supporting mechanism 5111 is positioned at the first bonding position 51a. In this case, the second connection region 112 (shown in FIG. 2) may be located in the first bonding position 51a. The fourth moving mechanism 5112 may be a cylinder method using a hydraulic cylinder or a pneumatic cylinder, a gear method using a rack gear and a pinion gear, a ball screw method using a ball screw, a belt method using a pulley and a belt, and the like. The fourth support mechanism 5111 can be moved in the X-axis direction and the Y-axis direction by using the same.

The fourth rotating mechanism 5113 may rotate the panel 10 supported by the fourth supporting mechanism 5111 by rotating the fourth supporting mechanism 5111. The fourth rotating mechanism 5113 may rotate the fourth supporting mechanism 5111 to adjust the state of the panel 10 supported by the fourth supporting mechanism 5111. The fourth rotating mechanism 5113 may include a motor that provides a rotational force, and the motor is directly connected to the rotating shaft of the fourth supporting mechanism 5111 or through the pulley and the belt. 5111 may be connected to the rotation axis.

3, 4, and 13 to 16, the first bonding unit 512 may bond the source driving circuit 22 located at the first bonding position 51a. The main bonding unit 5 may include at least one first bonding unit 512. The first bonding unit 512 may include a first bonding mechanism 5121, a first lifting mechanism 5122, and a first control mechanism 5123 (shown in FIG. 4).

The first bonding mechanism 5121 may bond the source driving circuit 22. The first bonding mechanism 5121 may bond the source driving circuit 22 by applying a force to the source driving circuit 22 located at the first bonding position 51a. Although not shown, the first bonding mechanism 5121 may include a heating device for heating a portion in contact with the source driving circuit 22, so that the source driving circuit 22 may include the first driving mechanism 22. It can be bonded by pressure and heat applied by the bonding mechanism 5121. The first bonding mechanism 5121 may be installed on the first bonding body 512a to be lowered and lowered.

The first elevating mechanism 5122 (shown in FIG. 15) may raise and lower the first bonding mechanism 5121. The first bonding mechanism 5121 may be moved up and down by the first lifting mechanism 5122 to bond the source driving circuit 22 located at the first bonding position 51a. The first elevating mechanism (5122) is a cylinder method using a hydraulic cylinder or a pneumatic cylinder, a gear method using a rack gear and a pinion gear, a ball screw method using a ball screw, a belt method using a pulley and a belt, etc. It is possible to raise and lower the first bonding mechanism (5121) by using. The first elevating mechanism 5122 may be installed in the first bonding body 512a.

The first control mechanism 5123 (shown in FIG. 4) may control the first elevating mechanism 5122 based on first control information. The first control information includes a pressure provided by the first bonding mechanism 5121 to the source driving circuit 22, a temperature of heat provided by the first bonding mechanism 5121 to the source driving circuit 22, and It may be a speed at which the first bonding mechanism (5121) is raised and lowered. The first control mechanism 5123 controls the first elevating mechanism 5122 based on the first control information, so that the source driving circuit 22, the sealing member 15, and the like are not damaged. The first bonding mechanism 5121 may be controlled so that the source driving circuit 22 is firmly bonded.

3, 4, and 13 to 16, the first bonding unit 512 may further include a first pressure sensor 5124 (shown in FIG. 15). The first pressure sensor 5124 may be installed to be located between the first bonding mechanism 5121 and the first lifting mechanism 5122. The first elevating mechanism 5122 may elevate the first bonding mechanism 5121 by applying a force to the first pressure sensor 5124. From the force exerted by the first elevating mechanism (5122) to the first pressure sensor (5124) and the reaction force generated when the first bonding mechanism (5121) is in contact with the source driving circuit 22, the first The pressure sensor 5124 may obtain first pressure information about the pressure provided to the source driving circuit 22. The first pressure sensor 5124 may provide the obtained first pressure information to the first control mechanism 5123. The first control mechanism 5123 (shown in FIG. 4) is configured such that the pressure applied to the source driving circuit 22 is adjusted based on the first pressure information acquired by the first pressure sensor 5124. The elevating mechanism 5122 can be controlled. Accordingly, the first bonding unit 512 may firmly bond the source driving circuit 22 without damaging the source driving circuit 22, the sealing member 15, or the like. A load cell may be used as the first pressure sensor 5124.

3, 4, and 13 to 16, the first bonding unit 512 may further include a first injection mechanism 5125 (shown in FIG. 14). The first injection mechanism 5125 may spray a cooling fluid toward the upper polarizing plate 16 of the panel 10 positioned at the first bonding position 51a. As described above, the source driving circuit 22 may be bonded using heat provided from the first bonding mechanism 5121, and the upper polarizing plate 16 may be bonded by heat provided from the first bonding mechanism 5121. ) May be damaged. The first injection mechanism 5125 may spray the cooling fluid toward the upper polarizing plate 16, thereby preventing the upper polarizing plate 16 from being damaged by heat for bonding the source driving circuit 22. The first injection mechanism 5125 may be installed on the first bonding body 512a to be positioned on the upper polarizing plate 16 at a position spaced apart from the first bonding position 51a by a predetermined distance.

3, 4, and 13 to 16, the first bonding unit 512 may further include a first buffer mechanism 5126 (shown in FIG. 14). The first shock absorbing mechanism 5126 may be located between the source driving circuit 22 located at the first bonding position 51a and the first bonding mechanism 5121. When the first bonding mechanism 5121 applies pressure and heat to the source driving circuit 22 to bond the source driving circuit 22, the first shock absorbing mechanism 5126 is the source driving circuit 22. ) And the first bonding mechanism 5121 may be prevented from being damaged by the source driving circuit 22, the sealing member 15, and the like. Teflon may be used as the first buffering mechanism 5126. The first buffering mechanism 5126 may be installed at the first bonding body 512a to be positioned below the first bonding mechanism 5121 at the first bonding position 51a.

3, 4, and 13 to 16, the first bonding unit 512 may further include a first support mechanism 5127.

The first support mechanism 5127 (shown in FIG. 14) may support the panel 10 positioned at the first bonding position 51a. The first support mechanism 5127 may support the lower surface of the lower substrate 12 at a position on the same vertical line as the position where the ACF 30 is attached to the upper substrate 11. Accordingly, the first support mechanism 5127 may allow the source driving circuit 22 to be accurately and firmly bonded, and may prevent deformation of the panel 10. Although not shown, the first support mechanism 5127 may include a heating device for heating a portion in contact with the lower substrate 12, so that the source driving circuit 22 may include the first bonding. The pressure and heat provided from the instrument 5121 and the heat provided from the first support mechanism 5127 may be bonded. A portion of the first support mechanism 5127 contacting the lower substrate 12 may be formed to have a size and a shape substantially coincident with the ACF 30 attached to the upper substrate 11. The first support mechanism 5127 may be elevated to move closer or away from the panel 10 positioned at the first bonding position 51a.

When the source driving circuit 22 is bonded to the panel 10, the panel 10 is transferred from the first main bonding unit 51 to the second main bonding unit 52 by the transfer unit 8. Can be transported.

3, 4 and 13 to 16, the second main bonding unit 52 bonds the gate driving circuit 21 attached to the first connection region 111 (shown in FIG. 2). can do. The second main bonding unit 52 may include a fifth support unit 521 and a second bonding unit 522.

The fifth supporting unit 521 may move the panel 10 transferred from the first main bonding unit 51 to the second bonding position 52a. The second bonding position 52a is a position at which the second bonding unit 522 may bond the gate driving circuit 21 attached to the panel 10. The panel 10 may be moved from the fourth support unit 511 to the fifth support unit 521 by the transfer unit 8, and the panel 10 may be supported by the fifth support unit 521. It may be moved to the second bonding position 52a.

The fifth support unit 521 may adjust the state of the panel 10 based on the fifth state information provided from the vision unit 7. The fifth state information may be a position in which the panel 10 is supported in the fifth support unit 521, a degree of rotation of the panel 10, a size of the panel 10, and the like. The fifth supporting unit 521 may adjust the state of the panel 10 based on the fifth state information, so that the gate driving circuit 21 is accurately and firmly bonded. Looking specifically at this, it is as follows.

First, vibration, slippage, or the like may occur while the transfer unit 8 transfers the panel 10 to the fifth support unit 521. Accordingly, the panel 10 may include the fifth support unit. 521 may not always be located in the same state. For example, the panel 10 may be supported by the fifth support unit 521 at different positions in the X-axis direction and the Y-axis direction, and is supported by the fifth support unit 521 while being rotated at a predetermined angle. Can be. That is, the panel 10 may be supported by the fifth support unit 521 in different states in some cases. Accordingly, when the fifth support unit 521 moves the panel 10 to the second bonding position 52a without adjusting the state of the panel 10, the gate driving circuit 21 is accurate. There is a problem that can not be firmly bonded.

In order to solve this problem, the fifth support unit 521 may adjust the state of the panel 10 based on the fifth state information provided from the vision unit 7. The fifth support unit 521 may move the panel 10 in the X-axis direction and the Y-axis direction or rotate the panel 10 based on the fifth state information. Accordingly, the fifth supporting unit 521 may allow the gate driving circuit 21 to be accurately and firmly bonded.

Here, the vision unit 7 may include a fifth vision unit 75 for obtaining fifth state information of the panel 10 supported by the fifth support unit 521. The fifth vision unit 75 may obtain the fifth state information from an alignment mark (not shown) formed on the upper substrate 11 of the panel 10. The fifth vision unit 75 may be installed to be positioned on the panel 10 supported by the fifth support unit 521. As can be seen from the above Figure 1 and Figure 2, the fifth vision unit 75 is installed so as to be positioned on the panel 10 supported by the fifth support unit 521, the fifth vision unit 75 Compared to the one installed below the panel 10 supported by the fifth support unit 521, a clearer still image can be obtained with respect to the alignment mark. Accordingly, the fifth vision unit 75 may obtain more accurate fifth state information, and may provide more accurate fifth state information to the fifth support unit 521.

Accordingly, the fifth support unit 521 may adjust the state of the panel 10 more accurately based on the fifth state information, so that the gate driving circuit 21 is more accurately and firmly bonded. . In order to adjust the state of the panel 10 and to move the panel 10 to the second bonding position 52a, the fifth support unit 521 is provided with a fifth support mechanism 5211 and a fifth movement mechanism ( 5212, and a fifth rotating mechanism 5213.

The fifth supporting mechanism 5211, the fifth moving mechanism 5212, and the fifth rotating mechanism 5213 are respectively provided with the first supporting mechanism 311, the first moving mechanism 312, and the fifth rotating mechanism 5213. Since it can be configured to substantially coincide with the one rotating mechanism 313, only the parts where there are differences will be described below.

The fifth supporting mechanism 5211 may be moved in the X-axis direction and the Y-axis direction by the fifth moving mechanism 5212, and may be rotated about the rotation axis by the fifth rotating mechanism 5213. . Accordingly, the panel 10 may be adjusted in a state such that the gate driving circuit 21 may be accurately and firmly bonded, and may be moved to the second bonding position 52a.

The fifth moving mechanism 5212 may move the fifth supporting mechanism 5211 such that the panel 10 supported by the fifth supporting mechanism 5211 is positioned at the second bonding position 52a. In this case, the first connection region 111 (shown in FIG. 2) may be located in the second bonding position 52a. The fifth moving mechanism 5212 is a cylinder method using a hydraulic cylinder or a pneumatic cylinder, a gear method using a rack gear and a pinion gear, a ball screw method using a ball screw, a belt method using a pulley and a belt, and the like. The fifth supporting mechanism 5211 can be moved in the X-axis direction and the Y-axis direction by using the same.

The fifth rotating mechanism 5213 may rotate the panel 10 supported by the fifth supporting mechanism 5211 by rotating the fifth supporting mechanism 5211. The fifth rotating mechanism 5211 may rotate the fifth supporting mechanism 5211 so that the first connection region 111 (shown in FIG. 2) can be positioned at the second bonding position 52a. . In the panel 10, the fifth support mechanism 5211 may be disposed in the fourth support mechanism 5111 with the second connection region 112 (shown in FIG. 2) facing the second bonding position 52a. Can be transferred to. In this case, the fifth rotation mechanism 5213 rotates the fifth support mechanism 5211 approximately 90 degrees, thereby allowing the first connection region 111 (shown in FIG. 2) to the second bonding position 52a. The panel 10 can be rotated so that it can be positioned. The fifth rotating mechanism 5213 may rotate the fifth supporting mechanism 5211 to adjust the state of the panel 10 supported by the fifth supporting mechanism 5211. The fifth rotating mechanism 5213 may include a motor that provides a rotational force, and the motor is directly connected to the rotating shaft of the fifth supporting mechanism 5211 or the fifth supporting mechanism (5) through a pulley and a belt. 5211 may be connected to the rotation axis.

3, 4, and 13 to 16, the second bonding unit 522 may bond the gate driving circuit 21 positioned at the second bonding position 52a. The main bonding unit 5 may include at least one second bonding unit 522. The second bonding unit 522 may include a second bonding mechanism 5221, a second lifting mechanism 5222, and a second control mechanism 5223 (shown in FIG. 4).

The second bonding mechanism 5221 may bond the gate driving circuit 21. The second bonding mechanism 5221 may bond the gate driving circuit 21 by applying a force to the gate driving circuit 21 positioned at the second bonding position 52a. Although not shown, the second bonding mechanism 5221 may include a heating device for heating a portion in contact with the gate driving circuit 21, so that the gate driving circuit 21 may be connected to the second bonding mechanism 21. It may be bonded by pressure and heat applied by the bonding mechanism 5221. The second bonding mechanism 5221 may be installed on the second bonding body 522a to be lowered and lowered.

The second elevating mechanism 5222 (shown in FIG. 15) may raise and lower the second bonding mechanism 5221. The second bonding mechanism 5221 may be moved up and down by the second lifting mechanism 5222 to bond the gate driving circuit 21 positioned at the second bonding position 52a. The second elevating mechanism 5222 is a cylinder method using a hydraulic cylinder or a pneumatic cylinder, a gear method using a rack gear and a pinion gear, a ball screw method using a ball screw, a belt method using a pulley and a belt, and the like. It is possible to raise and lower the second bonding mechanism (5221) using. The second elevating mechanism 5222 may be installed in the second bonding body 522a.

The second control mechanism 5223 (shown in FIG. 4) may control the second lifting mechanism 5222 based on the second control information. The second control information includes a pressure provided by the second bonding mechanism 5221 to the gate driving circuit 21, a temperature of heat provided by the second bonding mechanism 5221 to the gate driving circuit 21, and It may be a speed at which the second bonding mechanism 5221 is raised and lowered. The second control mechanism 5223 controls the second lifting mechanism 5222 based on the second control information, so that the gate driving circuit 21, the sealing member 15, and the like are not damaged. The second bonding mechanism 5221 may be controlled so that the gate driving circuit 21 is firmly bonded.

3, 4, and 13 to 16, the second bonding unit 522 may further include a second pressure sensor 5224. The second pressure sensor 5224 may be installed to be positioned between the second bonding mechanism 5221 and the second lifting mechanism 5222. The second elevating mechanism 5222 may elevate the second bonding mechanism 5221 by applying a force to the second pressure sensor 5224. From the force exerted by the second elevating mechanism 5222 to the second pressure sensor 5224 and the reaction force generated when the second bonding mechanism 5221 contacts the gate driving circuit 21, the second The pressure sensor 5224 may acquire second pressure information about the pressure provided to the gate driving circuit 21. The second pressure sensor 5224 may provide the obtained second pressure information to the second control mechanism 5223. The second control mechanism 5223 (shown in FIG. 4) is configured such that the pressure applied to the gate driving circuit 21 is adjusted based on the second pressure information acquired by the second pressure sensor 5224. The elevating mechanism 5222 can be controlled. Accordingly, the second bonding unit 522 may firmly bond the gate driving circuit 21 while preventing the gate driving circuit 21, the sealing member 15, and the like from being damaged. A load cell may be used as the second pressure sensor 5224.

3, 4, and 13 to 16, the second bonding unit 522 may further include a second injection mechanism 5225 (shown in FIG. 14). The second injection mechanism 5225 may spray a cooling fluid toward the upper polarizing plate 16 of the panel 10 positioned at the second bonding position 52a. As described above, the gate driving circuit 21 may be bonded using the heat provided from the second bonding mechanism 5221, and the upper polarizing plate 16 may be formed by the heat provided from the second bonding mechanism 5221. ) May be damaged. The second injection mechanism 5225 may spray the cooling fluid toward the upper polarizing plate 16, thereby preventing the upper polarizing plate 16 from being damaged by heat for bonding the gate driving circuit 21. The second injection mechanism 5225 may be installed on the second bonding body 522a to be positioned on the upper polarizing plate 16 at a position spaced apart from the second bonding position 52a by a predetermined distance.

3, 4, and 13 to 16, the second bonding unit 522 may further include a second buffer mechanism 5262 (shown in FIG. 14). The second buffer mechanism 5262 may be located between the gate driving circuit 21 positioned at the second bonding position 52a and the second bonding mechanism 5221. When the second bonding mechanism 5221 applies pressure and heat to the gate driving circuit 21 to bond the gate driving circuit 21, the second buffering mechanism 5326 is configured to provide the gate driving circuit 21. ) And the second bonding mechanism 5121 may be prevented from being damaged by the gate driving circuit 21, the sealing member 15, and the like. Teflon may be used as the second buffer mechanism 5262. The second shock absorbing mechanism 5262 may be installed at the second bonding body 522a to be positioned below the second bonding mechanism 5221 at the second bonding position 52a.

3, 4, and 13 to 16, the second bonding unit 522 may further include a second support mechanism 5227.

The second support mechanism 5227 (shown in FIG. 14) may support the panel 10 positioned at the second bonding position 52a. The second support mechanism 5227 may support the lower surface of the lower substrate 12 at a position on the same vertical line as the position where the ACF 30 is attached to the upper substrate 11. Accordingly, the second support mechanism 5227 may allow the gate driving circuit 21 to be accurately and firmly bonded, and may prevent deformation of the panel 10. Although not shown, the second support mechanism 5227 may include a heating device for heating a portion in contact with the lower substrate 12, so that the gate driving circuit 21 may be connected to the second bonding device. It may be bonded by the pressure and heat provided from the instrument 5121 and the heat provided from the second support mechanism 5227. A portion of the second support mechanism 5227 that contacts the lower substrate 12 may be formed in a size and shape that substantially matches the ACF 30 attached to the upper substrate 11. The second support mechanism 5227 may be moved up or down to approach or move away from the panel 10 positioned at the second bonding position 52a.

Here, the process of performing the main bonding process for the panel 10 will be described. As shown in FIG. 16, the panel 10 is moved from the prebonding unit 4 to the first main bonding unit 51. Moved to the first bonding position 51a and bonded to the source driving circuit 22 (shown in FIG. 14), and then moved to a position waiting to be moved to the second main bonding unit 52. Can be. In addition, the panel 10 is moved from the first main bonding unit 51 to the second main bonding unit 52, and moved to the second bonding position 52a to move the gate driving circuit 21 (FIG. 14) can be moved to a position waiting to be moved to the unloading section 6 after being bonded. This will be described in detail with reference to FIGS. 3, 4, and 13 to 16.

First, when the transfer unit 8 transfers the panel 10 from the prebonding unit 4 to the first main bonding unit 51, the fourth moving mechanism 5112 may be configured as the fourth support mechanism. The 5111 can be moved to the fourth seating position 51b. The fourth seating position 51b is a position at which the transfer part 8 can seat the panel 10 on the fourth support mechanism 5111. The fourth moving mechanism 5112 may position the fourth supporting mechanism 5111 at the fourth seating position 51b by moving the fourth supporting mechanism 5111 in the X-axis direction and the Y-axis direction. .

Next, when the panel 10 is supported by the fourth support mechanism 5111, the fourth support unit 511 may receive fourth state information of the panel 10 acquired by the fourth vision unit 74. The state of the panel 10 can be adjusted as a basis. As described above, the fourth vision unit 74 is installed to be positioned above the panel 10 supported by the fourth support unit 511 to obtain accurate fourth state information, and the fourth support unit 511 may accurately adjust the state of the panel 10 based on the fourth state information. In order to adjust the state of the panel 10 according to the fourth state information, the fourth moving mechanism 5112 may move the fourth supporting mechanism 5111 in the X axis direction and the Y axis direction. The fourth rotating mechanism 5113 may rotate the fourth supporting mechanism 5111.

Next, when the state of the panel 10 is adjusted, the fourth support unit 511 may move the panel 10 to the first bonding position 51a. The fourth moving mechanism 5112 may position the panel 10 at the first bonding position 51a by moving the fourth supporting mechanism 5111 in the X-axis direction and the Y-axis direction.

Next, when the panel 10 is positioned at the first bonding position 51a, the first bonding unit 512 may bond the source driving circuit 22 positioned at the first bonding position 51a. have. When the source driving circuit 22 positioned at the first bonding position 51a is bonded, the fourth supporting unit 511 may move the panel 10 to the fourth standby position 51c. The fourth standby position 51c is a position at which the transfer section 8 can pick up the panel 10 from the fourth support mechanism 5111. The fourth moving mechanism 5112 may position the panel 10 at the fourth standby position 51c by moving the fourth supporting mechanism 5111 in the X-axis direction and the Y-axis direction. The transfer unit 8 may transfer the panel 10 to which the source driving circuit 22 is bonded, from the first main bonding unit 51 to the second main bonding unit 52.

Next, when the transfer unit 8 transfers the panel 10 from the first main bonding unit 51 to the second main bonding unit 52, the fifth moving mechanism 5212 may move to the fifth main unit 5212. The support mechanism 5211 can be moved to the fifth seating position 52b. The fifth seating position 52b is a position at which the transfer part 8 can seat the panel 10 on the fifth support mechanism 5211. The fifth moving mechanism 5212 may position the fifth supporting mechanism 5211 at the fifth seating position 52b by moving the fifth supporting mechanism 5211 in the X-axis direction and the Y-axis direction. .

Next, when the panel 10 is supported by the fifth supporting mechanism 5211, the fifth rotating mechanism 5213 is shown in the first connection region 111 (FIG. 2) at the second bonding position 52a. The fifth supporting mechanism 5211 can be rotated approximately 90 degrees.

Next, when the first connection region 111 (shown in FIG. 2) may be positioned at the second bonding position 52a, the fifth support unit 521 may move to the fifth vision unit 75. ) May adjust the state of the panel 10 based on the fifth state information of the panel 10. As described above, the fifth vision unit 75 may be installed to be positioned on the panel 10 supported by the fifth support unit 521 to obtain accurate fifth state information. 521 may accurately adjust the state of the panel 10 based on the fifth state information. In order to adjust the state of the panel 10 according to the fifth state information, the fifth moving mechanism 5212 may move the fifth supporting mechanism 5211 in the X-axis direction and the Y-axis direction. The fifth rotating mechanism 5213 may rotate the fifth supporting mechanism 5211.

Next, when the state of the panel 10 is adjusted, the fifth support unit 521 may move the panel 10 to the second bonding position 52a. The fifth moving mechanism 5212 may position the panel 10 at the second bonding position 52a by moving the fifth supporting mechanism 5211 in the X axis direction and the Y axis direction.

Next, when the panel 10 is positioned at the second bonding position 52a, the second attachment unit 422 may bond the gate driving circuit 21 positioned at the second bonding position 52a. have. When the gate driving circuit 21 positioned at the second bonding position 52a is bonded, the fifth supporting unit 521 may move the panel 10 to the fifth standby position 52c. The fifth standby position 52c is a position at which the transfer part 8 can pick up the panel 10 from the fifth support mechanism 5211. The fifth moving mechanism 5212 may position the panel 10 at the fifth standby position 52c by moving the fifth supporting mechanism 5211 in the X-axis direction and the Y-axis direction. The transfer unit 8 may transfer the panel 10 in which the source driver circuit 22 and the gate driver circuit 21 are bonded to the unloading unit 6 from the main bonding unit 5.

<Unloading section 6>

17 is a schematic plan view of the main bonding portion and the unloading portion.

3 to 5 and 17, the unloading unit 6 is shown in the gate driving circuit 21 (shown in FIG. 14) and the source driving circuit 22 and FIG. 14 through the main bonding process. Unbonded panel 10 can be unloaded. The panel 10 may be transferred from the main bonding part 5 to the storage member 50 located in the unloading part 6 by the transfer part 8. The panel 10 may be stacked and stored in the storage member 50 up and down. The unloading unit 6 may include an unloading unit 61, a slip sheet supply unit 62, a second inspection unit 63, and a second discharge unit 64.

The unloading unit 61 moves the empty storage member 50 to the unloading position 6a. The unloading position 6a is a position at which the transfer part 8 can accommodate the panel 10 in the storage member 50. The unloading unit 61 positions the storage member 50 in the unloading position 6a until the storage member 50 positioned in the unloading position 6a is filled with the panel 10. You can. When the storage member 50 is filled with the panel 10, the storage member 50 filled with the panel 10 may be carried out by the second carrying unit 64. Referring to FIG. 4, the unloading unit 61 may include a second storage mechanism 611, a second transfer mechanism 612, and an alignment mechanism 613.

A plurality of storage members 50 may be stored in the second storage mechanism 611 (shown in FIG. 4). The storage members 50 stored in the second storage mechanism 611 are empty.

The second transfer mechanism 612 (shown in FIG. 4) may move the storage member 50 from the second storage mechanism 611 to the unloading position 6a. The second transfer mechanism 612 may move at least one storage member 50 at a time. The second transfer mechanism 612 is a cylinder method using a hydraulic cylinder or a pneumatic cylinder, a gear method using a rack gear and a pinion gear, a ball screw method using a ball screw, a belt method using a pulley and a belt, a conveyor, and the like. The storage member 50 can be moved using a method or the like.

The alignment mechanism 613 (shown in FIG. 4) may acquire the unloading state information of the storage member 50 located at the unloading position 6a. The unloading state information may be a position at which the storage member 50 is located at the unloading position 6a, a degree to which the storage member 50 is rotated, and the like. The unloading unit 61 may adjust the state of the storage member 50 based on the unloading state information, so that the panel 10 is accurately received in the storage member 50. The alignment mechanism 613 may be installed to be positioned on the storage member 50 positioned at the unloading position 6a and may include a CCD camera.

3 to 5 and 17, the slip sheet supply unit 62 may supply a slip sheet (not shown) to the panel 10 positioned at the unloading position 6a. By the interlayer paper supply unit 62, the interlayer paper may be interposed between the panels 10 that are stacked and stored in the storage members 50. Accordingly, the interleaver sheet supply unit 62 may prevent the panel 10 from being scratched by blocking direct contact between the panels 10 using the interleaver. The ticker sheet may be formed of Teflon. Although not shown, compared to a method of blocking direct contact of the panels 10 by inserting the panel 10 into grooves spaced at predetermined intervals from the storage member 50, manufacturing a touch screen panel according to the present invention. The device 1 may be implemented to accommodate a larger number of panels 10 in one storage member 50 by using the interleaver. Therefore, the apparatus 1 for manufacturing a touch screen panel according to the present invention can reduce the number of times of moving the storage member 50 to position the empty storage member 50 at the unloading position 6a. This can shorten the time it takes to work.

The slip sheet supply unit 62 picks up the slip sheet from the slip sheet receiving member 60 (shown in FIG. 17) positioned next to the unloading position 6a, and the panel 50 located at the unloading position 6a. Can be transferred. A plurality of slip sheets may be stacked and stacked in the slip sheet storage member 60 up and down. Referring to FIG. 17, the slip sheet supply unit 62 may include a second suction nozzle 621 and a second operating mechanism 622.

The second adsorption nozzle 621 may adsorb the kanji located on the uppermost side of the kanji storage member 60, and the adsorbed kanji is the best on the storage member 50 located at the unloading position 6a. It can be placed on the panel 10 located on the side. The slip sheet supply unit 62 may include a plurality of second suction nozzles 621. In FIG. 17, eight second suction nozzles 621 are illustrated, but the present invention is not limited thereto, and the number of the liver removing units 22 may be 8 or less or 9 if the number of the sheets can be stably adsorbed. The second suction nozzle 621 may be included.

The second actuating mechanism 622 may move the second suction nozzle 621 in the Y-axis direction, and may move up and down. The second suction nozzle 621 is lifted up and down by the second operating mechanism 622 to pick up the slip sheet from the slip sheet 60, and the panel 10 accommodated in the storage member 50. The interleaver can be placed on the back side. The second suction nozzle 621 may be moved in the Y-axis direction by the second operating mechanism 622 to transfer the interlayer paper. Although not shown, the second operating mechanism 622 may move the second suction nozzle 621 in the X-axis direction and the Y-axis direction. The second actuating mechanism 622 includes a cylinder method using a hydraulic cylinder or a pneumatic cylinder, a gear method using a rack gear and a pinion gear, a ball screw method using a ball screw, a belt method using a pulley and a belt, and the like. The second adsorption nozzle 621 can be moved and lifted up and down.

3 to 5 and 17, the unloading part 6 may further include a second inspection unit 63 (shown in FIG. 4). The second inspection unit 63 may acquire interleaf paper supply information on whether interlayer paper is supplied to the panel 10 positioned at the unloading position 6a. The second inspection unit 63 may provide the acquired sheet paper supply information to the first sheet paper supply unit 62 and the transfer unit 8. The first sheet paper supplying unit 62 may perform the operation of supplying sheet paper to the panel 10 located at the unloading position 6a based on the sheet paper supply information obtained by the second inspection unit 63. Can be. The panel 10, located at the unloading position 6a, is determined by the first sheet feeding unit 62 when there is no slip sheet in the panel 10 located at the unloading position 6a from the sheet intermittent supply information. ) Can be fed into the Kanji. The transfer unit 8 may perform the operation of transferring the panel 10 to the unloading unit 6 based on the sheet paper supply information acquired by the second inspection unit 63. When the transfer unit 8 determines that there is a slip sheet in the panel 10 located at the unloading position 6a from the slip sheet supply information, the transfer unit 8 unloads the panel 10 positioned in the main bonding unit 5. It can be transferred to the loading unit (6). The second inspection unit 63 may be installed to be positioned on the panel 10 positioned at the unloading position 6a and may include a CCD camera.

3 to 5 and 17, the unloading unit 6 may further include a second carrying unit 64 (shown in FIG. 4). When the storage member 50 located at the unloading position 6a is filled with the panels 10, the second carrying unit 64 moves the storage member 50 from the unloading position 6a. You can take it out. The second carrying unit 64 lowers the storage member 50 below the unloading position 6a, and then moves the storage member 50 toward the direction in which the second storage mechanism 611 is located. Can be exported. When the storage member 50 filled with the panels 10 is taken out, the second transfer mechanism 612 moves the empty storage member 50 to the unloading position 6a, and the transfer unit 8 The panel 10 is moved from the main bonding portion 5 to the storage member 50 located at the unloading position 6a, and the interlayer feeding unit 62 is positioned at the unloading position 6a. The job of supplying the sheet paper to the panel 10 may be repeatedly performed.

<Vision part 7>

1 and 3, the vision unit 7 may obtain state information of the panel from an alignment mark formed on the upper substrate 11 of the panel 10. The state information may be a position where the panel 10 is located, a degree of rotation of the panel 10, a size of the panel 10, and the like. The touch screen panel manufacturing apparatus 1 according to the present invention may perform the ACF attaching process, the prebonding process, and the main bonding process based on the state information acquired by the vision unit 7. The vision unit 7 includes the first vision unit 71, the second vision unit 72, the third vision unit 73, the fourth vision unit 74, and the fifth vision unit ( 75).

1, 3 and 7, the first vision unit 71 may obtain the first state information from an alignment mark formed on the upper substrate 11 of the panel 10. The first vision unit 71 may include a first vision mechanism 711 and a first frame 712.

The first vision mechanism 711 may be installed in the first frame 712 to be positioned above the panel 10 supported by the first support unit 31. As can be seen from the above Figure 1 and Figure 2, the first vision mechanism 711 is installed above the panel 10 supported by the first support unit 31, thereby providing a clear still image for the alignment mark It may be obtained, and accurate second state information may be obtained. The first vision mechanism 711 may be a CCD camera.

The first vision mechanism 711 is installed in the first frame 712. As shown in FIG. 7, the first frame 712 has a first state from the panel 10 in which the first vision mechanism 711 is located at the first seating position 3b (shown in FIG. 9). It may be installed to be located at a position where information can be obtained. The first vision unit 71 may include a plurality of first vision devices 711, and the first vision devices 711 may be spaced apart from each other by a predetermined distance in the first frame 712. have. As shown in FIG. 7, the first vision unit 71 may include two first vision mechanisms 711, and each of the first vision mechanisms 711 may include one end of the panel 10. The first state information may be obtained from an alignment mark formed at the other end.

The first vision unit 71 may further include a first vision movement mechanism 713. The first vision movement mechanism 713 may be installed in the first frame 712, and may move the first vision mechanism 711 in the Y-axis direction. When the first vision unit 71 includes two first vision mechanisms 711, the first vision movement mechanism 713 is the first vision mechanism of any one of the first vision mechanisms 711. 711 can be moved in the Y-axis direction. Accordingly, when the panel 10 having a different size from the existing one is positioned in the first support unit 31, the first vision movement mechanism 713 is a panel having a size in which the first vision mechanism 711 is changed ( 10) any one of the first vision movement mechanisms 713 may be moved to obtain the first state information. Therefore, the touch screen panel manufacturing apparatus 1 according to the present invention can easily respond even if the size of the panel 10 is changed. The first vision movement mechanism 713 is a cylinder method using a hydraulic cylinder or a pneumatic cylinder, a gear method using a rack gear and a pinion gear, a ball screw method using a ball screw, a belt method using a pulley and a belt, and the like. Using the first vision mechanism 711 may be moved.

1, 3 and 10, the second vision unit 72 may obtain the second state information from the alignment mark formed on the upper substrate 11 of the panel 10. The second vision unit 72 may include a second vision mechanism 721 and a second frame 722.

The second vision mechanism 721 may be installed in the second frame 722 to be positioned on the panel 10 supported by the second support unit 411. As can be seen from the above Figure 1 and Figure 2, the second vision mechanism 721 is installed to be positioned on the panel 10 supported by the second support unit 411, thereby providing a clear still image for the alignment mark It may be obtained, and accurate second state information may be obtained. The second vision mechanism 721 may be a CCD camera.

The second vision mechanism 721 is installed in the second frame 722. As shown in FIG. 10, the second frame 722 has a second state from the panel 10 in which the second vision mechanism 721 is positioned at the second seating position 41b (shown in FIG. 12). It may be installed to be located at a position where information can be obtained. The second vision unit 72 may include a plurality of second vision mechanisms 721, and the second vision mechanisms 721 may be spaced apart from each other by a predetermined distance in the second frame 722. have. As shown in FIG. 10, the second vision unit 72 may include two second vision mechanisms 721, and each of the second vision mechanisms 721 may include one end of the panel 10. The second state information may be obtained from the alignment mark formed at the other end.

The second vision unit 72 may further include a second vision movement mechanism 723. The second vision movement mechanism 723 may be installed in the second frame 722, and move the second vision mechanism 721 in the Y-axis direction. When the second vision unit 72 includes two second vision mechanisms 721, the second vision movement mechanism 723 is the second vision mechanism of any one of the second vision mechanisms 721. 721 can be moved in the Y-axis direction. Accordingly, when the panel 10 having a different size from the existing one is positioned in the second support unit 411, the second vision movement mechanism 723 may be a panel having a size in which the second vision mechanism 721 is changed. 10) any one of the second vision movement mechanisms 723 may be moved to obtain the second state information. Therefore, the touch screen panel manufacturing apparatus 1 according to the present invention can easily respond even if the size of the panel 10 is changed. The second vision movement mechanism 723 may include a cylinder method using a hydraulic cylinder or a pneumatic cylinder, a gear method using a rack gear and a pinion gear, a ball screw method using a ball screw, a belt method using a pulley and a belt, and the like. Using the second vision mechanism 721 may be moved.

1, 3 and 10, the third vision unit 73 may obtain the third state information from an alignment mark formed on the upper substrate 11 of the panel 10. The third vision unit 73 may include a third vision mechanism 731 and a third frame 732.

The third vision mechanism 731 may be installed in the third frame 732 to be positioned above the panel 10 supported by the third support unit 421. As can be seen from the above Figure 1 and Figure 2, the third vision mechanism 731 is installed on the panel 10 supported by the third support unit 421, thereby providing a clear still image for the alignment mark It can obtain, and accurate third state information can be obtained. The third vision mechanism 731 may be a CCD camera.

The third vision mechanism 731 is installed in the third frame 732. As shown in FIG. 10, the third frame 732 has a third state from the panel 10 in which the third vision mechanism 731 is located at the third seating position 42b (shown in FIG. 12). It may be installed to be located at a position where information can be obtained. The third vision unit 73 may include a plurality of third vision mechanisms 731, and the third vision mechanisms 731 may be spaced apart from each other by a predetermined distance in the third frame 732. have. As shown in FIG. 10, the third vision unit 73 may include two third vision mechanisms 731, and the third vision mechanisms 731 may include one end of the panel 10, respectively. The third state information may be obtained from the alignment mark formed at the other end.

The third vision unit 73 may further include a third vision movement mechanism 733. The third vision movement mechanism 733 may be installed in the third frame 732, and may move the third vision mechanism 731 in the Y-axis direction. When the third vision unit 73 includes two third vision mechanisms 731, the third vision movement mechanism 733 is a third vision mechanism of any one of the third vision mechanisms 731. 731 can be moved in the Y-axis direction. Accordingly, when the panel 10 having a different size than the existing one is positioned in the third support unit 421, the third vision movement mechanism 733 may be a panel having a size in which the third vision mechanism 731 is changed. 10) any one of the third vision movement mechanisms 733 may be moved to obtain the third state information. Therefore, the touch screen panel manufacturing apparatus 1 according to the present invention can easily respond even if the size of the panel 10 is changed. The third vision movement mechanism 733 is a cylinder method using a hydraulic cylinder or a pneumatic cylinder, a gear method using a rack gear and a pinion gear, a ball screw method using a ball screw, a belt method using a pulley and a belt, and the like. Using the third vision mechanism 731 can be moved.

1, 3, and 13, the fourth vision unit 74 may obtain the fourth state information from an alignment mark formed on the upper substrate 11 of the panel 10. The fourth vision unit 74 may include a fourth vision mechanism 741 and a fourth frame 742.

The fourth vision mechanism 741 may be installed in the fourth frame 742 to be positioned on the panel 10 supported by the fourth support unit 511. As can be seen from the above Figure 1 and Figure 2, the fourth vision mechanism 741 is installed on the panel 10 supported by the fourth support unit 511, thereby providing a clear still image for the alignment mark It may be obtained, and accurate fourth state information may be obtained. The fourth vision mechanism 741 may be a CCD camera.

The fourth vision mechanism 741 is installed in the fourth frame 742. As shown in FIG. 13, the fourth frame 742 has a fourth state from the panel 10 in which the fourth vision mechanism 741 is positioned at the fourth seating position 51b (shown in FIG. 16). It may be installed to be located at a position where information can be obtained. As shown in FIG. 13, the fourth vision unit 74 may include one fourth vision mechanism 741, and the fourth vision mechanism 741 may have one end and the other end of the panel 10. The fourth state information may be obtained from any one of the alignment marks formed at the. Although not shown, the fourth vision unit 74 may include a plurality of fourth vision mechanisms 741, and the fourth vision mechanisms 741 may be disposed at a predetermined distance from each other in the fourth frame 742. It can be spaced apart.

1, 3, and 13, the fifth vision unit 75 may obtain the fifth state information from an alignment mark formed on the upper substrate 11 of the panel 10. The fifth vision unit 75 may include a fifth vision mechanism 751 and a fifth frame 752.

The fifth vision mechanism 751 may be installed in the fifth frame 752 to be positioned above the panel 10 supported by the fifth support unit 521. As shown in FIG. 1 and FIG. 2, the fifth vision mechanism 751 is installed to be positioned on the panel 10 supported by the fifth support unit 521, thereby providing a clear still image with respect to the alignment mark. It is possible to obtain, and accurate fifth state information can be obtained. The fifth vision mechanism 751 may be a CCD camera.

The fifth vision mechanism 751 is installed in the fifth frame 752. As shown in FIG. 13, the fifth frame 752 has a fifth state from the panel 10 where the fifth vision mechanism 751 is positioned at the fifth seating position 52b (shown in FIG. 16). It may be installed to be located at a position where information can be obtained. As shown in FIG. 13, the fifth vision unit 75 may include one fifth vision mechanism 751, and the fifth vision mechanism 751 may have one end and the other end of the panel 10. The fifth state information may be obtained from any one of the alignment marks formed at the. Although not shown, the fifth vision unit 75 may include a plurality of fifth vision mechanisms 751, and the fifth vision mechanisms 751 may be disposed at a predetermined distance from each other in the fifth frame 752. It can be spaced apart.

<Transfer part 8>

Referring to FIG. 3, the transfer unit 8 includes the loading unit 2, the ACF attachment unit 3, the prebonding unit 4, the main bonding unit 5, and the unloading unit 6. The panel 10 may be transferred between the panels. The transfer unit 8 includes a first transfer unit 81, a second transfer unit 82, a third transfer unit 83, a fourth transfer unit 84, a fifth transfer unit 85, and a sixth transfer unit. (86).

3 and 7, the first transfer unit 81 may transfer the panel 10 from the loading unit 2 to the ACF attachment unit 3. The first transfer unit 81 may pick up the panel 10 located at the loading position 2 and transfer the picked up panel 10 to the first support unit 31. The first transfer unit 81 may include a plurality of first pick-up nozzles 811 for picking up the panel 10 and a first moving device 812 for moving the first pick-up nozzles 811. have. The first moving device 812 may move the first pick-up nozzles 811 in the X-axis direction, and move up and down. Although not shown, the first moving device 812 may move the first pick-up nozzles 811 in the X-axis direction and the Y-axis direction. The first moving device 812 may include a cylinder method using a hydraulic cylinder or a pneumatic cylinder, a gear method using a rack gear and a pinion gear, a ball screw method using a ball screw, a belt method using a pulley and a belt, and the like. The first pick-up nozzles 811 may be moved and moved up and down by using the same.

3 and 10, the second transfer unit 82 may transfer the panel 10 from the ACF attachment portion 3 to the first prebonding unit 41. The second transfer unit 82 may pick up the panel 10 supported by the first support unit 31, and transfer the picked up panel 10 to the second support unit 411. The second transfer unit 82 may include a plurality of second pick-up nozzles 821 for picking up the panel 10 and a second moving device 822 for moving the second pick-up nozzles 821. have. The second moving device 822 may move the second pick-up nozzles 821 in the X-axis direction, and may raise and lower the second pick-up nozzles 821. Although not shown, the second moving device 822 may move the second pick-up nozzles 821 in the X-axis direction and the Y-axis direction. The second moving device 822 includes a cylinder method using a hydraulic cylinder or a pneumatic cylinder, a gear method using a rack gear and a pinion gear, a ball screw method using a ball screw, a belt method using a pulley and a belt, and the like. The second pick-up nozzles 821 may be moved and moved up and down by using the same.

3 and 10, the third transfer unit 83 may transfer the panel 10 from the first prebonding unit 41 to the second prebonding unit 42. The third transfer unit 83 may pick up the panel 10 supported by the second support unit 411, and transfer the picked up panel 10 to the third support unit 421. The third transfer unit 83 may include a plurality of third pick-up nozzles 831 for picking up the panel 10 and a third moving device 832 for moving the third pick-up nozzles 831. have. The third moving device 832 may move the third pick-up nozzles 831 in the X-axis direction and move up and down. Although not shown, the third moving device 832 may move the third pick-up nozzles 831 in the X-axis direction and the Y-axis direction. The third moving device 832 includes a cylinder method using a hydraulic cylinder or a pneumatic cylinder, a gear method using a rack gear and a pinion gear, a ball screw method using a ball screw, a belt method using a pulley and a belt, and the like. The third pick-up nozzles 831 may be moved and moved up and down by using the same.

3 and 13, the fourth transfer unit 84 may transfer the panel 10 from the second prebonding unit 42 to the first main bonding unit 51. The fourth transfer unit 84 may pick up the panel 10 supported by the third support unit 421 and transfer the picked up panel 10 to the fourth support unit 511. The fourth transfer unit 84 may include a plurality of fourth pick-up nozzles 841 for picking up the panel 10 and a fourth moving device 842 for moving the fourth pick-up nozzles 841. have. The fourth moving device 842 may move the fourth pick-up nozzles 841 in the X-axis direction and move up and down. Although not shown, the fourth moving device 842 may move the fourth pick-up nozzles 841 in the X-axis direction and the Y-axis direction. The fourth moving device 842 includes a cylinder method using a hydraulic cylinder or a pneumatic cylinder, a gear method using a rack gear and a pinion gear, a ball screw method using a ball screw, a belt method using a pulley and a belt, and the like. The fourth pick-up nozzles 841 may be moved and moved up and down by using the same.

3 and 13, the fifth transfer unit 85 may transfer the panel 10 from the first main bonding unit 51 to the second main bonding unit 52. The fifth transfer unit 85 may pick up the panel 10 supported by the fourth support unit 511 and transfer the picked up panel 10 to the fifth support unit 611. The fifth transfer unit 85 may include a plurality of fifth pick-up nozzles 851 for picking up the panel 10 and a fifth moving device 852 for moving the fifth pick-up nozzles 851. have. The fifth moving device 852 may move the fifth pick-up nozzles 851 in the X-axis direction and move up and down. Although not shown, the fifth moving device 852 may move the fifth pick-up nozzles 851 in the X-axis direction and the Y-axis direction. The fifth moving device 852 includes a cylinder method using a hydraulic cylinder or a pneumatic cylinder, a gear method using a rack gear and a pinion gear, a ball screw method using a ball screw, a belt method using a pulley and a belt, and the like. The fifth pick-up nozzles 851 may be moved and moved up and down by using the same.

3 and 17, the sixth transfer unit 86 may transfer the panel 10 from the second main bonding unit 52 to the unloading unit 6. The sixth transfer unit 86 may pick up the panel 10 supported by the fifth support unit 611 and transfer the picked up panel 10 to the unloading position 6a. The sixth transfer unit 86 may include a plurality of sixth pick-up nozzles 861 for picking up the panel 10 and a sixth moving device 862 for moving the sixth pick-up nozzles 861. have. The sixth moving device 862 may move the sixth pick-up nozzles 861 in the X-axis direction and move up and down. Although not shown, the sixth moving device 862 may move the sixth pick-up nozzles 861 in the X-axis direction and the Y-axis direction. The sixth moving device 862 includes a cylinder method using a hydraulic cylinder or a pneumatic cylinder, a gear method using a rack gear and a pinion gear, a ball screw method using a ball screw, a belt method using a pulley and a belt, and the like. The sixth pick-up nozzles 861 may be moved and lifted up and down.

<ACF Inspection Department>

3, 18 and 19, the touch screen panel manufacturing apparatus 1 according to the present invention may further include an ACF inspection unit (9).

The ACF inspection unit 9 attaches the ACF to the upper substrate 11 (shown in FIG. 8) of the panel 10 through the ACF attaching process to determine whether the ACF (shown in FIG. 8) is normally attached. Information can be obtained. The ACF inspection unit 9 may be installed to be located between the ACF attachment unit 3 and the first prebonding unit 41. The touch screen panel manufacturing apparatus 1 according to the present invention selects the prebonding process and the main bonding process for the panel 10 that has undergone the ACF attaching process based on the ACF attaching information acquired by the ACF inspection unit 9. It can be done with When it is confirmed that the ACF (30, shown in Figure 8) is normally attached from the ACF attachment information, the touch screen panel manufacturing apparatus 1 according to the present invention is a pre-bonding process and the main bonding for the panel 10 The process can be carried out. If it is confirmed from the ACF attachment information that the ACF (30, shown in Figure 8) is not normally attached, the touch screen panel manufacturing apparatus 1 according to the present invention is the pre-bonding process and the main for the panel 10 It can be taken out without performing the bonding process. The ACF inspection unit 9 may include an ACF vision unit 91.

The ACF vision unit 91 may be installed on the movement path of the panel 10 transferred from the ACF attachment part 3 to the prebonding part 4. Accordingly, the ACF vision unit 91 may obtain the ACF attachment information from the panel 10 transferred by the second transfer unit 82. Therefore, when compared with acquiring the ACF attachment information in the state in which the ACF vision unit 91 and the panel 10 are stopped, the touch screen panel manufacturing apparatus 1 according to the present invention acquires the ACF attachment information. The time taken to reduce the time required to perform the ACF attaching process, the prebonding process, and the main bonding process can be performed on more panels 10 in a short time.

The ACF vision unit 91 may include an ACF vision apparatus 911 and a lighting apparatus 912. The ACF vision device 911 and the lighting device 912 are installed in the ACF frame 93 so as to be positioned on the movement path of the panel 10 transferred from the ACF attachment part 3 to the prebonding part 4. Can be. The ACF vision apparatus 911 may be a CCD camera, and the lighting apparatus 912 may be strobe lighting. The lighting device 912 may be installed in the ACF frame 93 or the ACF vision device 911 to be located next to the ACF vision device 911, and in the direction in which the ACF vision device 911 is located. It may be installed at an inclined angle.

As shown in FIG. 2, the ACF 30 (shown in FIG. 8) is attached to both the first connection region 111 and the second connection region 112 and the first connection region 111. And the second connection region 112 are located on the side of the first side 11a and the side of the second side 11b that are perpendicular to each other. The ACF vision unit 9 may include a mobile unit 92 so as to obtain ACF attachment information for both the first connection region 111 and the second connection region 112.

3, 18 and 19, the mobile unit 92 may move the ACF vision unit 91. The mobile unit 92 may be installed in the ACF frame 93 and move the ACF vision unit 91 in the X-axis direction. The ACF vision unit 9 is formed by the movement of the panel 10 by the second transfer unit 82 and the movement of the ACF vision unit 91 by the mobile unit 92. 111, shown in FIG. 2) and ACF attachment information for the second connection area 112 (shown in FIG. 2) can be obtained. Looking specifically at this, it is as follows.

First, as shown in FIG. 18, the ACF vision unit 91 is moved from the panel 10 moving from the ACF attachment part 3 to the first prebonding unit 41. ACF attachment information for FIG. 2) may be obtained. In this case, the panel 10 may be moved from the first standby position 3c to the second seating position 41b.

Next, as shown in FIG. 19, when the panel 10 is positioned in the first prebonding unit 41, the panel 10 is formed by the second support unit 411 (shown in FIG. 10). Rotate 90 degrees.

Next, the mobile unit 92 moves the ACF vision unit 91 from the first standby position 3c toward the second seating position 41b. The ACF vision unit 91 may be moved by the mobile unit 92 to obtain ACF attachment information for the first connection region 111 (shown in FIG. 2).

Therefore, the apparatus 1 for manufacturing a touch screen panel according to the present invention provides ACF attachment information for the first connection region 111 (shown in FIG. 2) and the second connection region 112 (shown in FIG. 2). The time taken to acquire can be reduced, and thus, the ACF attaching process, prebonding process, and main bonding process can be performed on more panels 10 in a shorter time.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the invention. It will be clear to those who have knowledge.

1: touch screen panel manufacturing apparatus 2: loading unit 3: ACF attachment unit
4: prebonding unit 5: main bonding unit 6: unloading unit 7: vision unit
8 transfer unit 9 ACF inspection unit

Claims (10)

A loading unit supplying a panel having a touch electrode formed on the upper substrate;
An ACF attachment part for performing an ACF attachment step of attaching the ACF to the upper substrate of the panel supplied from the loading part;
A prebonding unit performing a prebonding process for attaching a gate driving circuit and a source driving circuit for driving the touch electrode on the ACF attached to the upper substrate through the ACF attaching process;
A main bonding unit performing a main bonding process of bonding the gate driving circuit and the source driving circuit attached on the ACF through the prebonding process;
An unloading unit which unloads a panel bonded with a gate driving circuit and a source driving circuit through the main bonding process;
A transfer unit for transferring a panel between the loading unit, the ACF attachment unit, the prebonding unit, the main bonding unit, and the unloading unit; And
Touch screen panel manufacturing apparatus comprising a vision unit for obtaining the status information of the panel from the alignment mark formed on the upper substrate of the panel The method of claim 1,
The ACF attachment portion includes an ACF attachment unit for attaching the ACF to the upper substrate of the panel located at the ACF attachment position, and a first support unit for moving the panel supplied from the loading portion to the ACF attachment position;
The vision unit includes a first vision unit installed to be positioned on a panel supported by the first support unit;
The first support unit is a touch screen panel manufacturing apparatus, characterized in that for adjusting the state of the panel based on the first state information of the panel obtained by the first vision unit. The method of claim 1,
The prebonding unit includes a first prebonding unit for attaching a gate driving circuit and a second prebonding unit for attaching a source driving circuit;
The first prebonding unit includes a first attaching unit for attaching a gate driving circuit to an ACF positioned at a first attaching position, and a second support unit for moving a panel transferred from the ACF attaching portion to the first attaching position. It includes;
The second prebonding unit includes a second attachment unit attaching a source driving circuit to an ACF positioned at a second attachment position, and a third support for moving the panel transferred from the second support unit to the second attachment position. Touch screen panel manufacturing apparatus comprising a unit. The method of claim 3,
The vision unit includes a second vision unit installed to be positioned above the panel supported by the second support unit, and a third vision unit installed to be positioned above the panel supported to the third support unit;
The second support unit adjusts the state of the panel based on the second state information of the panel obtained by the second vision unit;
And the third support unit adjusts the state of the panel based on the third state information of the panel obtained by the third vision unit. The method of claim 1,
The main bonding unit includes a first main bonding unit for bonding a source driving circuit, and a second main bonding unit for bonding a gate driving circuit;
The first main bonding unit includes a first bonding unit for bonding the source driving circuit located at the first bonding position, and a fourth support unit for moving the panel transferred from the prebonding unit to the first bonding position. ;
The second main bonding unit includes a second bonding unit for bonding the gate driving circuit located at the second bonding position, and a fifth support unit for moving the panel transferred from the fourth support unit to the second bonding position. Touch screen panel manufacturing apparatus, characterized in that. The method of claim 5,
The vision unit includes a fourth vision unit installed to be positioned above the panel supported by the fourth support unit, and a fifth vision unit installed to be positioned above the panel supported by the fifth support unit;
The fourth support unit adjusts the state of the panel based on the fourth state information of the panel obtained by the fourth vision unit;
And the fifth support unit adjusts the state of the panel based on the fifth state information of the panel acquired by the fifth vision unit. The method of claim 5,
The first bonding unit may include a first bonding mechanism for bonding a source driving circuit, a first raising and lowering mechanism for raising and lowering the first bonding mechanism, and a first installed between the first bonding mechanism and the first raising and lowering mechanism. A pressure sensor, and a first control mechanism for controlling the first lifting mechanism to adjust the pressure applied to the source driving circuit based on the first pressure information acquired by the first pressure sensor;
The second bonding unit may include a second bonding mechanism for bonding a gate driving circuit, a second lifting mechanism for lifting up and down the second bonding mechanism, and a second device disposed between the second bonding mechanism and the second lifting mechanism. And a second control mechanism for controlling the second lifting mechanism to adjust the pressure applied to the gate driving circuit based on the second pressure information acquired by the second pressure sensor. Screen panel manufacturing equipment. The method of claim 5,
The first bonding unit includes a first injection mechanism for injecting a cooling fluid toward the upper polarizing plate of the panel located at the first bonding position;
The second bonding unit includes a second injection mechanism for injecting a cooling fluid toward the upper polarizing plate of the panel located at the second bonding position. The method of claim 1,
An ACF inspection unit for acquiring ACF attachment information;
And the ACF inspection unit includes an ACF vision unit installed to be positioned on a movement path of the panel transferred from the ACF attachment unit to the prebonding unit, and a moving unit to move the ACF vision unit. The method of claim 1,
The loading section includes a slip sheet removal unit for removing slip sheets from the panel located at the loading position;
The unloading unit is a touch screen panel manufacturing apparatus, characterized in that it comprises a slip sheet supply unit for supplying slip sheets to the panel located in the unloading position.

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