TWI469944B - A low melting point glass composition and a conductive paste material using the same - Google Patents

A low melting point glass composition and a conductive paste material using the same Download PDF

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Publication number
TWI469944B
TWI469944B TW100110466A TW100110466A TWI469944B TW I469944 B TWI469944 B TW I469944B TW 100110466 A TW100110466 A TW 100110466A TW 100110466 A TW100110466 A TW 100110466A TW I469944 B TWI469944 B TW I469944B
Authority
TW
Taiwan
Prior art keywords
glass
lead
conductive paste
melting glass
layer
Prior art date
Application number
TW100110466A
Other languages
English (en)
Chinese (zh)
Other versions
TW201141809A (en
Inventor
Jun Hamada
Original Assignee
Central Glass Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Central Glass Co Ltd filed Critical Central Glass Co Ltd
Publication of TW201141809A publication Critical patent/TW201141809A/zh
Application granted granted Critical
Publication of TWI469944B publication Critical patent/TWI469944B/zh

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/14Conductive material dispersed in non-conductive inorganic material
    • H01B1/16Conductive material dispersed in non-conductive inorganic material the conductive material comprising metals or alloys
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/02Frit compositions, i.e. in a powdered or comminuted form
    • C03C8/04Frit compositions, i.e. in a powdered or comminuted form containing zinc
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02Details
    • H01L31/0224Electrodes
    • H01L31/022408Electrodes for devices characterised by at least one potential jump barrier or surface barrier
    • H01L31/022425Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Physics & Mathematics (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Sustainable Energy (AREA)
  • General Chemical & Material Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Glass Compositions (AREA)
  • Conductive Materials (AREA)
  • Photovoltaic Devices (AREA)
TW100110466A 2010-03-28 2011-03-25 A low melting point glass composition and a conductive paste material using the same TWI469944B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010073963A JP5569094B2 (ja) 2010-03-28 2010-03-28 低融点ガラス組成物及びそれを用いた導電性ペースト材料

Publications (2)

Publication Number Publication Date
TW201141809A TW201141809A (en) 2011-12-01
TWI469944B true TWI469944B (zh) 2015-01-21

Family

ID=44712080

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100110466A TWI469944B (zh) 2010-03-28 2011-03-25 A low melting point glass composition and a conductive paste material using the same

Country Status (4)

Country Link
JP (1) JP5569094B2 (ja)
CN (1) CN102762509B (ja)
TW (1) TWI469944B (ja)
WO (1) WO2011122369A1 (ja)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5888493B2 (ja) * 2011-02-10 2016-03-22 セントラル硝子株式会社 導電性ペースト及び該導電性ペーストを用いた太陽電池素子
CN103915127B (zh) * 2013-01-03 2017-05-24 上海匡宇科技股份有限公司 用于表面高方阻硅基太阳能电池正面银浆及其制备方法
JP6398351B2 (ja) * 2013-07-25 2018-10-03 セントラル硝子株式会社 蛍光体分散ガラス
EP3134903B1 (de) * 2014-04-25 2019-06-12 CeramTec GmbH Aluminiumpaste für dickfilmhybride
CN104402234B (zh) * 2014-11-13 2016-09-21 海安建海新能源有限公司 晶体硅太阳能电池正面银浆用玻璃粉及其制备方法
CN110550864B (zh) * 2019-09-29 2022-09-02 长沙新材料产业研究院有限公司 一种低膨胀系数绝缘介质浆料及其制备方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030228471A1 (en) * 2002-04-24 2003-12-11 Central Glass Company, Limited Lead-free low-melting glass
US20080314444A1 (en) * 2006-03-07 2008-12-25 Murata Manufacturing Co., Ltd. Electrically conductive paste and solar cell

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6029654B2 (ja) * 1979-08-29 1985-07-11 株式会社日立製作所 磁気ヘッドの製造方法
JP3534684B2 (ja) * 2000-07-10 2004-06-07 Tdk株式会社 導電ペーストおよび外部電極とその製造方法
JP2007070196A (ja) * 2005-09-09 2007-03-22 Central Glass Co Ltd 無鉛低融点ガラス
JP2011502345A (ja) * 2007-10-18 2011-01-20 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー 伝導性組成物、および半導体デバイスの製造における使用方法:複数の母線
CN101483207B (zh) * 2009-01-07 2013-02-13 范琳 一种环保型硅太阳能电池正面栅线电极银导体浆料

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030228471A1 (en) * 2002-04-24 2003-12-11 Central Glass Company, Limited Lead-free low-melting glass
US20080314444A1 (en) * 2006-03-07 2008-12-25 Murata Manufacturing Co., Ltd. Electrically conductive paste and solar cell

Also Published As

Publication number Publication date
TW201141809A (en) 2011-12-01
JP5569094B2 (ja) 2014-08-13
WO2011122369A1 (ja) 2011-10-06
CN102762509A (zh) 2012-10-31
JP2011207629A (ja) 2011-10-20
CN102762509B (zh) 2015-11-25

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