TWI479508B - Conductive powder, conductive material containing the conductive powder, and method for producing conductive particles - Google Patents

Conductive powder, conductive material containing the conductive powder, and method for producing conductive particles Download PDF

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Publication number
TWI479508B
TWI479508B TW098133952A TW98133952A TWI479508B TW I479508 B TWI479508 B TW I479508B TW 098133952 A TW098133952 A TW 098133952A TW 98133952 A TW98133952 A TW 98133952A TW I479508 B TWI479508 B TW I479508B
Authority
TW
Taiwan
Prior art keywords
particles
nickel
conductive
core material
film
Prior art date
Application number
TW098133952A
Other languages
English (en)
Chinese (zh)
Other versions
TW201021054A (en
Inventor
Matsuura Hiroto
Oyamada Masaaki
Original Assignee
Nippon Chemical Ind
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Chemical Ind filed Critical Nippon Chemical Ind
Publication of TW201021054A publication Critical patent/TW201021054A/zh
Application granted granted Critical
Publication of TWI479508B publication Critical patent/TWI479508B/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/17—Metallic particles coated with metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/18—Non-metallic particles coated with metal
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1635—Composition of the substrate
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C23C18/1651—Two or more layers only obtained by electroless plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
    • C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals
    • C23C18/44—Coating with noble metals using reducing agents
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0218—Composite particles, i.e. first metal coated with second metal

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
  • Powder Metallurgy (AREA)
TW098133952A 2008-10-14 2009-10-07 Conductive powder, conductive material containing the conductive powder, and method for producing conductive particles TWI479508B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2008264725 2008-10-14
JP2009220045A JP4746116B2 (ja) 2008-10-14 2009-09-25 導電性粉体及びそれを含む導電性材料並びに導電性粒子の製造方法

Publications (2)

Publication Number Publication Date
TW201021054A TW201021054A (en) 2010-06-01
TWI479508B true TWI479508B (zh) 2015-04-01

Family

ID=42106551

Family Applications (1)

Application Number Title Priority Date Filing Date
TW098133952A TWI479508B (zh) 2008-10-14 2009-10-07 Conductive powder, conductive material containing the conductive powder, and method for producing conductive particles

Country Status (5)

Country Link
JP (1) JP4746116B2 (ko)
KR (1) KR101594639B1 (ko)
CN (1) CN102187405B (ko)
TW (1) TWI479508B (ko)
WO (1) WO2010044388A1 (ko)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5512306B2 (ja) * 2010-01-29 2014-06-04 日本化学工業株式会社 導電性粒子の製造方法
JP5476221B2 (ja) * 2010-06-18 2014-04-23 積水化学工業株式会社 導電性粒子、異方性導電材料及び接続構造体
WO2012043472A1 (ja) 2010-09-30 2012-04-05 積水化学工業株式会社 導電性粒子、異方性導電材料及び接続構造体
JP5184612B2 (ja) * 2010-11-22 2013-04-17 日本化学工業株式会社 導電性粉体、それを含む導電性材料及びその製造方法
JP5703836B2 (ja) * 2011-02-25 2015-04-22 日立化成株式会社 導電粒子、接着剤組成物、回路接続材料及び接続構造体
KR101097862B1 (ko) * 2011-03-04 2011-12-23 덕산하이메탈(주) 도전입자 및 그 제조방법
JP5695510B2 (ja) * 2011-06-22 2015-04-08 株式会社日本触媒 導電性微粒子の製造方法
JP5707247B2 (ja) * 2011-06-22 2015-04-22 日本化学工業株式会社 導電性粒子の製造方法
KR101191970B1 (ko) * 2011-12-09 2012-10-17 한화케미칼 주식회사 인 도핑된 니켈 나노 입자 및 이의 제조방법
JP5952553B2 (ja) * 2011-12-14 2016-07-13 株式会社日本触媒 導電性微粒子及びこれを含む異方性導電材料
JP5951977B2 (ja) * 2011-12-14 2016-07-13 株式会社日本触媒 導電性微粒子
KR101375298B1 (ko) * 2011-12-20 2014-03-19 제일모직주식회사 전도성 미립자 및 이를 포함하는 이방 전도성 필름
WO2013108740A1 (ja) * 2012-01-19 2013-07-25 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体
JP5973257B2 (ja) * 2012-07-03 2016-08-23 日本化学工業株式会社 導電性粒子及びそれを含む導電性材料
KR101443347B1 (ko) * 2013-05-14 2014-10-02 덕산하이메탈(주) 도전입자 및 그 제조방법
JP6352103B2 (ja) * 2013-08-12 2018-07-04 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体
JP6345075B2 (ja) * 2013-10-23 2018-06-20 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体
JP6460803B2 (ja) * 2014-01-10 2019-01-30 積水化学工業株式会社 導電性粒子、導電性粒子の製造方法、導電材料及び接続構造体
JP6523860B2 (ja) * 2014-08-07 2019-06-05 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体
JP6641118B2 (ja) * 2014-08-18 2020-02-05 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体
JP6263228B2 (ja) * 2016-06-09 2018-01-17 日本化学工業株式会社 導電性粒子及びそれを含む導電性材料
TWI783938B (zh) * 2016-06-22 2022-11-21 日商積水化學工業股份有限公司 連接結構體、含金屬原子之粒子及連接用組成物
CN110157363B (zh) * 2019-06-11 2021-04-06 莱芜职业技术学院 一种电磁屏蔽导电胶用导电粉末的制备方法
FR3119172A1 (fr) * 2021-01-28 2022-07-29 Swissto12 Sa Composition stable pour dépôt catalytique d’argent

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000243132A (ja) * 1999-02-22 2000-09-08 Nippon Chem Ind Co Ltd 導電性無電解めっき粉体とその製造方法並びに該めっき粉体からなる導電性材料
JP2004296322A (ja) * 2003-03-27 2004-10-21 Sekisui Chem Co Ltd 導電性微粒子及び液晶表示素子
JP2006228474A (ja) * 2005-02-15 2006-08-31 Sekisui Chem Co Ltd 導電性微粒子及び異方性導電材料

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US5378407A (en) * 1992-06-05 1995-01-03 Raychem Corporation Conductive polymer composition
TW277152B (ko) * 1994-05-10 1996-06-01 Hitachi Chemical Co Ltd
US6013713A (en) * 1997-11-06 2000-01-11 International Business Machines Corporation Electrode modification using an unzippable polymer paste

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000243132A (ja) * 1999-02-22 2000-09-08 Nippon Chem Ind Co Ltd 導電性無電解めっき粉体とその製造方法並びに該めっき粉体からなる導電性材料
JP2004296322A (ja) * 2003-03-27 2004-10-21 Sekisui Chem Co Ltd 導電性微粒子及び液晶表示素子
JP2006228474A (ja) * 2005-02-15 2006-08-31 Sekisui Chem Co Ltd 導電性微粒子及び異方性導電材料

Also Published As

Publication number Publication date
JP4746116B2 (ja) 2011-08-10
JP2010118334A (ja) 2010-05-27
KR101594639B1 (ko) 2016-02-16
CN102187405A (zh) 2011-09-14
WO2010044388A1 (ja) 2010-04-22
TW201021054A (en) 2010-06-01
KR20110069811A (ko) 2011-06-23
CN102187405B (zh) 2013-01-02

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