JP6357640B2 - Laminated parts - Google Patents

Description

  The present invention relates to a multilayer component such as a common mode noise filter used in various electronic devices such as digital devices, AV devices, and information communication terminals.

  As shown in FIG. 8, this type of conventional multilayer component is connected to the multilayer body 1, two internal conductors 2 and 3 formed inside the multilayer body 1 and facing each other, and the internal conductors 2 and 3, respectively. And the external conductor 4 connected to the lead conductors 2a and 3a. The external electrode 4 is formed by printing a silver paste. It was configured in a U shape so as to be continuous with the upper surface, end surface, and lower surface.

  As prior art document information relating to the invention of this application, for example, Patent Document 1 is known.

JP 2012-40860 A

  In the conventional laminated component described above, if the thickness of the external electrode 4 is reduced and the area of the external electrode 4 is reduced, the adhesion between the laminated body 1 and the external electrode 4 is reduced, so that the electrode strength is reduced. However, there is a problem that mounting failure may occur.

  The present invention solves the above-described conventional problems, and an object of the present invention is to provide a laminated component capable of preventing electrode peeling and mounting failure.

In order to achieve the above object, the present invention comprises an internal conductor, a multilayer body including the internal conductor, and an external electrode provided on at least an end surface of the multilayer body and connected to the internal conductor, The external electrode is formed by firing a conductive paste, a metal layer is provided on at least one of the upper surface and the lower surface of the laminate, and the same metal as the main component of the external electrode is included in the metal layer. Further, the external electrode is connected to the metal layer, and the external electrode covers the entire surface of the metal layer , and by this configuration, the external electrode is baked with a conductive paste. In the process of forming, the bonding with the metal layer increases the adhesion between the external electrode and the metal layer, thereby improving the electrode strength, and as a result, preventing electrode peeling and mounting defects. It is those having an iodine effect.

  As described above, in the multilayer component of the present invention, the metal layer is provided on at least one of the upper surface and the lower surface of the multilayer body, and the same metal as the main component of the external electrode is contained in the metal layer. As a result, the adhesion strength between the laminate and the external electrode is increased, which can improve the electrode strength, and thus has an excellent effect of preventing electrode peeling and mounting defects. .

Cross-sectional transmission diagram of the laminated component in Embodiment 1 of the present invention Perspective view of the same laminated component Exploded perspective view of the same laminated component Cross-sectional transmission diagram of another example of the same laminated component Cross-sectional transmission diagram of the same laminated part The figure which shows the manufacturing method of the same laminated parts Cross-sectional transmission diagram of laminated component in Embodiment 2 of the present invention Cross-sectional transmission diagram of conventional laminated parts

(Embodiment 1)
1 is a cross-sectional transparent view of a common mode noise filter that is an example of a multilayer component according to Embodiment 1 of the present invention, FIG. 2 is a perspective view of the common mode noise filter, and FIG. 3 is an exploded perspective view of the common mode noise filter. It is.

  As shown in FIGS. 1, 2, and 3, the common mode noise filter according to the first embodiment of the present invention includes first and second inner conductors 11 and 12, and first and second inner conductors 11, 12, an external electrode 14 integrally provided on the upper surface, end surface, and lower surface of the multilayer body 13 and connected to the first and second inner conductors 11, 12, And a metal layer 15 exposed on at least one of the upper surface and the lower surface. Note that FIG. 1 is partially transparent so that the positional relationship between the first and second inner conductors 11 and 12 in the multilayer body 13 can be understood.

  In addition, the external electrode 14 is formed by firing a conductive paste, and the main component of the external electrode 14 and the main component of the metal layer 15 are made of the same material.

  The laminated body 13 includes a nonmagnetic body portion 17 formed of the first to fifth nonmagnetic body layers 16a to 16e, and a spiral first formed in the nonmagnetic body portion 17, The second inner conductors 11 and 12 and a magnetic body portion 19 composed of a magnetic body layer 18 provided above and below the nonmagnetic body portion 17, respectively.

  In the above configuration, the first and second inner conductors 11 and 12 are each formed by spirally plating or printing a conductive material such as silver.

  At this time, the first inner conductor 11 is formed on the upper surface of the second nonmagnetic material layer 16b, and the second inner conductor 12 is formed on the upper surface of the third nonmagnetic material layer 16c.

  The first inner conductor 11 is connected to the first lead conductor 11a formed in the first nonmagnetic layer 16a via the first via electrode 20a, and the second inner conductor 12 is The second lead conductor 12a formed in the fourth nonmagnetic layer 16d is connected to the second non-magnetic layer 16d through the second via electrode 20b. Here, the first via electrode 20a and the second via electrode 20b are formed by drilling a hole in a predetermined portion of each nonmagnetic layer with a laser and filling the hole with silver.

  The end portions of the first inner conductor 11, the first lead conductor 11a, the second inner conductor 12, and the second lead conductor 12a are exposed at the end face of the multilayer body 13, and the first to fourth outer portions are respectively exposed. It is connected to the electrodes 14a to 14d.

  Furthermore, the external electrode 14 (first to fourth external electrodes 14a to 14d) is integrally provided in a U-shape on the end surface, upper surface, and lower surface of the laminate 13. The external electrode 14 is formed by firing a silver paste, and further includes a nickel plating layer formed by plating on the surface and a tin plating layer formed by plating on the surface of the nickel plating layer. A plated layer (not shown) is provided.

  The metal layer 15 is provided on the upper and lower surfaces of the end surface of the multilayer body 13 so as to be exposed from the multilayer body 13, and the first to fourth external electrodes 14 a to 14 located on the upper and lower surfaces of the multilayer body 13. 14d. That is, the metal layer 15 is provided at four places on the upper surface of the laminated body 13 and at four places on the lower surface of the laminated body 13. Furthermore, the first to fourth external electrodes 14 a to 14 d cover the entire surface of the metal layer 15. The main component of the metal layer 15 is made of silver, which is the same material as the main component of the external electrode 14, and is formed by printing of silver paste, sputtering of silver, or transfer of silver plating. The metal layer 15 may be made of an alloy containing silver, which is the main component of the external electrode 14, for example, silver palladium.

  The external electrode 14 may be connected to a part of the metal layer 15 without covering the entire surface of the metal layer 15. At this time, as shown in FIG. 4, if the external electrode 14 is connected only to its end face so as not to protrude from the metal layer 15, the metal layer 15 positioned on the upper surface and the lower surface of the laminate 13 is connected to the external electrode. Therefore, the shape of the external electrodes on the upper surface and the lower surface of the laminate 13 made of the metal layer 15 can be stabilized. In addition, a plating layer (not shown) is directly formed on the metal layer 15 located on the upper surface and the lower surface of the laminate 13.

  Furthermore, as shown in FIG. 5, the metal layer 15 may be embedded in the stacked body 13. With this configuration, the anchor effect is generated because the metal layer 15 bites into the laminated body 13, whereby the adhesion strength between the external electrode 14 and the laminated body 13 can be further improved, and the thickness can be reduced. it can. In order to bury the metal layer 15 in the stacked body 13, there are methods of pressing the entire stacked body 13 on which the metal layer 15 is formed or pressing it in a state where it is formed on the magnetic layer 18 in advance. Note that the metal layer 15 may not be entirely embedded in the stacked body 13, but only a part of the metal layer 15 may be embedded in the stacked body 13.

  Further, the first to fifth nonmagnetic layers 16a to 16e are laminated in order from the bottom, and are non-ferromagnetic insulating materials such as Cu-Zn ferrite and glass ceramic. It is comprised by the sheet form. And the nonmagnetic body part 17 which has the 1st-5th nonmagnetic body layers 16a-16e is comprised.

  The magnetic layer 18 is formed on the lower surface of the first nonmagnetic material layer 16a and the upper surface of the fifth nonmagnetic material layer 16e. Also, the magnetic material 18 is made of an insulating material such as Ni-Cu-Zn. The sheet is formed of ferrite or the like. Further, a magnetic body portion 19 is constituted by the magnetic body layer 18.

  Note that the number of sheets constituting the first to fifth nonmagnetic layers 16a to 16e and the magnetic layer 18 is not limited to the number shown in FIG.

  Moreover, although the shape of the metal layer 15 is a square shape in a top view in FIG. 3, other shapes such as a semicircular shape may be used. Furthermore, you may form so that it may straddle not only the end surface of the laminated body 13 but 2 sides of a side surface and an end surface.

  Hereinafter, the manufacturing method of the common mode noise filter in Embodiment 1 of this invention is demonstrated.

  First, as shown in FIG. 6A, the dry film 22 is attached to the upper surface of the base pallet 21.

  Next, as shown in FIG. 6B, a metal layer 15 is formed by transferring silver plating on the dry film 22. Here, the case where the metal layer 15 is formed by transfer of silver plating is shown.

  Next, as shown in FIG. 6C, a predetermined number of magnetic layers 18 (magnetic portions 19) are formed on the metal layer 15.

  Next, as shown in FIG. 6D, a nonmagnetic body portion 17 composed of first to fifth nonmagnetic body layers 16a to 16e is formed. At this time, the first inner conductor 11, the second inner conductor 12, the first lead conductor 11 a, and the second lead conductor 12 a are provided in the nonmagnetic body portion 17, and the first and second inner conductors 11 are provided. , 12 and the ends of the first and second lead conductors 11a, 12a are exposed on the surface.

  Next, as shown in FIG. 6E, a predetermined number of magnetic layers 18 (magnetic portions 19) are formed on the upper surface of the nonmagnetic portion 17.

  Next, as shown in FIG. 6F, a metal layer 15 is formed on the magnetic body portion 19 by transferring silver plating, and then fired. In addition, since the dry film 22 is thermally decomposed at the time of baking, the dry film 22, the lower metal layer 15, and the magnetic body part 19 peel.

  Further, after that, a silver paste is formed so as to be connected to the metal layer 15, the first inner conductor 11, the second inner conductor 12, the first lead conductor 11a, and the second lead conductor 12a with exposed end portions, The external electrode 14 is provided by baking. FIG. 6 shows the end of the multilayer body 13, that is, the surface on which the external electrode 14 is formed, and the end of the first and second inner conductors 11 and 12 are exposed.

  In addition, after forming the laminated body 13, the metal layer 15 may be formed by printing or plating transfer at a place where the external electrode 14 is formed. The formation of the metal layer 15 is performed after the laminated body 13 is fired. You may go.

  As described above, in the common mode noise filter according to the first embodiment of the present invention, the metal layer 15 is provided on the upper surface and the lower surface of the multilayer body 13, and the main component of the external electrode 14 and the main component of the metal layer 15 are made of the same material. Furthermore, since the external electrode 14 is connected so as to cover the surface of the metal layer 15, the adhesion strength between the laminate 13 and the external electrode 14 is increased, whereby the electrode strength can be improved. The effect of preventing peeling and mounting defects can be obtained.

  Here, the reason why the adhesion strength is improved by making the main component of the external electrode 14 and the main component of the metal layer 15 the same material is that the metal particles of the metal layer 15 and the metal layer 15 in the conductive paste of the external electrode 14 are. It is considered that the metal particles of the same material are combined in the firing process of the external electrode 14 to form a sintered body of these metals. Even when an alloy containing a metal that is the main component of the external electrode 14 is used as the metal layer 15, the same can be said for the metal particles that are the main component of the external electrode 14 in the alloy.

  In addition, since the external electrode 14 is formed so as to cover the surface of the metal layer 15 exposed from the stacked body 13, a contact area between the metal layer 15 and the external electrode 14 can be ensured. Becomes stronger, and electrode peeling and mounting defects can be prevented.

(Embodiment 2)
FIG. 7 is a cross-sectional transmission diagram of the common mode noise filter according to the second exemplary embodiment of the present invention. In the second embodiment of the present invention, components having the same configurations as those of the first embodiment of the present invention are denoted by the same reference numerals, and the description thereof is omitted.

  The second embodiment of the present invention is different from the first embodiment of the present invention described above in that the metal layer 15 connected to the external electrode 14 is formed only on the upper surface and the lower surface of the laminate 13 as shown in FIG. In addition, the first to fifth nonmagnetic layers 16a to 16e and the magnetic layer 18 are also provided.

  At this time, the metal layer 15 is not formed on the portions where the end portions of the first and second inner conductors 11 and 12 and the end portions of the first and second lead conductors 11a and 12a are exposed.

  With the above-described configuration, the contact area between the external electrode 14 and the metal layer 15 increases, so that the adhesion strength between the external electrode 14 and the laminate 13 can be improved, thereby more reliably preventing electrode peeling and mounting defects. Can be prevented.

  Note that the shape and laminated structure of the inner conductors 11 and 12, the material of the insulator layer, and the combination are not limited to those described in the first and second embodiments of the present invention.

  In the first and second embodiments of the present invention, the common mode noise filter has been described as an example of the multilayer component. However, the present invention can also be applied to other multilayer components such as a multilayer capacitor.

  The laminated component according to the present invention has an effect of preventing electrode peeling and mounting failure, and particularly in a common mode noise filter used in various electronic devices such as digital devices, AV devices, and information communication terminals. It will be useful.

DESCRIPTION OF SYMBOLS 11 1st inner conductor 12 2nd inner conductor 13 Laminated body 14 External electrode 15 Metal layer

Claims (3)

An inner conductor,
A laminate containing the internal conductor;
An external electrode provided on at least the end face of the laminate and connected to the internal conductor;
Forming the external electrode by firing a conductive paste;
A metal layer is provided on at least one of the upper surface and the lower surface of the laminate, and
Containing the same metal as the main component of the external electrode in the metal layer;
Connecting the external electrode and the metal layer ;
The external electrode is a laminated component that covers the entire surface of the metal layer .
The laminate is formed by laminating a plurality of insulator layers and a plurality of internal conductors formed with the insulator layers interposed therebetween, and the metal layer connected to the external electrode is formed on the insulator layer. The laminated component according to claim 1 provided. The multilayer component according to claim 1, wherein at least a part of the metal layer is embedded in the multilayer body.

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