TWI466780B - Apparatus for laminating transparent multi-layers plate and method for preventing liquid glue from overflowing thereof - Google Patents

Description

Transparent multi-layer board bonding device and method for preventing liquid glue overflow

The invention relates to a transparent multi-layer board bonding device and a method for preventing the liquid glue from overflowing, in particular to a transparent multi-layer board bonding device which is bonded by using a photo-setting liquid glue and preventing liquid glue during bonding. The method of overflowing.

In recent years, as the development of liquid glue has become more and more mature, more and more multi-layer board bonding processes have gradually adopted liquid glue as a medium for bonding, and for transparent multilayer boards, it is also light-solid type. The use of liquid glue is most common. However, since the liquid glue is prone to enveloping bubbles and colloid overflow during the process of adhesive bonding, relatively new or improved techniques are required in the bonding process and environment.

In the lamination process of the multi-layer board, in order to avoid the situation that the surrounding glue is easily generated when the liquid glue is adhered, the liquid glue is often applied to different patterns according to the shape of the different substrates, for example, on a square substrate, usually The liquid glue is coated into a meter-shaped pattern, so that the glue can be diffused from the center to the periphery during the actual overflow, reducing the chance of enclosing the bubble. However, based on the factor of the pattern applied by the liquid glue, the distance between the liquid glue after coating is not completely the same from each side of the substrate, and when the laminated board is pressed, the time when the liquid glue overflows to each side of the substrate It can't be exactly the same. In this way, in the bonding process, if the liquid glue is uniformly filled in a bonding boundary of the substrate, a bonding boundary range in which the colloid overflows the portion is often generated.

From the above description, at present, in the process of using liquid glue as a bonding medium, it is not easy to control the flow direction of the liquid glue overflowing glue and the time point of overflowing the glue to each predetermined bonding boundary line due to the fitting. . Therefore, in the bonding process, how to avoid the phenomenon that the liquid glue overflows, there is indeed room for further improvement.

In view of the above, the technical problem to be solved by the present invention is to improve the bonding of the transparent multilayer board and prevent the colloid from overflowing when the film is bonded by the photo-setting liquid glue. The invention scans the light source to form light on the transparent multi-layer board, so that the position where the light is irradiated can form a conforming boundary range, so that the transparent multi-layer board can adhere to the boundary of the light when it is bonded. The liquid glue can be cured by light.

According to an aspect of the present invention, a transparent multi-layer board bonding apparatus is provided, comprising: a pressing mechanism and a light source device. The pressing mechanism is a first substrate and a second substrate for carrying the transparent multilayer board, and the bonding surface of the first substrate and/or the bonding surface of the second substrate is coated with a light-solid liquid glue. The light source device is disposed corresponding to the pressing mechanism, and controls the light source device to form a light on the transparent multi-layer board such that the irradiation position of the light is to form a bonding boundary line. Therefore, when the pressing mechanism presses the first substrate and the second substrate to cause the photo-curable liquid glue to overflow, the photo-solid liquid glue that adheres to the boundary line is formed and cured.

According to another aspect of the present invention, a method for preventing liquid glue from overflowing is provided, the method comprising: pressing a first substrate and a second substrate to pre-coat a first substrate and/or a second substrate The photo-solid liquid glue on the bonding surface is overflowed, and a light is formed on the transparent multi-layer board, so that the light is irradiated to form a bonding boundary line, and the glue is glued to the photo-solid liquid glue which adheres to the boundary line. Forming cure.

Thereby, the efficacies achieved by the present invention are that the structural design of the substrate of the transparent multilayer board is not required, and the effect of adhering the boundary line can be formed. This can effectively prevent the overflow phenomenon which is easy to occur when the photo-curable liquid glue is adhered, improve the process of using the photo-curable liquid glue as a bonding medium, and improve the quality of the transparent multi-layer board product.

The above summary, the following detailed description and the annexed drawings are intended to further illustrate the manner, the Other objects and advantages of the present invention will be described in the following description and drawings.

In the present invention, the light source device is used to form a light on the transparent multilayer board by means of cyclic scanning, so that the position irradiated by the light can form a conforming boundary range. When the light-solid liquid glue is overflowed, the light-solid liquid glue which adheres to the bonding boundary can be solidified, thereby being able to easily and effectively prevent the light-solid liquid glue from overflowing with the actual designed sticker. In combination, the transparent multi-layer board is uniformly filled with the photo-curable liquid glue only within the bonding boundary, thereby improving the production quality of the transparent multi-layer board.

In addition, it is to be noted that the transparent multi-layer board according to the present invention refers to a structure in which at least two layers of substrates are substantially transparent, such as a touch panel, a liquid crystal display panel, a plastic composite substrate, and a glass. Products such as synthetic substrates. Wherein, the plates of different substrates are not limited to the same material, and may be made of plates of different materials (such as glass, film, plastic, etc.) or plates after different processing processes, and the invention does not limit.

Please refer to the first figure, which is a schematic structural diagram of a first embodiment of a transparent multi-layer board bonding apparatus of the present invention. As shown in the figure, the present embodiment provides a bonding apparatus 1 including a pressing mechanism 11, a light source device 12, a controller 13, and a support frame 14. The pressing mechanism 11 is a first substrate 101 and a second substrate 102 for carrying the transparent multilayer board 10, and the bonding surface of the first substrate 101 or the bonding surface of the second substrate 102 is dispensed. A photo-curable liquid glue 103 is used as a bonding medium when the first substrate 101 and the second substrate 102 are bonded together. Of course, the photo-curable liquid glue 103 can be simultaneously dispensed on the bonding surface of the first substrate 101 and the bonding surface of the second substrate 102 in accordance with the design requirements.

Regarding the dispensing device (not shown) of the photo-setting liquid glue 103, those skilled in the art can understand that the dispensing device can be directly integrated into the bonding device 1 and matched with the pressing mechanism 11 . Come out of the dispensing operation. In fact, it may also be an upstream device designed to be independent of the laminating device 1, which is not limited by this embodiment.

Next, the pressing mechanism 11 of the embodiment further includes: a carrier 110, a first positioning fixture 111, a second positioning fixture 112, and a lifting mechanism 113. The first positioning fixture 111 is disposed on the carrier 110 for carrying and positioning the first substrate 101, and the second positioning fixture 112 is configured to carry and position the second substrate 102. Moreover, the first positioning fixture 111 and the second positioning fixture 112 can further be combined with different or the same positioning structures (eg, suction structure, clip structure, etc.) to respectively position the first substrate 101 and the second substrate 102. The first positioning fixture 111 and the second positioning fixture 112 of the embodiment are respectively designed to implement the first air suction structure 1110 and the second air suction structure 1120 to implement the bearing and positioning functions. The lifting mechanism 113 is connected to the first positioning jig 111 and the second positioning jig 112 for operating the vertical displacement of the first positioning jig 111 and the second positioning jig 112 for pressing the first substrate during operation. 101 and the second substrate 102.

It is noted that, in the actual bonding process, the second substrate 102 of the embodiment may be a bonding surface or a second substrate of the first substrate 101 after the dispensing of the photo-curable liquid glue 103 by the dispensing device. After the bonding surface of 102 is turned over, the bonding surface of the second substrate 102 is a bonding surface facing the first substrate 101. In addition, after the bonding surface of the second substrate 102 faces the bonding surface of the first substrate 101, the bonding surface of the second substrate 102 may be directly inserted between the first substrate 101 and the second substrate 102 to perform dispensing. The photo-curable liquid glue 103 is on the bonding surface of the first substrate 101 or the bonding surface of the second substrate 102. Thereby, a laminated pattern formed by the first substrate 101, the second substrate 102, and the photo-curable liquid glue 103 in the first figure is formed.

Next, the light source device 12 is provided corresponding to the pressing mechanism 11. The controller 13 is electrically connected to the pressing mechanism 11 and the light source device 12 for storing a graphic. In operation, the controller 13 controls the light source device 12 to form a light on the transparent multilayer board 10 according to the pattern such that the illumination position of the light forms a bonding boundary line L. Therefore, when the controller 13 controls the pressing mechanism 11 to press the first substrate 101 and the second substrate 102 to cause the photo-curable liquid glue 103 to overflow, the glue adheres to the photo-solid liquid glue that adheres to the boundary line L. 103 will form a cure.

In addition, since the photo-curable liquid glue 103 is freely overflowing toward the periphery of the transparent multi-layer board 10 at the time of bonding, the controller 13 actually controls the light source device 12 to cyclically scan and illuminate the light to utilize the light. The cyclic scan is to virtually surround the perimeter of the transparent multilayer panel 10 with a conforming boundary. In other words, the bonding boundary line L formed by the irradiation position of the light will appear cyclically around the transparent multilayer board 10.

The light source device 12 can be designed as a light source device or a line source device according to the control requirements of the actual process, and the specification of the light source device 12 is determined according to the characteristics of the photo-solid liquid glue 103 used in practice, for example, It is irradiated with ultraviolet light (UV Light) in the wavelength range of 355 ± 50 nm, and is not limited herein. As an example, if the light source device 12 is a point light source device, the controller 13 can adjust the scanning speed of the point light source device according to the viscosity characteristics of the light-solid liquid glue 103, for example, at a frequency of 3 Hz. To cycle through the light coordinates and illuminate the light.

Next, in the structure of the bonding apparatus 1 of the present embodiment, the support frame 14 is used to support and position the pressing mechanism 11, so that the light source device 12 is correspondingly disposed on the transparent multilayer board 10 carried by the pressing mechanism 11. Below, used to form light upwards. Of course, in addition to the architecture described in this embodiment, the support frame 14 can also be designed to support and position the light source device 12 such that the light source device 12 is correspondingly disposed on the transparent multilayer board carried by the pressing mechanism 11. Above the 10, used to form light down. In this regard, those skilled in the art will appreciate that any architecture that can achieve a distance between the light source device 12 and the transparent multilayer board 10 to facilitate illumination of the light source device 12 is encompassed by the scope of the present invention.

It is worth mentioning that, in order to prevent the carrier 110, the first positioning jig 111 and the second positioning jig 112 from being designed to block the light irradiated by the light source device 12. The carrier 110 may be, for example, a design in which a transparent material is formed in part or all of the area, or a design in which at least one through hole is opened. The position of the transparent plate material or the position of the through hole is determined by the actual boundary of the transparent multilayer board 10, so as not to hinder the light path formed by the light source device 12 according to the pattern. The carrier 110 of the present embodiment is designed, for example, using all transparent materials. Incidentally, if the carrier 110 is designed to have a through hole, a light guide column may be embedded in the through hole to increase the light guiding effect of the illumination.

Similarly, the first positioning jig 111 and the second positioning jig 112 are also designed based on the same principle to be designed with a transparent material, and the positioning structures included in the first positioning jig 111 and the second positioning jig 112 are included. (suction structure or clip structure, etc.) does not hinder the light path formed by the light source device 12 according to the pattern.

Further, for the architecture of the light source device 12, the light source device 12 of the present embodiment is a mechanical slide type light source emitting device, which includes a moving slide 120, a light source emitter 121, and a control unit 122. For a part of the moving rail 120, please refer to the second figure at the same time, which is a schematic structural diagram of an embodiment of the moving rail of the present invention. The moving rail 120 includes at least one first rail 1201 and at least one second rail 1202. The second rail 1202 is vertically mounted on the first rail 1201, and the first rail 1201 is used to operate a displacement in a first direction. The light source emitter 121 is disposed on the second rail 1202 and utilizes the second rail 1202 to operate a displacement in the second direction. The control unit 122 is electrically connected to the moving rail 120, the light source transmitter 121 and the controller 13 for receiving the control of the controller 13 to operate the moving rail 120 and the light source transmitter 121.

In the design, the moving rail 120 is mounted on the two first rails 1201 in a vertical manner, as shown in the second embodiment, to be vertically erected in an I-shaped manner. Outside. In fact, a second rail 1202 can be directly erected with a first rail 1201 in a cross-shaped vertical erection. The present invention does not limit the actual design and installation of the moving rail 120.

Thereby, the above-disclosed structure can realize the bonding apparatus 1 of the present invention for bonding the transparent multilayer board 10. The description of the graphics stored in the controller 13 is supplemented with a practical example. First, in the set state, the controller 13 can draw a scan pattern according to the actually required fit range of the transparent multilayer board 10, and define the starting point of the scan pattern. Next, the position of the light source device 12 is adjusted so that the light irradiation position of the light source device 12 can be aligned with the starting point, and the position of the light source device 12 at this time is recorded as a starting coordinate. In this way, in the operating state, the controller 13 controls the light source device 12 to cyclically scan and form light according to the scanning pattern from the starting coordinate.

Please refer to the third figure again for a schematic diagram of the second embodiment of the transparent multi-layer board bonding apparatus of the present invention. As shown in the figure, the structure and working principle of the bonding apparatus 1' provided in this embodiment are substantially the same as those of the bonding apparatus 1 of the first embodiment. The main difference is that the light source device 12' is matched with the embodiment. It belongs to a galvanometer light source emitting device. It is known to those skilled in the art that the galvanometer light source emitting device includes a modular light source emitter 121' and a control unit 122', the principle of which is through the horizontal and vertical lenses inside the light source emitter 121'. The vibration of the figure (not shown) controls the path of the illumination light to omit the design of the external mechanical slide, and will not be described in detail in the detailed structure. As a result, the light source device 12' of the present embodiment will switch faster than the mechanical slide type light source emitting device in the first embodiment.

Please refer to the fourth figure, which is a schematic diagram of an embodiment of the bonding state of the transparent multi-layer board of the present invention. Since the present invention forms light by the light source means 12, 12', the irradiation position of the light is formed to form the bonding boundary line L, and the light-solid type liquid glue 103 is prevented from overflowing beyond the bonding boundary line L. Therefore, as shown in the upper part of the fourth figure, in the state where the first substrate 101 and the second substrate 102 are pressed together to allow the photo-curable liquid glue 103 to overflow, it is assumed that part of the photo-curable liquid glue 103 overflows first. The glue to the right side of the transparent multilayer board 10 is formed by the position of the light beam irradiated by the light source devices 12, 12'. The portion of the photo-curable liquid glue 103 is then subjected to illumination to form a solidification.

Then, as shown in the lower half of the fourth figure, when the waiting for the photo-curable liquid glue 103 to continue to overflow, the photo-curable liquid glue 103 can be prevented from continuously overflowing to the right side of the transparent multi-layer board 10, thereby causing overflow. full. Moreover, when the photo-curable liquid glue 103 overflows to the left side bonding boundary line L formed by the position of the light irradiated by the light source devices 12, 12', the photo-curable liquid glue 103 is also affected by the light to form a solidification. . In this way, the transparent multilayer board 10 can be uniformly filled with the photo-curable liquid glue 103 in the set bonding boundary line L, and the colloid overflow does not occur.

Please refer to the fifth figure again for a flow chart of an embodiment of the method for preventing liquid glue from overflowing. As shown in the figure, the present embodiment provides a method for preventing liquid glue from overflowing, which is applied to a transparent multi-layer board bonding apparatus, which is a first substrate pre-loaded with a transparent multi-layer board. And a second substrate, and the bonding surface of the first substrate or the bonding surface of the second substrate is dispensed with a light-solid liquid glue. In addition, the first substrate and the second substrate carried at this time are preferably in a superposed state, which are close to each other by the light-solid liquid glue, and form a transparent multi-layer board which has not been completely pressed.

In the above state, the method for preventing the liquid glue from overflowing in the embodiment includes: pressing the first substrate and the second substrate to cause the light-solid liquid glue to start overflowing (S501). At this time, the photo-curable liquid glue can freely diffuse the overflow gel, and then a light (point light or line light) is formed on the transparent multi-layer board according to a pattern, so that the irradiation position of the light is formed into a conforming boundary line ( S503). In this way, any bonding glue to the boundary line can be cured by the bonding boundary line formed by the light irradiation position (S505). Thereby, it is possible to prevent the colloidal overflow of the photo-curable liquid glue during the bonding.

It should be noted that, in the steps (S501) and (S503) described in the embodiment, the actual execution sequence may also be exchanged with each other to recombine the first substrate and the second substrate after confirming the formation of the light. To let the light-solid liquid glue overflow. This is not a limitation of this embodiment.

In summary, the present invention designs a conforming boundary line according to the characteristics of curing of the photo-curable liquid glue by light, and is used to prevent the overflow of the photo-curable liquid glue. Among them, the cured area is only on the bonding boundary line, and does not actually cure the photo-setting liquid glue in the bonding boundary line, so that the transparent multi-layer board is actually entering the back end of the so-called curing process, and then comprehensive Curing light-solid liquid glue. In this way, the present invention does not cause the degree of curing before and after the photo-solid liquid glue is inconsistent, and affects the quality of the photo-curable liquid glue after curing. In addition, the present invention does not require a structural change or design specifically for the substrate of the transparent multilayer board to form the effect of adhering the boundary line. In this way, the overflow phenomenon generated when the photo-curable liquid glue is adhered is effectively prevented, the process of using the photo-curable liquid glue as a bonding medium is improved, and the quality of the transparent multi-layer board product is improved.

However, the above description is only for the purpose of illustration and illustration of the embodiments of the present invention, and is not intended to limit the scope of the invention. Variations or modifications that may be readily conceived within the scope of the invention may be covered by the scope of the invention as defined in the following.

1,1’. . . Laminating device

10. . . Transparent multilayer board

101. . . First substrate

102. . . Second substrate

103. . . Light solid liquid glue

11. . . Pressing mechanism

110. . . Carrier board

111. . . First positioning fixture

1110. . . First suction structure

112. . . Second positioning fixture

1120. . . Second suction structure

113. . . Lifting mechanism

12,12’. . . Light source device

120. . . Moving rail

1201. . . First rail

1202. . . Second rail

121,121’. . . Light source emitter

122,122’. . . control unit

13. . . Controller

14. . . Support frame

L. . . Fit boundary line

S501 to S505. . . Flow chart step description

The first figure is a schematic structural view of a first embodiment of the transparent multi-layer board bonding apparatus of the present invention;

The second figure is a schematic diagram of an embodiment of a moving slide of the present invention;

The third drawing is a schematic structural view of a second embodiment of the transparent multi-layer board bonding apparatus of the present invention;

The fourth drawing is a schematic view of an embodiment of the bonding state of the transparent multilayer board of the present invention;

The fifth drawing is a flow chart of an embodiment of the method of the present invention for preventing liquid glue from overflowing.

1. . . Laminating device

10. . . Transparent multilayer board

101. . . First substrate

102. . . Second substrate

103. . . Light solid liquid glue

11. . . Pressing mechanism

110. . . Carrier board

111. . . First positioning fixture

1110. . . First suction structure

112. . . Second positioning fixture

1120. . . Second suction structure

113. . . Lifting mechanism

12. . . Light source device

120. . . Moving rail

121. . . Light source emitter

122. . . control unit

13. . . Controller

14. . . Support frame

L. . . Fit boundary line

Claims (16)

A transparent multi-layer board bonding apparatus comprising: a pressing mechanism for carrying a first substrate and a second substrate of the transparent multilayer board, wherein the bonding surface of the first substrate and/or the bonding of the second substrate The surface is coated with a light-solid liquid glue; a light source device is disposed corresponding to the pressing mechanism, and a light is formed on the transparent multilayer board; and a controller electrically connecting the pressing mechanism and the light source The device, and the controller draws and stores a scan pattern according to the actual required bonding range of the transparent multi-layer board, so that the illumination position of the light circulates to form a conforming boundary line to the transparent multi-layer board according to the scan pattern. The controller controls the pressing mechanism to press the first substrate and the second substrate to cure the photo-solid liquid glue that overflows from the periphery of the transparent multi-layer board to the bonding boundary line. The transparent multi-layer board bonding apparatus of claim 1, wherein the light source device further comprises: a moving slide rail, comprising: at least one first guide rail; and at least one second guide rail vertically mounted on the first a guide rail, and the first guide rail is used to operate a displacement of the first direction; a light source emitter is disposed on the second guide rail, and the second guide rail is used to operate a second direction displacement; and a control unit And electrically connecting the moving rail, the light source emitter and the controller, and receiving control of the controller to operate the moving rail and the light source emitter. The transparent multi-layer board bonding apparatus according to claim 1, wherein The light source device is a galvanometer light source emitting device. The transparent multi-layer board bonding apparatus according to claim 1, wherein the light source device is a one-point light source device or a line source device. The transparent multi-layer board bonding apparatus according to claim 1, further comprising: a support frame for supporting and positioning the pressing mechanism, wherein the light source device is placed correspondingly below the transparent multilayer board This light is formed. The transparent multi-layer board bonding apparatus according to claim 1, further comprising: a support frame for supporting and positioning the light source device, wherein the light source device is placed correspondingly above the transparent multilayer board to form downward The light. The transparent multi-layer board bonding apparatus according to claim 1, wherein the pressing mechanism further comprises: a carrier; a first positioning fixture is disposed on the carrier for carrying and positioning the first a second positioning fixture for carrying and positioning the second substrate; and a lifting mechanism for connecting the first positioning fixture and the second positioning fixture for operating the first positioning treatment And/or a vertical displacement of the second positioning fixture to press the first substrate and the second substrate. The transparent multi-layer board bonding apparatus according to claim 7, wherein part or all of the carrier board is made of a transparent material. The transparent multi-layer board bonding apparatus according to claim 7, wherein the carrier board is provided with at least one through hole. The transparent multi-layer board bonding apparatus according to claim 9, wherein the through-hole is further embedded with a light guiding column. The transparent multi-layer board bonding apparatus according to claim 7, wherein the first positioning fixture comprises a positioning structure, and the first positioning fixture adopts a transparent material design. The transparent multi-layer board bonding apparatus according to claim 11, wherein the positioning structure is a suction structure or a clip structure. The transparent multi-layer board bonding apparatus according to claim 7, wherein the second positioning fixture comprises a positioning structure, and the second positioning fixture adopts a transparent material design. The transparent multi-layer board bonding apparatus according to claim 13, wherein the positioning structure is a suction structure or a clip structure. A method for preventing liquid glue from overflowing, comprising the steps of: pressing a first substrate and a second substrate to form a transparent multilayer board, and pre-coating the first substrate and/or the second substrate The surface-setting photo-solid liquid glue is used to overflow the glue; and a light is formed on the transparent multi-layer board, wherein the light is irradiated by a controller according to the actual required bonding range of the transparent multi-layer board, and a scan is stored and stored. a pattern such that the irradiation position of the light circulates to form a bonding boundary line to the transparent multilayer board according to the scanning pattern, and causes a light-solid liquid state to overflow from the periphery of the transparent multilayer board to the bonding boundary line The glue forms a cure. The method for preventing liquid glue overflow as described in claim 15 wherein the light is designed using point light or line light.