TWI492686B - Method for manufacturing a wiring board with parts - Google Patents

Description

Manufacturing method of wiring board with parts

The present invention relates to a method of manufacturing a wiring board with components by connecting components on one side of a wiring substrate.

When a wiring board with a pin such as a PGA (pin grid array) is used, a jig for a pin connection portion in which a pin is connected to a wiring board is used. This jig erecting fixture has a configuration in which a plurality of through holes are formed in a plate-shaped member, and the through holes are inserted into the stitches. The stitching is constituted by the front end portion and the base end portion, and the front end portion of the stitch is inserted into the through hole, and the base end portion is exposed to the outside.

After that, a surrounding member (wiring substrate guiding member) is disposed at an end portion of the jig upright jig, and a wiring substrate is disposed in a region defined by the surrounding member, and then a stitch base end portion of the jig for standing up the needle is In the alignment of the connection portion of the wiring board, the base end portion protruding from the fixture for standing upright is brought into contact with the solder-forming connection portion of the wiring board, and then connected by soldering to form a PGA or the like. Wiring board of the stitch (Patent Document 1).

Further, when a component such as a sheet capacitor is mounted on the wiring board, a fixture for erecting a component for connecting the component to the component of the wiring board is also used for the alignment of the component.

In the manufacturing step of the actual wiring board with components, since it is necessary to continuously perform the above operation, it is required that the components in the fixture for erecting are connected to the wiring substrate to extract the components, and then gradually step from the surrounding members. The jig for erecting the parts is removed, and after the parts are inserted into the through holes, and then connected to the surrounding members, it is required to connect the parts to the wiring board as described above. Therefore, in the manufacturing step of the wiring board with the component, in order to continuously and correctly connect the components to the wiring substrate, it is required to appropriately perform the connection between the fixture for erecting the component and the surrounding member under certain conditions, and the positions of both. The relationship is always certain.

When the jig and the surrounding member are erected by the connecting member, a convex engaging member is formed by, for example, an end portion of the main surface facing the fitting member and the surrounding member, and the surrounding member is surrounded by the member. A guide hole is formed at an end portion of the main surface facing the fixture, and the convex engagement member of the fixture for erecting the member is engaged with the guide hole surrounding the member.

However, since the above-described engagement operation is performed by holding the surrounding member by, for example, a predetermined arm member or the like, the surrounding member is mechanically lowered by the arm member, and thus the amplitude of the operation of the arm member is caused. Etc. Sometimes, the convex engaging members and the guide holes come into contact, causing wear over time. As a result, after a predetermined period of time has elapsed since the manufacture of the wiring board, when the convex engaging member of the jig for the upright member is engaged with the guide hole of the surrounding member, a gap due to the above-described wear is formed, resulting in failure The engagement of the engaging member with the guide hole is firmly performed.

As a result, even in the case where the surrounding member is used, after the predetermined time has elapsed from the manufacture of the wiring board with the component, the alignment of the fixture for the upright part of the component and the wiring substrate cannot be correctly performed, and the component cannot be correctly aligned with the wiring substrate. When the ground connection is made, there is a problem that the yield of the wiring board with components such as PGA or the like which is obtained is reduced.

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] Special Opening 2007-27700

An object of the present invention is to provide a method of manufacturing a wiring board with a component by efficiently manufacturing a component such as a PGA or a sheet capacitor.

In order to achieve the above object, the present invention relates to a method of manufacturing a wiring board with a component, which is a method of manufacturing a wiring board with a component by connecting components on one side of a wiring substrate, and is characterized in that: the component is erected In the jig preparation step, the jig-shaped component erecting jig is prepared, and the plate-shaped component erecting jig is a plurality of component insertion holes formed from the main surface side to the back surface side for the aforementioned component insertion, and is The first insertion hole is formed on the outer peripheral side of the insertion hole forming region defined by the plurality of component insertion holes of the main surface, and the first engagement member having the upper end edge portion chamfered or the first guide hole having the hole entrance edge portion chamfered is formed. In the wiring board guiding jig preparation step, the board-shaped wiring board guiding jig having an opening portion corresponding to the size and shape of the wiring board in the planar direction is prepared, and Forming a second guide hole or a second-shaped engagement member in which the second guide hole or the upper end edge portion whose hole entrance edge portion is chamfered is chamfered on the outer peripheral side of the opening portion of the main surface; The step of integrating the jig for guiding, the first engagement member of the jig for erecting the component, the second guide hole of the wiring board guiding jig, or the first part of the component erecting jig The second engagement member of the guide hole and the wiring board guiding jig is engaged by the weight of any of the component upright jig and the wiring board guiding jig, and the component is erected And the component connection step of connecting the components in the fixture for standing uprights to the wiring board disposed in the opening of the wiring board guiding jig.

According to the present invention, in the case of a plate-shaped component erecting jig in which a plurality of component insertion holes are formed from the main surface side to the back surface side, the insertion hole defined by the plurality of component insertion holes is used. On the outer peripheral side of the formation region, a first first engagement hole in which the upper end edge portion is chamfered or a first guide hole in which the hole inlet edge portion is chamfered is formed. Further, a plate-shaped wiring board guiding member is provided, and the board-shaped wiring board guiding member is provided with an opening for accommodating the wiring board, and the wiring board is used for positioning and fixing the part erecting fixture for component connection. On the outer peripheral side of the opening of the wiring board guide member, a second guide hole in which the hole entrance edge portion is chamfered or a convex second engagement member in which the upper end edge portion is chamfered is formed on the wiring board.

Then, the fixture for erecting the component and the wiring board guiding member are located in the component upright jig and the wiring board guiding member by the first engaging member and the second guiding hole, or the first guiding hole and the second engaging member. Either one, that is, the weight of the upper one falls and is engaged, and the two are integrated.

Therefore, compared with the case where the fixture for standing uprights and the wiring board guide member are forcibly integrated by the mechanical means using the arm member, the engaging member and the guide hole hardly contact and wear. As a result, even in the actual manufacturing step of the wiring substrate with the component, the bonding can be firmly performed without forming a gap between the engaging member and the guide hole after a predetermined time elapses from the start of manufacture. The engagement of the member with the guide hole.

Therefore, even after a predetermined period of time has elapsed from the manufacture of the wiring board with the component, the alignment of the component erecting fixture and the wiring substrate can be accurately performed, even if the wiring substrate is placed in the opening of the wiring substrate guiding member. In this case, the connection portion of the wiring board and the position of the component in the fixture for standing uprights may be correctly aligned. Therefore, it is possible to accurately connect the components to the connection portion of the wiring board, and it is possible to suppress a decrease in the yield of the wiring board with components such as a PGA or the like.

Further, it is preferable to integrate the self-weight of any of the members of the fixture for erecting the part and the wiring board guide member, in particular, to use the edge portion of the guide hole to be engaged and the edge portion of the engaging member to be chamfered. That is, by inserting the hole entrance edge portion of the guide hole and the upper end edge portion of the convex engaging member, the engaging member can be inserted when the convex engaging member is inserted into the guide hole. Insert into the guide hole without hooking on the hole entrance of the guide hole.

In addition, as is clear from the above, a convex engagement member (first engagement member) can be formed on the fixture for standing upright, and a guide hole (second guide hole) can be provided in the wiring substrate guide member. The card is integrated to form the guide hole (the first guide hole) on the fixture for erecting the part, and the wiring base An engagement member (second engagement member) is provided on the plate guide member, and the two are integrated by engagement.

In addition, either the fixture for erecting the component and the wiring board guiding member may be provided above, or the fixture for standing upright may be disposed above, and the wiring board guiding member may be disposed below. However, when the fixture for erecting the parts is placed above, sometimes the parts inserted into the insertion holes of the parts may fall, so some means for preventing falling are required. Therefore, in consideration of the arrangement of the fall prevention means, it is preferable to arrange the component standing jigs on the lower side and to arrange the wiring board guide members on the upper side.

Further, in an example of the present invention, in the guiding jig integration step, the side surface of the first engaging member and the inner wall surface of the second guide hole, or the inner wall surface of the first guide hole, and the second card may be used. The side of the member is not in contact with each other, and any of the jig for the upright member and the jig for guiding the wiring substrate is dropped by its own weight.

That is, when the convex engaging member is inserted into the guide hole, the external force caused by the mechanical means does not directly act on the side surface of the engaging member and the inner wall surface of the guide hole, so that the side of the engaging member can be suppressed The inner wall surface of the guide hole is worn over time. As a result, after a predetermined time elapses from the start of manufacture, the engagement between the engaging member and the guide hole can be firmly performed without forming a gap between the engaging member and the guide hole. Therefore, the effects of the present invention described above can be more significantly achieved.

Furthermore, in an example of the present invention, the upper end edge portion of the first engaging member of the jig or the hole inlet edge portion of the first guide hole or the second guide hole of the wiring board guiding jig can be erected The hole inlet edge portion or the upper end edge portion of the second engaging member is chamfered into an arc (R) plane shape. Further The upper end edge portion of the first engaging member or the hole inlet edge portion of the first guide hole, and the hole inlet edge portion of the second guide hole or the upper end edge portion of the second engaging member are chamfered into an arc (R) surface shape.

In this case, at least one or both of the edge portion of the convex engaging member and the hole inlet edge portion of the guide hole are chamfered into an arc (R) plane shape, since the edge portion has been formed into an arc Since the (R) surface is inserted into the guide hole when the convex engaging member is inserted into the guide hole, the engaging member can be inserted into the guide hole more easily and smoothly without stopping at the hole entrance of the guide hole. Therefore, the effects of the present invention described above can be obtained more significantly.

As described above, according to the present invention, it is possible to provide a method of manufacturing a wiring board with a component by efficiently manufacturing a component such as a PGA or a sheet capacitor.

[Formation of the Invention]

Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following embodiments, a wiring board with a component is described as a wiring board with a pin, such as a PGA, using a pin as a component.

1 is a perspective view showing a schematic configuration of a jig for standing uprights (a jig for erecting parts) in the present embodiment, and FIG. 2 is a cross-sectional view showing the jig for standing uprights shown in FIG. . 3 is a perspective view showing a schematic configuration of a wiring board guiding member in the embodiment, and FIG. 4 is a cross-sectional view showing the wiring board guiding member shown in FIG. 3 taken along line II-II.

Furthermore, in the present embodiment, the features of the present invention are made clear. In the following, a case where a PGA (with a pin) wiring board is manufactured by connecting a pin to a single wiring board will be described.

As shown in Fig. 1 and Fig. 2, the jig for standing uprights 10 of the present embodiment is a plate-shaped jig 10 made of a metal such as stainless steel or aluminum, and a plurality of sheets formed from the main surface 10A side to the back surface 10B side. The pin insertion hole (part insertion hole) 10H is inserted into the pin 11.

The stitch 11 is composed of a proximal end portion 11A and a distal end portion 11B, and the diameter (outer diameter) of the proximal end portion 11A is larger than the diameter (outer diameter) of the distal end portion 11B. Further, the inner diameter of the stitch insertion hole 10H is larger than the diameter (outer diameter) of the front end portion 11B of the stitch 11 and smaller than the diameter (outer diameter) of the base end portion 11A of the stitch 11, and the stitch 11 is constructed such that the front end portion 11B is inserted into the stitch insertion hole. 11H, and the proximal end portion 11A is held in a state outside the stitch insertion hole 10H.

Further, the outer peripheral portion of the insertion hole forming region defined by the stitch insertion hole 10H of the main surface 10A of the jig upright jig 10 is specifically provided with engagement at each of the four corners of the main surface 10A. Member 13. In the present embodiment, the upper portion (upper end) 13A of the engaging member 13 is chamfered at the edge portion and has an arc (R) surface shape. That is, a convex curved surface is formed on the outer side. The circular arc (R) planar chamfer of the upper portion 13A may be defined by a single radius of curvature according to a single center of curvature set, or may be a form in which a plurality of curvature radii are synthesized by setting a plurality of centers of curvature.

Further, the chamfer of the upper portion 13A is not necessarily formed into a circular arc (R) plane shape, and may be formed into a C-plane shape as shown in Fig. 5 . However, by chamfering into a circular arc (R) plane shape, the effects of the present embodiment described below can be obtained more remarkably.

As shown in FIG. 3 and FIG. 4, the wiring board guiding member of this embodiment 20 is formed with an opening 21 for accommodating a wiring board in a central portion of a member 20 made of a metal such as stainless steel or aluminum. The size and shape of the inner peripheral surface 21A of the opening 21 correspond to the size and shape of the wiring board in the planar direction, and the wiring board can be provided along the inner peripheral surface 21A.

Further, four guide holes 23 are formed at positions corresponding to the engaging members 13 of the jig upright jig 10 at the four corners of the wiring substrate guiding member 20. In the present embodiment, the hole entrance 23A of the four guide holes 23 is chamfered into an arc (R) plane. That is, a convex curved surface is formed on the outer side. The circular arc (R) planar chamfer of the hole inlet 23A may be defined by a single radius of curvature that is set at a single center of curvature, or may be a form in which a plurality of curvature radii are synthesized by setting a plurality of centers of curvature.

Further, the chamfering of the hole inlet 23A is not necessarily formed into a circular arc (R) plane shape, and may be formed into a C-plane shape as shown in Fig. 6 . However, by chamfering into a circular arc (R) plane shape, the effects of the present embodiment described below can be obtained more remarkably.

Further, as described below, since the guide hole 23 of the wiring board guiding member 20 is inserted and engaged by the engaging member 13 for the jig upright jig 10, the maximum of the engaging member 13 of the jig upright jig 10 is established. The diameter d must be smaller than the inner diameter D of the guide hole 23 of the wiring substrate guiding member 20. In the specific design example, the maximum diameter d of the engaging member 13 of the jig erecting fixture 10 can be set to 2.98 mm to 3.00 mm, and the inner diameter D of the guide hole 23 of the wiring board guiding member 20 is 3.09 mm. 3.11mm.

In addition, the engaging member 13 and the guide hole 23 are provided in total at four corners of the jig upright jig 10 and the wiring board guiding member 20, respectively, as long as the effects of the present invention described below can be achieved. can, The number of the engaging members 13 and the guide holes 23 is not particularly limited.

Next, a procedure of connecting the stitches to the wiring board using the jig erecting fixture 10 shown in FIGS. 1 and 2 and the wiring board guiding member 20 shown in FIGS. 3 and 4 will be described. 7 to 10 are views showing the respective steps of stitching the wiring board in the embodiment.

First, after the jig erecting fixture 10 shown in FIGS. 1 and 2 and the wiring board guiding member 20 shown in FIGS. 3 and 4 are prepared, as shown in FIG. 7, the above-described wiring board guiding member 20 is erected at the stitches. After the upper portion of the jig 10 is aligned, the engagement member 13 of the jig 10 and the guide hole 23 of the wiring board guide member 20 are engaged by the lowering of the weight, and the two are integrated. At this time, the upper portion 13A of the engaging member 13 of the jig upright jig 10 has been chamfered into a circular arc (R) plane shape, and the guide hole 23 of the wiring substrate guiding member 20 to be engaged with the engaging member 13 The hole inlet 23A has also been chamfered into a circular arc (R) plane shape.

Therefore, as described above, in the step of integrating the guide jig in which the wiring board guiding member 20 is lowered and integrated with the jig upright jig 10, the side surface 13B of the engaging member 13 does not contact the inner wall surface 23B of the guide hole 23. In the state where the engagement member 13 of the jig erecting fixture 10 and the guide hole 23 of the wiring board guide member 20 are aligned substantially, the needle erecting fixture 10 is dropped by its own weight. The engaging member 13 can be engaged without being hooked on the hole inlet 23A of the guide hole 23 without using an external force.

Further, in the present embodiment, both the upper portion 13A of the engaging member 13 of the jig upright fixture 10 and the hole inlet 23A of the guide hole 23 of the wiring board guiding member 20 are chamfered into an arc (R). In the case of a flat surface, when the jig 10 and the wiring substrate guiding member 20 are erected, It is more reliably prevented that the engaging member 13 is hooked on the hole inlet 23A of the guide hole 23, and the engagement of the engaging member 13 and the guide hole 23 can be performed more easily and surely by the weight of the jig 10 by the stitch standing.

However, it is not necessary to chamfer both the upper portion 13A of the engaging member 10 of the jig 10 and the hole inlet 23A of the guide hole 23 of the wiring board guiding member 20 into a circular arc (R) plane, which may be, for example. Both of them are chamfered into a C-face shape, and either one of them may be chamfered into an arc (R) plane. However, by chamfering either or both of them into a circular arc (R) plane, the above-described effects are more remarkable.

Further, in the present embodiment, the upper portion 13A of the engaging member 13 of the jig upright fixture 10 and the hole inlet 23A of the guide hole 23 of the wiring board guiding member 20 are chamfered into an arc (R) plane. In particular, by setting the entire curvature of the arc (R) surface of the hole inlet 23A of the guide hole 23 to be larger than the entire curvature of the arc (R) surface of the upper portion 13A of the engaging member 13, the above-described effect is further enhanced. Significant.

Further, in the present embodiment, both the upper portion 13A of the engaging member 13 of the jig upright fixture 10 and the hole inlet 23A of the guide hole 23 of the wiring board guiding member 20 are chamfered into an arc (R) plane shape. In particular, the entire curvature of the arc (R) surface of the hole inlet 23A of the guide hole 23 is set to be larger than the entire curvature of the arc (R) surface of the upper portion 13A of the engaging member 13, and the wiring substrate is as described above. The guide member 20 is lowered with respect to the stitch standing fixture 10 by its own weight, and when the engaging member 13 of the jig upright jig 10 is engaged with the guide hole 23 of the wiring board guiding member 20, not only the engaging member 13 but also the engaging member 13 It is not hooked on the hole inlet 23A of the guide hole 23, and the two can be engaged in a state where the engaging member 13 and the guide hole 23 hardly rub.

Then, as shown in FIG. 8, after the jig upright jig 10 and the wiring board guide member 20 are integrated, a wiring board 30 on which the solder 31 is applied, for example, on the back surface 30B side thereof is prepared, and the wiring board 30 is placed on the wiring board 30. The inside of the opening portion 21 of the wiring substrate guiding member 20. When the wiring board 30 is placed in the opening portion 21 of the wiring board guide member 20, the solder 31 of the wiring board 30 is formed in advance at the base end portion of the stitch 11 disposed on the stitch upright jig 10 11A consistent position.

In addition, the type of the wiring board 30 is not particularly limited, and may be a double-area layer wiring board in which a wiring layer or the like is laminated on both sides of the core substrate, or a wiring layer may be laminated on the substrate side. Area layer type wiring substrate.

Then, as shown in FIG. 9, the jig for standing up the needle 10, the wiring board guide member 20, and the wiring board 30 are heat-treated in a state where the wiring board 30 is pressurized from above, and the solder 31 is reflowed. Then, the wiring board 30 is taken out from the wiring board guide member 20, and as shown in FIG. 10, the solder member 32 formed by reflowing the solder 31 is used to connect the stitches 11 to the wiring board 30, so that a so-called PGA or the like can be obtained. A wiring board 30X having stitches.

As described above, in the method of manufacturing the wiring board of the present embodiment, the card is vertically integrated with the wiring board guiding member 20 by the mechanical means such as the arm member. The engaging member 13 and the guide hole 23 are hardly worn. As a result, even in the manufacturing step of the wiring substrate, the engaging member 13 can be firmly performed without forming a large gap between the engaging member 13 and the guide hole 23 after a predetermined time elapses from the start of manufacture. Engagement of the guide hole 23.

Therefore, even after a predetermined period of time has elapsed from the manufacture of the wiring board, the positioning of the jig for the vertical standing of the stitching 10 and the wiring board 30 can be performed accurately, and the wiring board 30 can be placed in the opening of the wiring board guiding member 20. In the case of 21, the position of the solder 31 of the wiring board 30 and the stitch 11 of the jig upright jig 10 can be correctly matched. Therefore, the stitches 11 can be accurately connected to the solder 31 of the wiring board 30, and the yield reduction of the wiring board 30X with pins such as PGA can be suppressed.

The present invention has been described above in detail by way of specific examples. However, the invention is not limited thereto, and all modifications and changes may be made without departing from the scope of the invention.

For example, in the present embodiment, the wiring board guiding member 20 is placed above the stitching fixture 10, and the wiring board guiding member 20 is moved downward (falling) with respect to the stitch standing fixture 10, thereby making the wiring board guiding member 20 downward (falling) with respect to the stitch standing fixture 10. The engagement member 13 is engaged with the guide hole 23, but the jig upright jig 10 may be disposed above the wiring board guide member 20. However, when the jig for standing up the stitching needle 10 is placed on the upper side, the stitch 11 inserted into the stitch insertion hole 10H may fall, and it is necessary to take some fall prevention means. Therefore, in consideration of the arrangement of the drop prevention means, it is preferable to arrange the stitch upright jig 10 below and to arrange the wiring board guide member 20 above.

Further, in the present embodiment, the engaging member 13 is disposed on the jig for standing up the stitching, and the guide hole 23 is formed in the wiring board guiding member 20. However, the guide hole may be formed in the jig 10 for standing upright. An engagement member is disposed on the wiring board guiding member 20. In this case, the characteristics required for the via holes formed in the jig upright jig 10 are disposed on the wiring substrate. The characteristics required for the engaging members on the guiding member 20 are the same as those required for the guiding holes 23 of the wiring board guiding member 20 and the characteristics required for the engaging members 13 of the jig upright jig 10 .

In the present embodiment, the wiring board guiding member 20 has been described as being formed with one opening 21 in the center portion. However, a plurality of wiring boards 30 may be provided for accommodating the wiring board 30. The opening part. In this way, a plurality of products can be manufactured at the same time, so that the wiring board with the stitches can be efficiently manufactured.

In the present embodiment, a case has been described in which a wiring board with a pin such as a PGA is manufactured for a wiring board with components. However, the above-described contents are used to manufacture wiring with components such as a sheet capacitor. It is also applicable when the substrate is used.

10‧‧‧Standing fixture for stitching

11‧‧‧ stitches

11A‧‧‧ The base end of the stitch

11B‧‧‧Before the end of the stitch

13‧‧‧ engaging members

13A‧‧‧The upper part of the engaging member

13B‧‧‧Side of the snap member

20‧‧‧Wiring substrate guiding member

21‧‧‧ openings

21A‧‧‧The inner circumference of the opening

23‧‧‧ Guide hole

23A‧‧‧ hole entrance

23B‧‧‧ inner wall of the guide hole

30‧‧‧Wiring substrate

31‧‧‧ Solder

32‧‧‧ solder components

Fig. 1 is a perspective view showing a schematic configuration of a jig for erecting stitches in an embodiment.

Fig. 2 is a cross-sectional view showing the jig for standing upright shown in Fig. 1 taken along the line I-I.

3 is a perspective view showing a schematic configuration of a wiring board guiding member in the embodiment.

Fig. 4 is a cross-sectional view showing the wiring board guiding member shown in Fig. 3 taken along line II-II.

Fig. 5 is a cross-sectional view showing a schematic configuration of a modification of the jig for standing upright in the embodiment.

Fig. 6 is a cross-sectional view showing a schematic configuration of a modification of the wiring board guiding member in the embodiment.

Fig. 7 is a view showing the steps of the stitch connection of the wiring board in the embodiment.

Fig. 8 is a view showing the steps of the stitch connection to the wiring board in the same embodiment.

Fig. 9 is a view showing the steps of the stitch connection to the wiring board in the same embodiment.

Fig. 10 is a view showing the steps of the stitch connection to the wiring board in the same embodiment.

20‧‧‧Wiring substrate guiding member

21‧‧‧ openings

23‧‧‧ Guide hole

23A‧‧‧ hole entrance

23B‧‧‧ inner wall

D‧‧‧Inner diameter

Claims (7)

A method for manufacturing a wiring board with a component, wherein a wiring board having a component is formed by connecting a component to one side of the wiring board, and the manufacturing method is characterized in that: a step of preparing a fixture for erecting a part, and preparing a panel-shaped component The erecting fixture is constructed by erecting the yoke with a plurality of component insertion holes formed from the main surface side to the back side for the insertion of the aforementioned parts, and the plurality of parts in comparison with the main surface The insertion hole forming region defined by the insertion hole is formed on the outer peripheral side, and the first first engaging member whose chamfered upper end edge portion is chamfered or the first guide hole whose chamfered edge portion is chamfered is formed; In the preparation step, the plate-shaped wiring board guiding jig is configured to have an opening corresponding to the size and shape of the wiring board in the planar direction, and is larger than the main surface Further, the opening portion is formed on the outer peripheral side of the second guide hole whose chamfered entrance edge portion is chamfered, or a convex second engagement member whose upper end edge portion is chamfered; The first engagement hole of the fixture for erecting the component and the second guide hole of the wiring board guide jig, or the first guide hole of the component upright jig and the wiring board guide jig The second engagement member is engaged by the weight of the fixture for erecting the component and the fixture for guiding the substrate, and the fixture for erecting the component and the fixture for guiding the wiring substrate are integrated. And the connection steps of the parts, which are the zeros in the fixture for erecting the aforementioned parts The member is connected to the wiring board disposed in the opening of the wiring board guiding jig. The method of manufacturing a wiring board with a component according to the first aspect of the invention, wherein the guiding fixture integration step is performed from a side surface of the first engaging member and an inner wall surface of the second guiding hole, or The inner wall surface of the first guide hole and the side surface of the second engagement member are in a non-contact state, and any one of the component upright jig and the wiring board guide jig is dropped by its own weight. The method of manufacturing a wiring board with a component according to the first aspect of the invention, wherein the upper end edge portion of the first engaging member or the hole inlet edge portion of the first guiding hole of the fixture for erecting the component, or In the wiring board guiding jig, the hole entrance edge portion of the second guide hole or the upper end edge portion of the second engaging member is chamfered into an arc shape (R). The method of manufacturing a wiring board with a component according to the second aspect of the invention, wherein the upper end edge portion of the first engaging member or the hole inlet edge portion of the first guiding hole of the fixture for erecting the component, or In the wiring board guiding jig, the hole entrance edge portion of the second guide hole or the upper end edge portion of the second engaging member is chamfered into an arc shape (R). The method of manufacturing a wiring board with a component according to the third aspect of the invention, wherein the upper end edge portion of the first engaging member or the hole inlet edge portion of the first guiding hole of the fixture for erecting the component; In the wiring board guiding jig, the hole entrance edge portion of the second guide hole or the upper end edge portion of the second engaging member is chamfered into an arc shape (R). The method of manufacturing a wiring board with a component according to the fourth aspect of the invention, wherein the first engaging member of the jig for erecting the component The upper end edge portion or the hole inlet edge portion of the first guide hole, and the hole inlet edge portion of the second guide hole of the wiring board guiding jig or the upper end edge portion of the second engaging member are chamfered into a circle Arc (R) faceted. The method of manufacturing a wiring board with a component according to any one of claims 1 to 6, wherein the component is a stitch, and the component is erected by a jig-shaped pin erecting fixture, and is constructed: a plurality of component insertion holes formed from the main surface side toward the back surface side, wherein the stitches are inserted, and the upper end edge is formed on the outer peripheral side of the insertion hole forming region defined by the plurality of stitch insertion holes of the main surface a convex first-shaped engaging member that is chamfered or a first guide hole whose chamfered-edge edge portion is chamfered.