CN110153555A - Laser machine control method, device and the electronic equipment of rotary-cut scanning track - Google Patents

Laser machine control method, device and the electronic equipment of rotary-cut scanning track Download PDF

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Publication number
CN110153555A
CN110153555A CN201910527180.1A CN201910527180A CN110153555A CN 110153555 A CN110153555 A CN 110153555A CN 201910527180 A CN201910527180 A CN 201910527180A CN 110153555 A CN110153555 A CN 110153555A
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CN
China
Prior art keywords
rotary
cut
circle
increment
scale factor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201910527180.1A
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Chinese (zh)
Inventor
宋利强
李朋
姜宝宁
杨小君
赵华龙
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Xi'an Zhongke Micromach Photon Manufacturing Science And Technology Co Ltd
Original Assignee
Xi'an Zhongke Micromach Photon Manufacturing Science And Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Xi'an Zhongke Micromach Photon Manufacturing Science And Technology Co Ltd filed Critical Xi'an Zhongke Micromach Photon Manufacturing Science And Technology Co Ltd
Priority to CN201910527180.1A priority Critical patent/CN110153555A/en
Publication of CN110153555A publication Critical patent/CN110153555A/en
Pending legal-status Critical Current

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08Devices involving relative movement between laser beam and workpiece
    • B23K26/0823Devices involving rotation of the workpiece
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/38Removing material by boring or cutting
    • B23K26/382Removing material by boring or cutting by boring
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70Auxiliary operations or equipment
    • B23K26/702Auxiliary equipment

Abstract

The present invention is applicable in rotary-cut scanning laser capillary processing technical field, provide control method, device and the electronic equipment of a kind of laser processing rotary-cut scanning track, this method comprises: obtaining the scale factor of sweep parameter and setting, the sweep parameter includes becoming half collar number, wedge start angle, wedge angle at the end;The wedge deflection angle increment of each circle when being scanned according to the sweep parameter and the scale factor calculation rotary-cut;The rotary-cut scanning of each circle is carried out according to the wedge deflection angle increment.The controllability of rotary-cut scanning track, keeps the spacing between inner ring circle segment and circle bigger when this method and device can effectively improve laser processing, so that reasonable distribution laser power, optimizes the effect damaged to wall when playing to inner ring rotary-cut scanning.

Description

Laser machine control method, device and the electronic equipment of rotary-cut scanning track
Technical field
The invention belongs to rotary-cut scanning laser capillary processing technical fields more particularly to a kind of laser processing rotary-cut to scan rail Control method, device and the electronic equipment of mark.
Background technique
Laser processing technology possesses the unrivaled advantage of conventional machining techniques, therefore more and more Precision Machinings use Laser processing technology.Currently, laser micropore processing mainly has percussion drilling and rotary-cut scanning punching two ways.Percussion drilling letter List is easy to operate but can damage non-processing region, and rotary-cut scanning punching can reduce influence of the laser to non-processing region, beat Hole effect is more preferable.Therefore, laser micropore manufacture field mostly uses rotary-cut scanning punching.
Rotary-cut scanning punching mostly uses double wedges, three wedges, four wedges, wedge group cooperation plate glass group and road power and influence Mirror etc..Rotary-cut scanning is by the angle change between wedge, and control laser beam is by the angle of emergence variation after wedge, thus adding A rotary-cut scanning helix is formed on work face, realizes capillary processing.Compared with percussion drilling, laser on machining area according to Helix is scanned, therefore rotary-cut scanning is small to the place destruction other than machining area, and processing effect is more preferable.
In existing rotary-cut scanning cheesing techniques, since the output power of laser is constant, track can not be scanned to rotary-cut Effective Regulation is carried out, so that the radius increment between scanning helix circle and circle is difficult to.In rotary-cut scanning process, rotary-cut The rotation speed of scanning means is basically unchanged, then the rotational time of every circle is almost the same, it is constant in the output power of laser When, the laser energy on inner ring unit area will be higher than outer ring, it may appear that rotary-cut scanning helix inner round portion is than outer ring portion Divide the case where first punching, causes to damage wall.
Summary of the invention
The purpose of the present invention is to provide control method, device and the electronics of a kind of laser processing rotary-cut scanning track to set It is standby, it is intended to the controllability of rotary-cut scanning track not high technical problem when solving to laser machine in the prior art.
In a first aspect, the present invention provides a kind of control methods of laser processing rotary-cut scanning track, comprising:
Obtain the scale factor of sweep parameter and setting, the sweep parameter include become half collar number, wedge start angle, Wedge angle at the end;
The wedge deflection angle increment of each circle when being scanned according to the sweep parameter and the scale factor calculation rotary-cut;
The rotary-cut scanning of each circle is carried out according to the wedge deflection angle increment.
Preferably, radius increment the ratio between of the scale factor between adjacent turn, it is described according to the sweep parameter and The step of wedge deflection angle increment of each circle, includes: when scale factor calculation rotary-cut scanning
According to the sweep parameter and the radius increment of each circle of the scale factor calculation;
The wedge deflection angle increment of each circle when rotary-cut scans is calculated according to the radius increment of each circle.
Preferably, the scale factor can also the ratio between the ratio between radius increment between adjacent turn, perimeter increment or area The ratio between increment.
Second aspect, the present invention provides a kind of control devices of laser processing rotary-cut scanning track, comprising:
Parameter acquisition module, for obtaining the scale factor of sweep parameter and setting, the sweep parameter includes becoming radius Enclose number, wedge start angle, wedge angle at the end;
Angle step computing module, it is each when for being scanned according to the sweep parameter and the scale factor calculation rotary-cut The wedge deflection angle increment of circle;
Rotary-cut scan module, the rotary-cut for carrying out each circle according to the wedge deflection angle increment scan.
Preferably, the angle step computing module includes:
Radius increment computing unit, for being increased according to the radius of the sweep parameter and each circle of the scale factor calculation Amount;
Angle step computing unit, the wedge for calculating each circle when rotary-cut scans according to the radius increment of each circle are inclined Gyration increment.
The third aspect, the present invention also provides a kind of electronic equipment, comprising:
Processor;And
The memory being connect with the processor communication;Wherein,
The memory is stored with readable instruction, and the readable instruction realizes such as first when being executed by the processor Method described in aspect.
Fourth aspect, the present invention also provides a kind of computer readable storage mediums, are stored thereon with computer program, It is characterized in that, the computer program realizes method as described in relation to the first aspect when executed.
The control method of laser processing rotary-cut scanning track shown in the present invention can obtain sweep parameter and setting After scale factor, the wedge deflection angle increment of each circle when being scanned according to sweep parameter and scale factor calculation rotary-cut, in turn The rotary-cut scanning that each circle is carried out according to wedge deflection angle increment, rotary-cut scanning track when effectively improving laser processing Controllability keeps the spacing between inner ring circle segment and circle bigger, so that reasonable distribution laser power, plays and sweep to inner ring rotary-cut Optimize the effect damaged to wall when retouching.
Detailed description of the invention
Fig. 1 is the implementation flow chart of the wireless monitoring method of the cultural relics in the collection of cultural institution Conservation environment shown in the embodiment of the present invention one.
Fig. 2 is the schematic diagram of the rotary-cut scanning track shown in the embodiment of the present invention one.
Fig. 3 be scale factor shown according to an exemplary embodiment be 0.7 when rotary-cut scan track radius change Tendency chart.
Fig. 4 is the block diagram of the control device of the laser processing rotary-cut scanning track shown in the embodiment of the present invention two.
Specific embodiment
In order to make the objectives, technical solutions, and advantages of the present invention clearer, with reference to the accompanying drawings and embodiments, right The present invention is further elaborated.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, and It is not used in the restriction present invention.
Specific implementation of the invention is described in detail below in conjunction with specific embodiment:
Embodiment one:
Attached drawing 1 is the implementation flow chart of the control method of the laser processing rotary-cut scanning track shown in embodiment one.Implement The control method of laser processing rotary-cut scanning track shown in example one is suitable for controlling the electronic equipment of laser processing rotary-cut scanning In, processor is set in electronic equipment, and rotary-cut when being laser machined with controlling scans track.For ease of description, only show Go out part related to the embodiment of the present invention, details are as follows:
Step S110, obtains the scale factor of sweep parameter and setting, and the sweep parameter includes becoming half collar number, wedge Start angle, wedge angle at the end.
Sweep parameter relevant control parameter when being control laser processing rotary-cut scanning.Sweep parameter includes becoming half collar Number, wedge start angle, wedge angle at the end.
Become half collar number and scans the spiral winding number to form scanning disc into every layer of rotary-cut;Wedge start angle is wedge rotation Cut angle when scanning starts, the innermost circle corresponding to spiral scan trajectory;Wedge angle at the end is that wedge rotary-cut scans single layer At the end of angle, the outmost turns corresponding to spiral scan trajectory.
Normally, rotary-cut scanning cheesing techniques by become half collar number, wedge start angle, wedge angle at the end these three Sweep parameter controls the track of rotary-cut scanning.In entire scanning process, since rotary-cut scanning revolving speed is higher, it is difficult in required position The output power for being accurately controlled laser is set, so the output power of laser remains unchanged.
Rotary-cut scans the controllability of track when to improve laser processing, increases new control parameter --- scale factor.Than The example factor is the track regulation parameter of rotary-cut scanning helix, can control rotary-cut scanning helix by adjusting scale factor Density distribution.
Scale factor can the ratio between radius increment between adjacent turn, can also the ratio between perimeter increment between adjacent turn or The ratio between area increase can also be the control parameter of other forms.It can control rotary-cut scanning helix by adjusting scale factor Density distribution, to improve the controllability of the scanning of rotary-cut when laser processing track.
Step S120, the wedge of each circle deflects when being scanned according to the sweep parameter and the scale factor calculation rotary-cut Angle step.
Helix density degree in track is scanned by adjusting the adjustable entire rotary-cut of scale factor.
Specifically, when radius increment the ratio between of the scale factor between adjacent turn, according to the sweep parameter and the ratio The example factor calculates the radius increment of each circle, and then the wedge of each circle when rotary-cut scans is calculated according to the radius increment of each circle Deflection angle increment.
Rotary-cut scans track as shown in Fig. 2, radius increment d of the scale factor between adjacent turnrThe ratio between, if circle and circle Between spacing be drn(drn=Rn-Rn-1, n=1,2,3 ... n), d can be regulated and controled by the Set scale factorrVariation tendency, So that rotary-cut scanning track is adjustable.
Specifically, scale factor can make drIt is distributed according to Geometric Sequence, changes scale factor, radius increment drIt is formed Ordered series of numbers will change, the density degree of helix will change.
For example, scale factor is the common ratio q of Geometric Sequence.When the common ratio q using Geometric Sequence is scale factor, drn= dr1*qn, the track of rotary-cut scanning helix can be adjusted by changing q value.
After setting becomes half collar number, wedge start angle, wedge angle at the end and scale factor, by calculating rotary-cut scanning Each circle wedge deflection angle increment, and control rotary-cut scanning means according to the wedge deflection angle increment being calculated into Row rotary-cut scanning.If double wedge systems control the angle step that a wedge increase is calculated when individual pen rotates, another Wedge reduces the angle step being calculated, to control deflection angle increase and decrease of the laser after wedge.
It is almost the same in the rotary-cut scanning individual pen time, in the case where laser output power is constant, inner ring unit area On laser energy be higher than outer ring, it is possible to make the d of inner ringrBigger, i.e. the setting ratio factor makes rotary-cut scan spiral shell less than 1 Spin line outer perimeter section is closeer, and inner round portion is thinner, to achieve the purpose that optimization damages wall.
Fig. 3 be scale factor shown according to an exemplary embodiment be 0.7 when rotary-cut scan track radius change Tendency chart.Inner radii variation faster, makes in inner ring circle segment and circle in rotary-cut scanning of the present invention track as seen from Figure 3 Between spacing it is bigger, thus reasonable distribution laser power, optimize the effect damaged to wall when playing to inner ring rotary-cut scanning.
In specific practical application, takes the rotary-cut of the present embodiment to scan the adjustable control method in track, give scale factor Set numerical value less than 1, control rotary-cut scanning means operating, technique draws a design test, and longitudinally cutting is checked in punching on exemplar Shape, and the value of scale factor using dichotomy is determined according to technique test effect of drawing a design, if inner round portion is compared with outer ring depth, reduce Scale factor improves scale factor value if opposite, until obtaining suitable scale factor value.
Step S130 is scanned according to the rotary-cut that the wedge deflection angle increment carries out each circle.
Using method as described above, after obtaining the scale factor of sweep parameter and setting, according to sweep parameter and ratio The example factor calculates the wedge deflection angle increment of each circle when rotary-cut scanning, and then each according to the progress of wedge deflection angle increment The rotary-cut of circle scans, and the controllability of rotary-cut scanning track, makes in inner ring circle segment and circle when effectively improving laser processing Between spacing it is bigger, thus reasonable distribution laser power, optimize the effect damaged to wall when playing to inner ring rotary-cut scanning.
Embodiment two:
Fig. 4 shows the block diagram of the control device of laser processing rotary-cut scanning track provided by Embodiment 2 of the present invention, is Convenient for explanation, only parts related to embodiments of the present invention are shown, including:
Parameter acquisition module 110, for obtaining the scale factor of sweep parameter and setting, the sweep parameter includes becoming half Collar number, wedge start angle, wedge angle at the end;
Angle step computing module 120, when for being scanned according to the sweep parameter and the scale factor calculation rotary-cut The wedge deflection angle increment of each circle;
Rotary-cut scan module 130, the rotary-cut for carrying out each circle according to the wedge deflection angle increment scan.
Optionally, when radius increment the ratio between of the scale factor between adjacent turn, angle step computing module 120 includes:
Radius increment computing unit 121, for according to the half of the sweep parameter and each circle of the scale factor calculation Diameter increment;
Angle step computing unit 122, for calculating the light of each circle when rotary-cut scans according to the radius increment of each circle Wedge deflection angle increment.
Optionally, scale factor can also the ratio between the ratio between radius increment between adjacent turn, perimeter increment or area increase The ratio between.
In embodiments of the present invention, each module of the control device of laser processing rotary-cut scanning track can be by corresponding hard Part or software unit realize that each module can be independent soft and hardware module, also can integrate as a soft and hardware unit, This is not to limit the present invention.The specific embodiment of each module can refer to the description of embodiment one, and details are not described herein.
Embodiment three:
Embodiment three provides a kind of electronic equipment, executes all or part of step shown in above-described embodiment one.It should Electronic equipment includes:
At least one processor;And
The memory being connect at least one described processor communication;Wherein,
The memory is stored with the instruction that can be executed by least one described processor, and described instruction is by described at least one A processor executes, so that at least one described processor is able to carry out the method as described in any of the above-described exemplary embodiments.
The concrete mode that processor executes operation in equipment in the embodiment is swept in the related laser processing rotary-cut It retouches and performs detailed description in the embodiment of the control method of track, no detailed explanation will be given here.
Optionally, embodiment three additionally provides a kind of storage medium, which is computer readable storage medium, example It such as can be the provisional and non-transitorycomputer readable storage medium for including instruction.The storage medium is for example including instruction Memory 102, above-metioned instruction can be executed by the processor 109 of equipment 100 to complete above-mentioned laser processing rotary-cut scanning track Control method.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all in essence of the invention Made any modifications, equivalent replacements, and improvements etc., should all be included in the protection scope of the present invention within mind and principle.

Claims (8)

1. a kind of control method of laser processing rotary-cut scanning track, which is characterized in that the described method includes:
The scale factor of sweep parameter and setting is obtained, the sweep parameter includes becoming half collar number, wedge start angle, wedge Angle at the end;
The wedge deflection angle increment of each circle when being scanned according to the sweep parameter and the scale factor calculation rotary-cut;
The rotary-cut scanning of each circle is carried out according to the wedge deflection angle increment.
2. the method as described in claim 1, which is characterized in that radius increment of the scale factor between adjacent turn it Than the wedge deflection angle increment of the circle each when being scanned according to the sweep parameter and the scale factor calculation rotary-cut Step includes:
According to the sweep parameter and the radius increment of each circle of the scale factor calculation;
The wedge deflection angle increment of each circle when rotary-cut scans is calculated according to the radius increment of each circle.
3. method according to claim 2, which is characterized in that the scale factor can also perimeter increment between adjacent turn The ratio between or the ratio between area increase.
4. a kind of control device of laser processing rotary-cut scanning track, which is characterized in that described device includes:
Parameter acquisition module, for obtaining the scale factor of sweep parameter and setting, the sweep parameter include become half collar number, Wedge start angle, wedge angle at the end;
Angle step computing module, each circle when for according to the sweep parameter and scale factor calculation rotary-cut scanning Wedge deflection angle increment;
Rotary-cut scan module, the rotary-cut for carrying out each circle according to the wedge deflection angle increment scan.
5. device as claimed in claim 4, which is characterized in that the angle step computing module includes:
Radius increment computing unit, for the radius increment according to the sweep parameter and each circle of the scale factor calculation;
Angle step computing unit, for calculating the wedge deflection angle of each circle when rotary-cut scans according to the radius increment of each circle Spend increment.
6. method as claimed in claim 4, which is characterized in that the scale factor can also radius increment between adjacent turn The ratio between, the ratio between perimeter increment or the ratio between area increase.
7. a kind of electronic equipment, which is characterized in that the electronic equipment includes:
Processor;And
The memory being connect with the processor communication;Wherein,
The memory is stored with readable instruction, and the readable instruction realizes such as claim when being executed by the processor The described in any item methods of 1-3.
8. a kind of computer readable storage medium, is stored thereon with computer program, which is characterized in that the computer program The method according to claim 1 is realized when executed.
CN201910527180.1A 2019-06-18 2019-06-18 Laser machine control method, device and the electronic equipment of rotary-cut scanning track Pending CN110153555A (en)

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Application Number Priority Date Filing Date Title
CN201910527180.1A CN110153555A (en) 2019-06-18 2019-06-18 Laser machine control method, device and the electronic equipment of rotary-cut scanning track

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110977153A (en) * 2019-11-13 2020-04-10 中国科学院西安光学精密机械研究所 Control method of spiral scanning laser processing head
CN111001928A (en) * 2019-12-24 2020-04-14 西安中科微精光子制造科技有限公司 Light beam scanning device for laser micropore processing
CN111659766A (en) * 2020-06-11 2020-09-15 西安中科微精光子制造科技有限公司 Correction method and correction device applied to workpiece hole making position
CN113828932A (en) * 2021-10-20 2021-12-24 广东中科微精光子制造科技有限公司 Surface high-integrity micropore machining method and system based on laser hole making

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6355907B1 (en) * 1997-09-18 2002-03-12 Robert Bosch Gmbh Optical device for boring using a laser beam
DE10105346A1 (en) * 2001-02-05 2002-08-29 Forschungsgesellschaft Fuer St Helical cutting of holes in workpieces, involves rotating pulsed laser beam plane of polarization during beam movement so it is always at same angle to linearly machined cut surface
DE102007032231A1 (en) * 2007-07-11 2009-01-15 3D-Micromac Ag Laser micro-machining system hole cutter has beam source and an optical unit that sets up rotation and oscillation
CN102292797A (en) * 2009-02-23 2011-12-21 韩美半导体株式会社 Method for generating laser beam irradiation trajectory
KR20140028197A (en) * 2012-08-27 2014-03-10 주식회사 엘티에스 Apparatus for helical drilling using laser
CN104981317A (en) * 2012-12-04 2015-10-14 埃瓦格股份公司 Laser machining device and method for machining workpiece by using laser machining device
CN106312335A (en) * 2016-09-14 2017-01-11 张立国 Laser drilling and drilled-hole filling system and method
CN106425122A (en) * 2016-12-05 2017-02-22 清华大学 Device and method for laser rotary-cut processing
CN108067730A (en) * 2018-01-08 2018-05-25 西安中科微精光子制造科技有限公司 For lens type light-beam scanner, system and the beam scanning method of laser micropore processing
CN108890151A (en) * 2018-07-19 2018-11-27 深圳市吉祥云科技有限公司 A kind of photovoltaic glass drilling method

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6355907B1 (en) * 1997-09-18 2002-03-12 Robert Bosch Gmbh Optical device for boring using a laser beam
DE10105346A1 (en) * 2001-02-05 2002-08-29 Forschungsgesellschaft Fuer St Helical cutting of holes in workpieces, involves rotating pulsed laser beam plane of polarization during beam movement so it is always at same angle to linearly machined cut surface
DE102007032231A1 (en) * 2007-07-11 2009-01-15 3D-Micromac Ag Laser micro-machining system hole cutter has beam source and an optical unit that sets up rotation and oscillation
CN102292797A (en) * 2009-02-23 2011-12-21 韩美半导体株式会社 Method for generating laser beam irradiation trajectory
KR20140028197A (en) * 2012-08-27 2014-03-10 주식회사 엘티에스 Apparatus for helical drilling using laser
CN104981317A (en) * 2012-12-04 2015-10-14 埃瓦格股份公司 Laser machining device and method for machining workpiece by using laser machining device
CN106312335A (en) * 2016-09-14 2017-01-11 张立国 Laser drilling and drilled-hole filling system and method
CN106425122A (en) * 2016-12-05 2017-02-22 清华大学 Device and method for laser rotary-cut processing
CN108067730A (en) * 2018-01-08 2018-05-25 西安中科微精光子制造科技有限公司 For lens type light-beam scanner, system and the beam scanning method of laser micropore processing
CN108890151A (en) * 2018-07-19 2018-11-27 深圳市吉祥云科技有限公司 A kind of photovoltaic glass drilling method

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110977153A (en) * 2019-11-13 2020-04-10 中国科学院西安光学精密机械研究所 Control method of spiral scanning laser processing head
CN111001928A (en) * 2019-12-24 2020-04-14 西安中科微精光子制造科技有限公司 Light beam scanning device for laser micropore processing
CN111001928B (en) * 2019-12-24 2020-09-25 西安中科微精光子制造科技有限公司 Light beam scanning device for laser micropore processing
CN111659766A (en) * 2020-06-11 2020-09-15 西安中科微精光子制造科技有限公司 Correction method and correction device applied to workpiece hole making position
CN111659766B (en) * 2020-06-11 2022-03-22 西安中科微精光子制造科技有限公司 Correction method and correction device applied to workpiece hole making position
CN113828932A (en) * 2021-10-20 2021-12-24 广东中科微精光子制造科技有限公司 Surface high-integrity micropore machining method and system based on laser hole making

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