TWI477341B - Semiconductor packages and method for manufacturing the same - Google Patents

Description

Semiconductor package and method of manufacturing semiconductor package

BACKGROUND OF THE INVENTION 1. Field of the Invention This invention relates to a method for generating a laser beam trajectory for processing a semiconductor package, and more particularly to a method for generating a laser beam trajectory for fabricating a semiconductor package, by which a stacked package type (PoP) A manufacturing process of a semiconductor package can automatically, accurately and easily generate a spiral laser beam radiation trajectory directed to a mold portion of the semiconductor package.

Currently, according to the trend of small size and multi-purpose with various functions, such as mobile portable phones, portable Internet devices and portable multimedia terminals, various semiconductor packages such as multi-chip package MCP and stacked package PoP technology Technology is evolving to enable the manufacture of lightweight and small-sized devices, as well as high-capacity and highly integrated devices.

In these technologies, the stacked package PoP technology is a technology in which a package in which one or more semiconductor wafers are combined is stacked, and in general, is electrically connected by bonding solder balls formed on the lower side of an upper semiconductor package. This is achieved with a plurality of solder balls formed on the upper side of the semiconductor package.

When the stacked and packaged PoP technology is combined with the upper and lower semiconductor packages, if the two semiconductor packages are different due to warpage, the solder balls of the upper semiconductor package and the lower semiconductor package are The precise bonding of the solder balls becomes difficult, and thus the possibility of forming defects is large.

However, if the type or size of the semiconductor package is changed in a semiconductor package fabrication process, the spiral track needs to be changed to meet the type or size of the semiconductor package. However, as mentioned above, in the related art, since the spiral trajectory of the laser beam is first generated by CAD, and the digital information of the trajectory is supplied to one of the controllers of the laser beam radiation device, any Whenever the type of the semiconductor package to be manufactured changes, it is necessary to repeat the Spiral trajectory generation.

Therefore, since the generation of the spiral trajectory takes a lot of time, the productivity is low.

In order to solve such problems, an object of the present invention is to provide a method for generating a laser beam radiation trajectory for forming a through hole by using the laser beam, by means of the method, for example, in a stacked package type (PoP) In the manufacturing process of the semiconductor package, a through hole is formed in a mold portion of the semiconductor package, which can quickly and easily generate a laser beam radiation trajectory.

To achieve these and other advantages, and in accordance with the present invention, as specifically and broadly described herein, a semiconductor package fabrication machine is utilized that radiates a laser beam along a spiral track to a semiconductor package. The mold portion is for forming a through hole--a method for generating a laser beam radiation trajectory, the method comprising the steps of: (a) from a plurality of spiral trajectory pattern types stored in a controller of a laser beam radiation device Selecting a pattern type; (b) generating a spiral trajectory by inputting information related to the selected spiral trajectory pattern; and (c) inputting a laser beam radiation condition associated with the spiral trajectory.

In another aspect of the invention, a semiconductor package manufacturing machine is used which radiates a laser beam along a spiral path to a mold portion of a semiconductor package for forming a via hole to generate a laser beam radiation trajectory The method comprises the steps of: (a) inputting information relating to a segmented spiral pattern type to form the spiral track, the segmented spiral pattern type forming the spiral track pitch G from one segment to another segment Different; and (b) input laser beam radiation conditions.

The present invention has the following advantageous effects.

Since the operator can select the laser beam spiral trajectory pattern and can input information related to the spiral pattern and the laser beam radiation condition, the generation of the spiral pattern and the formation of the through hole can be automatically realized even when manufacturing. The size and type of the semiconductor package may vary, and the operator can also quickly and accurately generate the spiral pattern, thereby improving productivity and processing efficiency.

[best mode]

The specific embodiments of the present invention will now be described in detail, and examples of such specific embodiments are illustrated in the drawings. Wherever possible, the same elementary symbols refer to the same or similar parts in all of the drawings.

For reference only, although the following description relates to a method according to the present invention for generating a laser beam radiation trajectory for forming a via hole in a stacked package PoP type semiconductor package manufacturing process, the through hole A specific embodiment of a solder ball pad exposed from a mold portion of a lower semiconductor package, but the invention is not limited thereto, and may be applied to all semiconductor package manufacturing processes in the same or similar manner, that is, at each such The laser beam is radiated along a spiral track in a semiconductor package fabrication process to form a predetermined pattern.

For reference only, a specific embodiment of a method for generating a laser beam radiation trajectory for processing a semiconductor package according to the present invention is described below with respect to a method for packaging in a package on a package (PoP) type semiconductor package. Forming a through hole to expose a solder ball pad to a laser beam spiral radiation track generating method of one of the mold portions of the semiconductor package, but the present invention is not limited thereto, but can be applied to all semiconductor packaging processes in the same or similar manner. During this process, a laser beam is radiated along a spiral track.

After the lower semiconductor package is entirely molded at a position to reduce warpage, wherein a solder ball pad is formed in a molding step during the process of the lower semiconductor package, a laser beam radiating device (20) can be used in the semiconductor package (10) On the mold portion (11), a through hole (13) is formed in a portion of each solder ball pad (12) to expose the solder ball pad (12) to the outside of a mold portion (11), as shown in the drawing. 1 and 2 are shown. Thereafter, when the upper semiconductor package When laminated on the lower semiconductor package, the solder balls of the upper semiconductor package are interconnected with the solder ball pads (12) of the lower semiconductor package through the via holes (13).

When a via is formed in the mold portion of the lower semiconductor package, the laser beam is radiated. At this time, a method is used in which the laser beam is radiated along a spiral track at a position matching each of the solder ball pads, and the mold portion is uniformly cut, since the damage of the solder ball pad is reduced by the laser beam to Minimal. Such a spiral trajectory of the laser beam is first drawn by a computer aided design (CAD), and then the digital information of each trajectory is input to a controller of the laser beam radiating device for forming the through hole. The laser beam is always radiated with a fixed trajectory.

If the type or size of the semiconductor package to be processed is changed in a semiconductor package process, the spiral track should also be changed to conform to the type or size of the semiconductor package. However, because the operator first generates a spiral trajectory from the above CAD drawing, and then inputs the digital information on the spiral trajectory into the controller of the laser beam irradiation device, this spiral trajectory needs to be repeated each time the type of the semiconductor package to be processed is changed. Generate processing.

3 illustrates a flow chart showing the steps of a method for generating a laser beam radiation trace for fabricating a semiconductor package in accordance with a preferred embodiment of the present invention, the method comprising the steps of: Selecting a pattern from a plurality of spiral track patterns stored in a controller of a laser beam radiation device; generating a spiral track by inputting information related to the selected spiral track pattern; and inputting and generating the spiral The ray-related laser beam radiation conditions.

Each step will be described in detail later.

In the controller of the laser beam radiating device that radiates the laser beam, a spiral pattern program having a plurality of helical traces for generating a laser beam is stored.

The spiral track pattern stored in the controller includes: an equally spaced pattern, In each of the patterns, as shown in FIG. 4, the fixed pitch G of the spiral track remains unchanged from an inner end to an outer end; an incremental/subtractive spiral track pattern is used in each of the patterns. In the pattern, as shown in FIG. 5 or 6, from an inner end to an outer end, the distance between the spiral tracks is gradually increased or decreased; and the segmented spiral track pattern is in each of the patterns. In the figure, as shown in FIG. 7, the distance G between the spiral tracks is different from one segment to another.

In the step of selecting a pattern from the plurality of spiral trajectory patterns, the operator selects one of the patterns to generate a corresponding spiral trajectory, that is, selecting the equally spaced modality to generate the equally spaced spiral trajectory, and selecting the A progressive spiral mode is used to generate the incremental/subtractive spiral pattern, and the segmented spiral mode is selected for generating the segmented spiral pattern.

The operator then inputs information relating to the spiral trajectory that is desired to be generated based on the selected trajectory of the spiral trajectory.

For example, if the operator selects the equally spaced spiral mode from the spiral track pattern generation mode, the user inputs the information, that is, one direction of the spiral track (clockwise or counterclockwise), the spiral track The diameter Is of the innermost trajectory, the diameter Os of the outermost trajectory of the spiral trajectory, and the distance G between the spiral trajectories. In addition to this, the operator also inputs whether or not to generate a contour connection trajectory OL for connecting the outermost trajectory of the spiral trajectory with a circle. The spiral trajectories in Figures 4C and 4D illustrate the state in which the contour connection trajectories have been generated. The profile connection track is used to form the profile of the spiral track that will be a complete circle for forming a through hole that will be a complete circle in the mold portion of the semiconductor package.

If the operator selects the progressive spiral mode from the spiral track pattern generation modes, the operator inputs the information, that is, one direction of the spiral track (clockwise or counterclockwise), the spiral track The diameter Is of the innermost trajectory, the diameter Os of the outermost trajectory of the spiral trajectory, and the distance G between the spiral trajectories. In addition, the operator also inputs the amount of change of the pitch of the spiral track, the spiral track of the maximum distance G _max and the minimum pitch of the spiral track G _min. Of course, also in this case, similar to the aforementioned equal-pitch spiral mode, it is preferable that the operator input generates the contour connection trajectory OL for determining whether a contour connecting trajectory OL is generated or not. The OL is used to connect the outermost trajectory of the spiral trajectory with a circle.

According to the variation of the pitch of the spiral track, the spiral track generated by the progressive spiral mode or becomes such a shape that the pitch gradually increases as the track gradually moves outward, as shown in FIG. Show, or become such a shape that the pitch gradually decreases as the trajectory gradually moves outward, as shown in FIG.

If the operator selects the segmented spiral mode from the spiral track pattern generation modalities, the operator inputs the information, that is, one direction of the spiral track (clockwise or counterclockwise), the spiral The diameter Is of the innermost track of the track, the diameter Os of the outermost track of the spiral track, and the distance G between the spiral tracks in each segment, and the number of segments. The information of the segments can be set by considering the diameter or the like of the solder ball pad (see FIG. 2) of the semiconductor package.

For example, the spiral track has a shape in which the pitch is dense at a central portion opposite to the solder ball pad 12 of the semiconductor package, and the pitch at the outer portion of the center portion is sparse, and the spiral track is The spacing at one of the outermost portions becomes dense again, as shown in Figures 7A, 7B, 7E and 7F, or the spacing at a most central portion is sparse, the spacing at the outer portion of one of the most central portions being dense And the spacing at the outer portion of the spiral track becomes sparse again, as shown in Figures 7C, 7D, 7G and 7H.

Once the selected trajectory information input of the spiral trajectory pattern is completed, the controller of the laser beam radiant device outputs the spiral trajectory generated by a monitor for verifying that the desired trajectory has been generated for the operator. .

The operator then sets the laser beam radiation conditions, such as the laser beam radiation velocity of the laser beam radiation device, the laser beam density, the number of times the laser beam is radiated, and the radiation direction of the laser beam (from the spiral track) From the inside to the outside, or vice versa). For example, to cut the mold portion 11 (see Figures 1 and 2) or to the opposite side The laser beam radiation speed may be set to a low speed or to enhance the intensity of the laser beam at a plurality of places where energy is required; to cut the mold portion 11, the laser beam radiation speed may be set to be fast or to reduce the energy required. The intensity of the laser beam. Of course, some of these laser beam radiation conditions can be entered in the step of inputting the spiral track information.

After all of the laser beam radiation conditions are set, the operation of generating the spiral trajectory is completed, and the controller of the laser beam radiant device repeatedly radiates the ray along the generated trajectory of the laser beam radiation. The beam is formed by forming the through hole 13 in the mold portion 11 (see FIGS. 1 and 2) of the semiconductor package. In this case, although the laser beam radiating means is capable of radiating the laser beam from the inside to the outside of the generated spiral track along the spiral track, it is preferred that the laser beam radiating means generates the spiral from The outer side of the track to the inner side radiates the laser beam along the spiral track, thereby forming the through hole 13 for having an upwardly enlarged inner circumference.

At the same time, although the foregoing specific embodiment suggests that the via hole is formed by repeatedly radiating the laser beam along the same spiral track that has been generated, different spiral tracks may be generated according to the number of repetitions.

For example, when the first laser beam is irradiated, the equal pitch or the progressive pitch spiral track is formed only in the central portion, and when the second laser beam is radiated, the end point is formed from the end of the first spiral track. The predetermined shape of the spiral track, and when the third laser beam is radiated, the spiral track is formed only at the outermost portion of the spiral track for forming the through hole segment piece by piece according to the number of repetitions.

Moreover, although the foregoing specific embodiment suggests inputting information of the spiral trajectory pattern prior to inputting the conditions of the laser beam radiation, differently, the laser beam radiation conditions may be input first, and then the spiral trajectory pattern may be input. The information.

In the method of generating the laser beam radiation trajectory of one of the foregoing embodiments, the plurality of spiral trajectory patterns are stored in the controller, and one of the spiral trajectory patterns is selected to generate the laser beam radiation trajectory. . However, as shown in Figure 8. According to another embodiment of the present invention, by storing one of the spiral track patterns, for example, by default, the segmented spiral pattern is stored in the controller, so that the spiral track information is directly input. This step is possible with these laser beam radiation conditions without the need to implement the type of selection of the spiral pattern.

Of course, also in this embodiment, the operator inputs such information, that is, one direction of the spiral track (clockwise or counterclockwise), the diameter Is of the innermost track of the spiral track, and the outermost part of the spiral track The diameter Os of the track, and the distance G between the spiral tracks, along with information relating to the segments, includes the diameter of the solder ball pad (see FIG. 2) of the semiconductor package.

Once the input of the trajectory information of the spiral trajectory pattern is completed, the operator outputs the generated spiral trajectory on a monitor, determines whether a desired trajectory has been generated, and sets the laser beam radiation conditions, such as the The laser beam radiation velocity of the laser beam radiation device, the intensity of the laser beam, the number of radiations of the laser beam, the radiation direction of the laser beam (from the inside to the outside of the spiral track, or vice versa).

9 illustrates an example of a segmented spiral trajectory pattern generated by the method of generating one of the laser beam radiation trajectories of FIG. 8, wherein FIG. 9A illustrates the segmented spiral trajectory pattern, the segmented spiral trajectory pattern having a first segment, the segment being matched to the outside of one of the solder balls, which is formed at a very dense pitch; and a second segment on the inner side of the first segment, which is compared to the first segment The equidistant spacing is formed at equal intervals; and a third segment is formed on the inner side of one of the second segments, which is formed at a greater spacing than the distance between the second segments. Figure 9B illustrates the segmented spiral trajectory pattern having a fourth segment formed at equal intervals, outside of one of the first segments, the spacing being greater than the segmented spiral pattern of Figure 9A. The distance between the first paragraph. In addition to the patterns illustrated in Figure 9, it is apparent that a variety of such segmented patterns can be formed.

It will be apparent to those skilled in the art that various modifications and changes can be made in the present invention without departing from the spirit and scope of the invention. Therefore, if such changes and changes are in the scope of the appended claims and their equivalents The present invention covers such modifications and variations of the present invention.

[Industrial Application]

The present invention can be used to automatically generate a laser beam radiation trajectory directed to the mold portion of the semiconductor package in a semiconductor package fabrication process.

10‧‧‧Semiconductor package

11‧‧‧Mold part

12‧‧‧ solder ball mat

13‧‧‧through hole

20‧‧‧Laser beam radiation device

G‧‧‧ spacing

The diameter of the innermost track of Is‧‧‧

Os‧‧‧ diameter of the outermost track

OL‧‧‧ contour connection track

G _max ‧‧‧Maximum spacing

G _min ‧‧‧minimum spacing

These drawings are included to provide a further understanding of the disclosure, which is incorporated in and constitute a part of this application, and the specific embodiments of the disclosure, .

In the drawings: Figures 1 and 2 illustrate portions of the critical portion, each showing a process for forming a via, which is made in a conventional stacked package PoP type semiconductor package fabrication process The laser beam is directed to a mold portion of a semiconductor package.

3 illustrates a flow diagram showing the steps of a method of fabricating a laser beam radiation trace for fabricating a semiconductor package in accordance with a preferred embodiment of the present invention.

4 illustrates an equally spaced spiral trajectory pattern generated by an equally spaced spiral mode in the method for generating a laser beam radiation trajectory in FIG. 3, wherein FIGS. 4A and 4B illustrate one of the non-contour connecting trajectories in a counterclockwise direction. A clockwise unequal spiral trajectory pattern, and Figures 4C and 4D illustrate one of the contoured trajectories, one counterclockwise direction and one clockwise equal pitch spiral trajectory pattern.

Figure 5 illustrates an example of an incremental spiral trajectory pattern generated by one of the progressive spiral modes of one of the methods for generating a laser beam radiation trajectory in Figure 3.

Figure 6 illustrates an example of a decreasing spiral trajectory pattern generated by one of the progressive spiral modes in the method of generating a laser beam trajectory in Figure 3.

Figure 7 illustrates an example of a segmented spiral trajectory pattern by one of the segmented spiral modes in the method of generating a laser beam radiation trajectory in Figure 3. generate.

Figure 8 illustrates a flow chart showing the steps of a method of fabricating a semiconductor package to generate a laser beam radiation trajectory in accordance with another preferred embodiment of the present invention.

Figures 9(A) and (B) illustrate other examples of segmented spiral trajectory patterns generated by one of the methods used to generate a laser beam radiation trajectory in Figure 8.

Claims (21)

A method of fabricating a semiconductor package, the method comprising the steps of: disposing a semiconductor package to a processing location, the semiconductor package being integrally molded over a portion of a solder ball pad having a vertical circular cross section; and forming a via hole by a spiral track radiating a laser beam to a mold portion of the semiconductor package corresponding to the solder ball pad to expose a portion of the outer surface of each solder ball pad to the outside through the through hole, the spiral track being a spiral A complete circle formed by the continuous connection from the start point to the end point. The method of claim 1, wherein the spiral track comprises an equally spaced spiral pattern, wherein the spiral track is spaced from an inner end of the spiral track to an outer end of the spiral track. The method of claim 1, wherein the spiral trajectory comprises an increasing or decreasing spiral pattern, wherein the spacing of the spiral trajectory is gradually increasing or decreasing from one end of the spiral trajectory to one of the spiral trajectories Outer end. The method of claim 1, wherein the spiral trajectory comprises a segmented spiral pattern, wherein the spacing of the spiral trajectories varies with a portion of the spiral trajectory. The method of any one of claims 2 to 4, wherein the step of forming a through hole comprises radiating a ray along the spiral trajectory, that is, from one of the spiral trajectories to one of the spiral trajectories The beam is exposed to expose the solder ball pad. The method of any one of claims 2 to 4, wherein in the step of forming a through hole, one of the outermost tracks of the spiral track is connected as a circle. A method for fabricating a semiconductor package, the method comprising the steps of: disposing a molded semiconductor package to a processing location; forming a via in the lower semiconductor package to radiate a laser beam along a spiral track Exposing an upper portion of the outer surface of each solder ball pad to the outside through the through hole, the spiral track forming a complete circle continuously connected from the start point to the end point of the spiral; and laminating an upper semiconductor package on the lower semiconductor package Each solder ball pad exposed through the through hole of the lower semiconductor package is such that a solder ball is connected to the upper semiconductor package. The method of claim 7, wherein the spiral trajectory is formed such that when the laser beam is continuously radiated, the laser beam can move along the spiral trajectory. The method of claim 7, wherein the spiral The trajectory includes an equally spaced helical pattern, wherein the spacing of the helical trajectory is maintained from an inner end of the helical trajectory to an outer end of the helical trajectory. The method of claim 7, wherein the spiral trajectory comprises an increasing or decreasing spiral pattern, wherein the spacing of the spiral trajectory is gradually increasing or decreasing from one end of the spiral trajectory to one of the spiral trajectories Outer end. The method of claim 7, wherein the spiral track comprises a segmented spiral pattern, wherein an interval of the spiral track changes with a portion of the spiral track. The method of claim 9, wherein in the step of forming a through hole, one of the outermost tracks of the spiral track is connected as a circle. The method of claim 10, wherein in the step of forming a through hole, one of the outermost tracks of the spiral track is connected as a circle. In the method of claim 11, in the step of forming a through hole, one of the outermost tracks of the spiral track is connected as a circle. The method of claim 9, wherein the form The step of forming a through hole includes the step of exposing a laser beam to expose the solder ball pad along the spiral track, i.e., from one of the spiral tracks to the inside of the spiral track. The method of claim 10, wherein the step of forming a through hole comprises irradiating a laser beam along the spiral track, that is, from one of the spiral tracks to one of the spiral tracks, to expose the The steps of the solder ball pad. The method of claim 11, wherein the step of forming a through hole comprises irradiating a laser beam along the spiral track, that is, from one of the spiral tracks to one of the spiral tracks, to expose the The step of soldering the ball pad. A method for fabricating a semiconductor package, the method comprising: a first step of selecting a spiral trajectory pattern from a controller of a laser beam radiant device, the laser beam radiant device having a type stored according to a spiral trajectory pattern a plurality of spiral track patterns; a second step of generating a spiral track by inputting information of the selected spiral track pattern; a third step of inputting a laser beam radiation condition; and a fourth step of following a spiral The track radiates a laser beam to a mold portion of a semiconductor package, the spiral track forming a complete circle continuously connected from the start point to the end point of the spiral, thereby forming a through hole for passing The through hole exposes an upper portion of the outer surface of each solder ball pad. The method of claim 18, wherein the plurality of spiral trajectories are any of the following: an equally spaced spiral pattern, wherein the spacing of the spiral trajectories is maintained from one end of the spiral trajectory to One of the spiral tracks is external; a spiral pattern that gradually increases or decreases, wherein the interval of the spiral track is gradually increasing or decreasing from the inner end to the outer end; and a segmented spiral pattern in which the spiral track is spaced (G) changes as a part of the spiral trajectory. The method of claim 18, wherein the first to fourth steps are repeatedly performed at least once, wherein the mutually different spiral trajectory patterns are generated according to the number of repetitions. The method of any one of claims 2 to 4, wherein the step of forming a through hole comprises radiating a ray along the spiral trajectory, that is, from inside one of the spiral trajectories to outside one of the spiral trajectories The beam is exposed to expose the solder ball pads.