TWI479508B - Conductive powder, conductive material containing the conductive powder, and method for producing conductive particles - Google Patents

Conductive powder, conductive material containing the conductive powder, and method for producing conductive particles Download PDF

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Publication number
TWI479508B
TWI479508B TW098133952A TW98133952A TWI479508B TW I479508 B TWI479508 B TW I479508B TW 098133952 A TW098133952 A TW 098133952A TW 98133952 A TW98133952 A TW 98133952A TW I479508 B TWI479508 B TW I479508B
Authority
TW
Taiwan
Prior art keywords
particles
nickel
conductive
core material
film
Prior art date
Application number
TW098133952A
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English (en)
Chinese (zh)
Other versions
TW201021054A (en
Inventor
Matsuura Hiroto
Oyamada Masaaki
Original Assignee
Nippon Chemical Ind
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Filing date
Publication date
Application filed by Nippon Chemical Ind filed Critical Nippon Chemical Ind
Publication of TW201021054A publication Critical patent/TW201021054A/zh
Application granted granted Critical
Publication of TWI479508B publication Critical patent/TWI479508B/zh

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20Conductive material dispersed in non-conductive organic material
    • H01B1/22Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00Non-insulated conductors or conductive bodies characterised by their form
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/17Metallic particles coated with metal
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/18Non-metallic particles coated with metal
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601Process or apparatus
    • C23C18/1633Process of electroless plating
    • C23C18/1635Composition of the substrate
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601Process or apparatus
    • C23C18/1633Process of electroless plating
    • C23C18/1646Characteristics of the product obtained
    • C23C18/165Multilayered product
    • C23C18/1651Two or more layers only obtained by electroless plating
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31Coating with metals
    • C23C18/32Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31Coating with metals
    • C23C18/32Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C23C18/34Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
    • C23C18/36Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31Coating with metals
    • C23C18/42Coating with noble metals
    • C23C18/44Coating with noble metals using reducing agents
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203Fillers and particles
    • H05K2201/0206Materials
    • H05K2201/0218Composite particles, i.e. first metal coated with second metal

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Dispersion Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
  • Powder Metallurgy (AREA)
TW098133952A 2008-10-14 2009-10-07 Conductive powder, conductive material containing the conductive powder, and method for producing conductive particles TWI479508B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2008264725 2008-10-14
JP2009220045A JP4746116B2 (ja) 2008-10-14 2009-09-25 導電性粉体及びそれを含む導電性材料並びに導電性粒子の製造方法

Publications (2)

Publication Number Publication Date
TW201021054A TW201021054A (en) 2010-06-01
TWI479508B true TWI479508B (zh) 2015-04-01

Family

ID=42106551

Family Applications (1)

Application Number Title Priority Date Filing Date
TW098133952A TWI479508B (zh) 2008-10-14 2009-10-07 Conductive powder, conductive material containing the conductive powder, and method for producing conductive particles

Country Status (5)

Country Link
JP (1) JP4746116B2 (ja)
KR (1) KR101594639B1 (ja)
CN (1) CN102187405B (ja)
TW (1) TWI479508B (ja)
WO (1) WO2010044388A1 (ja)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5512306B2 (ja) * 2010-01-29 2014-06-04 日本化学工業株式会社 導電性粒子の製造方法
JP5476221B2 (ja) * 2010-06-18 2014-04-23 積水化学工業株式会社 導電性粒子、異方性導電材料及び接続構造体
WO2012043472A1 (ja) 2010-09-30 2012-04-05 積水化学工業株式会社 導電性粒子、異方性導電材料及び接続構造体
JP5184612B2 (ja) 2010-11-22 2013-04-17 日本化学工業株式会社 導電性粉体、それを含む導電性材料及びその製造方法
JP5703836B2 (ja) * 2011-02-25 2015-04-22 日立化成株式会社 導電粒子、接着剤組成物、回路接続材料及び接続構造体
KR101097862B1 (ko) * 2011-03-04 2011-12-23 덕산하이메탈(주) 도전입자 및 그 제조방법
JP5695510B2 (ja) * 2011-06-22 2015-04-08 株式会社日本触媒 導電性微粒子の製造方法
JP5707247B2 (ja) * 2011-06-22 2015-04-22 日本化学工業株式会社 導電性粒子の製造方法
KR101191970B1 (ko) * 2011-12-09 2012-10-17 한화케미칼 주식회사 인 도핑된 니켈 나노 입자 및 이의 제조방법
JP5952553B2 (ja) * 2011-12-14 2016-07-13 株式会社日本触媒 導電性微粒子及びこれを含む異方性導電材料
JP5951977B2 (ja) * 2011-12-14 2016-07-13 株式会社日本触媒 導電性微粒子
KR101375298B1 (ko) * 2011-12-20 2014-03-19 제일모직주식회사 전도성 미립자 및 이를 포함하는 이방 전도성 필름
KR101987509B1 (ko) * 2012-01-19 2019-06-10 세키스이가가쿠 고교가부시키가이샤 도전성 입자, 도전 재료 및 접속 구조체
JP5973257B2 (ja) * 2012-07-03 2016-08-23 日本化学工業株式会社 導電性粒子及びそれを含む導電性材料
KR101443347B1 (ko) * 2013-05-14 2014-10-02 덕산하이메탈(주) 도전입자 및 그 제조방법
JP6352103B2 (ja) * 2013-08-12 2018-07-04 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体
JP6345075B2 (ja) * 2013-10-23 2018-06-20 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体
JP6460803B2 (ja) * 2014-01-10 2019-01-30 積水化学工業株式会社 導電性粒子、導電性粒子の製造方法、導電材料及び接続構造体
JP6523860B2 (ja) * 2014-08-07 2019-06-05 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体
JP6641118B2 (ja) * 2014-08-18 2020-02-05 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体
JP6263228B2 (ja) * 2016-06-09 2018-01-17 日本化学工業株式会社 導電性粒子及びそれを含む導電性材料
TWI783938B (zh) * 2016-06-22 2022-11-21 日商積水化學工業股份有限公司 連接結構體、含金屬原子之粒子及連接用組成物
CN110157363B (zh) * 2019-06-11 2021-04-06 莱芜职业技术学院 一种电磁屏蔽导电胶用导电粉末的制备方法
WO2022044913A1 (ja) * 2020-08-24 2022-03-03 日本化学工業株式会社 被覆粒子及びその製造方法
FR3119172A1 (fr) * 2021-01-28 2022-07-29 Swissto12 Sa Composition stable pour dépôt catalytique d’argent

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000243132A (ja) * 1999-02-22 2000-09-08 Nippon Chem Ind Co Ltd 導電性無電解めっき粉体とその製造方法並びに該めっき粉体からなる導電性材料
JP2004296322A (ja) * 2003-03-27 2004-10-21 Sekisui Chem Co Ltd 導電性微粒子及び液晶表示素子
JP2006228474A (ja) * 2005-02-15 2006-08-31 Sekisui Chem Co Ltd 導電性微粒子及び異方性導電材料

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5378407A (en) * 1992-06-05 1995-01-03 Raychem Corporation Conductive polymer composition
TW277152B (ja) * 1994-05-10 1996-06-01 Hitachi Chemical Co Ltd
US6013713A (en) * 1997-11-06 2000-01-11 International Business Machines Corporation Electrode modification using an unzippable polymer paste

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000243132A (ja) * 1999-02-22 2000-09-08 Nippon Chem Ind Co Ltd 導電性無電解めっき粉体とその製造方法並びに該めっき粉体からなる導電性材料
JP2004296322A (ja) * 2003-03-27 2004-10-21 Sekisui Chem Co Ltd 導電性微粒子及び液晶表示素子
JP2006228474A (ja) * 2005-02-15 2006-08-31 Sekisui Chem Co Ltd 導電性微粒子及び異方性導電材料

Also Published As

Publication number Publication date
JP2010118334A (ja) 2010-05-27
CN102187405A (zh) 2011-09-14
TW201021054A (en) 2010-06-01
JP4746116B2 (ja) 2011-08-10
KR20110069811A (ko) 2011-06-23
CN102187405B (zh) 2013-01-02
WO2010044388A1 (ja) 2010-04-22
KR101594639B1 (ko) 2016-02-16

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