TWI469331B - 固態成像裝置及其製造方法 - Google Patents
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Description
本揭示內容係關於一種固態成像裝置及其製造方法。更特定言之,本揭示內容係關於一種可容易且可靠地抑制光斑及重像之固態成像裝置及一種製造此一裝置之方法。
相關技術中已知藉由自一物體接收光以使該物體成像之固態成像裝置。形成此一固態成像裝置之一部分之一影像感測器具有一矩形光接收區域,且自一透鏡進入該影像感測器之一光束係投射在該影像感測器之一表面上以呈包含該矩形光接收區域之一圓形斑點形式。
光亦照射在佈置在影像感測器之光接收區域周圍之外部連接端子上,且光進一步照射在將信號自該等外部連接端子導出之接合引線上。因此,光可由該等接合引線反射以進入光接收區域,且由影像感測器獲得之一影像可因此具有可使該影像之品質降級之光斑或重像。
由於近來趨向於更小之影像感測器晶片,所以光束可到達表面安裝在一影像感測器晶片周圍之組件。此等表面安裝組件之電極具有高反射率,因為其等係由一焊接材料(諸如Sn、Ag或Cu)或含有導電粒子(諸如Ag)之一導電黏著劑形成,且亦可由於光於此等電極區域處之反射而產生光斑及重像,此亦使影像品質降級。
在此情形下,通常的做法是藉由將一屏蔽構件佈置在一光接收區域上方而防止無用光束進入一影像感測器之該光接收區域。然而,難以根據此一方法而有效抑制光斑及重像,因為該屏蔽構件與該影像感測器之光接收區域必須彼此精確對準。
所提出之另一技術為藉由使用一成形材料連同晶片之切割面(側面)來密封連接一影像感測器與一基板之接合引線而防止雜散光(見專利文件1(JP-A-63-273353))。
尚無法使用上述技術來充分抑制光斑及重像。具體而言,根據涉及利用一成形材料來密封接合引線之處理之方法,接合引線係經成環以具有在一晶片之一頂面上方之約100微米至200微米之一高度。因此,可由於照射在定位在該晶片表面之更高處之該等引線上之光之反射而產生重像。
經一成形材料密封之引線部分與未經密封之引線部分之線性膨脹係數之間存在一差值。因此,在一溫度循環期間應力經由引線之密封部分之介面而集中在引線之部分上,此可導致可歸因於引線之變形或破損之開路失效。此外,一成形材料之黏度在該材料開始熱硬化之前即刻下降。因此,若引線係經該成形材料密封達與一晶片之高度實質上相同之一密封高度,則該成形材料可上爬至該晶片之一頂面且該材料可因此自該晶片表面流出而進入一光接收區域。為此,已極難控制待施加之該成形材料之數量。
本揭示內容中所述之技術被認為已考慮此一情況且技術能容易且可靠地防止光斑及重像。
本揭示內容之一實施例係關於一種固態成像裝置,其包含:一成像區段,其具有用於自一物體接收光以使該物體成像之一光接收部分;及一基板,該成像區段係佈置在該基板上,其中設置在該基板上之該光接收部分附近之一預定構件被部分或完全塗黑。
可使用噴墨印刷來塗黑預定構件。
預定構件可為定位在基板上之一範圍(來自物體之光照射該位置範圍)內之一構件,且定位在該範圍內之預定構件之一部分可被塗黑。
預定構件可為設置在基板上之具有一預定值或更高之反射率之一構件,且預定構件可被塗黑。
預定構件可為連接基板與佈置在基板上之成像區段或一封裝組件之一引線。
本揭示內容之實施例亦係關於一種製造一固態成像裝置之方法,其包含:將一成像區段佈置在一基板上,該成像區段具有用於自一物體接收光以使該物體成像之一光接收部分;及部分或完全塗黑設置在該光接收部分附近之一預定構件。
根據本揭示內容之實施例,具有用於自一物體接收光以使該物體成像之一光接收部分之一成像區段係佈置在一基板上,且設置在該基板上之該光接收部分附近之一預定構件被部分或完全塗黑。
本揭示內容之另一實施例係關於一種固體成像裝置,其包含:一成像區段,其具有用於自一物體接收光以使該物體成像之一光接收部分;一基板,該成像區段係佈置在該基板上;及一預定構件,其佈置在該基板上之該光接收部分附近中且利用由添加於其中之一顏料著黑之一導電黏著劑來牢固至該基板。
本揭示內容之另一實施例亦係關於一種製造一固態成像裝置之方法,其包含:將由添加於其中之一顏料著黑之一導電黏著劑佈置在一基板上;將一預定構件佈置在該基板之區域中,其中該導電黏著劑係經佈置以將該預定構件連接至該基板;及將一成像區段佈置在該基板上之該預定構件附近,該成像區段具有用於自一物體接收光以使該物體成像之一光接收部分。
根據本揭示內容之另一實施例,由添加於其中之一顏料著黑之導電黏著劑係佈置在一基板上,預定構件係佈置在該基板之區域中,其中導電黏著劑係經佈置以將預定構件連接至該基板,且具有用於自一物體接收光以使該物體成像之光接收部分之成像區段係佈置在該基板上之預定構件附近。
本揭示內容之另外實施例能容易且可靠地抑制光斑及重像。
現將參考圖式而描述本揭示內容之實施例。
圖1係顯示根據本揭示內容之一固態成像裝置之一實施例之一例示性組態之一說明圖。
一固態成像裝置11包含一印刷電路板21、一影像感測器22及表面安裝組件23-1與23-2。
固態成像裝置11係一成像裝置,其自一物體接收光且光電轉換該光以獲得該物體之一影像。影像感測器22及表面安裝組件23-1及23-2係佈置在印刷電路板21上以形成固態成像裝置11之一部分,且一透鏡單元(圖中未顯示)係佈置在相對於圖式之平面之印刷電路板21之近側上。
影像感測器22係藉由複數個接合引線31而電連接至印刷電路板21。
影像感測器22包含一光接收部分32,其通過設置在透鏡單元上之一透鏡而接收自一物體進入之光。感測器執行光接收部分32處所接收之該光之光電轉換以根據所接收光之數量而將該接收光轉換成一電信號。影像感測器22通過接合引線而將通過光電轉換所獲得之該電信號輸出至設置在印刷電路板21之感測器下游之一控制區段。
表面安裝組件23-1及23-2係被動組件(諸如晶片電阻器),且組件係表面安裝組件以形成佈置在影像感測器22附近之用於驅動固態成像裝置11之一電路。在圖1所示之實例中,表面安裝組件23-1及23-2係佈置在影像感測器22附近。
在下文中,表面安裝組件23-1及23-2可在無需彼此區別時被統稱為「表面安裝組件23」。
已照射在透鏡單元之透鏡上以由透鏡聚集之來自一物體之光係投射在印刷電路板21之一區域R11上。區域R11為將矩形光接收部分32包含於其中之一圓形區域。已到達區域R11之該光之一部分照射在光接收部分32上,且該光係轉換成表示該物體之一影像之一電信號。
如因此所述,由固態成像裝置11之透鏡單元聚集之光束之非全部照射在光接收部分32上,且該聚集光束之部分係投射在佈置在光接收部分32附近之接合引線及表面安裝組件23上。
當照射在接合引線及表面安裝組件23上之光藉由在接合引線及表面安裝組件23之表面被反射而進入光接收部分32時,光斑及重像可出現在所得影像上且影像可因此具有低品質。
例如,吾人假定來自一物體之光照射在形成透鏡單元之一部分之一透鏡61上(如圖2中所示)且由透鏡61聚集之光透過一紅外線截止濾光器而照射在接合引線31上(如圖2中之虛線所指示)。圖2中之虛線表示由透鏡61聚集之來自該物體之一些光束之光學路徑。由兩圖中之相同元件符號指示圖1與圖2之間之一相同特徵,且下文中可在適當條件下省略此一特徵之描述。
在圖2所示之實例中,因為未對接合引線31執行特定處理,所以接合引線31之表面具有高反射率。因此,來自透鏡61且照射在接合引線31上之光之大部分在接合引線31之表面上被反射以進入光接收部分32。
固態成像裝置11中採取針對該問題之一措施。如圖3中所示,連接印刷電路板21與影像感測器22之接合引線31於定位在更靠近光接收部分32之側上之其部分中被塗黑且表面安裝組件23之表面亦被塗黑。由相同元件符號指示圖1與圖3之間之一相同特徵,且下文中可在適當條件下省略此一特徵之描述。
參考圖3,接合引線31之黑色區域及表面安裝組件23之陰影區域為被塗黑使得其等將展示針對光之低反射率之區域。使用光屏蔽印刷(諸如噴墨印刷)來提供充當一光屏蔽之黑色塗層。
例如,當考慮處理之節拍時間(處理時間)及印刷油墨之擴散時,使用UV(紫外線)油墨來較佳執行噴墨印刷。然而,本揭示內容不受限於使用UV油墨,且可使用任何類型之油墨,只要其易於固化。
較佳地,噴墨印刷塗層係設置在影像感測器22周圍之組件上,諸如接合引線31及表面安裝組件23,其等僅在使來自透鏡單元之光照射在其上之該等組件之部分或包含在圖1所示區域R11中之該等組件之部分中。
替代地,塗層可設置在影像感測器22附近之組件(構件)(諸如接合引線31及表面安裝組件23)之整個表面上,因為需要使該等組件之部分(來自透鏡單元之光照射在該等之部分上)之反射率保持較低。替代地,可選擇性提供黑色塗層以僅覆蓋具有高反射率之組件或具有等於或高於一預定值(其為影像感測器22附近之組件(諸如接合引線31)所特有)之反射率之組件。
例如,當一黑色塗層係設置在影像感測器22附近之組件表面上時(如因此所述),接合引線31之表面之反射率係保持低於引線具有之反射率且在更靠近光接收部分32之引線之側上無需使引線之部分中具有塗層,如圖4中所示。由相同元件符號指示圖2與圖4之間之一相同特徵,且將在適當條件下省略此一特徵之描述。在圖4中,由虛線表示自透鏡61傳播且透過紅外線截止濾光器62而照射在接合引線31上之光束之部分之光學路徑。
在圖4所示之實例中,更靠近光接收部分32之引線之側上之接合引線31之區域B11塗有使引線免受光損害之UV油墨,且接合引線31在區域B11中之反射率低於在其之其他區域中之反射率。因此,抑制來自透鏡61且照射在區域B11上之光之反射,且來自透鏡61之光之僅一小部分被反射以照射在光接收部分32上。
如因此所述,當使用一光屏蔽印刷處理來塗黑影像感測器22附近之組件(諸如接合引線31)時,可在塗覆部分處抑制光之反射以防止不必要光照射在影像感測器22上。因此,可簡單且可靠地抑制光斑及重像以獲得一高品質影像。
例如,當使用一光屏蔽印刷處理來塗覆影像感測器22附近之組件時,可選擇性塗覆組件之期望部分,此比利用一成形材料來密封接合引線有利,因為可以一更低成本來更可靠地抑制光斑及重像。使用光屏蔽印刷來塗覆接合引線及類似物之益處亦在於:可獲得一小型影像感測器晶片,因為塗覆區域佔用比利用一成形材料來密封引線之一所需空間小之一空間。
此外,固態成像裝置11無需具有使影像感測器22鄰近處之組件免受來自透鏡單元之光之損害之一構件,諸如一屏蔽板。因此,可充分抑制光斑及重像且無需依賴形成固態成像裝置11之組件之精確組裝。
現將參考圖5中所示之流程圖而描述圖1中所示之固態成像裝置11之製程。
在步驟S11中,將表面安裝組件安裝在由複數個印刷電路板形成之一聚合板上。
例如,提供由包含一印刷電路板21之複數個印刷電路板形成之一聚合版91,如由圖6中之一箭頭M11所指示。所需表面安裝組件係佈置及牢固在形成聚合板91之該等印刷電路板之各者上,如由一箭頭M12所指示。由相同元件符號指示圖6與圖1或圖4之間之一相同特徵,且可在適當條件下省略此一特徵之描述。
例如,由箭頭M12指示之聚合板91之右下部分為一印刷電路板21,且表面安裝組件23-1及23-2係佈置及牢固在印刷電路板21上。
當表面安裝組件係安裝在聚合板91上時(如因此所述),形成聚合板91之印刷電路板彼此隔開,其後,印刷電路板係經處理以製造固態成像裝置。
再次參考圖5中之流程圖,在步驟S12中,將一影像感測器22晶粒接合至印刷電路板21上。例如,影像感測器22係佈置在印刷電路板21上,如圖6中之一箭頭M13所指示,且使用一黏著劑來將影像感測器22牢固在印刷電路板21上。
在步驟13中,於印刷電路板21與影像感測器22之間執行引線接合。例如,由複數個接合引線31電連接印刷電路板21與影像感測器22,如圖6中之一箭頭M14所指示。更具體而言,由接合引線31連接印刷電路板21上之影像感測器22之端子與設置在信號線之端部處之墊片。
在步驟S14中,對連接至影像感測器22之接合引線執行光屏蔽印刷(噴墨印刷)。例如,在連接至影像感測器22之接合引線(諸如接合引線31)中,UV油墨係選擇性噴墨印刷及固化在包含於之一區域R11中之引線之部分(如圖1中所示)或使來自一物體之光照射在其上之引線之部分上。因此,接合引線之印刷區域塗有UV油墨。
在步驟S15中,對表面安裝組件23執行光屏蔽印刷。例如,UV油墨係選擇性噴墨印刷及固化在包含於區域R11中之表面安裝組件23之部分(如圖1中所示)或具有高反射率之該等組件之部分上。
由於步驟S14及S15之處理,例如,印刷電路板21上之接合引線31之部分及表面安裝組件23之整個表面塗有UV油墨,如由圖6中之一箭頭M15所指示。在圖6中,接合引線31之黑色部分及表面安裝組件23之陰影部分為塗覆部分。
再次參考圖5中所示之流程圖,在步驟S16中,將一透鏡單元安裝在印刷電路板21上以形成一固態成像裝置11,且製程系列結束。
例如,如由圖6中之一箭頭M16指示,具有一透鏡61之一透鏡單元92係佈置在印刷電路板21上使得包含影像感測器22之組件將被覆蓋,且該單元係牢固至印刷電路板21。因此,提供包含一透鏡單元92及一印刷電路板21之一裝置作為一固態成像裝置11。
更具體而言,(例如)藉由將UV油墨重複施加(印刷)及固化在影像感測器22周圍之構件上(如圖7中顯示)而實施步驟S14及S15中之光屏蔽印刷(噴墨印刷)。由相同元件符號指示圖1與圖7之間之一相同特徵,且可視情況省略此一特徵之描述。
在圖7所示之實例中,定位在說明圖之印刷電路板21上方之一噴墨頭121可噴射UV油墨,同時左右往復運動以將UV油墨施加至接合引線31及類似物之期望位置。因此將UV油墨係施加(印刷)至接合引線之黑色區域。
在噴墨頭121噴射UV油墨之後,由設置在圖7中噴墨頭121之左右端上之UV燈122-1及122-2固化UV油墨。即,UV燈122-1及122-2利用紫外光來照射其上已施加UV油墨之接合引線之部分以固化UV油墨。
如上所述,由重複噴射及固化UV油墨同時在說明圖中左右移動之噴墨頭121實施噴墨印刷。在對接合引線(諸如接合引線31)執行噴墨印刷之後,以類似方式對表面安裝組件23執行噴墨印刷。
當UV油墨係用作為噴墨印刷處理之噴墨材料時,可防止可歸因於油墨材料流出之固態成像裝置11之良品率降低,因為可快速固化材料。
如因此所述,可藉由將一黑色塗層提供在影像感測器22周圍之構件上而容易且可靠地抑制光斑及重像。
在以上描述中,利用噴墨印刷來塗覆影像感測器22周圍之構件,當光接收部分32與接合引線31之間存在一足夠距離時,可替代地將一黑色樹脂施加至接合引線及表面安裝組件23。即,可藉由利用一液體材料來密封組件而提供保護。
當使用一施配器或類似物來將一黑色樹脂施加至接合引線31及表面安裝組件23時(如因此所述),該黑色樹脂可抑制來自透鏡61之照射在接合引線31及表面安裝組件23之表面上之光之反射。因此,可抑制光班及重像之產生以防止一影像之品質降級。
當使用一施配器來施加一黑色樹脂時,為防止在施加該樹脂之後因該樹脂流出而污染印刷電路板21上之一晶片,較佳地將UV可固化性賦予該樹脂以允許該樹脂在被施加至一表面之後即刻被固化。在此情況中,較佳地執行該樹脂之初步固化及其後執行熱固化以完全固化該樹脂。
此外,當使用一施配器來將一黑色樹脂施加至接合引線31時,施加在接合引線31與影像感測器22之間之間隙中之該樹脂中可產生空穴(氣泡)。為抑制空穴之產生,可期望執行引線接合使得引線係經成環以具有小至約30微米至70微米之一線環高度。
當將表面安裝組件23安裝在一印刷電路板21上時,可使用經著黑之一導電黏著劑來將表面安裝組件23牢固至板。以下將參考圖8中之流程圖而描述此一情況中所執行之製程。
在步驟S41中,將使用碳黑來著黑之一導電黏著劑施配或印刷(施加)在印刷電路板21之連接焊盤上以將表面安裝組件23連接至板。
在步驟S42中,將表面安裝組件23安裝在印刷電路板21上之已佈置導電黏著劑之位置中。更具體而言,例如,可將表面安裝組件23之電極部分佈置在印刷電路板21之連接焊盤上。
在步驟S43中,對導電黏著劑執行熱固化。因此,導電黏著劑係經固化以將表面安裝組件23牢固在印刷電路板21上且電連接印刷電路板21與表面安裝組件23。
在步驟S44中,將一影像感測器22晶粒接合至印刷電路板21上。例如,使用一黏著劑來將影像感測器22牢固至印刷電路板21。此外,在步驟S45中,於印刷電路板21與影像感測器22之間實施引線接合。
在步驟S46中,將一透鏡單元92安裝在印刷電路板21上以形成一固態成像裝置11,且結束製程系列。
當製造一固態成像裝置11時(如上所述),由黑色導電黏著劑覆蓋連接印刷電路板21與表面安裝組件23之部分及表面安裝組件23之側向部分。因為此一導電黏著劑之反射率通常低於用以牢固表面安裝組件23之焊料之反射率,所以即使來自一透鏡61之光照射在施加至用於連接表面安裝組件23之部分之導電黏著劑上,亦可抑制光之反射。因此,可防止無用光照射在一光接收部分32上,且可因此充分抑制光斑及重像。
任何類型之導電黏著劑可用以安裝表面安裝組件23,只要其為因添加一顏料(諸如碳黑)而著黑之一導電材料。
本揭示內容不受限於上述實施例,且可在不背離本揭示內容之精神之情況下作出各種修改。
本揭示內容含有與2011年2月18日於日本專利局申請之日本優先權專利申請案JP 2011-033687中所揭示標的相關之標的,該案之全文以引用方式併入本文中。
熟習技術者應瞭解,可根據設計要求及其他因素而作出各種修改、組合、子組合及改變,只要其等係在隨附請求項或其等效物之範圍內。
11...固態成像裝置
21...印刷電路板
22...影像感測器
23-1...表面安裝組件
23-2...表面安裝組件
31...接合引線
32...光接收部分
61...透鏡
62...紅外線截止濾光器
91...聚合板
92...透鏡單元
121...噴墨頭
122-1...紫外線燈/UV燈
122-2...紫外線燈/UV燈
B11...區域
R11...區域
圖1係顯示根據本揭示內容之一固態成像裝置之一實施例之一例示性組態之一說明圖;
圖2係用於解釋光在一接合引線處之反射之一說明圖;
圖3係用於解釋由噴墨印刷實現之反射抑制之一說明圖;
圖4係用於解釋光在一接合引線處之反射抑制之一說明圖;
圖5係用於解釋一固態成像裝置之製程之一流程圖;
圖6係用於解釋固態成像裝置之製造步驟之說明圖;
圖7係用於解釋噴墨印刷之一說明圖;
圖8係用於解釋一固態成像裝置之製程之一流程圖。
21...印刷電路板
22...影像感測器
23-1...表面安裝組件
23-2...表面安裝組件
31...接合引線
32...光接收部分
Claims (8)
- 一種固態成像裝置,其包括:一成像區段,其具有用於自一物體接收光以使該物體成像之一光接收部分;及一基板,該成像區段係佈置在該基板上,其中設置在該基板上之該光接收部分附近之一預定構件被部分或完全塗黑,且該預定構件包含至少一接合引線。
- 如請求項1之固態成像裝置,其中使用噴墨印刷來塗黑該預定構件。
- 如請求項2之固態成像裝置,其中該預定構件為定位在使來自該物體之該光照射在其上之該基板上之一範圍內之一構件;及定位在該範圍內之該預定構件之一部分被塗黑。
- 如請求項2之固態成像裝置,其中該預定構件為設置在該基板上之具有一預定值或更高之反射率之一構件;及該預定構件被塗黑。
- 如請求項1之固態成像裝置,其中該預定構件為連接該基板與佈置在該基板上之該成像區段或一封裝組件之一引線。
- 一種製造一固態成像裝置之方法,其包括:將一成像區段佈置在一基板上,該成像區段具有用於 自一物體接收光以使該物體成像之一光接收部分;及部分或完全塗黑設置在該光接收部分附近之一預定構件,其中該預定構件包含至少一接合引線。
- 一種固態成像裝置,其包括:一成像區段,其具有用於自一物體接收光以使該物體成像之一光接收部分;一基板,該成像區段係佈置在該基板上;及一預定構件,其佈置在該基板上之該光接收部分附近且利用由添加於其中之一顏料著黑之一導電黏著劑來牢固至該基板。
- 一種製造一固態成像裝置之方法,其包括:將由添加於其中之一顏料著黑之一導電黏著劑佈置在一基板上;將一預定構件佈置在該基板之區域中,其中佈置該導電黏著劑以將該預定構件連接至該基板;及將一成像區段佈置在該基板上之該預定構件附近,該成像區段具有用於自一物體接收光以使該物體成像之一光接收部分。
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