TWI471988B - 半導體封裝件之製法 - Google Patents
半導體封裝件之製法 Download PDFInfo
- Publication number
- TWI471988B TWI471988B TW101142158A TW101142158A TWI471988B TW I471988 B TWI471988 B TW I471988B TW 101142158 A TW101142158 A TW 101142158A TW 101142158 A TW101142158 A TW 101142158A TW I471988 B TWI471988 B TW I471988B
- Authority
- TW
- Taiwan
- Prior art keywords
- semiconductor package
- package according
- fabricating
- heat dissipating
- encapsulant
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title claims 13
- 238000000034 method Methods 0.000 title claims 3
- 238000004519 manufacturing process Methods 0.000 claims 8
- 239000008393 encapsulating agent Substances 0.000 claims 5
- 230000017525 heat dissipation Effects 0.000 claims 4
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
- H01L23/4334—Auxiliary members in encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Claims (9)
- 一種半導體封裝件之製法,係包括:提供一散熱結構,該散熱結構具有散熱部、與該散熱部結合之支撐部及與該支撐部結合之結合部,且該支撐部係為形變體,該結合部具有第一定位部;結合一其上承載有半導體元件之承載件至該散熱結構之結合部上,使該承載件與該散熱部之間形成一容置空間,而令該半導體元件收納於該容置空間中,該承載件具有對應該第一定位部之第二定位部;以及形成封裝膠體於該容置空間中,以由該封裝膠體包覆該半導體元件。
- 如申請專利範圍第1項所述之半導體封裝件之製法,復包括於形成該封裝膠體後,移除該結合部及支撐部。
- 如申請專利範圍第1項所述之半導體封裝件之製法,其中,該散熱部具有溝槽。
- 如申請專利範圍第1項所述之半導體封裝件之製法,其中,該散熱部之尺寸係小於該結合部之尺寸。
- 如申請專利範圍第1項所述之半導體封裝件之製法,其中,該散熱部之尺寸係等於該結合部之尺寸。
- 如申請專利範圍第1項所述之半導體封裝件之製法,其中,係於模具中形成該封裝膠體。
- 如申請專利範圍第6項所述之半導體封裝件之製法,其中,該模具係具有夾持部,以夾固該承載件與該結合部。
- 如申請專利範圍第6項所述之半導體封裝件之製法,其中,該模具係具有一模穴,該模穴之高度係小於該散熱結構之高度。
- 如申請專利範圍第6項所述之半導體封裝件之製法,其中,該模具係具有複數透孔,於形成該封裝膠體時,藉抽氣方式經該透孔吸附該散熱結構之散熱部。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW101142158A TWI471988B (zh) | 2012-11-13 | 2012-11-13 | 半導體封裝件之製法 |
CN201210499796.0A CN103811359B (zh) | 2012-11-13 | 2012-11-29 | 半导体封装件的制法 |
US13/859,147 US9257311B2 (en) | 2012-11-13 | 2013-04-09 | Method of fabricating a semiconductor package with heat dissipating structure having a deformed supporting portion |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW101142158A TWI471988B (zh) | 2012-11-13 | 2012-11-13 | 半導體封裝件之製法 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201419466A TW201419466A (zh) | 2014-05-16 |
TWI471988B true TWI471988B (zh) | 2015-02-01 |
Family
ID=50682108
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW101142158A TWI471988B (zh) | 2012-11-13 | 2012-11-13 | 半導體封裝件之製法 |
Country Status (3)
Country | Link |
---|---|
US (1) | US9257311B2 (zh) |
CN (1) | CN103811359B (zh) |
TW (1) | TWI471988B (zh) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI629761B (zh) * | 2017-10-27 | 2018-07-11 | 日月光半導體製造股份有限公司 | 基板結構及半導體封裝元件之製造方法 |
CN108417540B (zh) * | 2018-03-26 | 2020-10-16 | 合肥源康信息科技有限公司 | 一种指纹识别芯片装置 |
CN108493165A (zh) * | 2018-04-19 | 2018-09-04 | 苏州通富超威半导体有限公司 | 封装结构及焊接方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070065984A1 (en) * | 2005-09-22 | 2007-03-22 | Lau Daniel K | Thermal enhanced package for block mold assembly |
TW201230211A (en) * | 2011-01-11 | 2012-07-16 | Apic Yamada Corp | Method for resin molding, resin molding apparatus and feeding handler |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4890152A (en) * | 1986-02-14 | 1989-12-26 | Matsushita Electric Works, Ltd. | Plastic molded chip carrier package and method of fabricating the same |
KR970005712B1 (ko) * | 1994-01-11 | 1997-04-19 | 삼성전자 주식회사 | 고 열방출용 반도체 패키지 |
TWI220783B (en) * | 2002-08-26 | 2004-09-01 | Siliconware Precision Industries Co Ltd | A semiconductor device having a heat-dissipating structure |
WO2004032186A2 (en) * | 2002-09-30 | 2004-04-15 | Advanced Interconnect Technologies Limited | Thermal enhanced package for block mold assembly |
CN1549337A (zh) * | 2003-05-09 | 2004-11-24 | 华泰电子股份有限公司 | 防止半导体封装件中散热片溢胶的散热片装置 |
CN101221944A (zh) * | 2007-01-09 | 2008-07-16 | 矽品精密工业股份有限公司 | 散热型半导体封装件 |
-
2012
- 2012-11-13 TW TW101142158A patent/TWI471988B/zh active
- 2012-11-29 CN CN201210499796.0A patent/CN103811359B/zh active Active
-
2013
- 2013-04-09 US US13/859,147 patent/US9257311B2/en active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070065984A1 (en) * | 2005-09-22 | 2007-03-22 | Lau Daniel K | Thermal enhanced package for block mold assembly |
TW201230211A (en) * | 2011-01-11 | 2012-07-16 | Apic Yamada Corp | Method for resin molding, resin molding apparatus and feeding handler |
Also Published As
Publication number | Publication date |
---|---|
CN103811359B (zh) | 2017-04-05 |
CN103811359A (zh) | 2014-05-21 |
TW201419466A (zh) | 2014-05-16 |
US9257311B2 (en) | 2016-02-09 |
US20140134805A1 (en) | 2014-05-15 |
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