CN113828932A - Surface high-integrity micropore machining method and system based on laser hole making - Google Patents
Surface high-integrity micropore machining method and system based on laser hole making Download PDFInfo
- Publication number
- CN113828932A CN113828932A CN202111224658.7A CN202111224658A CN113828932A CN 113828932 A CN113828932 A CN 113828932A CN 202111224658 A CN202111224658 A CN 202111224658A CN 113828932 A CN113828932 A CN 113828932A
- Authority
- CN
- China
- Prior art keywords
- scanning
- laser
- layer
- etching
- laser emitter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
Abstract
The invention discloses a surface high-integrity micropore machining method and system based on laser hole making, wherein the method comprises the following steps: providing a laser emitter, wherein the laser emitter can emit etching laser which is subjected to layer-by-layer planar scanning and longitudinal feeding so as to form a hole at a target position on a workpiece in a layer-by-layer flat-bottom advancing mode; controlling the scanning path of the laser emitter on each scanning layer, so that the etching laser emitted by the laser emitter rotationally moves along the spiral track line on each scanning layer to form a spiral etching line comprising a plurality of circular scanning turns on each scanning layer of the workpiece; the hole machining method adopts a spiral scanning mode to perform hole machining, so that the material removing force of each circle and the acting time of each laser and the material are ensured to be the same, higher machining efficiency can be obtained due to larger energy density distribution of etching laser in the feeding direction, and the integrity of the surface of the hole can be effectively improved through spiral scanning.
Description
Technical Field
The invention relates to the technical field of laser hole making, in particular to a surface high-integrity micropore machining method and system based on laser hole making.
Background
At present, high-efficiency hole making is generally carried out on a non-transparent material by adopting a high-power laser punching mode, the laser punching is a thermal action process, part of the material is discharged out of a hole cavity after being gasified, part of the material is cooled and solidified to form a recast layer, and even microcracks are caused by temperature difference, so that the quality of the surface and the inner wall of the hole becomes worse. When the femtosecond laser processing technology is used for processing the micropores, due to the extremely high peak power caused by the narrow pulse width of the micropore, the material can be discharged in a plasma mode, and the surface and the inner wall of the micropore have good quality by matching with good process parameters. However, the current femtosecond laser hole making technology generally has a small power value, and cannot raise the power without limitation in order to meet the requirement of hole surface integrity, so that the hole processing efficiency is low, and a planar circular ring scanning track is adopted, as shown in fig. 5, the material removal rate and the shaft feeding rate are not matched in the depth feeding direction, and the application requirement of high-efficiency group hole processing is not met.
Disclosure of Invention
The invention aims to provide a surface high-integrity micropore machining method and system based on laser hole machining, which can realize high-efficiency hole machining while meeting the high integrity of the surface of a hole.
In order to achieve the purpose, the invention discloses a surface high-integrity micropore machining method based on laser hole making, which comprises the following steps:
providing a laser emitter, wherein the laser emitter can emit etching laser which can carry out layer-by-layer planar scanning and longitudinal feeding so as to form a hole at a target position on a workpiece in a layer-by-layer flat-bottom advancing mode;
and controlling the scanning path of the laser emitter on each scanning layer, so that the etching laser emitted by the laser emitter rotationally moves along a spiral track line on each scanning layer to form a spiral etching line comprising a plurality of ring scanning turns on each scanning layer of the workpiece.
Preferably, the processing angle of the etching laser emitted by the laser transmitter relative to the front scanning plane is controlled so that the processing angle is progressively changed as the number of ring scans increases.
Preferably, according to the preset starting value and the preset ending value of the machining angle, the machining angle is changed progressively in an equal amount along with the increase of the number of ring sweeping turns.
Preferably, the progressive variation of the machining angle relative to the number of ring sweeps
According to the following formula one,
wherein δ 1 is a starting value of the machining angle, δ 2 is an ending value of the machining angle, and N is a number of sweeping circles.
Preferably, the plane scanning speed SP of the laser transmitter is obtained according to the following formula two, formula three and formula four,
SP ═ L/T (formula two)
Wherein D is the thread pitch of the spiral etching line, D is the processing aperture, D1 is the initial aperture of the spiral etching line, K is the preset number of scanning layers, pi is a circumferential rate constant, and T is a preset processing time constant.
Preferably, the longitudinal feeding distance of the etching laser emitted by the laser emitter to each scanning layer can be adjusted at will.
Preferably, the feeding distance of the etching laser in the front scanning layers of the workpiece is larger than that of the rear scanning layers.
The invention also discloses a surface high-integrity micropore machining system based on laser hole making, which comprises a laser emitter and a control system electrically connected with the laser emitter, wherein the laser emitter is used for emitting etching laser for layer-by-layer plane scanning and longitudinal feeding so as to make a hole at a target position on a machined part in a layer-by-layer flat bottom advancing mode;
the control system is used for controlling the scanning path of the laser emitter on each scanning layer, so that the etching laser emitted by the laser emitter rotationally moves along a spiral track line on each scanning layer to form a spiral etching line comprising a plurality of circle scanning turns on each scanning layer of the workpiece.
Preferably, the control system can also control the processing angle of the etching laser emitted by the laser emitter relative to the front scanning plane, so that the processing angle is gradually changed along with the increase of the number of ring scanning circles.
Preferably, the control system is preset with a starting value and an ending value of the machining angle, and the machining angle is changed progressively in an equal amount along with the increase of the number of ring sweeping turns.
Compared with the prior art, the hole processing method has the advantages that the scanning path of the laser emitter is controlled, etching laser emitted by the laser emitter rotates and moves along a spiral track line, so that the traditional plane circular ring scanning track is changed, hole making work is carried out in a spiral scanning mode, the spiral scanning can ensure that the material removing force of each circle and the acting time of each position of the laser and the material are the same, and the spiral scanning longitudinal non-jumping type feeding is added.
Drawings
FIG. 1 is a schematic diagram of a spiral etching line formed on any one scanning layer by an etching laser according to an embodiment of the present invention.
Fig. 2 is a schematic view of the principle of layer-by-layer planar scanning and longitudinal feeding in the embodiment of the invention.
Fig. 3 is a schematic view of a progressive feeding structure of a scan layer according to an embodiment of the present invention.
Fig. 4 is a schematic view of a progressive feeding structure of a scan layer according to another embodiment of the present invention.
FIG. 5 is a schematic diagram of a planar spiral scan formed by an etching laser on any one scanning layer in the prior art.
Detailed Description
In order to explain technical contents, structural features, and objects and effects of the present invention in detail, the following detailed description is given with reference to the accompanying drawings in conjunction with the embodiments.
The embodiment discloses a method for processing a surface high-integrity micropore based on laser hole making, which is used for processing a workpiece by a laser hole making process to obtain a micropore with high surface integrity, and specifically, as shown in fig. 1 and 2, the method for processing the micropore comprises the following steps:
providing a laser emitter, wherein the laser emitter can emit etching laser which is subjected to layer-by-layer planar scanning and longitudinal feeding so as to form a hole at a target position on a workpiece in a layer-by-layer flat-bottom advancing mode;
and controlling the scanning path of the laser emitter on each scanning layer, so that the etching laser emitted by the laser emitter rotationally moves along the spiral track line on each scanning layer to form a spiral etching line P comprising a plurality of circular scanning turns on each scanning layer of the workpiece.
In this embodiment, the specific structure of the laser emitter and the specific mechanism for driving the laser emitter to move are common knowledge in the art, and are not described herein again.
When the micropore machining method is adopted to conduct micropore machining on a machined part, the laser emitter conducts layer-by-layer plane scanning on the target position of the machined part, one layer is completed through scanning, and longitudinal feeding is conducted once, so that scanning of the next layer is conducted until the machined part penetrates through the micropore machining method. In each scanning layer, the scanning path of the laser emitter is controlled to rotationally move along the spiral track line, so that a spiral etching line P comprising a plurality of circle scanning turns is formed on the scanning layer. Therefore, the hole making work is carried out by adopting a spiral scanning mode, the spiral scanning can ensure that the material removing force of each circle is the same as the acting time of each laser and the material, and the spiral scanning longitudinal non-jumping type feeding is added, so that the hole punching is finished after the last layer of material of the longitudinal material is removed instantly, the hole punching can be considered as synchronously penetrating the center and the edge of the hole, and the higher processing efficiency can be obtained due to the larger energy density distribution of the material in the feeding direction. Moreover, because the center of the spiral scanning track has the characteristics of defocusing spot scanning and low linear velocity, and the edge of the hole has the characteristics of focusing spot scanning and high linear velocity, under the interaction of the two, the whole hole is pushed in a flat bottom mode, and the defects of slag hanging, burrs, recasting layers, microcracks and the like which influence the surface integrity can not be generated, so that the surface integrity of the hole is improved. For example, 0.1mm of micropores are formed on a stainless steel sheet with the thickness of 1mm, high laser energy (150uJ-200uJ) is utilized to match with high scanning speed (15000-22000rpm), a dimensional spiral scanning track is arranged for hole forming, 0.4MPa of compressed gas is used for auxiliary slag removal, feeding is carried out in the depth direction by matching with a feeding shaft, and finally high-efficiency and high-integrity hole forming is realized on a non-transparent material.
In the process flow of laser hole making, the emission angle of laser also plays an extremely important role, and the traditional laser is emitted out in a way of being vertical to a processing surface, but the phenomenon of relatively serious edge sweeping can be caused, so that the hole edge on the front surface is excessively ablated, the property of materials around the hole is damaged due to the influence on the aperture precision, and the quality of the micropore is influenced to a great extent due to the change of the incidence angle. In view of the above, in another preferred embodiment of the micro-hole processing method of the present invention, the processing angle of the etching laser emitted from the laser emitter relative to the front scanning plane may be controlled such that the processing angle is gradually changed as the number of ring scans increases. The processing angle in this embodiment refers to an angle between the etching laser and a perpendicular to a plane where the current scanning layer is located, that is, an inclination angle of the etching laser, and when the laser is emitted perpendicular to the processing surface, the processing angle is zero. Compared with vertical non-angle processing, the slight-angle inclination can eliminate ablation and edge sweeping phenomena generated by laser on the front surface of the material, especially in the processing of micropores with large depth-diameter ratio, the change of the inclination angle is particularly important, and in addition, the processing of a positive cone and an inverted cone is also conveniently realized by variable-angle processing.
Further, according to the preset initial value and the preset end value of the machining angle, the machining angle is changed in an equivalent progressive mode along with the increase of the number of the ring sweeping turns.
Further, the progressive variation of the machining angle relative to the number of ring sweeps
According to the following formula one,
wherein, δ 1 is the initial value of the machining angle, δ 2 is the end value of the machining angle, and N is the number of ring sweeping turns.
For example, the initial angle is set to be 0 °, the end angle is set to be-2 °, the number of ring scans is set to be 5, and then the progressive variation per one turn is 0.4 °, that is, in the laser helical scanning process, the machining angle of the initial turn is 0.4 °, the machining angle of the second turn is 0.8 °, the machining angle of the third turn is 1.2 °, the machining angle of the fourth turn is 1.6 °, and the machining angle of the fifth turn is 2 °.
Moreover, the action time of the laser and the material is determined by the plane spiral scanning speed, the shorter the action time of the laser and the material is when the aperture is fixed, the lower the material removing capability is, and the longer the action time is, the slower the scanning speed is, the higher the material removing capability is. In order to realize efficient processing, the processing of the holes is completed in as short a time as possible, and the hole diameter and the quality of the holes are ensured, so that a proper scanning speed is selected, and the material with too high speed is not completely removed, so that residues and attached slag are caused; in another preferred embodiment of the method for processing the micro-holes, the processing speed is properly increased while the high-power laser and the high-repetition-frequency laser are matched, so that the quality of the micro-holes is improved. Specifically, the plane scanning speed SP of the laser transmitter is obtained according to the following formula two, formula three and formula four,
SP ═ L/T (formula two)
Wherein D is the thread pitch of the spiral etching line P, D is the processing aperture, D1 is the initial aperture of the spiral etching line P, K is the preset number of scanning layers, pi is the circumference constant, and T is the preset processing time constant.
Further, by adopting the hole machining method, the longitudinal machining position can be adjusted according to requirements, so that the laser action point can be fed layer by layer along the longitudinal direction to enable the surface of the material to be a machining surface (a focus or an optimal defocusing position) all the time. The longitudinal feeding distance of the etching laser emitted by the laser emitter to each scanning layer can be adjusted at will, and the scanning mode has the advantage that the processing mode of multiple circles and multiple layers of different processes can be realized at one time in the same process procedure. As shown in fig. 3, in the longitudinal processing, the feeding distances d1 and d2 of the etching laser in the front scanning layers of the workpiece are greater than the feeding distances d3, d4, d5 and d6 in the rear scanning layers, that is, the front scanning layer is arranged sparsely, and the rear scanning layer is arranged densely, so that the capability of removing the front surface material can be improved, the processing of the bottom layer is finer, slag removal of the back surface hole is facilitated, and the edge sweeping is reduced. In addition, as shown in fig. 4, the feeding distance of the etching laser for each scanning layer can be set to be the same according to the specific process requirements, and the processing mode realizes the integrity and uniformity of one-time material removal.
In summary, as shown in fig. 1 to 4, the present invention discloses a micro-hole processing method, in which a spiral scanning is used to replace a conventional circular scanning on each scanning layer, and a planar two-dimensional spiral scanning is performed first during punching, and then a longitudinal feeding is performed to form a three-dimensional spiral punching process. The spiral line from inside to outside is the sequence of the laser acting on the surface of the material, the spiral line is expanded from the center to the outside, the interval of the expanded spiral track, namely the pitch, can be set to any value larger than 0, the spiral coil is expanded to the outermost side, the spiral coil can longitudinally step to the next layer to walk from the outside to the inside, then the feeding mode of the first layer is executed to the next layer for reciprocating circulation again, and of course, the spiral coil can also jump to the center of the second layer after the first layer is executed, namely, each layer is scanned according to the scanning mode from the inside to the outside.
The invention also discloses a surface high-integrity micropore machining system based on laser hole making, which comprises a laser emitter and a control system electrically connected with the laser emitter. The laser emitter is used for emitting etching laser which is scanned layer by layer in a plane manner and fed longitudinally, and drilling a hole at a target position on a workpiece in a layer-by-layer flat-bottom advancing manner;
and the control system is used for controlling the scanning path of the laser emitter on each scanning layer, so that the etching laser emitted by the laser emitter rotationally moves along the spiral track line on each scanning layer to form a spiral etching line P comprising a plurality of ring scanning turns on each scanning layer of the workpiece. In this embodiment, the working principle and the working mode of the micro-hole processing system are described in detail in the micro-hole processing method, and are not described herein again.
The above disclosure is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the scope of the present invention, therefore, the present invention is not limited by the appended claims.
Claims (10)
1. A surface high-integrity micropore machining method based on laser hole making is characterized by comprising the following steps:
providing a laser emitter, wherein the laser emitter can emit etching laser which can carry out layer-by-layer planar scanning and longitudinal feeding so as to form a hole at a target position on a workpiece in a layer-by-layer flat-bottom advancing mode;
and controlling the scanning path of the laser emitter on each scanning layer, so that the etching laser emitted by the laser emitter rotationally moves along a spiral track line on each scanning layer to form a spiral etching line comprising a plurality of ring scanning turns on each scanning layer of the workpiece.
2. The method of claim 1, wherein the machining angle of the etching laser emitted by the laser emitter relative to the front scanning plane is controlled such that the machining angle is progressively changed as the number of ring scans increases.
3. The method of claim 2, wherein the machining angle is progressively changed by an equal amount as the number of ring passes increases according to the preset starting value and ending value of the machining angle.
4. The method of claim 3 wherein the progressive change in machining angle relative to the number of ring sweeps is a function of a number of machining angles
According to the following formula one,
wherein δ 1 is a starting value of the machining angle, δ 2 is an ending value of the machining angle, and N is a number of sweeping circles.
5. The method for processing the surface high-integrity micro-holes based on the laser drilling of claim 4, wherein the planar scanning speed SP of the laser emitter is obtained according to the following formula two, formula three and formula four,
SP ═ L/T (formula two)
Wherein D is the thread pitch of the spiral etching line, D is the processing aperture, D1 is the initial aperture of the spiral etching line, K is the preset number of scanning layers, pi is a circumferential rate constant, and T is a preset processing time constant.
6. The method for processing the surface high-integrity micro-holes based on the laser drilling is characterized in that the longitudinal feeding distance of the etching laser emitted by the laser emitter to each scanning layer can be adjusted at will.
7. The method of claim 6, wherein the etching laser is advanced a distance greater in the front scan layers than in the back scan layers of the workpiece.
8. The system for processing the surface high-integrity micropores based on the laser hole making is characterized by comprising a laser emitter and a control system electrically connected with the laser emitter, wherein the laser emitter is used for emitting etching laser for layer-by-layer plane scanning and longitudinal feeding so as to make holes at a target position on a workpiece in a layer-by-layer flat bottom advancing mode;
the control system is used for controlling the scanning path of the laser emitter on each scanning layer, so that the etching laser emitted by the laser emitter rotationally moves along a spiral track line on each scanning layer to form a spiral etching line comprising a plurality of circle scanning turns on each scanning layer of the workpiece.
9. The laser-based, high-integrity micro-via machining system for surfaces as claimed in claim 8 wherein the control system further controls the machining angle of the etching laser emitted by the laser emitter relative to the pre-scan plane such that the machining angle varies in steps as the number of ring scans increases.
10. A laser-based, surface high integrity micro-hole machining system as claimed in claim 9, wherein the control system is pre-configured with a start and end value of the machining angle, the machining angle being incrementally changed by an equal amount as the number of ring sweeps increases.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111224658.7A CN113828932A (en) | 2021-10-20 | 2021-10-20 | Surface high-integrity micropore machining method and system based on laser hole making |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111224658.7A CN113828932A (en) | 2021-10-20 | 2021-10-20 | Surface high-integrity micropore machining method and system based on laser hole making |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113828932A true CN113828932A (en) | 2021-12-24 |
Family
ID=78965609
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111224658.7A Pending CN113828932A (en) | 2021-10-20 | 2021-10-20 | Surface high-integrity micropore machining method and system based on laser hole making |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113828932A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114939733A (en) * | 2022-04-24 | 2022-08-26 | 武汉华工激光工程有限责任公司 | Laser processing method and device for improving quality of through hole of green ceramic chip |
| CN116441765A (en) * | 2023-03-24 | 2023-07-18 | 中国科学院西安光学精密机械研究所 | Straight round hole laser processing spiral line track planning method |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102016205262A1 (en) * | 2016-03-31 | 2017-10-05 | MTU Aero Engines AG | Method for producing a wire from a brittle material and use thereof for the generative production of a component |
| CN108723615A (en) * | 2018-07-17 | 2018-11-02 | 西安中科微精光子制造科技有限公司 | Micropore laser processing and system based on the control of laser pulse Duplication |
| CN110026677A (en) * | 2019-04-24 | 2019-07-19 | 西安中科微精光子制造科技有限公司 | The laser processing of special-shaped air film hole |
| CN110153555A (en) * | 2019-06-18 | 2019-08-23 | 西安中科微精光子制造科技有限公司 | Laser machine control method, device and the electronic equipment of rotary-cut scanning track |
| CN110385521A (en) * | 2019-08-29 | 2019-10-29 | 西安交通大学 | A kind of femtosecond laser processing device and method for the quick deep etching of silicon carbide |
| CN110405368A (en) * | 2019-08-30 | 2019-11-05 | 温州大学 | A kind of perforating device and its drilling technology that femtosecond laser processing taper is controllable |
| CN111069798A (en) * | 2019-12-26 | 2020-04-28 | 上海市激光技术研究所 | Laser hole making method for carbon fiber composite material and tool clamp |
| CN111318808A (en) * | 2019-08-30 | 2020-06-23 | 南京理工大学 | Meter-scale large-caliber optical element CO2Laser polishing device and polishing method |
| CN112157357A (en) * | 2020-08-20 | 2021-01-01 | 深圳市吉祥云科技有限公司 | Laser processing control method for glass special-shaped hole |
| CN112453730A (en) * | 2020-11-17 | 2021-03-09 | 西安中科微精光子制造科技有限公司 | Laser processing system and processing method for micropores with high depth-diameter ratio |
-
2021
- 2021-10-20 CN CN202111224658.7A patent/CN113828932A/en active Pending
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102016205262A1 (en) * | 2016-03-31 | 2017-10-05 | MTU Aero Engines AG | Method for producing a wire from a brittle material and use thereof for the generative production of a component |
| CN108723615A (en) * | 2018-07-17 | 2018-11-02 | 西安中科微精光子制造科技有限公司 | Micropore laser processing and system based on the control of laser pulse Duplication |
| CN110026677A (en) * | 2019-04-24 | 2019-07-19 | 西安中科微精光子制造科技有限公司 | The laser processing of special-shaped air film hole |
| CN110153555A (en) * | 2019-06-18 | 2019-08-23 | 西安中科微精光子制造科技有限公司 | Laser machine control method, device and the electronic equipment of rotary-cut scanning track |
| CN110385521A (en) * | 2019-08-29 | 2019-10-29 | 西安交通大学 | A kind of femtosecond laser processing device and method for the quick deep etching of silicon carbide |
| CN110405368A (en) * | 2019-08-30 | 2019-11-05 | 温州大学 | A kind of perforating device and its drilling technology that femtosecond laser processing taper is controllable |
| CN111318808A (en) * | 2019-08-30 | 2020-06-23 | 南京理工大学 | Meter-scale large-caliber optical element CO2Laser polishing device and polishing method |
| US20210323097A1 (en) * | 2019-08-30 | 2021-10-21 | Wenzhou University | Drilling device with controllable femtosecond laser processing taper and drilling process thereof |
| CN111069798A (en) * | 2019-12-26 | 2020-04-28 | 上海市激光技术研究所 | Laser hole making method for carbon fiber composite material and tool clamp |
| CN112157357A (en) * | 2020-08-20 | 2021-01-01 | 深圳市吉祥云科技有限公司 | Laser processing control method for glass special-shaped hole |
| CN112453730A (en) * | 2020-11-17 | 2021-03-09 | 西安中科微精光子制造科技有限公司 | Laser processing system and processing method for micropores with high depth-diameter ratio |
Non-Patent Citations (1)
| Title |
|---|
| 李仲元: "几种螺旋曲线的长度计算公式", 矿山机械 * |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114939733A (en) * | 2022-04-24 | 2022-08-26 | 武汉华工激光工程有限责任公司 | Laser processing method and device for improving quality of through hole of green ceramic chip |
| CN116441765A (en) * | 2023-03-24 | 2023-07-18 | 中国科学院西安光学精密机械研究所 | Straight round hole laser processing spiral line track planning method |
| CN116441765B (en) * | 2023-03-24 | 2024-04-05 | 中国科学院西安光学精密机械研究所 | Straight round hole laser processing spiral line track planning method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102189335B (en) | For the manufacture of laser processing device and the method for rotation symmetric tool | |
| CN113828932A (en) | Surface high-integrity micropore machining method and system based on laser hole making | |
| KR101939801B1 (en) | Method for machining a workpiece by a laser beam, laser tool, laser machine, machine controller | |
| JP6611741B2 (en) | Method for generating workpiece surface of rod-like workpiece | |
| JP5994723B2 (en) | Laser drilling method and apparatus | |
| CN105163897A (en) | Coordination of beam angle and workpiece movement for taper control | |
| CN113441852B (en) | Laser spiral scanning blind hole manufacturing method | |
| CN102642082A (en) | Laser processing device with switchable laser assembly and laser processing method | |
| JP2013529137A (en) | Method and apparatus for drilling using a series of laser pulses | |
| CN111151892B (en) | Non-taper laser cutting method | |
| WO2020239857A1 (en) | Laser hole drilling apparatus and method | |
| CN110026677B (en) | Laser processing method of special-shaped air film hole | |
| JP2020108904A5 (en) | ||
| JP2718795B2 (en) | Method for fine processing of work surface using laser beam | |
| JP5873978B2 (en) | Laser processing method and nozzle manufacturing method | |
| EP3715037A1 (en) | Laser processing method and laser processing apparatus | |
| CN217344054U9 (en) | Laser beam machining apparatus for producing countersunk holes | |
| CN114273800A (en) | Ultrafast laser drilling method and system suitable for stainless steel workpiece | |
| CN215846425U (en) | Laser high-speed dislocation perforating device that Z axle dynamic state removed | |
| CN114535832A (en) | Method for machining plate-shaped or tubular workpieces | |
| CN107662054B (en) | Laser processing method and laser processing device for brittle material substrate | |
| CN111940930A (en) | Micropore laser processing method and equipment | |
| CN107662055B (en) | Laser processing method and laser processing device for brittle material substrate | |
| JP7290239B1 (en) | LASER CUTTING METHOD AND LASER CUTTING APPARATUS | |
| CN109732202B (en) | Ultra-fast laser rotary cutting processing method for deep micro-holes |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |