TWI493150B - Heat pipe and method for forming the same - Google Patents
Heat pipe and method for forming the same Download PDFInfo
- Publication number
- TWI493150B TWI493150B TW101145061A TW101145061A TWI493150B TW I493150 B TWI493150 B TW I493150B TW 101145061 A TW101145061 A TW 101145061A TW 101145061 A TW101145061 A TW 101145061A TW I493150 B TWI493150 B TW I493150B
- Authority
- TW
- Taiwan
- Prior art keywords
- oxidized
- metal
- metal pipe
- contact angle
- solution
- Prior art date
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C8/00—Solid state diffusion of only non-metal elements into metallic material surfaces; Chemical surface treatment of metallic material by reaction of the surface with a reactive gas, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
- C23C8/40—Solid state diffusion of only non-metal elements into metallic material surfaces; Chemical surface treatment of metallic material by reaction of the surface with a reactive gas, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using liquids, e.g. salt baths, liquid suspensions
- C23C8/42—Solid state diffusion of only non-metal elements into metallic material surfaces; Chemical surface treatment of metallic material by reaction of the surface with a reactive gas, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using liquids, e.g. salt baths, liquid suspensions only one element being applied
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2245/00—Coatings; Surface treatments
- F28F2245/02—Coatings; Surface treatments hydrophilic
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2245/00—Coatings; Surface treatments
- F28F2245/04—Coatings; Surface treatments hydrophobic
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Chemical Treatment Of Metals (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
本發明係為一種熱傳導技術,尤其是指一種熱管及其加工方法。The invention is a heat transfer technology, in particular to a heat pipe and a processing method thereof.
隨著積體電路封裝技術與製程的演進,內部線路密集度增加且微型化,使得電子元件運算之速度及頻率快速提升,然而當微型化的電子元件於高速頻率下運作時,會衍生出元件於單位面積下發熱量大幅提升導致熱源更為集中於晶片上之問題。統計結果顯示因為過熱導致所有電子產品損壞的比例高達55%,並經研究指出,每降低溫度約10℃可提昇運算晶片1-3%的效率,因此電子元件於運作時需要一套有效的散熱設計以解決熱源過於集中之問題,才可使電子設備於長期使用下保有其可靠度、穩定性及使用壽命。With the evolution of integrated circuit packaging technology and process, the internal circuit density is increased and miniaturized, which makes the speed and frequency of electronic components operate rapidly. However, when miniaturized electronic components operate at high speed, components are derived. A significant increase in heat generation per unit area results in a problem where the heat source is more concentrated on the wafer. The statistical results show that the proportion of all electronic products damaged due to overheating is as high as 55%, and it has been pointed out that every time the temperature is lowered by about 10 °C, the efficiency of the operation chip is increased by 1-3%, so the electronic components need an effective heat dissipation during operation. Designed to solve the problem of excessive concentration of heat sources, electronic equipment can maintain its reliability, stability and service life under long-term use.
熱管類產品(如熱管或均溫板)具有將熱源所產生之熱快速導熱至散熱端之特徵,因此被廣泛運用於目前電子元件、發光二極體(LED)、太陽能板等高度熱集中且需快速散熱之元件上。熱管內部係為一低壓之密封空間,具有毛細結構與填充之工作流體,內部之低壓狀態促使工作流體液氣相變化溫度大幅降低,於運作之時,蒸發區遇熱產升液氣相變化帶走大量的熱,氣化後之工作流體因壓力較高而向冷凝區流動,於冷凝區遇冷產生氣液相變化而冷凝,毛細結構則負責將冷凝後之工作流體回流至加熱端,使加熱 端持續具有工作流體,保持著一端蒸發、一端冷凝之密閉循環均熱系統。Heat pipe products (such as heat pipes or temperature equalizing plates) have the characteristics of rapidly transferring heat generated by heat sources to the heat dissipating end, and thus are widely used in high heat concentration of electronic components, light emitting diodes (LEDs), solar panels, and the like. On components that require fast heat dissipation. The inside of the heat pipe is a low-pressure sealed space with a capillary structure and a filled working fluid. The internal low-pressure state causes the gas-liquid phase change temperature of the working fluid to be greatly reduced. At the time of operation, the evaporation zone encounters a heat-producing liquid phase change zone. A large amount of heat is taken, and the working fluid after gasification flows to the condensation zone due to the high pressure, and the liquid phase changes and condenses in the condensation zone, and the capillary structure is responsible for returning the condensed working fluid to the heating end, so that heating The end continues to have a working fluid, maintaining a closed loop soaking system with one end of evaporation and one end of condensation.
熱管使用上有著不同的傳熱限制,一般電子散熱所使用之銅-水熱管,應用時常會先遇到之限制為毛細極限,隨著熱傳量增加,工作流體質量流率增加,若超過毛細力將工作流體帶回蒸發區之最大量,則會產生蒸發區無工作流體乾枯而使熱管運作失效之現象,達到熱管最大工作傳熱量極限。There are different heat transfer restrictions on the use of heat pipes. The copper-water heat pipes used in general heat dissipation are often limited to the capillary limit when applied. As the heat transfer rate increases, the mass flow rate of the working fluid increases. The force will bring the working fluid back to the maximum amount of the evaporation zone, which will result in the phenomenon that the evaporation zone has no working fluid drying and the heat pipe operation fails, and reaches the limit of the maximum heat transfer capacity of the heat pipe.
本揭露提出一種熱管及其加工方法,其係利用化學反應改變既有熱管或均熱板之毛細結構表面特性,使熱管內之工作流體與熱管內壁所具有之經過改質之毛細結構間具有不同之潤濕性,促使管內毛細結構所提供驅動工作流體流動之毛細壓差提升,藉此方式大幅提升熱管之最大熱傳量。The present disclosure proposes a heat pipe and a processing method thereof, which use a chemical reaction to change the surface characteristics of the capillary structure of the existing heat pipe or the heat equalizing plate, so that the working fluid in the heat pipe and the modified capillary structure of the inner wall of the heat pipe have Different wettability promotes the capillary pressure difference of the driving working fluid flow provided by the capillary structure in the tube, thereby greatly increasing the maximum heat transfer amount of the heat pipe.
在一實施例中,本揭露提供一種熱管加工方法,其係包括有下列步驟:提供一兩端具有開口之一金屬管體,該金屬管體內壁具有一毛細結構表面;以及氧化該毛細結構表面以形成氧化結構表面。In one embodiment, the present disclosure provides a heat pipe processing method comprising the steps of: providing a metal pipe body having an opening at both ends, the metal pipe inner wall having a capillary structure surface; and oxidizing the capillary structure surface To form an oxidized structure surface.
在另一實施例中,本揭露提供一種熱管,其係包括:一金屬管體,其內管壁具有一第一區域;一工作流體,其係充填於該金屬管體內;以及一第一氧化結構,其係形成於該第一區域之內管壁上,該工作流體於該第一氧化結構上具有一第一接觸角。In another embodiment, the present disclosure provides a heat pipe comprising: a metal pipe body having a first region in a pipe wall; a working fluid filled in the metal pipe; and a first oxidation The structure is formed on the inner tube wall of the first region, and the working fluid has a first contact angle on the first oxidized structure.
為使 貴審查委員能對本發明之特徵、目的及功能有更進一步的認知與瞭解,下文特將本發明之裝置的相關細部結構以及設計的理念原由作一說明,以使得 審查委員可以了解本發明之特點,詳細說明陳述如下:請參閱第1圖所示,該圖係為本揭露熱管加工方法第一實施例流程示意圖。在本實施例中,該方法2包括有步驟20提供一兩端具有開口之一金屬管體。如第2圖所示,該圖係為本揭露之金屬管體一端截面側視示意圖。該金屬管體80係為具有一長度之柱狀空心的管體,內壁具有一毛細結構表面81。本實施例中,該毛細結構表面81,係為在金屬管體內管壁形成凹槽結構。在另一實施例中,也可以在該內管壁上形成網目結構或者是燒結而成具有多孔隙之金屬結構,並利用網目或燒結金屬的孔隙作為毛細結構。毛細結構表面81的形成方式為本領域技術之人所熟知,因此並不以前述之毛細結構表面81之態樣為本發明之限制。該金屬管體80可以選擇導熱性良好的材質,例如:銅或鋁等材質。在本實施例中,該金屬管體80係為銅管。要說明的是,本發明之金屬管體80的截面形狀可以為圓形,但不以此為限。In order to enable the reviewing committee to have a further understanding and understanding of the features, objects and functions of the present invention, the related detailed structure of the device of the present invention and the concept of the design are explained in the following, so that the reviewing committee can understand the present invention. The detailed description is as follows: Please refer to FIG. 1 , which is a schematic flow chart of the first embodiment of the heat pipe processing method. In this embodiment, the method 2 includes the step 20 of providing a metal tube having an opening at both ends. As shown in Fig. 2, the figure is a side cross-sectional side view of the metal pipe body of the present disclosure. The metal pipe body 80 is a tubular body having a length of a columnar hollow, and the inner wall has a capillary structure surface 81. In this embodiment, the capillary structure surface 81 is formed by forming a groove structure in the tube wall of the metal tube. In another embodiment, a mesh structure may be formed on the inner tube wall or a porous metal structure may be sintered, and the pores of the mesh or sintered metal may be utilized as the capillary structure. The manner in which the capillary structure surface 81 is formed is well known to those skilled in the art and is therefore not limited by the foregoing aspects of the capillary structure surface 81. The metal pipe body 80 can be made of a material having good thermal conductivity, such as copper or aluminum. In the present embodiment, the metal pipe body 80 is a copper pipe. It should be noted that the cross-sectional shape of the metal pipe body 80 of the present invention may be circular, but not limited thereto.
再回到第1圖所示,接著進行步驟21,氧化該毛細結構表面以形成氧化結構表面,該氧化結構表面與工作流體(例如:水,但不以此為限制)間具有一第一接觸角。請參閱第3A至第3C圖所示,該圖係為接觸角示意圖。所謂接觸角之定義係為工作流體表面與金屬表面接觸時的夾角。 在第3A至第3C圖中,顯示出工作流體91和不同金屬表面90a,90b,與90c間的接觸角關係,其中θ 1<θ 2<θ 3,接觸角越小代表金屬表面屬於親水性之表面而具有較高潤濕性,而接觸角越大則代表金屬表面屬於疏水性之表面,其潤濕性相較於接觸角小的金屬表面差。Returning to Figure 1, then proceeding to step 21, oxidizing the surface of the capillary structure to form an oxidized structure surface having a first contact with a working fluid (e.g., water, but not limited thereto) angle. Please refer to FIGS. 3A to 3C, which are schematic diagrams of contact angles. The so-called contact angle is defined as the angle between the surface of the working fluid and the metal surface. In Figs. 3A to 3C, the contact angle relationship between the working fluid 91 and the different metal surfaces 90a, 90b, and 90c is shown, where θ 1 < θ 2 < θ 3 , and the smaller the contact angle, the hydrophilicity of the metal surface. The surface has a higher wettability, and the larger the contact angle, the more hydrophobic the metal surface, and the wettability is worse than the metal surface with a small contact angle.
再回到第1圖,在步驟21中氧化的方式,可以有很多種方式,在一實施例中,將該具有毛細結構之金屬管體,在兩端未封口的情況下,如第4A圖所示,將金屬管體80浸漬於過硫酸銨與一鹼性溶液之混合反應溶液92中,或者如第4B圖所示,是經由管路93與泵浦94之導引使該混合反應溶液92流入該金屬管體80內與該毛細結構接觸等方式,使該混合反應溶液92對該金屬管體80之內管壁進行氧化反應。該鹼性溶液可以為氫氧化鈉或氫氧化鉀,但不以此為限制。而該過硫酸銨亦可以用過硫酸鉀或過硫酸鈉來替代。以過硫酸銨與氫氧化鈉之混合反應溶液為例,在與金屬管體之內管壁反應的過程中,藉由調整氫氧化鈉與過硫酸銨之濃度、濃度比例、反應時間以及反應溫度等參數,可以將該金屬管體之內管壁所具有之毛細結構表面改質為氧化結構表面。以銅管為例,氫氧化鈉之濃度可以在0.25~5M之間、而氫氧化鈉與過硫酸銨之濃度比例(NaOH/(NH4 )2 S2 O8 =4~50)與反應時間介於0~12小時、反應溫度0~70℃之間,使得該氧化結構表面為藍色之氫氧化銅微結構所形成之表面,其反應方程式如下式(1)所示。要說明的是,氫氧化鈉可以用氫氧化鉀來替代。Returning to Fig. 1, the manner of oxidation in step 21 can be carried out in a variety of ways. In one embodiment, the metal tube body having the capillary structure is unsealed at both ends, as shown in Fig. 4A. As shown, the metal pipe body 80 is immersed in the mixed reaction solution 92 of ammonium persulfate and an alkaline solution, or as shown in FIG. 4B, the mixed reaction solution is guided via the line 93 and the pump 94. 92 flows into the metal pipe body 80 to contact the capillary structure, and the mixed reaction solution 92 oxidizes the inner pipe wall of the metal pipe body 80. The alkaline solution may be sodium hydroxide or potassium hydroxide, but is not limited thereto. The ammonium persulfate can also be replaced by potassium persulfate or sodium persulfate. Taking the mixed reaction solution of ammonium persulfate and sodium hydroxide as an example, the concentration, concentration ratio, reaction time and reaction temperature of sodium hydroxide and ammonium persulfate are adjusted during the reaction with the inner wall of the metal pipe body. With the parameters, the surface of the capillary structure of the inner tube wall of the metal pipe body can be modified into an oxidized structure surface. Taking a copper tube as an example, the concentration of sodium hydroxide can be between 0.25 and 5 M, and the concentration ratio of sodium hydroxide to ammonium persulfate (NaOH/(NH 4 ) 2 S 2 O 8 = 4 to 50) and reaction time. Between 0~12 hours and a reaction temperature of 0-70 °C, the surface of the oxidized structure is a surface formed by a blue copper hydroxide microstructure, and the reaction equation is as shown in the following formula (1). It should be noted that sodium hydroxide can be replaced by potassium hydroxide.
Cu+(NH4 )2 S2 O8 +NaOH → Cu(OH)2 +2Na2 SO4 +2NH3 +2H2 O...(1)Cu+(NH 4 ) 2 S 2 O 8 +NaOH → Cu(OH) 2 +2Na 2 SO 4 +2NH 3 +2H 2 O...(1)
在另一實施例中,該氧化結構表面可以將藍色之氫氧化銅微結構進一步脫水成黑色之氧化銅微結構,其反應方程式如下式(2)所示。In another embodiment, the surface of the oxidized structure may further dehydrate the blue copper hydroxide microstructure into a black copper oxide microstructure, and the reaction equation is as shown in the following formula (2).
Cu+(NH4 )2 S2 O8 +NaOH → Cu(OH)2 +2Na2 SO4 +2NH3 +2H2 O Cu(OH)2 → CuO+H2 O...(2)Cu+(NH 4 ) 2 S 2 O 8 +NaOH → Cu(OH) 2 +2Na 2 SO 4 +2NH 3 +2H 2 O Cu(OH) 2 → CuO+H 2 O...(2)
步驟21之氧化的另一實施例,基本上與上述式(1)與(2)之方法類似,差異的是本實施例係藉由調整混合反應溶液的成分,以過硫酸鉀與氫氧化鉀溶液之濃度、比例、反應時間與反應溫度,將銅表面氧化成具有藍色氫氧化銅之微結構,如下述式(3)所示。要說明的是,過硫酸鉀可以用過硫酸鈉來替代,氫氧化鉀亦可以用氫氧化鈉來替代。Another embodiment of the oxidation of the step 21 is substantially similar to the methods of the above formulas (1) and (2), except that the present embodiment adjusts the composition of the mixed reaction solution to potassium persulfate and potassium hydroxide. The surface concentration, the ratio, the reaction time and the reaction temperature of the solution oxidize the surface of the copper to a microstructure having blue copper hydroxide, as shown by the following formula (3). It should be noted that potassium persulfate can be replaced by sodium persulfate, and potassium hydroxide can also be replaced by sodium hydroxide.
Cu+K2 S2 O8 +2 KOH → Cu(OH)2 +2K2 SO4 ...(3)Cu+K 2 S 2 O 8 +2 KOH → Cu(OH) 2 +2K 2 SO 4 (3)
在另一實施例中,該氧化結構表面可以將藍色之氫氧化銅微結構進一步脫水成黑色之氧化銅微結構,其反應方程式如下式(4)所示。In another embodiment, the oxidized structure surface may further dehydrate the blue copper hydroxide microstructure into a black copper oxide microstructure, and the reaction equation is as shown in the following formula (4).
Cu+K2 S2 O8 +2 KOH → Cu(OH)2 +2K2 SO4 Cu(OH)2 → CuO+H2 O...(4)Cu+K 2 S 2 O 8 +2 KOH → Cu(OH) 2 +2K 2 SO 4 Cu(OH) 2 → CuO+H 2 O...(4)
此外,在步驟21中,氧化的另一實施例係為透過溫度處理的方式來進行氧化,亦即,本實施例之氧化方式並不需要藉由反應溶液來氧化,而是利用溫度與時間的控制來達成氧化的效果。在一實施例中,將具傳統毛細結構之金屬管體,兩端未封口之狀態下,放置於含氧環境(例如:大氧環境)之高溫烘箱中,經過一氧化溫度以及一氧化時間,而使得金屬管體之內管壁的毛細結構改質成金屬氧化物。以銅管為例,可以將其置於溫度範圍250~450℃,反 應時間0.5~6小時下,使銅管內壁表面改質成氧化銅,如下式(5)所示。In addition, in step 21, another embodiment of the oxidation is performed by means of temperature treatment, that is, the oxidation mode of the embodiment does not need to be oxidized by the reaction solution, but utilizes temperature and time. Control to achieve the effect of oxidation. In one embodiment, the metal pipe body having the conventional capillary structure is placed in a high-temperature oven in an oxygen-containing environment (for example, a high-oxygen environment) in an unsealed state, and the oxidation temperature and the oxidation time are performed. The capillary structure of the inner tube wall of the metal pipe body is modified into a metal oxide. Take the copper tube as an example, it can be placed in the temperature range of 250~450 °C, The surface of the inner wall of the copper tube is modified to copper oxide at a time of 0.5 to 6 hours, as shown in the following formula (5).
前述之式(1)~(5)所形成之氧化結構表面,以銅為例,與此表面微結構之水與銅所形成的氧化結構之接觸角幾乎為零度,增加了經過氧化改質之毛細結構之親水性。再回到第1圖所示,步驟21之後,可以進一步進行步驟22,對該金屬管體之內管壁所具有之部份區域進行第二次的氧化反應或對該部分區域之第一氧化結構表面進行改質而形成一第二氧化結構表面,該第二氧化結構表面具有一第二接觸角。在本實施例中,該第二接觸角係大於該第一接觸角。請參閱第5A圖所示,該圖係為經過步驟21後關於第2圖之金屬管體剖面示意圖。圖中具有複數個點所示的區域代表內管壁上的第一氧化結構82。以銅管為例,步驟22中,氧化之實施例為依據前述式(1)至(5)之反應式完成第一氧化方式後,再執行第二氧化方式,其係將該金屬管體80的部份區域800,浸漬於氟代烷基矽氧烷[CF3 (CF2 )n (CH2 )2 Si(OCH2 CH3 )3 or CF3 (CF2 )n (CH2 )2 Si(OCH3 )3 ]、氟代烷基三氯矽烷[CF3 (CF2 )n (CH2 )2 SiCl3 ]、氟代烷基二甲基氯矽烷[CF3 (CF2 )n (CH2 )2 SiCl(CH2 )2 ]、烷基矽氧烷[CH3 (CH2 )n Si(OCH2 CH3 )3 or CH3 (CH2 )n Si(OCH3 )3 ]、烷基三氯矽烷[CH3 (CH2 )n SiCl3 ]、烷基二甲基氯矽烷[CH3 (CH2 )n SiCl(CH2 )2 ]或硫醇[CH3 (CH2 )n SH]之稀釋溶液(ex:1H,1H,2H,2H-perfluorooctyltrichlorosilane濃度為 1w.t.%之乙醇溶液)中反應0~1hr,取出後清洗並放置於烘箱中乾燥(25~150℃),使該第一氧化結構表面82改質成為如第5B圖所示之具長碳鏈結構830之第二氧化結構表面83。該長碳鏈結構830可以為長碳鏈氟代烷基或長碳鏈烷基。此外,第二氧化結構表面83與工作流體間(例如:水)具有一第二接觸角,該第二接觸角大於該第一接觸角。The surface of the oxidized structure formed by the above formulas (1) to (5) is exemplified by copper, and the contact angle between the water and the oxidized structure formed by the surface microstructure is almost zero, which increases the oxidative modification. The hydrophilicity of the capillary structure. Returning to FIG. 1 , after step 21, step 22 may be further performed to perform a second oxidation reaction or a first oxidation of a portion of the inner tube wall of the metal tube body. The surface of the structure is modified to form a second oxidized structure surface having a second contact angle. In this embodiment, the second contact angle is greater than the first contact angle. Please refer to FIG. 5A, which is a schematic cross-sectional view of the metal pipe body according to FIG. 2 after the step 21. The area shown by the plurality of dots in the figure represents the first oxidized structure 82 on the inner tube wall. Taking the copper tube as an example, in the step 22, the oxidation method is performed according to the reaction formulas of the above formulas (1) to (5), and then the second oxidation mode is performed, which is the metal tube body 80. Part of region 800, impregnated with fluoroalkyl siloxane (CF 3 (CF 2 ) n (CH 2 ) 2 Si(OCH 2 CH 3 ) 3 or CF 3 (CF 2 ) n (CH 2 ) 2 Si (OCH 3 ) 3 ], fluoroalkyltrichloromethane [CF 3 (CF 2 ) n (CH 2 ) 2 SiCl 3 ], fluoroalkyl dimethylchlorodecane [CF 3 (CF 2 ) n (CH 2 ) 2 SiCl(CH 2 ) 2 ], alkyl alkane [CH 3 (CH 2 ) n Si(OCH 2 CH 3 ) 3 or CH 3 (CH 2 ) n Si(OCH 3 ) 3 ], alkyl Trichlorodecane [CH 3 (CH 2 ) n SiCl 3 ], alkyl dimethyl chlorodecane [CH 3 (CH 2 ) n SiCl(CH 2 ) 2 ] or thiol [CH 3 (CH 2 ) n SH] The diluted solution (ex: 1H, 1H, 2H, 2H-perfluorooctyltrichlorosilane concentration of 1w.t.% ethanol solution) in the reaction for 0 ~ 1hr, removed and washed and placed in an oven to dry (25 ~ 150 ° C), so that The first oxidized structure surface 82 is modified to form a second oxidized structure surface 83 having a long carbon chain structure 830 as shown in FIG. 5B. The long carbon chain structure 830 can be a long carbon chain fluoroalkyl or a long carbon chain alkyl group. In addition, the second oxidized structure surface 83 has a second contact angle with the working fluid (eg, water), the second contact angle being greater than the first contact angle.
如第5C圖所示,其中區域800之管壁內部的斜線區域代表形成於內管壁之第二氧化結構83。經過步驟21之後,區域801所形成的氧化結構可以視為親水性之氧化結構,而步驟22後,區域800所形成的氧化結構,相對於區域801之氧化結構可以視為疏水性之氧化結構。再回到第1圖所示,最後以步驟23將金屬管體進行一加工程序以形成一熱管。在本步驟23中,該加工程序可以分成幾個階段,第一階段先將該金屬管體之一端封閉,然後第二階段,對該金屬管體抽真空,再進行第三階段將工作流體,例如:水充填至該一端封閉之金屬管體內,隨後第四階段將該金屬管體之另一端封閉以形成兩端封閉之結構,最後,再進行對該熱管進行表面處理清潔以形成熱管。而在步驟23之後,在另一實施例中,可以將該熱管進行塑形加工,以形成各種不同形狀之熱管,例如:U形管、L形管或者是環形管等。As shown in Fig. 5C, the hatched area inside the tube wall of the region 800 represents the second oxidized structure 83 formed on the inner tube wall. After the step 21, the oxidized structure formed by the region 801 can be regarded as a hydrophilic oxidized structure, and after the step 22, the oxidized structure formed by the region 800 can be regarded as a hydrophobic oxidized structure with respect to the oxidized structure of the region 801. Returning to Figure 1, the metal tube is finally subjected to a processing procedure in step 23 to form a heat pipe. In this step 23, the processing program can be divided into several stages. The first stage first closes one end of the metal pipe body, then in the second stage, the metal pipe body is evacuated, and then the third stage is to work the fluid. For example, water is filled into the metal pipe body closed at one end, and then the other end of the metal pipe body is closed in the fourth stage to form a structure in which both ends are closed. Finally, the heat pipe is surface-cleaned to form a heat pipe. After step 23, in another embodiment, the heat pipe can be shaped to form heat pipes of various shapes, such as U-shaped tubes, L-shaped tubes or annular tubes.
請參閱第6A圖所示,該圖係為本揭露之另一實施例流程示意圖。在本實施例中,主要是加熱的方式使金屬管體內壁的毛細結構被改質成氧化結構。該方法3同樣以步驟30提供一兩端未封閉的金屬管體,該金屬管體之特徵係 如前述步驟20之金屬管體所述,在此不作贅述。接著以步驟31使該金屬管體置於具有一第一氧化溫度之含氧環境內,經過一第氧化時間而得到該第一氧化結構表面。以銅管為例,該第一氧化溫度為80℃~150℃,該第一氧化時間為0~10小時。經過步驟31所形成的第一氧化結構與工作流體之間具有一第一接觸角。在本實施例中,該金屬管體為銅管,因此該第一氧化結構為氧化亞銅。接著再進行步驟32,將具有該第一氧化結構表面之金屬管體之一部份區域進行另一氧化處理,以形成一第二氧化結構表面。如第6B圖所示,在本實施例中,該氧化處理之方式為將該金屬管體80之區域802內之具有第一氧化結構表面置於具有一第二氧化溫度之含氧環境內,經過一第二氧化時間而得到該第二氧化結構。在本實施例中,該第二氧化溫度為250℃~450℃,該第二氧化時間為0.5~6小時。經過步驟32所得到的第二氧化結構表面85具有一第二接觸角,該第二接觸角小於另一區域803內之第一氧化結構表面84(如第6B圖中具有複數個點之區域)所具有之第一接觸角。要說明的是,如果利用加熱方式形成第二氧化結構85(如第6B圖中之管壁內的斜線區域),為了避免熱傳導效果影響原先具有第一氧化結構之區域803,因此可以在對區域802進行熱處理時,同時對區域803進行冷卻,例如:冰浴或者是透過液態氣體來冷卻,以避免加熱區域802時所產生的熱經由熱傳導效應影響到區域803。此外步驟32之氧化方式,除了利用熱之外,亦可以利用如前述第(1)至(4)式之方式來製作,亦即利用浸漬之方式,使混合反應溶液與金屬 管體80之區域802內所具有該第一氧化結構表面接觸,進而讓具有第一氧化結構之金屬管體經過該混合反應溶液之改質,而形成第二氧化結構表面85。該第二氧化結構表面85可以為金屬氧化物或者金屬氫氧化物,例如:氧化銅或者是氫氧化銅。再回到第6A圖所示,步驟32之後,同樣以步驟33將金屬管體進行一加工程序以形成一熱管。該加工程序分成幾個階段,第一階段先將該金屬管體之一端封閉,然後第二階段,對該金屬管體抽真空,再進行第三階段將工作流體,例如:水充填至該一端封閉之金屬管體內,隨後第四階段將該金屬管體之另一端封閉以形成兩端封閉之結構,最後,再進行對該熱管進行表面處理清潔以形成熱管。而在步驟33之後,在另一實施例中,可以將該熱管進行塑形加工,以形成各種不同形狀之熱管,例如:U形管、L形管或者是環形管等。Please refer to FIG. 6A, which is a schematic flow chart of another embodiment of the present disclosure. In this embodiment, the capillary structure of the inner wall of the metal tube is modified to an oxidized structure mainly by heating. The method 3 also provides, in step 30, a metal tube body which is not closed at both ends, and the characteristic of the metal tube body As described in the metal pipe body of the foregoing step 20, no further details are provided herein. Then, in step 31, the metal tube body is placed in an oxygen-containing environment having a first oxidation temperature, and the surface of the first oxidized structure is obtained after a oxidizing time. Taking a copper tube as an example, the first oxidation temperature is 80 ° C to 150 ° C, and the first oxidation time is 0 to 10 hours. The first oxidized structure formed through step 31 has a first contact angle with the working fluid. In this embodiment, the metal pipe body is a copper pipe, and thus the first oxidation structure is cuprous oxide. Then, in step 32, a portion of the metal tube body having the surface of the first oxidized structure is subjected to another oxidation treatment to form a second oxidized structure surface. As shown in FIG. 6B, in the present embodiment, the oxidation treatment is performed by placing the surface having the first oxidized structure in the region 802 of the metal pipe body 80 in an oxygen-containing environment having a second oxidation temperature. The second oxidized structure is obtained after a second oxidation time. In this embodiment, the second oxidation temperature is from 250 ° C to 450 ° C, and the second oxidation time is from 0.5 to 6 hours. The second oxidized structure surface 85 obtained in step 32 has a second contact angle which is smaller than the first oxidized structure surface 84 in the other region 803 (as in the region having a plurality of points in FIG. 6B) The first contact angle. It is to be noted that if the second oxidized structure 85 is formed by heating (as in the oblique line region in the tube wall in FIG. 6B), in order to prevent the heat conduction effect from affecting the region 803 having the first oxidized structure, it is possible to When the 802 is subjected to the heat treatment, the region 803 is simultaneously cooled, for example, an ice bath or cooled by a liquid gas to prevent the heat generated when the region 802 is heated from affecting the region 803 via the heat conduction effect. Further, in addition to the use of heat, the oxidation method of the step 32 can also be carried out by using the above formulas (1) to (4), that is, by mixing the reaction solution and the metal by means of impregnation. The first oxidized structure surface contact is formed in the region 802 of the tube body 80, and the metal tube body having the first oxidized structure is modified by the mixed reaction solution to form the second oxidized structure surface 85. The second oxidized structure surface 85 can be a metal oxide or a metal hydroxide such as copper oxide or copper hydroxide. Returning to Figure 6A, after step 32, the metal tube is also subjected to a processing procedure in step 33 to form a heat pipe. The processing program is divided into several stages. The first stage first closes one end of the metal pipe body, then in the second stage, the metal pipe body is evacuated, and then the third stage is to fill the working fluid, for example, water to the one end. In the closed metal pipe body, the other end of the metal pipe body is then closed in a fourth stage to form a structure in which both ends are closed. Finally, the heat pipe is surface-treated to form a heat pipe. After step 33, in another embodiment, the heat pipe can be shaped to form heat pipes of various shapes, such as U-shaped tubes, L-shaped tubes or annular tubes.
雖然第1圖與第6A圖所示的流程,為同一金屬管體內製作不同接觸角的氧化結構之方法,但實際上,並不一定要同時採用兩階段的氧化程序。在一實施例中,如第7A圖所示,可以步驟40提供兩端未封閉之具有毛細結構的金屬管體,例如:銅管。接著將該金屬管體的特定區域以步驟41將該區域之金屬管體內壁上的毛細結構氧化,形成親水性的區域。該步驟41之方式係如前述步驟21之方式所述,在此不作贅述。之後再將該金屬管體之一端封閉,然後對該金屬管體抽真空,再將工作流體,例如:水充填至該一端封閉之金屬管體內,隨後將該金屬管體之另一端封閉以形成兩端封閉之結構,最後再進行表面處理與清潔以形 成熱管。在另一實施例中,如第7B圖所示,同樣可以步驟50提供兩端未封閉之具有毛細結構的金屬管體,例如:銅管。接著以步驟51氧化該金屬管體所具有一特定區域上.的毛細結構氧化,形成疏水性的區域。該步驟51之方式係如前述步驟31之方式或者是前述步驟21至步驟22之流程所述,在此不作贅述。其中,如果以前述步驟31之加熱金屬管體之方式來實施時,對於不想要受熱而氧化之區域可以透過冷卻的方式,例如:冰浴或者是透過液態氣體來冷卻,以避免加熱該特定區域而形成氧化結構時,熱傳導效應影響到其他區域。之後再將該金屬管體之一端封閉,然後對該金屬管體抽真空,再將工作流體,例如:水充填至該一端封閉之金屬管體內,隨後將該金屬管體之另一端封閉以形成兩端封閉之結構,最後再進行表面處理與清潔以形成熱管。一般而言,以銅材質為例,熱管內如單純為毛細結構時,其與工作流體,例如:水,之接觸角介於70~80度間,但是藉由本揭露之氧化方式所形成的氧化結構,可以讓親水性區域內的氧化結構與水之接觸角為小於70度,因此該親水區域可以作為熱管之蒸發區;以及讓疏水性區域內的氧化結構與水之接觸角為大於80度,因此該疏水區域可以作為熱管之冷凝區。Although the flow shown in Fig. 1 and Fig. 6A is a method of producing an oxidized structure having different contact angles in the same metal pipe body, in practice, it is not necessary to simultaneously employ a two-stage oxidation process. In one embodiment, as shown in FIG. 7A, a metal tube having a capillary structure, such as a copper tube, which is not closed at both ends, may be provided in step 40. Next, the specific region of the metal pipe body is oxidized in step 41 to the capillary structure on the inner wall of the metal pipe of the region to form a hydrophilic region. The manner of the step 41 is as described in the foregoing step 21, and details are not described herein. Then, one end of the metal pipe body is closed, and then the metal pipe body is vacuumed, and then a working fluid such as water is filled into the metal pipe body closed at one end, and then the other end of the metal pipe body is closed to form Structure closed at both ends, and finally surface treatment and cleaning to shape Heated into a tube. In another embodiment, as shown in FIG. 7B, step 50 may also be provided to provide a metal tube having a capillary structure that is not closed at both ends, such as a copper tube. Next, in step 51, the capillary structure of the metal tube having a specific region is oxidized to form a hydrophobic region. The manner of the step 51 is as described in the foregoing step 31 or the foregoing steps 21 to 22, and details are not described herein. Wherein, if the method of heating the metal pipe body in the foregoing step 31 is carried out, the region oxidized not to be heated may be cooled by means of cooling, for example, an ice bath or a liquid gas to avoid heating the specific region. When an oxidized structure is formed, the heat transfer effect affects other regions. Then, one end of the metal pipe body is closed, and then the metal pipe body is vacuumed, and then a working fluid such as water is filled into the metal pipe body closed at one end, and then the other end of the metal pipe body is closed to form The structure is closed at both ends, and finally surface treatment and cleaning are performed to form a heat pipe. Generally speaking, in the case of a copper material, if the heat pipe is simply a capillary structure, the contact angle with a working fluid such as water is between 70 and 80 degrees, but the oxidation formed by the oxidizing method of the present disclosure. The structure can make the contact angle between the oxidized structure and the water in the hydrophilic region less than 70 degrees, so the hydrophilic region can serve as the evaporation region of the heat pipe; and the contact angle of the oxidized structure with water in the hydrophobic region is greater than 80 degrees. Therefore, the hydrophobic region can serve as a condensation zone for the heat pipe.
請參閱第8圖所示,該圖係為本揭露之熱管加工方法另一實施例流程示意圖。在本實施例中,該方法6包括有步驟60提供一兩端未封閉之金屬管體。如第9A圖所示,該圖係為金屬管體剖面示意圖。該金屬管體70內壁具有毛細結構71(如第9A圖中具有複數個點之區域),該金屬管體 70之內壁可以分成一蒸發區700、一冷凝區701以及一隔熱區702。接著進行步驟61,氧化該蒸發區700內的毛細結構71,以將該毛細結構71改質形成一第一氧化結構,該第一氧化結構具有一第一接觸角。在步驟61中,氧化的方式可以利用前述步驟21所揭露的三種方式來形成親水性佳的氧化結構,在一實施例中,該第一接觸角小於70度。接著,在步驟62中,氧化該冷凝區701內的毛細結構71,以將該毛細結構71改質形成一第二氧化結構,該第二氧化結構具有一第二接觸角。在步驟62中,氧化的方式可以利用前述步驟31所揭露的方式或者是利用步驟21與22之方式來形成疏水性的氧化結構,在一實施例中,該疏水性氧化結構之第二接觸角大於80度。接著再以步驟63,將金屬管體進行一加工程序以形成一熱管。該加工程序分成幾個階段,第一階段先將該金屬管體之一端封閉,然後第二階段,對該金屬管體抽真空,再進行第三階段將工作流體,例如:水充填至該一端封閉之金屬管體內,隨後第四階段將該金屬管體之另一端封閉以形成兩端封閉之結構,最後,再進行對該熱管進行表面處理清潔以形成熱管。請參閱第9B圖所示,該圖係為步驟63所形成的熱管剖面示意圖。其中蒸發區700內具有的氧化結構表面72(如第9B圖中蒸發區700內之管壁內的斜線區域)為親水性的氧化結構,可以產生具有小於70度的接觸角。而冷凝區701內具有的氧化結構表面73(如第9B圖中冷凝區701內之管壁內的斜線區域)為疏水性的氧化結構,可以產生具有大於80度的接觸角。Please refer to FIG. 8 , which is a schematic flow chart of another embodiment of the heat pipe processing method of the present disclosure. In this embodiment, the method 6 includes the step 60 of providing a metal tube body that is not closed at both ends. As shown in Fig. 9A, the figure is a schematic cross-sectional view of a metal pipe body. The inner wall of the metal pipe body 70 has a capillary structure 71 (such as a region having a plurality of points in FIG. 9A), the metal pipe body The inner wall of 70 can be divided into an evaporation zone 700, a condensation zone 701, and a thermal insulation zone 702. Next, in step 61, the capillary structure 71 in the evaporation zone 700 is oxidized to modify the capillary structure 71 to form a first oxidation structure having a first contact angle. In step 61, the manner of oxidizing may be performed by the three methods disclosed in the foregoing step 21 to form a highly hydrophilic oxidized structure. In one embodiment, the first contact angle is less than 70 degrees. Next, in step 62, the capillary structure 71 in the condensation zone 701 is oxidized to modify the capillary structure 71 to form a second oxidation structure having a second contact angle. In step 62, the oxidation may be performed by the manner disclosed in the foregoing step 31 or by the steps 21 and 22 to form a hydrophobic oxidized structure. In one embodiment, the second contact angle of the hydrophobic oxidized structure More than 80 degrees. Then, in step 63, the metal pipe body is subjected to a processing procedure to form a heat pipe. The processing program is divided into several stages. The first stage first closes one end of the metal pipe body, then in the second stage, the metal pipe body is evacuated, and then the third stage is to fill the working fluid, for example, water to the one end. In the closed metal pipe body, the other end of the metal pipe body is then closed in a fourth stage to form a structure in which both ends are closed. Finally, the heat pipe is surface-treated to form a heat pipe. Please refer to FIG. 9B, which is a schematic cross-sectional view of the heat pipe formed in step 63. The oxidized structure surface 72 (e.g., the hatched region within the tube wall in the evaporation zone 700 in Figure 9B) having an oxidized structure surface therein is a hydrophilic oxidized structure that can produce a contact angle of less than 70 degrees. The oxidized structure surface 73 (e.g., the hatched area in the tube wall in the condensing zone 701 in Fig. 9B) in the condensing zone 701 is a hydrophobic oxidizing structure which can produce a contact angle of more than 80 degrees.
請參閱下式(6)所示,其係為熱管內毛細壓差之計算方程式。Please refer to the following formula (6), which is the calculation equation for the capillary pressure difference in the heat pipe.
反觀利用本揭露之方式,若能以同樣的毛細結構半徑,亦不改變工作流體表面張力,利用化學表面改質方式使工作流體於蒸發區與冷凝區有不同之潤濕性,亦即改變蒸發區與冷凝區之接觸角,帶入公式(6)可發現亦可達成提升毛細壓差與最大熱傳量之效果。以本揭露的第9B圖之實施例為例,在該實施例中,經過前述之氧化製程後,蒸發區700的氧化結構表面72可以達到約57度的接觸角,而冷凝區701的氧化結構表面73可以達到約137度的接觸角,因此可以在不改變熱管內工作流體表面張力,利用化學表面改質方式使熱管7內的工作流體(例如:水)於蒸發 區700與冷凝區701有不同之潤濕性,進而提升毛細壓差而產生最大熱傳量之效果。In contrast, according to the method of the present disclosure, if the same capillary structure radius is used, and the surface tension of the working fluid is not changed, the chemical fluid is modified to make the working fluid have different wettability in the evaporation zone and the condensation zone, that is, to change evaporation. The contact angle between the zone and the condensing zone, brought into the formula (6), can also be found to achieve the effect of increasing the capillary pressure difference and the maximum heat transfer amount. Taking the embodiment of FIG. 9B of the present disclosure as an example, in this embodiment, after the foregoing oxidation process, the oxidized structure surface 72 of the evaporation zone 700 can reach a contact angle of about 57 degrees, and the oxidized structure of the condensing zone 701 The surface 73 can reach a contact angle of about 137 degrees, so that the working fluid (for example, water) in the heat pipe 7 can be evaporated by chemical surface modification without changing the surface tension of the working fluid in the heat pipe. The zone 700 has a different wettability from the condensing zone 701, thereby increasing the capillary pressure differential to produce the maximum heat transfer.
例如,在一實施例中,以工作流體為水,而管體之材質為銅的熱管,且熱管內具有溝槽毛細結構為例,總管長25公分、管徑6釐米,溝槽高度0.34釐米、寬度0.21釐米、總溝槽數55,藉由通過化學表面改質處理,可將水與銅之接觸角於冷凝區提升之接觸角至137度,若蒸發區固定為水與銅之接觸角78度,並套入公式估計最大熱傳量,此熱管之最大熱傳量為128.3W。相較於傳統未改變熱管而言,其所能達到的最大熱傳量僅28.4W,可以區別出,經過化學氧化改質的毛細結構提昇的更多的熱傳量。For example, in one embodiment, the working fluid is water, and the pipe body is made of copper heat pipe, and the heat pipe has a groove capillary structure as an example, the total pipe length is 25 cm, the pipe diameter is 6 cm, and the groove height is 0.34 cm. The width is 0.21 cm and the total number of grooves is 55. By chemical surface modification, the contact angle of water and copper can be raised to a contact angle of 137 degrees in the condensation zone, if the evaporation zone is fixed to the contact angle of water and copper. 78 degrees, and nested into the formula to estimate the maximum heat transfer, the maximum heat transfer of this heat pipe is 128.3W. Compared with the traditional unmodified heat pipe, the maximum heat transfer capacity that can be achieved is only 28.4W, which can distinguish the more heat transfer from the chemical structure of the chemically modified foam.
以上所述,乃僅記載本發明為呈現解決問題所採用的技術手段之較佳實施方式或實施例而已,並非用來限定本發明專利實施之範圍。即凡與本發明專利申請範圍文義相符,或依本發明專利範圍所做的均等變化與修飾,皆為本發明專利範圍所涵蓋。The above description is only intended to describe the preferred embodiments or embodiments of the present invention, which are not intended to limit the scope of the invention. That is, the equivalent changes and modifications made in accordance with the scope of the patent application of the present invention or the scope of the invention are covered by the scope of the invention.
2‧‧‧熱管加工方法2‧‧‧ Heat pipe processing method
20~23‧‧‧步驟20~23‧‧‧Steps
3‧‧‧熱管加工方法3‧‧‧ Heat pipe processing method
30~33‧‧‧步驟30~33‧‧‧Steps
40~41‧‧‧步驟40~41‧‧‧Steps
50~51‧‧‧步驟50~51‧‧‧Steps
6‧‧‧熱管加工方法6‧‧‧ Heat pipe processing method
60~63‧‧‧步驟60~63‧‧‧Steps
7‧‧‧熱管7‧‧‧heat pipe
70‧‧‧金屬管體70‧‧‧Metal pipe body
700‧‧‧蒸發區700‧‧‧Evaporation zone
701‧‧‧冷凝區701‧‧‧Condensation zone
702‧‧‧隔熱區702‧‧‧Insulation zone
71‧‧‧毛細結構71‧‧‧Capillary structure
72、73‧‧‧氧化結構表面72, 73‧‧‧ oxidized structure surface
80‧‧‧金屬管體80‧‧‧Metal pipe body
800、801、802、803‧‧‧區域800, 801, 802, 803‧‧‧ areas
81‧‧‧毛細結構81‧‧‧Capillary structure
82、84‧‧‧第一氧化結構表面82, 84‧‧‧ First oxidized structure surface
83、85‧‧‧第二氧化結構表面83, 85‧‧‧Second oxidized structure surface
830‧‧‧長碳鏈結構830‧‧‧Long carbon chain structure
90a~90c‧‧‧金屬表面90a~90c‧‧‧Metal surface
91‧‧‧工作流體91‧‧‧Working fluid
92‧‧‧混合反應溶液92‧‧‧ mixed reaction solution
93‧‧‧管路93‧‧‧pipe
94‧‧‧泵浦94‧‧‧ pump
第1圖係為本揭露熱管加工方法第一實施例流程示意圖。FIG. 1 is a schematic flow chart of a first embodiment of a heat pipe processing method according to the present disclosure.
第2圖係為本揭露之金屬管體一端截面側視示意圖。Figure 2 is a side elevational cross-sectional view of the metal pipe body of the present disclosure.
第3A至第3C圖係為接觸角示意圖。Figures 3A to 3C are schematic views of contact angles.
第4A與第4B圖係為本揭露之利用混合反應溶液氧化金屬管體內壁示意圖。4A and 4B are schematic views showing the inner wall of a metal tube oxidized by a mixed reaction solution according to the present disclosure.
第5A圖係為經過步驟21之氧化程序後之金屬管體剖 面示意圖。Figure 5A is a metal tube section after the oxidation process of step 21. Schematic diagram.
第5B圖係為經過步驟22之氧化程序後形成之具有長碳鏈之氧化結構示意圖。Figure 5B is a schematic diagram of an oxidized structure having a long carbon chain formed after the oxidation process of Step 22.
第5C圖係為經過熱管加工方法第一實施例所形成之熱管結構剖面示意圖。Fig. 5C is a schematic cross-sectional view showing the structure of the heat pipe formed by the first embodiment of the heat pipe processing method.
第6A圖係為本揭露熱管加工方法第二實施例流程示意圖。Figure 6A is a schematic flow chart of the second embodiment of the heat pipe processing method.
第6B圖係為經過熱管加工方法第二實施例所形成之熱管結構剖面示意圖。Figure 6B is a schematic cross-sectional view showing the structure of the heat pipe formed by the second embodiment of the heat pipe processing method.
第7A與第7B圖係為本揭露熱管加工方法其他實施例流程示意圖。7A and 7B are schematic views showing the flow of other embodiments of the heat pipe processing method.
第8圖係為本揭露之熱管加工方法另一實施例流程示意圖。Figure 8 is a schematic flow chart of another embodiment of the heat pipe processing method of the present disclosure.
第9A圖係為金屬管體剖面示意圖。Figure 9A is a schematic cross-sectional view of a metal pipe body.
第9B係為經過第8圖之熱管加工方法所形成之熱管剖面示意圖。Section 9B is a schematic cross-sectional view of the heat pipe formed by the heat pipe processing method of Fig. 8.
2‧‧‧熱管加工方法2‧‧‧ Heat pipe processing method
20~23‧‧‧步驟20~23‧‧‧Steps
Claims (3)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW101145061A TWI493150B (en) | 2012-11-30 | 2012-11-30 | Heat pipe and method for forming the same |
CN201310002294.7A CN103851942B (en) | 2012-11-30 | 2013-01-05 | Heat pipe and processing method thereof |
US13/946,045 US20140150997A1 (en) | 2012-11-30 | 2013-07-19 | Heat pipe and processing method thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW101145061A TWI493150B (en) | 2012-11-30 | 2012-11-30 | Heat pipe and method for forming the same |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201420989A TW201420989A (en) | 2014-06-01 |
TWI493150B true TWI493150B (en) | 2015-07-21 |
Family
ID=50824285
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW101145061A TWI493150B (en) | 2012-11-30 | 2012-11-30 | Heat pipe and method for forming the same |
Country Status (3)
Country | Link |
---|---|
US (1) | US20140150997A1 (en) |
CN (1) | CN103851942B (en) |
TW (1) | TWI493150B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11359874B2 (en) | 2020-10-19 | 2022-06-14 | Industrial Technology Research Institute | Three dimensional pulsating heat pipe |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104567502B (en) * | 2014-12-25 | 2017-01-04 | 广东工业大学 | A kind of laser preparation method with discontinuous capillary structure micro heat pipe |
US10100411B2 (en) * | 2016-02-12 | 2018-10-16 | Iowa State University Research Foundation, Inc. | Supernucleating multiscale copper surfaces for high performance phase change heat transfer |
CN105803447B (en) * | 2016-04-14 | 2018-05-04 | 东北电力大学 | A kind of preparation of super hydrophilic micro-nano copper oxide film with anti-fouling performance and detection method |
CN106197105A (en) * | 2016-07-13 | 2016-12-07 | 广东工业大学 | A kind of augmentation of heat transfer heat pipe and heat pipe processing method |
CN106679473B (en) * | 2016-12-27 | 2020-06-12 | 山东飞龙制冷设备有限公司 | Double-layer multi-channel flat plate nanometer surface pulsating heat pipe and preparation method thereof |
CN106767062B (en) * | 2016-12-27 | 2020-06-05 | 山东飞龙制冷设备有限公司 | Nano surface copper-based pulsating heat pipe |
CN112444151B (en) * | 2019-09-03 | 2022-01-11 | 广州力及热管理科技有限公司 | Metal oxide slurry for manufacturing capillary structure of uniform temperature plate element |
CN113399669A (en) * | 2020-03-17 | 2021-09-17 | 永源科技材料股份有限公司 | Capillary structure |
CN111595188B (en) * | 2020-06-03 | 2021-07-27 | 常州大学 | Micro heat pipe with multi-stage capillary structure and preparation method thereof |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101266110A (en) * | 2008-04-24 | 2008-09-17 | 上海交通大学 | Preparation method of micro heat pipe array chip possessing functional surface |
TWM413160U (en) * | 2011-05-20 | 2011-10-01 | Asia Vital Components Co Ltd | Heat dissipation unit and its heat dissipation module |
CN102527614A (en) * | 2012-03-02 | 2012-07-04 | 华南理工大学 | Copper surface gradient wetting self-assembly film and preparation method thereof |
CN102776502A (en) * | 2012-07-20 | 2012-11-14 | 华南理工大学 | Copper base gradient contact angle functional surface and preparation method thereof |
Family Cites Families (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4109709A (en) * | 1973-09-12 | 1978-08-29 | Suzuki Metal Industrial Co, Ltd. | Heat pipes, process and apparatus for manufacturing same |
US4082575A (en) * | 1976-04-21 | 1978-04-04 | Thermacore, Inc. | Production of liquid compatible metals |
US6861159B2 (en) * | 1992-03-27 | 2005-03-01 | The Louis Berkman Company | Corrosion-resistant coated copper and method for making the same |
JP3408033B2 (en) * | 1995-10-12 | 2003-05-19 | 古河電気工業株式会社 | heat pipe |
JP3516961B2 (en) * | 1996-10-25 | 2004-04-05 | ク,ユズイ | Superconducting heat transfer medium, superconducting heat transfer device, and method of manufacturing these |
US6916430B1 (en) * | 1996-10-25 | 2005-07-12 | New Qu Energy Ltd. | Superconducting heat transfer medium |
US6911231B2 (en) * | 1996-10-25 | 2005-06-28 | New Qu Energy Limited | Method for producing a heat transfer medium and device |
JP2000054159A (en) * | 1998-08-07 | 2000-02-22 | Hitachi Chem Co Ltd | Heat transfer material, heat transfer body, production of heat transfer material, and production of heat transfer body |
US7579077B2 (en) * | 2003-05-05 | 2009-08-25 | Nanosys, Inc. | Nanofiber surfaces for use in enhanced surface area applications |
US6994152B2 (en) * | 2003-06-26 | 2006-02-07 | Thermal Corp. | Brazed wick for a heat transfer device |
CN1705043B (en) * | 2004-05-26 | 2010-06-23 | 财团法人工业技术研究院 | Method for improving flowing property of working fluid inside liquid-vapor phase heat sink |
US7011145B2 (en) * | 2004-07-12 | 2006-03-14 | Industrial Technology Research Institute | Method for enhancing mobility of working fluid in liquid/gas phase heat dissipating device |
FI118181B (en) * | 2005-07-11 | 2007-08-15 | Luvata Oy | A method for improving the fluid flow properties of a heat transfer surface |
CA2625777A1 (en) * | 2005-10-13 | 2007-04-26 | Velocys, Inc. | Electroless plating in microchannels |
CN100480612C (en) * | 2006-04-28 | 2009-04-22 | 富准精密工业(深圳)有限公司 | Heat pipe |
JP2008051389A (en) * | 2006-08-24 | 2008-03-06 | Asahi Kasei Fibers Corp | Heat pipe type heat transfer device |
US9574832B2 (en) * | 2007-12-28 | 2017-02-21 | Intel Corporation | Enabling an aluminum heat exchanger with a working fluid |
US20100294475A1 (en) * | 2009-05-22 | 2010-11-25 | General Electric Company | High performance heat transfer device, methods of manufacture thereof and articles comprising the same |
DE102009050568A1 (en) * | 2009-10-23 | 2011-04-28 | Schott Ag | Cover disk for a signaling system in railway areas and street area and for display- and traffic light device in traffic and scoreboard, comprises a substrate on which a coating is applied and which is a soda-lime glass disk |
TW201124068A (en) * | 2009-12-29 | 2011-07-01 | Ying-Tong Chen | Heat dissipating unit having antioxidant nano-film and its method of depositing antioxidant nano-film. |
CN101900505A (en) * | 2010-08-19 | 2010-12-01 | 燿佳科技股份有限公司 | Heat pipe and manufacturing method thereof |
TW201211488A (en) * | 2010-09-14 | 2012-03-16 | Univ Nat Yunlin Sci & Tech | Manufacturing method of two-phase flow heat dissipation device |
US9281207B2 (en) * | 2011-02-28 | 2016-03-08 | Inpria Corporation | Solution processible hardmasks for high resolution lithography |
CN102790021B (en) * | 2011-05-20 | 2015-06-17 | 奇鋐科技股份有限公司 | Radiating unit and manufacture method thereof and radiating module |
US20130008634A1 (en) * | 2011-07-05 | 2013-01-10 | Hsiu-Wei Yang | Heat dissipation unit and manufacturing method thereof and thermal module thereof |
KR101225704B1 (en) * | 2011-11-04 | 2013-01-23 | 잘만테크 주식회사 | Evaporator for the looped heat pipe system and method for manufacturing thereof |
US9810483B2 (en) * | 2012-05-11 | 2017-11-07 | Thermal Corp. | Variable-conductance heat transfer device |
-
2012
- 2012-11-30 TW TW101145061A patent/TWI493150B/en active
-
2013
- 2013-01-05 CN CN201310002294.7A patent/CN103851942B/en active Active
- 2013-07-19 US US13/946,045 patent/US20140150997A1/en not_active Abandoned
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101266110A (en) * | 2008-04-24 | 2008-09-17 | 上海交通大学 | Preparation method of micro heat pipe array chip possessing functional surface |
TWM413160U (en) * | 2011-05-20 | 2011-10-01 | Asia Vital Components Co Ltd | Heat dissipation unit and its heat dissipation module |
CN102527614A (en) * | 2012-03-02 | 2012-07-04 | 华南理工大学 | Copper surface gradient wetting self-assembly film and preparation method thereof |
CN102776502A (en) * | 2012-07-20 | 2012-11-14 | 华南理工大学 | Copper base gradient contact angle functional surface and preparation method thereof |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11359874B2 (en) | 2020-10-19 | 2022-06-14 | Industrial Technology Research Institute | Three dimensional pulsating heat pipe |
Also Published As
Publication number | Publication date |
---|---|
CN103851942A (en) | 2014-06-11 |
CN103851942B (en) | 2016-04-27 |
US20140150997A1 (en) | 2014-06-05 |
TW201420989A (en) | 2014-06-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI493150B (en) | Heat pipe and method for forming the same | |
TWI271501B (en) | Heat pipe and method of manufacturing it | |
CN103687455A (en) | Vapor chamber | |
TWI598556B (en) | Heat equalizing plate and method for making the same | |
CN106604607B (en) | A kind of no liquid-sucking core ultrathin heat pipe device | |
CN102338584B (en) | The radiator structure of improvement | |
CN106225531A (en) | The preparation of a kind of non-homogeneous wettability efficient phase transformation coating and gravity assisted heat pipe device | |
JP2011530195A (en) | Heat exchange structure and cooling device comprising such a structure | |
US20220221233A1 (en) | Single and multi-layer mesh structures for enhanced thermal transport | |
Gukeh et al. | Low-profile heat pipe consisting of wick-lined and non-adiabatic wickless wettability-patterned surfaces | |
CN113280667B (en) | Liquid suction core, temperature equalization plate, manufacturing method and electronic equipment | |
CN113237366B (en) | Preparation method of working medium heat dissipation element | |
TWM510445U (en) | Heat pipe | |
Thompson et al. | Recent advances in two-phase thermal ground planes | |
CN1507038A (en) | Thermal transfer device and producing method thereof and electronic device | |
JP2009092344A (en) | Vapor chamber with superior heat transport characteristic | |
TWI752345B (en) | A heat transfer enhancement device having graphene | |
CN102593083B (en) | A kind of heat-sink unit and hydrophilic compounds membrane deposition method with hydrophilic compounds film | |
JP3173270U (en) | heat pipe | |
JP2011237156A (en) | Vibration type heat pipe | |
CN106767062B (en) | Nano surface copper-based pulsating heat pipe | |
Zhang et al. | High performance ultra-thin vapor chamber by reducing liquid film and enhancing capillary wicking | |
CN217486819U (en) | Ultrathin vapor chamber and electronic equipment | |
CN114610126A (en) | Method for forming organic hydrophilic film and microgroove, soaking plate and heat sink | |
KR20060010628A (en) | Cooling device with micro-nano copper structure and method of the same |