TWI486981B - Laminated ceramic electronic parts and manufacturing method thereof - Google Patents

Description

Laminated ceramic electronic component and manufacturing method thereof

The present invention relates to a laminated ceramic electronic component and a method of manufacturing the same, and more particularly to a structure of an external terminal electrode provided in a laminated ceramic electronic component and a method of forming an external terminal electrode.

In recent years, the market for small portable electronic devices such as mobile phones, notebook computers, digital cameras, and digital audio devices is expanding. With the advancement of miniaturization, these portable electronic devices have also advanced in performance. In the portable electronic device, a plurality of laminated ceramic electronic components are mounted, and the laminated ceramic electronic component is also required to be small in size and high in performance. For example, a laminated ceramic capacitor is required to be small in size and large in capacity.

As a method of miniaturizing and increasing the capacity of a laminated ceramic capacitor, it is effective to thin the ceramic layer. Recently, the thickness of the ceramic layer is about 3 μm. At present, the possibility of thinning is being sought, but there is a problem in that as the ceramic layer is thinned, the short circuit between the internal electrodes is more likely to occur, so that it is difficult to ensure quality.

As another method, it is considered to enlarge the effective area of the internal electrode. However, when the mass production of the laminated ceramic capacitor is to be performed, it is necessary to ensure the side margin of the internal electrode and the ceramic body side to the extent that the ceramic green sheet is laminated unevenly and the cutting deviation is considered. Since the internal electrode and the end face of the ceramic body end face have an end margin, there is a limitation in enlarging the effective area of the internal electrode.

In order to ensure a specific margin on the one hand and to enlarge the effective area of the internal electrode on the one hand, it is necessary to enlarge the area of the ceramic layer. However, there is a limit to expanding the area of the ceramic layer within the determined size specification, and the thickness of the external terminal electrode itself is also an obstacle.

Previously, the external terminal electrode of the laminated ceramic capacitor was formed by applying a conductive paste to the end of the ceramic body and baking it. As a coating method of the conductive paste, the end portion of the ceramic body is immersed in a paste tank containing the conductive paste and then taken out as a mainstream, but in the method, the ceramic body is affected by the viscosity of the conductive paste. The conductive paste is easily attached to the center portion of the end face. Therefore, the external terminal electrode is partially thickened (for example, specifically beyond 30 μm), so that the area of the ceramic layer has to be correspondingly reduced.

Thus, a method of forming an external terminal electrode by direct plating has been proposed (for example, refer to Patent Document 1). According to this method, the plating film is deposited with the exposed portion of the internal electrode in the end surface of the ceramic body as a core, and the plating film is grown to connect the exposed portions of the adjacent internal electrodes to each other. Therefore, after applying this method, a thin and flat external terminal electrode can be formed as compared with the prior method of the conductive paste.

However, in the above plating method, the effect of the adhesive of the glass in the method of the prior conductive paste cannot be obtained, and thus there is a problem that the fixing force with respect to the plating film of the ceramic body, that is, the external terminal electrode is weak.

[Patent Document 1] International Publication No. 2007/049456

Accordingly, an object of the present invention is to provide a laminated ceramic electronic component having a thin external terminal electrode excellent in adhesion to a ceramic body and a method of manufacturing the same.

The laminated ceramic electronic component of the present invention is characterized by comprising: a ceramic body formed by laminating a plurality of ceramic layers; and an inner conductor formed in the interior of the ceramic body and on the outer surface of the ceramic body An exposed portion; and an external terminal electrode formed on the outer surface of the ceramic body and covering the exposed portion of the inner conductor; to solve the above technical problem, the external terminal electrode includes a copper plating film covering the exposed portion of the inner conductor, and In the interior of the copper plating film and at least on the interface side of the copper plating film and the ceramic body, copper oxide is present discontinuously.

The above copper oxide is often present in a spherical form.

Further, the copper oxide may contain Cu ₂ O and CuO. In this case, it is preferable that Cu ₂ O accounts for 90% by weight or more of the copper oxide.

The inner conductor may also contain dummy inner conductors that do not substantially contribute to the appearance of electrical characteristics.

An auxiliary conductor may be formed between a region other than the exposed portion of the inner conductor on the outer surface of the ceramic body and between the external terminal electrode and the ceramic body. In this case, the auxiliary conductor preferably contains glass.

When the laminated ceramic electronic component of the present invention is, for example, a capacitor array or a multi-terminal type low ESL capacitor, the exposed portion of the inner conductor is formed on at least four rows on the outer surface of the ceramic body, and the external terminal electrode is formed. At least four are formed in a manner corresponding to the line of the exposed portion of the inner conductor.

When the laminated ceramic electronic component of the present invention is, for example, a laminated ceramic capacitor or a laminated ceramic inductor, the ceramic body typically has first and second main faces facing each other and connecting the first and second sides. The four side faces between the main faces and the external terminal electrodes include first and second external terminal electrodes respectively formed at the first and second positions different in the side faces.

In the embodiment, when the laminated ceramic electronic component of the present invention comprises a laminated ceramic capacitor, the internal conductor includes a first internal electrode having an exposed portion at a first position on the side surface, and the first external portion The terminal electrode is electrically connected; and the second internal electrode has an exposed portion at a second position on the side surface and is electrically connected to the second external terminal electrode; and the first and second internal electrodes are mutually connected via a specific ceramic layer relatively.

When the laminated ceramic electronic component of the present invention constitutes a laminated ceramic inductor, the inner conductor includes: a first inner conductor having an exposed portion at a first position on the side surface; and a second inner conductor attached to the side surface The second position has an exposed portion, and is disposed at a position different from the first inner conductor in the stacking direction of the ceramic layer, and the coil conductor extends in a coil shape to electrically connect the first inner conductor and the second inner conductor connection.

When the four side faces include the first and second side faces facing each other and the third and fourth side faces facing each other, the first external terminal electrode is formed only on the third side face, and the second external terminal electrode is formed only on It can also be on the fourth side. In this case, it is preferable that each of the first and second main faces and each of the first and second side faces are electrically connected to the first external terminal electrode only on the outer periphery of the first external terminal electrode. The first end edge conductor is electrically connected to the second external terminal electrode only on the outer periphery of the second external terminal electrode on each of the first and second main faces and each of the first and second side faces. The second end edge conductor.

Further, the present invention is also useful as a method of manufacturing a laminated ceramic electronic component as described above.

The method for manufacturing a laminated ceramic electronic component of the present invention is characterized by comprising the steps of: preparing a ceramic body which is formed by laminating a plurality of ceramic layers, having an inner conductor inside, and having a part of an inner conductor on the outer surface The exposed portion is exposed; the ceramic body is subjected to a plating treatment to deposit a copper plating film on the exposed portion of the inner conductor; and the ceramic body is subjected to heat treatment to form a Cu liquid phase, an O liquid phase, and a ceramic liquid body between the copper plating film and the ceramic body. Cu solid phase.

The above heat treatment is preferably carried out under the conditions of a temperature of 1065 ° C or more and an oxygen concentration of 50 ppm or more.

According to the present invention, after the copper plating film is formed, heat treatment is performed under specific conditions, whereby a Cu liquid phase, an O liquid phase, and a Cu solid phase are formed between the copper plating film and the ceramic body. These mixed phases are easily segregated inside the copper plating film and on the interface side between the copper plating film and at least the ceramic body. Then, after cooling, the Cu liquid phase and the O liquid phase become solid to form a copper oxide. The copper oxide is present in a discontinuous state in the interior of the copper plating film and on the interface side between the copper plating film and the at least ceramic body. In this state, the copper oxide acts as an adhesive for firmly bonding the ceramic body and the copper plating film, thereby improving the fixing force of the external terminal electrode including the copper plating film with respect to the ceramic body, and as a result, it is possible to obtain A laminated ceramic electronic component of an external terminal electrode having excellent adhesion to a ceramic body.

Moreover, since the copper plating film contained in the external terminal electrode is formed by plating, it can be made thin and flat compared with the case where it is formed using a conductive paste. Therefore, it contributes to miniaturization of the laminated ceramic electronic component, and the volume of the ceramic body can be increased within the determined size specification, thereby contributing to the high performance of the laminated ceramic electronic component. In particular, when applied to a laminated ceramic capacitor, it is possible to increase the capacity in a predetermined size specification.

When the copper oxide contains Cu ₂ O and CuO, in particular, diffusion bonding between Cu ₂ O and ceramic can achieve a strong bonding state, so if Cu ₂ O accounts for 90% by weight or more in the copper oxide, Further, the fixing force of the external terminal electrode with respect to the ceramic body can be further improved.

When the inner conductor contains a dummy inner conductor, the fixing force of the external terminal electrode with respect to the ceramic body can be further improved.

When an auxiliary conductor is formed on a region other than the exposed portion of the internal electrode on the surface other than the ceramic body, the formation region of the external terminal electrode can be easily enlarged, and as a result, the fixing force of the external terminal electrode with respect to the ceramic body can be achieved. Further improve.

The ceramic body has first and second side faces facing each other and third and fourth side faces facing each other, the first external terminal electrode is formed only on the third side face, and the second external terminal electrode is formed only on the fourth side face. Further, a first end electrically connected to the first external terminal electrode only on the outer periphery of the first external terminal electrode is formed on each of the first and second main faces and each of the first and second side faces The edge conductor forms a second end electrically connected to the second external terminal electrode only on the outer periphery of the second external terminal electrode on each of the first and second main faces and each of the first and second side faces. The edge conductor can complete the plating step for forming the external terminal electrode in a relatively short period of time, and the connection reliability when mounting by soldering can be improved due to the presence of the edge conductor, and the moisture can be surely suppressed. The penetration from the periphery of the external terminal electrode into the interior of the ceramic body can improve the reliability of the laminated capacitor.

In the method for producing a laminated ceramic electronic component of the present invention, if the heat treatment is performed under the conditions of a temperature of 1065 ° C or higher and an oxygen concentration of 50 ppm or more, a sufficient Cu liquid phase and O liquid phase can be surely formed.

1 to 4 are views for explaining the first embodiment of the present invention. Here, FIG. 1 is a perspective view showing a laminated ceramic capacitor 1 as an example of a laminated ceramic electronic component. Figure 2 is a cross-sectional view taken along line A-A of Figure 1.

The laminated ceramic capacitor 1 is provided with a ceramic body 2. The ceramic body 2 has a rectangular parallelepiped shape, and has first and second main faces 3 and 4 opposed to each other, and four side faces 5 to 8 that connect the first and second main faces 3 and 4. In the following description, the side faces 5 and 6 extending in the longitudinal direction of the main faces 3 and 4 are referred to as the first and second side faces, respectively, in the four side faces 5 to 8, and are oriented in the short side direction. The extended side faces 7 and 8 are referred to as first and second end faces, respectively.

The first and second external terminal electrodes 9 and 10 are formed on the first and second end faces 7 and 8 of the ceramic body 2, respectively.

Referring mainly to Fig. 2, the ceramic body 2 has a structure in which a plurality of ceramic layers 11 are laminated. Inside the ceramic body 2, the first and second internal electrodes 12 and 13 are alternately formed in the stacking direction in a state in which a specific ceramic layer 11 is interposed. The first inner electrode 12 has an exposed portion 14 on the first end surface 7, and the second inner electrode 13 has an exposed portion 15 on the second end surface 8. The exposed portion 14 of the first internal electrode 12 is covered by the first external terminal electrode 9 and electrically connected to the first external terminal electrode 9. The exposed portion 15 of the second internal electrode 13 is covered by the second external terminal electrode 10 and electrically connected to the second external terminal electrode 10.

3 is a plan view showing the internal structure of the ceramic element body 2, wherein (1) shows a cross section through which the first internal electrode 12 passes, and (2) shows a cross section through which the second internal electrode 13 passes.

As shown in FIG. 3, each of the first and second internal electrodes 12 and 13 has a rectangular planar shape. The first internal electrode 12 includes a first capacitor portion 16 that faces the second internal electrode 13 and a first lead portion 17 that is drawn from the first capacitor portion 16 to the first end surface 7 . The second internal electrode 13 also includes the second capacitor portion 18 and the second lead portion 19 in the same manner.

Fig. 4 is a cross-sectional view showing a portion of Fig. 2, that is, a portion in which the first external terminal electrode 9 is formed.

As shown in FIG. 4, the first external terminal electrode 9 includes a copper plating film 20 which is formed on the first end surface 7 so as to cover the exposed portion 14 of the first internal electrode 12. The second external terminal electrode 10 also includes a copper plating film 20 as shown below. The thickness of the copper plating film 20 is preferably 1 to 10 μm.

The copper oxide 21 is present discontinuously in the interior of the copper plating film 20 and on the interface side between the copper plating film 20 and at least the ceramic body 2. In FIG. 4, as an example of the discontinuous state, the copper oxide 21 is present in a spherical shape. However, it is not necessarily required to exist in an independent state. For example, it may exist in a stripe shape. The copper oxide 21 functions to firmly bond the ceramic element body 2 to the external terminal electrodes 9 and 10. Details regarding this effect will be described below. The copper oxide 21 may contain Cu ₂ O and CuO. Preferably, in the copper oxide 21, the proportion of Cu ₂ O is 90% by weight or more.

The ceramic layer 11 is made of, for example, a dielectric ceramic containing BaTiO ₃ , CaTiO ₃ , SrTiO ₃ , CaZrO ₃ or the like as a main component. Further, an auxiliary component such as a Mn compound, an Fe compound, a Cr compound, a Co compound or a Ni compound may be added to the main components. Further, the thickness of the ceramic layer 11 is preferably, for example, 1 to 10 μm after the firing.

The size of the ceramic element body 2 may be 0402 size, 0603 size, 1005 size, 1608 size, 2012 size, 3216 size, 3225 size (refer to JEITA specifications, etc.), but based on the viewpoint of miniaturization and large capacity. The invention is particularly advantageous for parts of the size of 1005~2012.

As the conductive component contained in the internal electrodes 12 and 13, for example, Ni, Cu, Ag, Pd, an Ag-Pd alloy, Au, or the like can be used. Further, in consideration of the reactivity with the copper oxide 21 or Cu of Cu ₂ O or CuO which may be contained in the copper plating film 20, Ni is particularly preferably used. Further, the thickness of each of the internal electrodes 12 and 13 after firing is preferably 0.5 to 2.0 μm.

Next, an example of a method of manufacturing the laminated ceramic capacitor 1 described above will be described.

First, a ceramic green sheet which can be the ceramic layer 11 and a conductive paste for forming the internal electrodes 12 and 13 are separately prepared. A binder and a solvent are contained in the ceramic green sheets and the conductive paste, and as the binders and solvents, known organic binders and organic solvents can be used.

Next, on the ceramic green sheet, a conductive paste is printed by holding a specific pattern, for example, by a screen printing method. Thereby, a ceramic green sheet in which the conductive paste films which can be the internal electrodes 12 and 13 can be formed can be obtained.

Then, as described above, the ceramic green sheets on which the conductive paste film is formed are laminated in a specific order in a specific order, and the ceramic green sheets are laminated on the upper and lower sides of the conductive paste film without forming a specific number of sheets. A mother layer body in an unprocessed state can be obtained. The unprocessed mother laminate is crimped toward the stacking direction by a mechanism such as an isostatic pressing as needed.

Next, the unprocessed mother laminate is cut into a specific size, thereby cutting out the unprocessed state of the ceramic body 2.

Then, the unprocessed ceramic body 2 is calcined. The calcination temperature also depends on the ceramic material contained in the ceramic green sheet and the metal material contained in the conductive paste film, and is preferably selected, for example, in the range of 900 to 1300 °C.

Then, if necessary, a polishing process such as barrel polishing is performed to expose the exposed portions 14 and 15 of the internal electrodes 12 and 13. At the same time, an arc is formed at the ridges and corners of the ceramic body 2. Further, a water repellent treatment is performed as needed to prevent penetration of the plating solution from the gap between the exposed portions 14 and 15 of the internal electrodes 12 and 13 and the ceramic layer 11.

Then, the ceramic body 2 is subjected to a plating treatment to deposit the copper plating film 20 on the exposed portions 14 and 15 of the first and second internal electrodes 12 and 13. As a method of copper plating, any of electrolytic copper plating and electroless copper plating can be used. When electroless copper plating is used, in order to increase the plating deposition rate, it is necessary to perform pre-treatment such as Pd catalyst, which causes complicated steps. Disadvantages. Therefore, it is preferred to use electrolytic copper plating. Further, in order to promote the formation of the copper plating film 20, it is preferred to perform strike plating of copper before electrolytic copper plating or electroless copper plating. Further, in the plating treatment, it is preferred to use barrel plating.

Then, the ceramic body 2 is subjected to heat treatment to form a Cu liquid phase, an O liquid phase, and a Cu solid phase between the copper plating film 20 and the outer surface of the ceramic body 2. These mixed phases are easily segregated on the interface between the copper plating film 20 and the outer surface of the ceramic body 2. It is presumed that the liquid phase easily moves toward the minute gap between the copper plating film 20 and the outer surface of the ceramic body 2 or the fine pores on the surface of the ceramic body 2 during the heat treatment.

The heat treatment conditions are preferably such that the temperature is selected to be 1065 ° C or higher and the oxygen concentration is 50 ppm or more. When the temperature is less than 1065 ° C or the oxygen concentration is less than 50 ppm, the Cu liquid phase and the O liquid phase may not be sufficiently formed. The upper limit of the heat treatment temperature is preferably such that it does not exceed the melting point of Cu, and specifically, it is preferably less than 1084 °C.

Then, the ceramic body 2 was cooled to room temperature. At this time, the Cu liquid phase and the O liquid phase segregated on the above interface become solid, and the copper oxide 21 is formed therein. The copper oxide 21 firmly bonds the ceramic body 2 to the copper plating film 20. Among them, a stronger bonding state can be achieved between the Cu ₂ O and the ceramic by diffusion bonding. Further, since the copper plating film 20 and the ceramic body 2 are sealed by the copper oxide 21, it is difficult to infiltrate moisture from the outside, and the reliability of the laminated ceramic capacitor 1 can be improved.

Fig. 5 is a view for explaining the second embodiment of the present invention, corresponding to Fig. 4; In FIG. 5, the same components as those shown in FIG. 4 are denoted by the same reference numerals, and the description thereof will be omitted.

In the second embodiment, the first outer conductive layer 24 and the second outer conductive layer 25 are further formed on the copper plating film 20.

The first outer conductive layer 24 is composed of a plating film selected from the group consisting of a group consisting of Cu and Ni or an alloy containing the metal. The first outer conductive layer 24 functions as a solder barrier layer that prevents the copper plating film 20 from being eroded by solder, for example, when solder is mounted. Further, when the first outer conductive layer 24 is made of Cu, the copper plating film 20 is also made of Cu. Therefore, the first outer conductive layer 24 functions as a solder barrier layer by increasing the thickness of the Cu film.

The second outer conductive layer 25 is composed of a plating film selected from the group consisting of Sn, Pb, Au, Ag, Pd, Bi, and Zn, or a plating film containing an alloy of the metal. The material constituting the second outer conductive layer 25 is, for example, solder for solder mounting, conductive adhesive for mounting a conductive adhesive, Au during wire bonding, and the like, and solder and conductivity are considered depending on the mounting form. The compatibility of the agent, Au, etc. is appropriately selected.

Fig. 6 is a view for explaining the third embodiment of the present invention, corresponding to Fig. 4; In FIG. 6, the same components as those shown in FIG. 4 are denoted by the same reference numerals, and the description thereof will be omitted.

In the third embodiment, the outer conductive layer 28 is further formed on the copper plating film 20. The outer conductive layer 28 is composed of a plating film selected from the group consisting of Au, Ag, and Pd, or a plating film containing an alloy of the metal. When it is not necessary to correspond to the solder mounting, the third embodiment is effectively applied to, for example, the case where the conductive adhesive is mounted or the wire bonding is specialized. According to the third embodiment, for example, the number of layers of the external terminal electrodes 9 and 10 can be reduced as compared with the second embodiment.

Fig. 7 is a view for explaining a fourth embodiment of the present invention, corresponding to Fig. 4; In FIG. 7, the same components as those shown in FIG. 4 are denoted by the same reference numerals, and the description thereof will be omitted.

In the fourth embodiment, the first outer conductive layer 31 and the second outer conductive layer 32 are further formed on the copper plating film 20. The first outer conductive layer 31 is made of a conductive resin containing a thermosetting resin and a metal filler. The second outer conductive layer 32 is composed of a plating film selected from the group consisting of Cu, Ni, Sn, Pb, Au, Ag, Pd, Bi, and Zn, or a plating film containing an alloy of the metal.

According to the fourth embodiment, when external stress is applied to the laminated ceramic capacitor 1, the resin component contained in the first outer conductive layer 31 absorbs stress, or the first outer conductive layer 31 and the second outer conductive layer 32 The peeling is caused as a fail safe function, so that the suppression stress is directly applied to the ceramic body 2, and as a result, cracks are generated on the ceramic body 2.

8 and 9 are for explaining a fifth embodiment of the present invention, FIG. 8 corresponds to FIG. 2, and FIG. 9 corresponds to FIG. In FIGS. 8 and 9, the components that are the same as those in the components shown in FIGS. 2 and 3 are denoted by the same reference numerals, and the description thereof will not be repeated.

In the fifth embodiment, the dummy internal conductors 35 and 36 which do not substantially contribute to the electrical characteristics are formed inside the ceramic body 2. In this embodiment, the dummy inner conductors 35 and 36 are classified into an inner layer dummy inner conductor 35 formed on the same surface as the first or second inner electrode 12 or 13, and the first and second inner portions. The outer layer dummy inner conductor 36 is formed on a different surface of either of the electrodes 12 and 13.

The dummy inner conductors 35 and 36 are the same as the internal electrodes 12 and 13, and have exposed portions on the end faces 7 and 8 of the ceramic body 2, and the exposed portions are also provided by the first or second external terminal electrodes 9 or 10. It is covered and connected to the copper plating film 20 (refer to FIG. 4). It is preferable that the metal contained in the dummy inner conductors 35 and 36 be reacted with Cu contained in the copper plating film 20. Thereby, the fixing force of the external terminal electrodes 9 and 10 to the ceramic element body 2 can be further improved. Further, the dummy inner conductors 35 and 36 preferably contain the same metal as the inner electrodes 12 and 13, and for example, Ni, Cu, or the like can be used as the metal contained in the dummy inner conductors 35 and 36.

As shown in FIG. 9, the dummy inner conductors 35 and 36 are preferably formed to have the same width as the lead portions 17 and 19 of the internal electrodes 12 and 13. Further, the pattern of the two outer dummy inner conductors 36 shown in FIG. 9(1) is the same as that provided by the first inner electrode 12 and the inner dummy inner conductor 35 shown in FIG. 9(2). The pattern provided by the second inner electrode 13 and the inner dummy inner conductor 35 shown in Fig. 9 (3) is the same as the pattern provided by the two outer dummy inner conductors 36 shown in Fig. 9 (4). Therefore, it is possible to achieve the commonality of the manufacturing steps between the two.

10 and 11 are views for explaining the sixth embodiment of the present invention. Here, Fig. 10 is a view corresponding to Fig. 2. Fig. 11 is a perspective view showing a state of the ceramic body 2 before the external terminal electrodes 9 and 10 are formed. In FIGS. 10 and 11, the same components as those shown in FIGS. 1 and 2 are denoted by the same reference numerals, and the description thereof will not be repeated.

In the sixth embodiment, a region other than the exposed portions 14 and 15 of the internal electrodes 12 and 13 on the outer surface of the ceramic element body 2, and the external terminal electrodes 9 and 10 and the ceramic body 2 are formed with assistance. Conductor 39. More specifically, the auxiliary conductor 39 is formed at both end portions of the first and second main faces 3 and 4 of the ceramic body 2 in the longitudinal direction.

The copper plating film 20 (see FIG. 4) of the external terminal electrodes 9 and 10 is formed by plating, and therefore has a tendency to be formed on regions other than the exposed portions 14 and 15 of the internal electrodes 12 and 13, but by formation The auxiliary conductor 39 can easily extend the formation region of the copper plating film 20. Thereby, the deposition region of the copper oxide 21 can be easily expanded, and the adhesion of the copper plating film 20 to the ceramic body 2 can be easily improved.

The auxiliary conductor 39 preferably contains glass. As the glass, those containing B and Si such as borosilicate glass can be used. In the glass, an auxiliary component such as Ba, Al or Cu may be contained. Further, regarding the state of the glass, for example, the composition can be confirmed by mapping analysis using a wavelength dispersion type micro analyzer (WDX).

The auxiliary conductor 39 can be formed by, for example, laminating a ceramic green sheet formed with a conductive paste film which can serve as the auxiliary conductor 39 in the uppermost layer and the lowermost layer of the ceramic body 2 in an unprocessed state, and ceramics The body 2 is simultaneously calcined. Alternatively, it may be formed by printing a conductive paste on the first and second main faces 3 and 4 of the ceramic body 2 after firing and baking it. In these cases, a conductive paste is used, but only the main surfaces 3 and 4 are provided. Therefore, the thickness of the auxiliary conductor 39 can be 10 μm or less, and even if the thickness of the external terminal electrodes 9 and 10 is included, the thickness can be suppressed to 30 μm or less. The thickness.

Further, after the auxiliary conductor 39 is formed, it is preferable to impart an arc to the end portion of the auxiliary conductor 39 by performing a polishing process such as barrel polishing.

12 to 14 are views for explaining the seventh embodiment of the present invention. The seventh embodiment is a modification of the sixth embodiment, and Figs. 12 and 13 correspond to Figs. 10 and 11, respectively. In FIGS. 12 to 14, the same components as those shown in FIGS. 10 and 11 are denoted by the same reference numerals, and the description thereof will not be repeated.

In the seventh embodiment, the auxiliary conductor 42 is formed in the same manner as in the sixth embodiment. More specifically, the auxiliary conductor 42 is formed on both end portions of the first and second main faces 3 and 4 of the ceramic body 2 in the longitudinal direction, and in the longitudinal direction of each of the first and second side faces 5 and 6 Both end portions and the outer peripheral edge portions of the first and second end faces 7 and 8 are provided.

Fig. 14 is a cross-sectional view showing a preferred method of forming the above-described auxiliary conductor 42.

First, as shown in Fig. 14 (1), the ceramic body 2 is prepared, and a flat plate 45 on which the paste layer 44 composed of the conductive paste 43 is formed is prepared.

Then, as shown in Fig. 14 (2), the first end face 7 of the ceramic body 2 is immersed in the paste layer 44, and then the ceramic body 2 is taken out as shown in Fig. 14 (3). At this time, the conductive paste 43 is adhered to the first end face 7.

Next, as shown in Fig. 14 (4), a flat plate 46 on which no paste layer is formed is prepared.

Then, as shown in FIG. 14 (5), the first end surface 7 is pressed against the flat plate 46, and the conductive paste 43 adhered to the central portion of the first end surface 7 is extruded toward the outer peripheral edge portion of the first end surface 7. Then, as shown in Fig. 14 (6), when the ceramic body 2 is taken out, the conductive paste 43 is not adhered or hardly adhered to the central portion of the first end face 7.

The same procedure is also applied to the second end face 8 of the ceramic body 2.

Then, the conductive paste 43 is baked, whereby the auxiliary conductor 42 is formed in a state as shown in FIG. Further, in the steps shown in FIGS. 14(5) and (6), the conductive paste 43 may remain on the central portions of the end faces 7 and 8, but in the above case, the auxiliary conductor is formed. After 42, the exposed portions 14 and 15 of the internal electrodes 12 and 13 can be well exposed by polishing treatment such as barrel polishing.

The auxiliary conductor 42 of the seventh embodiment has the same operational effects as the auxiliary conductor 39 of the sixth embodiment. However, since the auxiliary conductors 42 of the seventh embodiment are formed on the first and second side faces 5 and 6 of the ceramic body 2, the external terminal electrodes 9 can be easily formed on the first and second side faces 5 and 6 and 10 copper plating film 20 (refer to FIG. 4). Therefore, it is easy to rewind the deposition region of the copper oxide 21 to the first and second side faces 5 and 6, and the fixing force of the external terminal electrodes 9 and 10 can be easily improved. Further, since the auxiliary conductors 42 are formed so as to extend to the first and second side faces 5 and 6, it is not necessary to particularly form the dummy inner conductors 36, for example, in the fifth embodiment.

Further, in the case of the seventh embodiment, the remaining portion of the conductive paste 43 can be removed or the like to suppress the thickness thereof. Therefore, even if the external terminal electrodes 9 and 10 are included, the thickness can be suppressed to 30 μm or less.

15 and 16 are diagrams for explaining an eighth embodiment of the present invention. Figure 15 corresponds to Figure 2. In FIG. 15, the same components as those shown in FIG. 2 are denoted by the same reference numerals, and the description thereof will be omitted.

In the eighth embodiment, the first external terminal electrode 9 is formed only on the first end face 7, and the second external terminal electrode 10 is formed only on the second end face 8. Therefore, even if the plating film is deposited by using the exposed portions 14 and 15 of the internal electrodes 12 and 13 in the end faces 7 and 8 of the ceramic body 2 as a core, the plating film is grown. The external terminal electrodes 9 and 10 can be formed in a relatively short period of time by connecting the exposed portions 14 and 15 of the adjacent internal electrodes 12 and 13 to each other.

In the eighth embodiment, the first and second main faces 3 and 4 and the first end faces 7 of the first and second side faces 5 and 6 are formed on only the first outer portion. A first end edge conductor 49 electrically connected to the first external terminal electrode 9 on the outer periphery of the terminal electrode 9. Similarly, on the outer peripheral edges of the first and second main terminals 3 and 4 and the second end faces 8 of the first and second side faces 5 and 6, only the outer periphery of the second external terminal electrode 10 is formed. The second end edge conductor 50 electrically connected to the second external terminal electrode 10.

Similarly to the above-described auxiliary conductor 39 or 42, the first and second end edge conductors 49 and 50 preferably contain glass and are formed by, for example, imparting and baking of a conductive paste. The baking of the conductive paste can be performed simultaneously with the calcination of the ceramic body 2, or after the calcination of the ceramic body 2.

According to the eighth embodiment, each of the first and second main faces 3 and 4 of the ceramic body 2 and the first and second side faces 5 and 6 are adjacent to the first and second end faces 7 and 8 The first and second end edge conductors 49 and 50 are formed to be electrically connected to the outer periphery of the first and second external terminal electrodes 9 and 10 at the end portion, so that the bonding at the time of mounting by soldering can be improved. Sex. Further, since the penetration of moisture from the periphery of the ceramic terminal body 2 from the periphery of the external terminal electrodes 9 and 10 is suppressed as compared with the case where the edge conductors 49 and 50 are not formed, the reliability of the laminated ceramic capacitor 1 can be improved. Sex.

In the eighth embodiment, it is preferable that the outer plating film 51 is further formed on the first external terminal electrode 9 and the first end edge conductor 49, and on the second external terminal electrode 10 and the second end. On the edge conductor 50, an outer plating film 52 is further formed. In the outer plating films 51 and 52, by using a metal having good solder wettability, it is possible to surely improve the bonding reliability when the laminated ceramic capacitor 1 is mounted by soldering. Examples of the metal having good solder wettability include Sn, Au, and the like.

In addition, the outer plating films 51 and 52 are not limited to the one-layer structure, and may be, for example, a two-layer structure in which a nickel plating layer is used as a bottom layer, and a tin plating layer or the like is formed thereon, or three or more layers may be used. Construction.

Fig. 16 is a cross-sectional view showing a preferred method of forming the edge conductors 49 and 50. Figure 16 corresponds to Figure 14. In FIG. 16, the same components as those shown in FIG. 14 are denoted by the same reference numerals, and the description thereof will be omitted.

First, as shown in Fig. 16 (1), the ceramic element body 2 in which the external terminal electrodes 9 and 10 are formed in advance is prepared, and a flat plate 45 on which the paste layer 44 composed of the conductive paste 43 is formed is prepared.

Then, as shown in Fig. 16 (2), the first end face 7 of the ceramic body 2 and the first external terminal electrode 9 are immersed in the paste layer 44, and then the ceramic element is taken out as shown in Fig. 16 (3). Body 2. At this time, the conductive paste 43 is adhered so as to cover the first end face 7 on which the first external terminal electrode 9 is formed.

Next, as shown in Fig. 16 (4), a flat plate 46 on which no paste layer is formed is prepared.

Then, as shown in Fig. 16 (5), the first external terminal electrode 9 on the first end face 7 is pressed against the flat plate 46, and the conductive paste 43 adhered to the first external terminal electrode 9 faces the first external terminal electrode. 9 outside the peripheral part of the extrusion. Then, as shown in Fig. 16 (6), when the ceramic element body 2 is taken out, the portion other than the peripheral portion other than the first external terminal electrode 9 is in a state in which the conductive paste 43 is not adhered or hardly adhered.

The same step is also performed for the second end face 8 of the second external terminal electrode 10 in which the ceramic body 2 is formed.

Then, the conductive paste 43 is baked, whereby the edge conductors 49 and 50 are formed in a state as shown in FIG.

17 and 18 are views for explaining a ninth embodiment of the present invention. Here, Fig. 17 is a perspective view showing a laminated ceramic capacitor array 101 as an example of a laminated ceramic electronic component.

The laminated ceramic capacitor array 101 is provided with a ceramic body 102. The ceramic body body 102 has a rectangular parallelepiped shape, and has first and second main faces 103 and 104 facing each other, and a first side face 105 and a second side face 106 that connect the first and second main faces 103 and 104 to each other. The third side 107 and the fourth side 108 are provided.

Fig. 18 is a plan view showing the internal structure of the ceramic body 102, and (1) and (2) of Fig. 18 show different cross sections. The ceramic body 102 has a structure in which a plurality of ceramic layers 109 are laminated. The first and second internal electrodes 110 are formed in the ceramic body 102 so as to be alternately arranged in the stacking direction and alternate in the main surface direction in the ceramic body 102. 111. In this embodiment, the two first inner electrodes 110 and the two second inner electrodes 111 are alternately arranged in the main surface direction. The first inner electrode 110 has an exposed portion 112 on the first side surface 105, and the second inner electrode 111 has an exposed portion 113 on the second side surface 106.

As shown in FIG. 17, four first external terminal electrodes 114 and four second external terminal electrodes 115 are formed on the first and second side faces 105 and 106 of the ceramic body 102, respectively. The exposed portion 112 of the first internal electrode 110 is covered by the first external terminal electrode 114 and electrically connected to the first external terminal electrode 114. The exposed portion 113 of the second internal electrode 111 is covered by the second external terminal electrode 115 and electrically connected to the second external terminal electrode 115.

The first and second external terminal electrodes 114 and 115 of the laminated ceramic capacitor array 101 are not shown, but the structure and formation of the external terminal electrode 9 described with reference to FIG. 4, FIG. 5, FIG. 6, or FIG. The method is also applicable.

In the multi-terminal type laminated ceramic electronic component such as the capacitor array 101 of the ninth embodiment, it is necessary to ensure the distance between adjacent external terminal electrodes to some extent to prevent solder bridging, but for coating with a conductive paste. In the cloth method, it is difficult to apply the conductive paste with high precision, and therefore it is necessary to ensure that the distance between the exposed internal electrodes is slightly wide, and as a result, it is prevented from being downsized. On the other hand, according to the present invention, since direct plating is used to form the external terminal electrode, the distance between the exposed internal electrodes can be suppressed to a minimum, and the size of the laminated ceramic electronic component can be further reduced.

Further, in the ninth embodiment, the eight terminals, that is, the exposed portions 112 and 113 of the internal electrodes 110 and 111 are formed in a total of eight rows. However, as long as at least four rows are formed, the external terminal electrodes may correspond to each other. It is sufficient to form at least 4 lines in the manner of the trip.

19 to 21 are views for explaining the tenth embodiment of the present invention. Here, FIG. 19 and FIG. 20 are diagrams corresponding to FIGS. 17 and 18, respectively. 21 is a view showing the first and second main faces 103 and 104 of the ceramic body 102 before the external terminal electrodes 114 and 115 are formed. In FIGS. 19 to 21, the same components as those shown in FIGS. 17 and 18 are denoted by the same reference numerals, and the description thereof will not be repeated.

The tenth embodiment is characterized in that, as shown in FIG. 20, the inner layer dummy inner conductor 116 formed on the same surface as the first or second inner electrode 110 or 111 and the inner electrodes 110 and 111 are provided. The outer layer dummy inner conductor 117 is formed on the outer surface of the ceramic body 102, and the auxiliary conductor 118 formed on the first and second main surfaces 103 and 104 of the ceramic body 102 is provided as shown in FIG.

The dummy inner conductors 116 and 117 have the same operational effects as the dummy inner conductors 35 and 36 of the fifth embodiment, and the auxiliary conductor 118 exhibits the same operational effects as the auxiliary conductor 39 of the sixth embodiment. Therefore, according to the ninth embodiment, the fixing force of the first and second external terminal electrodes 114 and 115 with respect to the ceramic body 102 can be further improved, and the first and second portions can be easily obtained. The formation regions of the external terminal electrodes 114 and 115 are extended to the main faces 103 and 104.

Further, in the tenth embodiment, the dummy inner conductors 116 and 117 may be omitted or the auxiliary conductor 118 may be omitted.

22 and 23 are views for explaining the eleventh embodiment of the present invention. Here, FIG. 22 is a perspective view showing a multi-terminal type low ESL laminated ceramic capacitor 151 as an example of a laminated ceramic electronic component.

The low ESL laminated ceramic capacitor 151 is provided with a ceramic body 152. The ceramic body 152 has a rectangular parallelepiped shape, and has first and second main faces 153 and 154 opposed to each other, and first to fourth side faces 155 to 158 that connect the first and second main faces 153 and 154. .

Fig. 23 is a plan view showing the internal shape of the ceramic body 152, and (1) and (2) of Fig. 23 show different cross sections.

The ceramic body 152 has a structure in which a plurality of ceramic layers 159 are laminated. Inside the ceramic element body 152, a plurality of first and second internal electrodes 160 and 161 are alternately formed in the stacking direction with a specific ceramic layer 159 interposed therebetween.

The first internal electrode 160 has a first capacitor portion 162 that faces the second internal electrode 161, and a plurality of first lead portions 163 that are led out from the first capacitor portion 162 to the first or second side surface 155 or 156, and are led out at the first one. An exposed portion 164 exposed to the first or second side surface 155 or 156 is formed at an end portion of the portion 163.

The second internal electrode 161 includes a second capacitor portion 165 that faces the first internal electrode 160 and a plurality of second lead portions 166 that are led out from the second capacitor portion 165 to the first or second side surface 155 or 156. The exposed portion 167 exposed to the first or second side surface 155 or 156 is formed at the end portion of the lead portion 166.

The first and second external terminal electrodes 168 and 169 of the plurality of arrays are alternately arranged on the first and second side faces 155 and 156 of the ceramic body 152. The exposed portion 164 of the first internal electrode 160 is covered by the first external terminal electrode 168 and electrically connected to the first external terminal electrode 168. The exposed portion 167 of the second internal electrode 161 is covered by the second external terminal electrode 169 and electrically connected to the second external terminal electrode 169.

The structure and formation method of the external terminal electrode 9 described with reference to FIG. 4, FIG. 5, FIG. 6, or FIG. 7 are also applicable to the first and second external terminal electrodes 168 and 169 of the eleventh embodiment.

24 to 26 are views for explaining the twelfth embodiment of the present invention. Here, Fig. 24 is a view corresponding to Fig. 22, and Fig. 25 is a view corresponding to Fig. 23. Fig. 26 is a view showing the first and second main faces 153 and 154 of the ceramic body 152. In FIGS. 24 to 26, the same components as those shown in FIGS. 22 and 23 are denoted by the same reference numerals, and the description thereof will not be repeated.

The relationship between the twelfth embodiment and the eleventh embodiment is the same as that of the tenth embodiment with respect to the ninth embodiment. In other words, the twelfth embodiment is characterized in that, as shown in FIG. 25, the inner layer dummy inner conductor 170 formed on the same surface as the first or second inner electrode 160 or 161 and the inner electrode 160 and The outer layer dummy inner conductor 171 is formed on the different surface of the 161, and the auxiliary conductor 172 formed on the first and second main faces 153 and 154 of the ceramic body 152 is provided as shown in FIG. .

The dummy inner conductors 170 and 171 have the same operational effects as the dummy inner conductors 35 and 36 of the fifth embodiment, and the auxiliary conductor 172 exhibits the same operational effects as the auxiliary conductor 39 of the sixth embodiment. Therefore, according to the twelfth embodiment, the fixing force of the first and second external terminal electrodes 168 and 169 with respect to the ceramic element body 152 can be further improved, and the first and second portions can be easily obtained. The formation regions of the external terminal electrodes 168 and 169 are extended to the first and second main faces 153 and 154.

Further, in the twelfth embodiment, the dummy inner conductors 170 and 171 may be omitted or the auxiliary conductor 172 may be omitted.

27 and 28 are views for explaining the thirteenth embodiment of the present invention. Here, Fig. 27 is a perspective view showing a laminated ceramic inductor 201 as an example of a laminated ceramic electronic component.

The laminated ceramic inductor 201 is provided with a ceramic body 202. The ceramic body 202 has a rectangular parallelepiped shape, and has first and second main faces 203 and 204 opposed to each other, and four side faces 205 to 208 that connect the first and second main faces 203 and 204. In the following description, in the four side faces 205 to 208, the side faces 205 and 206 extending in the longitudinal direction of the main faces 203 and 204 are referred to as first and second side faces, respectively, and are extended in the short side direction. The side faces 207 and 208 are referred to as first and second end faces, respectively.

First and second external terminal electrodes 209 and 210 are formed on the first and second end faces 207 and 208 of the ceramic body 202, respectively.

FIG. 28 is a perspective view showing the ceramic element body 202 included in the laminated ceramic inductor 201 in an exploded manner.

The ceramic body 202 has a structure in which a plurality of ceramic layers 211 are laminated. Inside the ceramic body 202, a first inner conductor 213 having an exposed portion 212 on the first end surface 207 and a second inner conductor 215 having an exposed portion 214 on the second end surface 208 and being ceramic The layer 211 is disposed at a position different from the first inner conductor 213 in the stacking direction. The exposed portion 212 of the first inner conductor 213 is covered by the first external terminal electrode 209 and electrically connected to the first external terminal electrode 209. The exposed portion 214 of the second inner conductor 215 is covered by the second external terminal electrode 210 and electrically connected to the second external terminal electrode 210.

Further, inside the ceramic body 202, a coil conductor 216 which is extended in a coil shape to electrically connect the first inner conductor 213 and the second inner conductor 215 is formed. The coil conductor 216 is composed of a plurality of wire conductors 217 extending over a specific ceramic layer 211 and a plurality of via conductors 218 extending through a specific ceramic layer 211 in the thickness direction, and is stereoscopically inside the ceramic body 202. extend.

Further, the laminated ceramic inductor 201 has a plurality of dummy internal conductors 219 that do not contribute substantially to the performance of electrical characteristics. The dummy inner conductor 219 has an exposed portion adjacent to the exposed portion 212 or 214 of the first or second inner conductor 213 or 215, and functions to cause the first and second external terminal electrodes 209 and 210 to be opposed to the ceramic body. The fixing power of 202 is further improved.

Although the present invention has been described above in connection with the embodiments shown in the drawings, the present invention is also applicable to other laminated ceramic electronic components such as laminated piezoelectric electronic components or laminated thermistors.

Next, an experimental example performed to confirm the effects of the present invention will be described. In this experimental example, a laminated ceramic capacitor was produced and evaluated according to the second embodiment.

First, a ceramic body for producing a laminated ceramic capacitor having the specifications shown in Table 1 below was prepared.

Then. In order to form an external terminal electrode on the ceramic body, an electroplating bath as shown in Table 2 below was used, and a horizontal rotating drum was applied under the plating conditions as shown in Table 3, thereby performing copper plating and thick copper plating. A copper plating film having a thickness of about 10 μm was formed.

Then, the ceramic body was subjected to heat treatment under each of the conditions shown in Table 4 below.

Thereafter, while using the plating bath shown in Table 2 as disclosed above, a horizontal rotating drum was applied under the plating conditions as shown in Table 3, whereby nickel plating and tin plating were sequentially performed to form a thickness on the copper plating film. A nickel plating film of about 4 μm, and a tin plating film having a thickness of about 4 μm were formed thereon, and samples of respective samples 1 to 13 were obtained.

Next, with respect to each sample thus obtained, first, the fixing force of the external terminal electrode was evaluated in the following manner. The evaluation of the fixing force of the external terminal electrode is performed by causing shear damage to the sample. That is, the laminated ceramic capacitor of each sample was mounted on the substrate by soldering, and a load was applied in parallel directions to the two external terminal electrodes at a load speed of 0.5 mm/sec until breakage occurred, and the failure mode at the time of destruction was observed. In Table 5 below, the areas where the damage occurred in each sample were shown. Further, in Table 5, in each of the ten samples, the number of samples which were broken between the copper plating film and the ceramic body, that is, the number of samples in which electrode peeling occurred, was displayed as [non-performing rate].

Further, a moisture resistance reliability test was carried out. After applying a voltage of 3.2 V to each sample for 72 hours in an environment of 125 ° C and 95% RH, the sample having an insulation resistance of 1 MΩ or less was judged to be defective. In Table 5, the bad samples of each of the 20 samples were determined. The number is shown as [moisture resistance failure rate].

As shown in Table 5, in Samples 1 to 8 and 11, damage occurred between the copper plating film and the ceramic body, and the moisture resistance reliability was poor. On the other hand, in the samples 9, 10, 12, and 13, the ceramic body was used. The inside is broken and the moisture resistance reliability is also excellent. From this, it can be seen that, as in the samples 9, 10, 12 and 13, the heat treatment is performed at a temperature of 1065 ° C or higher in an oxygen atmosphere of 50 ppm or more, whereby the external terminal electrode can have sufficient strength and resistance with respect to the ceramic body. Wet and fixed.

1. . . Laminated ceramic capacitor

2, 102, 152, 202. . . Ceramic body

3, 4, 103, 104, 153, 154, 203, 204. . . Main face

5~8, 105~108, 155~158, 205~208. . . side

9, 10, 114, 115, 168, 169, 209, 210. . . External terminal electrode

11, 109, 159, 211. . . Ceramic layer

12, 13, 110, 111, 160, 161. . . Internal electrode (internal conductor)

14, 15, 112, 113, 164, 167, 212, 214. . . Exposed part

20. . . Copper coating

twenty one. . . Copper oxide

35, 36, 116, 117, 170, 171, 219. . . Dummy internal conductor

Fig. 1 is a perspective view showing the appearance of a laminated ceramic capacitor 1 according to the first embodiment of the present invention.

Figure 2 is a cross-sectional view taken along line A-A of Figure 1.

3(1) and (2) are plan views showing the internal structure of the ceramic element body 2 included in the laminated ceramic capacitor 1 shown in Fig. 1.

Fig. 4 is a cross-sectional view showing a portion of Fig. 2 in an enlarged manner.

Fig. 5 is a view for explaining the second embodiment of the present invention, corresponding to Fig. 4;

Fig. 6 is a view for explaining the third embodiment of the present invention, corresponding to Fig. 4;

Fig. 7 is a view for explaining a fourth embodiment of the present invention, corresponding to Fig. 4;

Fig. 8 is a view for explaining the fifth embodiment of the present invention, corresponding to Fig. 2;

9(1) to (4) are views for explaining the fifth embodiment of the present invention, which corresponds to Fig. 3.

Fig. 10 is a view for explaining the sixth embodiment of the present invention, corresponding to Fig. 2;

FIG. 11 is a perspective view showing a state in which the ceramic element body 2 before the external terminal electrodes 9 and 10 are formed, for explaining the sixth embodiment of the present invention.

Fig. 12 is a view for explaining the seventh embodiment of the present invention, corresponding to Fig. 10.

Fig. 13 is a view for explaining the seventh embodiment of the present invention, corresponding to Fig. 11;

14(1) to 6(6) are cross-sectional views showing a preferred embodiment of the auxiliary conductor 42 shown in Fig. 13 for explaining the seventh embodiment of the present invention.

Fig. 15 is a view for explaining the eighth embodiment of the present invention, corresponding to Fig. 2;

16(1) to 6(6) are cross-sectional views showing a preferred embodiment of the edge conductors 49 and 50 shown in Fig. 15 for explaining the eighth embodiment of the present invention.

Fig. 17 is a perspective view showing the appearance of a laminated ceramic capacitor array 101 according to a ninth embodiment of the present invention.

18(1) and (2) are plan views showing the internal structure of the ceramic element body 102 included in the laminated ceramic capacitor array 101 shown in Fig. 17.

Fig. 19 is a view for explaining the tenth embodiment of the present invention, corresponding to Fig. 17.

20(1) to (4) are views for explaining the tenth embodiment of the present invention, which corresponds to Fig. 18.

21(1) and (2) are for explaining the tenth embodiment of the present invention, and the first and second main faces 103 of the ceramic body 102 before forming the external terminal electrodes 114 and 115, and 104 diagram.

Fig. 22 is a perspective view showing the appearance of a multi-terminal type low ESL laminated ceramic capacitor 151 according to the eleventh embodiment of the present invention.

23(1) and (2) are plan views showing the internal structure of the ceramic element body 152 provided in the laminated ceramic capacitor 151 shown in Fig. 22.

Fig. 24 is a view for explaining a 12th embodiment of the present invention, corresponding to Fig. 22;

25(1) to (4) are views for explaining the 12th embodiment of the present invention, which corresponds to Fig. 23.

26(1) and (2) are for explaining the twelfth embodiment of the present invention, and the first and second main faces 153 of the ceramic body 152 before forming the external terminal electrodes 168 and 169, respectively. 154 diagram.

Fig. 27 is a perspective view showing the appearance of a laminated ceramic inductor 201 according to a thirteenth embodiment of the present invention.

28(1) to (7) are perspective views showing the ceramic element body 202 included in the laminated ceramic inductor 201 shown in Fig. 27 in an exploded manner.

1. . . Laminated ceramic capacitor

2. . . Ceramic body

7. . . First end face

9. . . External terminal electrode

11. . . Ceramic layer

12. . . Internal electrode (internal conductor)

14. . . Exposed part

20. . . Copper coating

twenty one. . . Copper oxide

Claims (13)

A laminated ceramic electronic component comprising: a ceramic body formed by laminating a plurality of ceramic layers; an inner conductor formed inside the ceramic body and having an exposed portion on a surface of the ceramic body And an external terminal electrode formed on the outer surface of the ceramic body and covering the exposed portion of the inner conductor; the external terminal electrode includes a copper plating film directly covering the exposed portion of the inner conductor, and the copper is Inside the plating film, at least on the interface side of the copper plating film and the ceramic body, copper oxide is present in a discontinuous manner, the copper oxide contains Cu ₂ O and CuO, and the Cu ₂ O is in the ceramic body and The above copper plating films are diffusion bonded. The laminated ceramic electronic component of claim 1, wherein the copper oxide is present in a spherical shape. The laminated ceramic electronic component of claim 1, wherein among the copper oxides, Cu ₂ O accounts for 90% by weight or more. A laminated ceramic electronic component according to claim 1 or 2, wherein said inner conductor contains a dummy inner conductor that does not substantially contribute to the appearance of electrical characteristics. The laminated ceramic electronic component according to claim 1 or 2, wherein an auxiliary conductor is formed between a region other than the exposed portion of the inner conductor on the outer surface of the ceramic body and between the external terminal electrode and the ceramic body. A laminated ceramic electronic component according to claim 5, wherein said auxiliary conductor comprises glass. The laminated ceramic electronic component of claim 1 or 2, wherein said exposed portion of said inner conductor is formed on at least four rows on said outer surface of said ceramic body, said external terminal electrode being associated with said inner conductor At least four of the above-mentioned exposed portions are formed in a corresponding manner. The laminated ceramic electronic component according to claim 1 or 2, wherein the ceramic body has four first side faces facing each other and four side faces connecting the first and second main faces, wherein the external terminal electrode includes The first and second external terminal electrodes are formed at the first and second positions different from each other on the side surface. The laminated ceramic electronic component according to claim 8, wherein the inner conductor includes: a first internal electrode having an exposed portion at the first position on the side surface, and electrically connected to the first external terminal electrode; The internal electrode has an exposed portion at the second position on the side surface and is electrically connected to the second external terminal electrode, and the first and second internal electrodes are opposed to each other via a specific ceramic layer. The laminated ceramic electronic component according to claim 8, wherein the inner conductor includes: a first inner conductor having an exposed portion at the first position on the side surface; and a second inner conductor having the first inner conductor The second position has an exposed portion, and is disposed at a position different from the first inner conductor in a stacking direction of the ceramic layer, and the laminated ceramic electronic component includes a coil conductor extending in a coil shape to connect the first inner portion The conductor is electrically connected to the second inner conductor. A laminated ceramic electronic component according to claim 8, wherein the above four sides comprise The first and second side faces facing each other and the third and fourth side faces facing each other, wherein the first external terminal electrode is formed only on the third side surface, and the second external terminal electrode is formed only on the fourth side surface Furthermore, the method further includes: a first end edge conductor formed on each of the first and second main faces, and each of the first and second side faces, and only on the outer periphery of the first external terminal electrode The first external terminal electrode is electrically connected; and the second edge conductor is formed on each of the first and second main faces and each of the first and second side faces, and only the second external terminal electrode The outer peripheral edge is electrically connected to the second external terminal electrode. A method for manufacturing a laminated ceramic electronic component, comprising the steps of: preparing a ceramic body, which is formed by laminating a plurality of ceramic layers, having an inner conductor inside, and having a portion of the inner conductor exposed on the outer surface An exposed portion; a plating treatment is performed on the ceramic body to directly deposit a copper plating film on the exposed portion of the inner conductor; and the ceramic body is heat-treated to form a Cu liquid phase and O between the copper plating film and the ceramic body The liquid phase and the Cu solid phase; and the mixed phase formed by the cooling, the copper oxide is formed discontinuously on the interface side between the copper plating film and the ceramic body. The method for producing a laminated ceramic electronic component according to claim 12, wherein the heat treatment is carried out under the conditions of a temperature of 1065 ° C or more and an oxygen concentration of 50 ppm or more.