TWI492686B - 帶有零件之配線基板的製造方法 - Google Patents

帶有零件之配線基板的製造方法 Download PDF

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Publication number
TWI492686B
TWI492686B TW101127101A TW101127101A TWI492686B TW I492686 B TWI492686 B TW I492686B TW 101127101 A TW101127101 A TW 101127101A TW 101127101 A TW101127101 A TW 101127101A TW I492686 B TWI492686 B TW I492686B
Authority
TW
Taiwan
Prior art keywords
wiring board
component
edge portion
jig
hole
Prior art date
Application number
TW101127101A
Other languages
English (en)
Chinese (zh)
Other versions
TW201316867A (zh
Inventor
Takeshi Fujiwara
Satoru Watanabe
Original Assignee
Ngk Spark Plug Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ngk Spark Plug Co filed Critical Ngk Spark Plug Co
Publication of TW201316867A publication Critical patent/TW201316867A/zh
Application granted granted Critical
Publication of TWI492686B publication Critical patent/TWI492686B/zh

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Classifications

    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Supply And Installment Of Electrical Components (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
TW101127101A 2011-07-29 2012-07-27 帶有零件之配線基板的製造方法 TWI492686B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011167461 2011-07-29
JP2012090485A JP2013051393A (ja) 2011-07-29 2012-04-11 部品付き配線基板の製造方法

Publications (2)

Publication Number Publication Date
TW201316867A TW201316867A (zh) 2013-04-16
TWI492686B true TWI492686B (zh) 2015-07-11

Family

ID=48013205

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101127101A TWI492686B (zh) 2011-07-29 2012-07-27 帶有零件之配線基板的製造方法

Country Status (2)

Country Link
JP (1) JP2013051393A (ja)
TW (1) TWI492686B (ja)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWM276230U (en) * 2005-04-29 2005-09-21 Horng Terng Automation Co Ltd Fixture set with automatic guiding and alignment function
TW200905822A (en) * 2007-07-16 2009-02-01 Phoenix Prec Technology Corp Method of fabricating pin grid array package substrate

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0247860A (ja) * 1988-08-10 1990-02-16 Hitachi Ltd ろう接方法
JPH0671622U (ja) * 1993-03-19 1994-10-07 ヤマハリビングテック株式会社 ユニットバスの壁面組立構造
JP2003324262A (ja) * 2002-05-01 2003-11-14 Shibaura Mechatronics Corp 物品位置決め装置
WO2006048931A1 (ja) * 2004-11-04 2006-05-11 Senju Metal Industry Co., Ltd カラム吸着ヘッドおよびカラム搭載方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWM276230U (en) * 2005-04-29 2005-09-21 Horng Terng Automation Co Ltd Fixture set with automatic guiding and alignment function
TW200905822A (en) * 2007-07-16 2009-02-01 Phoenix Prec Technology Corp Method of fabricating pin grid array package substrate

Also Published As

Publication number Publication date
JP2013051393A (ja) 2013-03-14
TW201316867A (zh) 2013-04-16

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Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees