TWI498182B - 雷射加工裝置 - Google Patents

雷射加工裝置 Download PDF

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Publication number
TWI498182B
TWI498182B TW101144059A TW101144059A TWI498182B TW I498182 B TWI498182 B TW I498182B TW 101144059 A TW101144059 A TW 101144059A TW 101144059 A TW101144059 A TW 101144059A TW I498182 B TWI498182 B TW I498182B
Authority
TW
Taiwan
Prior art keywords
laser light
light
lens
optical path
workpiece
Prior art date
Application number
TW101144059A
Other languages
English (en)
Chinese (zh)
Other versions
TW201336610A (zh
Inventor
Ikuyoshi Nakatani
Yuma Iwatsubo
Original Assignee
Mitsuboshi Diamond Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsuboshi Diamond Ind Co Ltd filed Critical Mitsuboshi Diamond Ind Co Ltd
Publication of TW201336610A publication Critical patent/TW201336610A/zh
Application granted granted Critical
Publication of TWI498182B publication Critical patent/TWI498182B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
    • B23K26/0676—Dividing the beam into multiple beams, e.g. multifocusing into dependently operating sub-beams, e.g. an array of spots with fixed spatial relationship or for performing simultaneously identical operations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
    • B23K37/04—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
    • B23K37/0408—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work for planar work

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Laser Beam Processing (AREA)
  • Dicing (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
TW101144059A 2012-03-15 2012-11-23 雷射加工裝置 TWI498182B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012059053A JP5966468B2 (ja) 2012-03-15 2012-03-15 レーザー加工装置

Publications (2)

Publication Number Publication Date
TW201336610A TW201336610A (zh) 2013-09-16
TWI498182B true TWI498182B (zh) 2015-09-01

Family

ID=49128357

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101144059A TWI498182B (zh) 2012-03-15 2012-11-23 雷射加工裝置

Country Status (4)

Country Link
JP (1) JP5966468B2 (ja)
KR (1) KR101412810B1 (ja)
CN (1) CN103302398B (ja)
TW (1) TWI498182B (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10052719B2 (en) 2014-03-27 2018-08-21 Primearth Ev Energy Co., Ltd. Laser welding device, laser welding method, and battery casing
JP6401943B2 (ja) * 2014-06-18 2018-10-10 株式会社ディスコ レーザー加工装置
KR102427155B1 (ko) * 2015-08-25 2022-07-29 삼성디스플레이 주식회사 레이저 결정화 장치
JP6904567B2 (ja) * 2017-09-29 2021-07-21 三星ダイヤモンド工業株式会社 スクライブ加工方法及びスクライブ加工装置
CN110102910A (zh) * 2019-06-19 2019-08-09 浙江圣石激光科技股份有限公司 用于晶圆划片的双光路激光加工装置及方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11221684A (ja) * 1998-02-06 1999-08-17 Hamamatsu Photonics Kk パルスレーザ加工装置
CN1575909A (zh) * 2003-07-11 2005-02-09 株式会社迪斯科 利用激光束的加工设备

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002178323A (ja) 2000-12-12 2002-06-26 Taiyo Yuden Co Ltd セラミックグリーンシートの加工装置
US6720526B2 (en) * 2001-07-31 2004-04-13 Siemens Automotive Corporation Method and apparatus to form dimensionally consistent orifices and chamfers by laser using spatial filters
JP2004337902A (ja) * 2003-05-14 2004-12-02 Hamamatsu Photonics Kk レーザ加工装置及びレーザ加工方法
JP2005138143A (ja) * 2003-11-06 2005-06-02 Disco Abrasive Syst Ltd レーザ光線を利用する加工装置
JP4527488B2 (ja) * 2004-10-07 2010-08-18 株式会社ディスコ レーザ加工装置
JP2006123228A (ja) * 2004-10-27 2006-05-18 Disco Abrasive Syst Ltd レーザ加工方法およびレーザ加工装置
KR101074408B1 (ko) * 2004-11-05 2011-10-17 엘지디스플레이 주식회사 펨토초 레이저 발생장치 및 이를 이용한 기판의 절단방법
JP5473414B2 (ja) * 2009-06-10 2014-04-16 株式会社ディスコ レーザ加工装置
JP5446631B2 (ja) * 2009-09-10 2014-03-19 アイシン精機株式会社 レーザ加工方法及びレーザ加工装置
JP5056839B2 (ja) * 2009-12-25 2012-10-24 三星ダイヤモンド工業株式会社 被加工物の加工方法および被加工物の分割方法
JP2011161491A (ja) * 2010-02-10 2011-08-25 Disco Abrasive Syst Ltd レーザー加工装置
JP5104920B2 (ja) * 2010-07-23 2012-12-19 三星ダイヤモンド工業株式会社 レーザー加工装置、被加工物の加工方法および被加工物の分割方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11221684A (ja) * 1998-02-06 1999-08-17 Hamamatsu Photonics Kk パルスレーザ加工装置
CN1575909A (zh) * 2003-07-11 2005-02-09 株式会社迪斯科 利用激光束的加工设备

Also Published As

Publication number Publication date
JP5966468B2 (ja) 2016-08-10
CN103302398A (zh) 2013-09-18
CN103302398B (zh) 2017-04-12
TW201336610A (zh) 2013-09-16
KR20130105275A (ko) 2013-09-25
JP2013193081A (ja) 2013-09-30
KR101412810B1 (ko) 2014-07-02

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