TWI474763B - Multi-layer wiring board and manufacturing method for same - Google Patents

Description

Multilayer circuit board and method of manufacturing same

The present invention relates to a circuit board and a method of fabricating the same, and more particularly to a multilayer wiring board and a method of fabricating the same.

In general, the manufacturing process of a multilayer wiring board includes first stacking a single layer board or a double layer board to form a multilayer board. The multilayer board is then etched to form a multilayer wiring board. The structure of the single layer board comprises a metal layer, an insulating layer and an adhesive layer, and the structure of the double layer board comprises two metal layers, an insulating layer and an adhesive layer. However, the multilayer board formed by stacking a single layer board and a double layer board has a large thickness, so that the formed multilayer wiring board cannot have a thin profile.

The present invention provides a multilayer wiring board that can meet the demand for thinning products.

The present invention provides a method of manufacturing a multilayer wiring board for manufacturing the above multilayer wiring board.

The invention provides a multilayer circuit board comprising a circuit substrate, an insulating substrate, a second hole, a first nano silver conductive column, a second nano silver conductive column, a first silver paste layer, and a second silver paste layer a first protective layer and a second protective layer. The circuit substrate includes a substrate layer and a metal pattern layer attached to the substrate layer. The insulating substrate is located on the metal pattern layer and includes an adhesive layer, an insulating layer and a first hole. The adhesive layer is attached to the metal pattern layer, and the insulating layer is attached to the adhesive layer. The first hole penetrates the insulating substrate and exposes the metal pattern layer. The aperture of the first hole is from the opening of the first hole to the metal The pattern layer is decremented. The second hole is located in the substrate layer and exposes the metal pattern layer. The aperture of the second hole is decremented from the opening of the second hole toward the metal pattern layer. The first nano silver conductive pillar is filled into the first hole, and the second nano silver conductive pillar is filled into the second hole. The first silver paste layer covers the insulating layer and the first nano silver conductive pillar, and the second silver paste layer covers the substrate layer and the second nano silver conductive pillar. The first protective layer covers the first silver paste layer and the second protective layer covers the second silver paste layer.

The present invention provides a method of manufacturing a multilayer wiring board. First, a circuit substrate is provided which includes a substrate layer and a metal layer attached to the substrate layer. The metal layer is patterned to form a metal pattern layer. An insulating substrate is formed on the metal pattern layer, and includes an adhesive layer, an insulating layer and at least one first hole. The adhesive layer is attached to the metal pattern layer, and the insulating layer is attached to the adhesive layer. The first hole penetrates the insulating substrate and exposes the metal pattern layer. Thereafter, a second hole is formed in the substrate layer, and the second hole exposes the metal pattern layer. Then, a first nano silver conductive pillar is formed in the first hole, and a second nano silver conductive pillar is formed in the second hole. A first silver paste layer is formed on the insulating layer, and a second silver paste layer is formed on the substrate layer. Forming a first protective layer on the first silver paste layer and forming a second protective layer on the second silver paste layer.

In summary, the present invention provides a multilayer circuit board comprising a circuit substrate, a first nano silver conductive pillar, a second nano silver conductive pillar, and a first silver paste. a layer and a second layer of silver paste. The circuit substrate includes a substrate layer and a metal pattern layer, and the first silver paste layer is electrically connected to the metal pattern layer through the first nano silver conductive pillar. The second silver paste layer is electrically connected to the metal pattern layer through the second nano silver conductive pillar. The first silver paste layer and the second silver paste layer can be used to replace the structure of the single layer board and the double layer board. To form a structure of a multilayer wiring board. In this way, the number of layers of the multi-layer board can be reduced, and the thickness of the multi-layer board can be reduced to achieve the purpose of thinning the product.

The detailed description of the present invention and the accompanying drawings are to be understood by the claims The scope is subject to any restrictions.

1 is a cross-sectional view showing a multilayer wiring board 1 according to an embodiment of the present invention. Referring to FIG. 1 , the multilayer circuit board 1 includes a circuit substrate 100 , an insulating substrate 200 ′, a second hole 160 , a first nano silver conductive pillar 422 , a second nano silver conductive pillar 442 , and a first A silver paste layer 520, a second silver paste layer 540, a first protective layer 620, and a second protective layer 640.

The circuit substrate 100 includes a substrate layer 120' and a metal pattern layer 140'. The metal pattern layer 140' is attached over the substrate layer 120' and serves as a wiring layer of the multilayer wiring board 1. The insulating substrate 200' is located on the metal pattern layer 140' and includes an adhesive layer 220', an insulating layer 240', and a first hole 260. The adhesive layer 220' is attached to the metal pattern layer 140', and the insulating layer 240' is attached to the adhesive layer 220'. The first hole 260 penetrates the insulating substrate 200', and the first hole 260 exposes the metal pattern layer 140' under the insulating substrate 200'.

It should be noted that, as shown in FIG. 1, the aperture of the first hole 260 is decreased from the opening of the first hole 260 toward the metal pattern layer 140'. That is, the maximum aperture of the first hole 260 is at the upper surface of the insulating layer 240', and the minimum aperture of the first hole 260 is at the lower surface of the adhesive layer 220'. In detail, in the present embodiment, the first hole 260 has a maximum aperture of 0.2 mm and a minimum aperture of 0.1 mm. However, the present invention does not limit the shape of the first hole 260. Shape and pore size.

In addition, the material of the substrate layer 120 ′ may be polyimide (PI), polyethylene terephthalate (PET), liquid crystal polymer (LCP), or pyruvic acid. Pyruvate Carboxylase (PC). The material of the metal pattern layer 140' includes copper, aluminum or tin. The material of the adhesive layer 220' includes epoxy resin (Epoxy), polyester resin (Polyester) or acrylic resin (Acrylic). Further, the thickness of the substrate layer 120' is 12 μm. The thickness of the insulating substrate 200' was 27 μm, in which the thickness of the adhesive layer 220' was 15 μm, and the thickness of the insulating layer 240' was 12 μm.

Referring again to Figure 1, the second hole 160 extends through the substrate layer 120' and exposes the metal pattern layer 140' over the substrate layer 120'. The aperture of the second hole 160 is decremented from the opening of the second hole 160 toward the metal pattern layer 140'. That is, the maximum aperture of the second hole 160 is on the lower surface of the substrate layer 120', and the minimum aperture of the second hole 160 is on the upper surface of the substrate layer 120'. In detail, in the present embodiment, the second hole 160 has a maximum pore diameter of 0.2 mm and a minimum pore diameter of 0.1 mm. However, the present invention does not limit the shape of the second hole 160 and the size of the aperture. In other embodiments, the second hole 160 may have only a single aperture, and the aperture size may be 0.15-0.35 mm.

As shown in FIG. 1, the first nano silver conductive pillar 422 is filled in the first hole 260 and electrically connected to the metal pattern layer 140'. The second nano silver conductive pillar 442 is filled in the second hole 160 and electrically connected to the metal pattern layer 140'. The first silver paste layer 520 is over the insulating layer 240' and the first nano-silver conductive pillars 422 and covers the insulating layer 240' and the first nano-silver conductive pillars 422. The first silver paste layer 520 has a thickness of 4-12 μm. The second silver paste layer 540 is located The substrate layer 120' and the second nano-silver conductive pillars 442 are overlying the substrate layer 120' and the second nano-silver conductive pillars 442. The second silver paste layer 540 has a thickness of 4-12 μm. It should be noted that the first silver paste layer 520 and the second silver paste layer 540 can replace the double-layer circuit board and the single-layer circuit board in the general multilayer circuit board, so that the thickness of the multilayer circuit board 1 can be reduced to achieve a thin product. Demand.

The first silver paste layer 520 is electrically connected to the metal pattern layer 140 ′ by the first nano silver conductive pillar 422 , and the second silver paste layer 540 is electrically connected to the metal pattern by the second nano silver conductive pillar 442 . Layer 140'. That is, the first silver paste layer 520, the second silver paste layer 540, and the metal pattern layer 140' are electrically connected to each other. In the present embodiment, the first silver paste layer 520 and the second silver paste layer 540 may have no wiring pattern as the ground layer of the multilayer wiring board 1. In other embodiments, however, the first silver paste layer 520 and the second silver paste layer 540 may also be line pattern layers. That is, the multilayer wiring board 1 has a three-layer wiring pattern and is electrically connected to each other through the first nano silver conductive pillar 422 and the second nano silver conductive pillar 442.

Referring again to FIG. 1 , the first protective layer 620 is located on the first silver paste layer 520 and covers the first silver paste layer 520 . The second protective layer 640 is located on the second silver paste layer 540 and covers the second silver paste layer 540, that is, the second silver paste layer 540 is located between the second protective layer 640 and the substrate layer 120. The material of the first protective layer 620 and the second protective layer 640 may be polyester or polyimine, which can protect the first silver paste layer 520 and the second silver paste layer 540 from scratching, and can avoid the first silver The slurry layer 520 and the second silver paste layer 540 are electrically conductive with other electronic components or other multilayer wiring boards.

The above is the structure of the multilayer wiring board 1 according to an embodiment of the present invention. Next, a method of manufacturing the multilayer wiring board 1 will be described. Figure 1A to Figure 1G A schematic cross-sectional view showing a manufacturing process of the multilayer wiring board 1 according to an embodiment of the present invention.

Referring to FIG. 1A, a circuit substrate 100 is first provided. The circuit substrate 100 includes a substrate layer 120 and a metal layer 140. The metal layer 140 is attached over the substrate layer 120. Referring to FIG. 1B, the metal layer 140 is then patterned to form a metal pattern layer 140' in accordance with the needs of the user. The method of patterning the metal layer 140 includes forming a line pattern on the metal layer 140 by means of image transfer with a chemical liquid. Referring to FIG. 1B and FIG. 1C, next, an insulating substrate 200' is formed on the metal pattern layer 140'. The insulating substrate 200' includes an adhesive layer 220', an insulating layer 240', and a first hole 260. The first hole 260 will penetrate the adhesive layer 220' and the insulating layer 240' and expose the metal pattern layer 140' under the adhesive layer 220'.

In detail, the method of forming an insulating substrate 200' on the metal pattern layer 140' includes providing an insulating substrate 200 including an adhesive layer 220 and an insulating layer 240, and the insulating layer 240 is attached to the adhesive layer. Above 220. Thereafter, the insulating substrate 200 may be attached onto the metal pattern layer 140' by, for example, a thermocompression bonding method, and the adhesive layer 220 is attached to the metal pattern layer 140'. The thickness of the adhesive layer 220 is 15 μm, and the thickness of the insulating layer 240 is 12 μm, that is, the thickness of the insulating substrate 200 is 27 μm.

In addition, the material of the substrate layer 120 may be polyimide (PI), polyethylene terephthalate (PET), liquid crystal polymer (LCP), or pyruvate carboxylate. Pyruvate Carboxylase (PC). The material of the metal layer 140 includes copper, aluminum or tin. The material of the adhesive layer 220 includes epoxy resin (Epoxy), polyester resin (Polyester) or acrylic resin. (Acrylic).

As shown in Fig. 1B, the insulating substrate 200 is drilled by the laser light L at a position where a hole is to be formed in the metal pattern layer 140' to form the first hole 260 in the insulating substrate 200'. As shown in FIG. 1C, the aperture of the first aperture 260 is diminished from the opening of the first aperture 260 toward the metal pattern layer 140'. That is, the aperture of the first hole 260 is decremented from the upper surface of the insulating layer 240' toward the lower surface of the adhesive layer 220' (as shown in Fig. 1C), and has a minimum aperture of 0.1 mm and a maximum aperture of 0.2 mm. That is, in the present embodiment, the insulating substrate 200 may be attached to the metal pattern layer 140' first, and then a first hole 260 is formed on the insulating substrate 200 according to the position at which the metal pattern layer 140' is to be turned on. Forming the insulating substrate 200' to the metal pattern layer 140' by the above method allows the first hole 260 to fall at a relatively precise position.

Referring to FIG. 1C and FIG. 1D, the substrate layer 120 is then drilled by the laser beam L at a position on the metal pattern layer 140' to be drilled to form a second hole 160 in the substrate layer 120'. The second via 160 will penetrate the substrate layer 120' and expose the metal pattern layer 140' over the substrate layer 120'. The aperture of the second hole 160 is decremented from the opening of the second hole 160 toward the metal pattern layer 140' (as shown in Fig. 1D). That is, the aperture of the second hole 160 is decreased from the upper surface of the substrate layer 120' toward the lower surface of the substrate layer 120'. The second hole 160 has a minimum aperture of 0.1 mm and a maximum aperture of 0.2 mm.

It should be noted that, in this embodiment, the steps of clearing holes and inspecting are performed after the first holes 260 and the second holes 160 are formed. The step of clearing the holes can remove a portion of the insulating substrate 200' remaining at the bottom of the first hole 260 and a portion of the substrate layer 120' at the bottom of the second hole 160. The step of clearing the hole The chemical may include a chemical liquid or a plasma. The step of inspecting ensures that the first hole 260 and the second hole 160 are completely clear. Thus, the quality of the subsequently formed first nano silver conductive pillar 422 and the second nano silver conductive pillar 442 to the metal pattern layer 140' can be maintained or improved.

Referring to FIG. 1E, next, a first nano silver conductive pillar 422 and a second nano silver conductive pillar 442 are formed in the first hole 260 and the second hole 160, respectively. The method of forming the first nano silver conductive pillar 422 includes disposing a first mask 320 over the insulating layer 240' and the first via 260. The first mask 320 has a first hollow 322, and the area of the hollow 322 is larger than the opening area of the first hole 260. That is, the hollow 322 exposes the first hole 260. It should be noted that the present invention does not limit the number of first holes 260. In other embodiments, the multilayer circuit board 1 may also have a plurality of first holes 260, and the first hollow portion 322 may correspond to the number of the first holes 260.

Next, as shown in FIG. 1E, a first nano silver material 420 is coated on the first mask plate 320 such that the first nano silver material 420 fills the first holes 260. Finally, the mask 320 is removed and the first nanosilver material 420 is cured to form a first nanosilver conductive post 422 in the first aperture 260. The method of curing the first nanosilver material 420 includes heating the first nanosilver material 420 at a temperature of 130-140 ° C for about 30 minutes. Alternatively, the first nanosilver material 420 may be irradiated with UV light. The resistance of the first nano silver conductive pillar 422 is m20mΩ/square/mil.

As shown in FIG. 1E, a method of forming a second nanosilver conductive pillar 442 includes disposing a second mask 340 over the substrate layer 120' and the second via 160. The second mask 340 includes a second hollow 342, and the area of the second hollow 342 is greater than the open area of the second hole 160. That is It is said that the second hollow 342 exposes the second hole 160 below the second mask 340. Thereafter, a second nanosilver material 440 is applied to the second mask 340 (as shown in FIG. 1E) such that the second nanosilver material 440 fills the second hole 160. Again, the second masking plate 340 is removed and the second nanosilver material 440 is cured to form a second nanosilver conductive pillar 442. The method of curing the second nanosilver material 440 includes heating the second nanosilver material 440 at a temperature of 130-140 ° C for about 30 minutes. Alternatively, the second nanosilver material 440 may be irradiated with UV light. The second nano silver conductive pillar 442 has a resistance value of m20 mΩ/square/mil. In other embodiments, the multilayer circuit board 1 may also have a plurality of second holes 160, and the second hollow portions 342 may correspond to the number of the second holes 160.

It should be noted that the present invention does not limit the number of the first hole 260, the second hole 160, the first nano silver conductive pillar 422, and the second nano silver conductive pillar 442. In other embodiments, the user may The number of the first hole 260, the second hole 160, the first nano silver conductive pillar 422, and the second nano silver conductive pillar 442 is determined according to actual needs and the routing design.

In addition, the aperture, depth and shape of the first hole 260 and the second hole 160 affect the ease of filling of the first nano silver material 420 and the second nano silver material 440 and the uniformity of filling. In the present embodiment, the depth of the first hole 260 is the thickness of the substrate layer 120', that is, 12 μm. The depth of the second hole 160 is the total thickness of the adhesive layer 220' and the insulating layer 240', that is, 27 μm. Further, the opening of the first hole 260 is decremented toward the metal pattern layer 140' with a minimum aperture of 0.1 mm and a maximum aperture of 0.2 mm. The opening of the second hole 160 is also tapered toward the metal pattern layer 140' with a minimum aperture of 0.1 mm and a maximum aperture of 0.2 mm.

The aperture and depth of the first hole 260 and the second hole 160 described above The degree and shape may cause the first nano silver material 420 and the second nano silver material 440 to fill the first hole 260 and the second hole 160 relatively easily. However, the invention is not limited thereto.

Next, referring to FIG. 1F, a first silver paste layer 520 is formed over the insulating layer 240' and the first nano silver conductive pillars 422. The first silver paste layer 520 has a thickness of 4-12 μm. The method of forming the first silver paste layer 520 includes applying a first silver paste material onto the insulating layer 240' and the first nano silver conductive pillars 422 by coating. Thereafter, the first silver paste material is cured to form a first silver paste layer 520. The means for curing the first silver paste material includes heating the first silver paste material or irradiating the first silver paste material with UV. In addition, the first silver layer 520 is electrically connected to the first nano silver conductive pillar 422 and the metal pattern layer 140'.

Thereafter, a second silver paste layer 540 is formed over the substrate layer 120' and the second nano silver conductive pillars 442. The method of forming the second silver paste layer 540 is the same as the method of forming the first silver paste layer 520, and will not be described here. The second silver layer 540 has a thickness of 4-12 μm. In addition, the second silver layer 540 is electrically connected to the second nano silver conductive pillar 442 and the metal pattern layer 140'. It should be noted that the first silver paste layer 520 and the second silver paste layer 540 can replace the double-layer circuit board and the single-layer circuit board in the general multilayer circuit board, so that the thickness of the multilayer circuit board 1 can be reduced to achieve a thin product. Demand.

In the present embodiment, the first silver paste layer 520 and the second silver paste layer 540 are ground layers of the multilayer wiring board 1. However, in other embodiments, the first silver paste layer 520 and the second silver paste layer 540 may be further patterned to form a first line pattern layer and a second line pattern layer. The multilayer circuit board 1 is a three-layer circuit board structure. Here, the present invention does not limit the functions of the first silver paste layer 520 and the second silver paste layer 540.

In addition, the material of the first silver paste layer 520 and the second silver paste layer 540 may be a viscous slurry in which metal silver and a resin are mixed. The material of the first nano silver material 420 and the second nano silver material 440 is a viscous slurry of a mixture of nano metal silver and a resin, and the nano metal silver is a metallic silver of less than 100 nm, and the total solid is The content is 82 ± 3%. Since the first nano silver material 420 and the second nano silver material 440 are metallic silver of less than 100 nm, the first nano silver material 420 and the second nano silver material 440 can be easily filled into the first hole 260 and The second hole 160.

It should be noted that since the main components of the first nano silver conductive pillar 422 and the first silver paste layer 520 and the second nano silver conductive pillar 442 and the second silver paste layer 540 are both silver, the first silver is formed. When the slurry layer 520 is on the first nano silver conductive pillar 422 and the second silver paste layer 540 is formed on the second nano silver conductive pillar 442, there is no problem that electrical connection or explosion is caused by the difference of materials.

Further, in the present embodiment, the insulating substrate 200' is first formed on the wiring substrate 100, and the first holes 260 are formed by laser cutting on the insulating substrate 200'. This practice allows the first hole 260 to fall in a more precise position. Therefore, the formed first nano silver conductive pillar 422 will fall more accurately on the metal pattern layer 140' where it is electrically conductive. In particular, in the case where the line distribution of the metal pattern layer 140' is dense, such a method can electrically connect the metal pattern layer 140' and the first silver paste layer 520 more accurately.

Referring to FIG. 1G, next, a first protective layer 620 is formed over the first silver paste layer 520, and a second protective layer 640 is formed over the second silver paste layer 540, that is, the second silver paste layer 540. It will be located between the second protective layer 640 and the substrate 120. The material of the first protective layer 620 and the second protective layer 640 may be a polyester resin or a polyimide, having a dielectric constant of 3.5 and an insulation resistance of 10 ¹¹ Ω. In addition, the first protective layer 620 and the second protective layer 640 can protect the first silver paste layer 520 and the second silver paste layer 540 from scratches, and can avoid the first silver paste layer 520 and the second silver paste layer 540 and others. Electronic components or other multilayer circuit boards are electrically conductive.

2A to 2B are schematic cross-sectional views showing a manufacturing process of a multilayer wiring board according to another embodiment of the present invention. Referring to FIG. 2A, unlike the previous embodiment, the method of forming the insulating substrate 200" on the metal pattern layer 140' of the present embodiment includes providing an insulating substrate 200". The insulating substrate 200" includes an adhesive layer 220" and an insulating layer 240", and the insulating layer 240" is attached to the adhesive layer 220". Thereafter, the laser is used according to the position of the hole where the metal pattern layer 140' is to be formed. A first hole 260' is formed on the insulating substrate 200". This first hole 260' will penetrate the insulating substrate 200" and expose the metal pattern layer 140'.

The insulating substrate 200 ′′ is attached to the metal pattern layer 140 ′ such that the first hole 260 ′ corresponds to the position where the metal pattern layer 140 ′ is to form a hole. The insulating substrate 200 ′ can be attached by thermal pressing. The way. Thereafter, the substrate layer 120' is drilled using the laser light L to form a second hole 160 in the substrate layer 120'. The other steps and structures of the multilayer circuit board are substantially the same as those of the previous embodiment, and will not be described here. It should be noted that in the present embodiment, the first hole 260' is formed on the insulating substrate 200", and the insulating substrate 200" is attached to the circuit substrate 100.

In summary, the present invention provides a multilayer circuit board comprising a circuit substrate, a first nano silver conductive pillar, a second nano silver conductive pillar, and a first silver paste. a layer and a second layer of silver paste. The circuit substrate includes a substrate layer and a metal pattern layer, and the first silver paste layer, The metal pattern layer and the second silver paste layer are electrically connected through the first nano silver conductive pillar and the second nano silver conductive pillar. The first silver paste layer and the second silver paste layer may replace the single layer board and the double layer board to form a structure of the multilayer wiring board. In this way, the number of layers of the multilayer board can be reduced, and the thickness of the multilayer board can be reduced to achieve the purpose of thinning the product.

The above is only an embodiment of the present invention, and is not intended to limit the scope of the invention. It is still within the scope of patent protection of the present invention to make any substitutions and modifications of the modifications made by those skilled in the art without departing from the spirit and scope of the invention.

1‧‧‧Multilayer circuit board

100‧‧‧Line substrate

120, 120'‧‧‧ substrate layer

140‧‧‧metal layer

140’‧‧‧metal pattern layer

160‧‧‧Second hole

200, 200', 200" ‧ ‧ insulating substrates

220, 220’, 220” ‧ ‧ adhesive layer

240, 240', 240" ‧ ‧ insulation

260, 260’ ‧ ‧ first hole

320‧‧‧First mask

322‧‧‧First empty space

340‧‧‧Second mask

342‧‧‧Second Hollow

420‧‧‧First nano silver material

422‧‧‧First nano silver conductive column

440‧‧‧Second nano silver material

442‧‧‧Second nano silver conductive column

520‧‧‧First silver paste layer

540‧‧‧Second silver paste layer

620‧‧‧First protective layer

640‧‧‧Second protective layer

L‧‧‧Laser

1 is a cross-sectional view showing a multilayer wiring board according to an embodiment of the present invention.

1A to 1G are schematic cross-sectional views showing a manufacturing process of a multilayer wiring board according to an embodiment of the present invention.

2A to 2B are schematic cross-sectional views showing a manufacturing process of a multilayer wiring board according to another embodiment of the present invention.

1‧‧‧Multilayer circuit board

100‧‧‧Line substrate

120'‧‧‧ substrate layer

140’‧‧‧metal pattern layer

160‧‧‧Second hole

200'‧‧‧Insert substrate

220’‧‧‧Adhesive layer

240'‧‧‧Insulation

260‧‧‧ first hole

422‧‧‧First nano silver conductive column

442‧‧‧Second nano silver conductive column

520‧‧‧First silver paste layer

540‧‧‧Second silver paste layer

620‧‧‧First protective layer

640‧‧‧Second protective layer

Claims (15)

A multi-layer circuit board comprising: a circuit substrate comprising: a substrate layer; a metal pattern layer attached to the substrate layer; and an insulating substrate on the metal pattern layer having an adhesive layer attached On the metal pattern layer; an insulating layer attached to the adhesive layer; at least one first hole penetrating the insulating substrate and exposing the metal pattern layer, wherein the first hole has a hole diameter from the first The opening of the hole is decremented toward the metal pattern layer; at least one second hole is located in the substrate layer, wherein the second hole exposes the metal pattern layer, wherein the second hole has an aperture from the opening of the second hole toward the metal pattern The layer is decremented; at least one first nano silver conductive pillar fills the first hole and is electrically connected to the metal pattern layer; at least one second nano silver conductive pillar fills the second hole and electrically connects the layer a metal pattern layer; a first silver paste layer covering the insulating layer and the first nano silver conductive pillar, and electrically connecting the metal pattern layer by the first nano silver conductive pillar; a second silver paste layer Covering the substrate layer to The second nano silver conductive pillar is electrically connected to the metal pattern layer by the second nano silver conductive pillar; a first protective layer covers the first silver paste layer; and a second protective layer covers the first Two silver paste layers. The multilayer circuit board of claim 1, wherein the first hole has a minimum aperture of 0.1 mm and a maximum aperture of 0.2 mm. The multilayer circuit board of claim 1, wherein the second hole has a minimum aperture of 0.1 mm and a maximum aperture of 0.2 mm. The multilayer wiring board according to claim 1, wherein the first silver paste layer has a thickness of 4 to 12 μm. The multilayer wiring board according to claim 1, wherein the second silver paste layer has a thickness of 4 to 12 μm. The multilayer wiring board according to claim 1, wherein the substrate layer has a thickness of 12 μm. The multilayer wiring board according to claim 1, wherein the insulating substrate has a thickness of 27 μm, wherein the thickness of the adhesive layer is 15 μm, and the thickness of the insulating layer is 12 μm. The multilayer circuit board of claim 1, wherein the first silver paste layer is a first line pattern layer and the second silver paste layer is a second line pattern layer. A method for manufacturing a multilayer circuit board, comprising: providing a circuit substrate, the circuit substrate comprising a substrate layer and a metal layer attached to the substrate layer; patterning the metal layer to form a metal pattern layer; forming an insulating substrate On the metal pattern layer, wherein the insulating substrate comprises: an adhesive layer attached to the metal pattern layer; an insulating layer attached to the adhesive layer; at least a first hole penetrating through the insulating substrate and exposed Out the metal pattern layer, wherein the aperture of the first hole is opened from the first hole The opening is decremented toward the metal pattern layer; at least one second hole is formed in the substrate layer, wherein the second hole exposes the metal pattern layer, wherein the second hole has an aperture from the opening of the second hole toward the metal pattern Depressing a layer; forming a first nano-silver material to fill the first hole; curing the first nano-silver material to form a first nano-silver conductive column in the first hole; forming a a second nano silver material to fill the first hole; curing the second nano silver material to form a second nano silver conductive pillar in the second hole; forming a first silver paste material On the insulating layer and the first nano-silver conductive pillar; curing the first silver paste material to form a first silver paste layer on the insulating layer, wherein the first silver paste layer is electrically connected to the first nano-layer a silver-plated conductive pillar and the metal pattern layer; forming a second silver paste material on the substrate layer and the second nano-silver conductive pillar; curing the second silver paste material to form a second silver paste layer on the substrate a layer, wherein the second silver paste layer is electrically connected to the second nano silver conductive And metal pattern layer; forming a first protective layer on the first silver layer; and forming a second protective layer on the second silver paste layer. The method of manufacturing a multilayer wiring board according to claim 9, wherein the method of forming the first nano silver material to fill the first hole comprises: providing a first mask to the insulating layer The first masking plate There is at least a first hollow, the first hollow exposes the first hole, and an area of the first hollow is larger than an opening area of the first hole; and coating the first nano silver material On the first mask plate. The method of manufacturing a multilayer wiring board according to claim 9, wherein the method of forming the second nano silver material to fill the second hole comprises: providing a second mask to the substrate layer The second mask panel has at least one second hollow portion, the second hollow portion exposing the second hole, and the second hollow portion has an area larger than the opening area of the second hole; And coating the second nano silver material on the second mask. The method for manufacturing a multilayer wiring board according to claim 9, wherein the method of forming the first silver paste layer on the insulating layer further comprises: patterning the first silver paste layer. The method for manufacturing a multilayer wiring board according to claim 9, wherein the method of forming the second silver paste layer on the substrate layer further comprises: patterning the second silver paste layer. The method of manufacturing a multilayer circuit board according to claim 9, wherein the method of forming an insulating substrate on the metal pattern layer comprises: providing an insulating substrate, wherein the insulating substrate comprises the adhesive layer and the insulating layer, wherein Attaching the insulating layer to the adhesive layer; attaching the insulating substrate to the metal pattern layer, wherein the adhesive layer is attached to the metal pattern layer; and forming the first hole in the insulating substrate, wherein the insulating layer The first hole penetrates through the insulating substrate. The method of manufacturing a multilayer wiring board according to claim 9, wherein the method of forming an insulating substrate on the metal pattern layer comprises: An insulating substrate is provided, wherein the insulating substrate includes the adhesive layer and the insulating layer, wherein the insulating layer is attached to the adhesive layer; the first hole is formed in the insulating substrate, wherein the first hole penetrates the insulating substrate And attaching the insulating substrate to the metal pattern layer, wherein the adhesive layer is attached to the metal pattern layer.