JP2908259B2 - Method and apparatus for bonding liquid crystal panels - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and an apparatus for bonding a liquid crystal panel in which a transparent substrate and a transparent substrate or a semiconductor substrate are bonded with a photocurable adhesive in a process of assembling the liquid crystal panel.

[0002]

2. Description of the Related Art There are two types of liquid crystal screens: a transmission type and a reflection type. The transmissive liquid crystal screen is composed of a liquid crystal panel, a driver for controlling the liquid crystal panel, and a backlight for illuminating the liquid crystal panel from the back. The liquid crystal panel encloses liquid crystal and controls the voltage applied to the liquid crystal to transmit or block light from the backlight, thereby displaying a screen. In this case, the liquid crystal panel is composed of two glass substrates.

On the other hand, a reflection type liquid crystal screen utilizes room light without using a backlight, and one substrate is constituted by a semiconductor substrate having a mirror surface for reflecting light.
The room light incident on the liquid crystal panel passes through the glass substrate and the liquid crystal layer, is reflected by the reflecting mirror surface, passes through the liquid crystal layer and the glass substrate again, and displays a screen. The reflective liquid crystal screen has the advantage of low power consumption because no backlight is used.

Recently, a resin substrate has been used instead of a glass substrate for cost reduction. Usually, one of two substrates (a glass substrate, a resin substrate or a semiconductor substrate) constituting a liquid crystal panel is provided with a driving element for driving a liquid crystal, for example, a thin film transistor (TFT).
And a liquid crystal driving electrode formed of a transparent conductive film.

On the other glass substrate (or resin substrate), a light-shielding film called a black matrix is formed, and in the case of a color liquid crystal panel, a color filter and the like are formed. The black matrix is formed of, for example, a chromium deposited film or a black resin, and light from a backlight or a reflecting mirror surface is applied to a portion other than liquid crystal that is not related to image display, that is, a liquid crystal driving element or a wiring portion. It acts as a blindfold so that it does not leak and disturb the image.

FIG. 12 shows an example of the above-mentioned liquid crystal panel (color liquid crystal panel). In FIG.
Is a color filter substrate, 102 is a TFT substrate, 103 is a TFT element (thin film transistor), 104 is a black matrix, 105 is a scatter spacer, 106 is an alignment film,
Reference numeral 107 denotes a sealant, and reference numeral 108 denotes a display ITO electrode. In the figure, the horizontal direction is shown on a smaller scale than the vertical direction for easy understanding.

In the process of manufacturing a liquid crystal panel, the two glass substrates are separately manufactured and then bonded together with an adhesive (sealant 107 in FIG. 12). At this time, spherical fine particles called spacers (see FIG. 1) are placed between the two glass substrates.
The gap 105 for injecting the liquid crystal is formed between the two glass substrates by spraying the spacer 105).
The above-mentioned adhesive also serves as a seal for preventing liquid crystal from leaking. That is, the adhesive is applied in a thin line shape so as to surround the screen display portion. The width of the line is 1-1.5m
m.

FIG. 13 is a view showing a state in which an adhesive (sealant) is applied on a glass substrate. As shown in FIG. 13, usually, a plurality of (four in FIG. Is installed. Then, an adhesive is applied so as to surround each product, and after bonding to a part thereof, an injection port for injecting liquid crystal is provided. Adhesives are temporarily applied to the four corners of the glass substrate as necessary, and the two glass substrates are temporarily fixed with the adhesive for the temporary fixing, and then the two glass substrates are bonded together.

Screen printing is used for applying the adhesive. Recently, a method of extruding an adhesive in a thread form from a probe such as a syringe called a dispenser and applying the adhesive while moving the dispenser has been performed. This method has an advantage that dust does not easily adhere to the substrate because the screen or the like does not contact the substrate surface, as compared with application by printing, and defects due to dust contamination hardly occur.

When the two substrates are bonded to each other, the two substrates are aligned so that the black matrix correctly overlaps with the portion to be shielded from light. Furthermore, so that the gap is uniform over the entire surface of the substrate,
The adhesive is cured while applying pressure in a direction in which the two substrates relatively approach each other. Conventionally, in a step of bonding two substrates, bonding has been performed using a thermosetting adhesive. However, in this method, since high temperature treatment is performed to cure the adhesive, the two substrates are displaced during bonding and curing due to the thermal expansion of the substrate, which causes a product defect. For this reason, in recent years, an adhesive technique of curing with light without applying heat using a photocurable adhesive has been developed and used.

In the case where the adhesive is cured with light, the curing can be completed in a shorter time as the intensity of the irradiated light is higher. For this reason, the entire liquid crystal panel has been illuminated collectively using a high-pressure mercury lamp, a metal halide lamp, or the like that can obtain a strong ultraviolet intensity as a light source. FIG. 14 is a view showing a conventional example in which a light curable adhesive is irradiated with light to cure the adhesive on the liquid crystal substrate. In FIG. 14, 1 is a mirror, 2 is a high-pressure mercury lamp or metal halide lamp which emits ultraviolet rays. Lamps, etc.
Reference numeral 3 denotes a work such as a liquid crystal panel formed integrally by sandwiching an adhesive between the two glass substrates. The light emitted from the lamp 2 is collected by being reflected by the mirror 1 and the light transmission window 11 is formed. The light passes through and enters the liquid crystal panel 3 on the side of the substrate on which the black matrix is provided.

Reference numeral 10 denotes a work processing chamber, 11 denotes a light transmitting window, 12 denotes a stage on which a work is mounted, 13 denotes a guide,
Reference numeral 14 denotes a water-cooled tube, which can be cooled by the water-cooled tube 14 in order to prevent the work from being undesirably heated by the irradiated light. Reference numeral 15 denotes a through hole, which presses the work 3 upward by supplying air from an air inlet 16 below the stage to the lower surface of the work 3 through the through hole 15.

In the figure, the step of bonding the liquid crystal panels is performed as follows. (1) The work 3 is placed on the stage 12 in the processing chamber 10. (2) Supply air through the through hole 15 of the stage 12. The work 3 rises by air pressure, and the upper surface is a light transmitting window 1.
1 and pressurized by air pressure. (3) Irradiate ultraviolet rays from the lamp 2 to cure the adhesive applied to the work 3. At that time, if necessary, water cooling tube 1
4 is supplied with cold water or the like to prevent an undesired rise in temperature of the work 3.

By the way, in recent years, in order to improve manufacturing efficiency,
The work has been increased in size due to a demand to simultaneously manufacture a plurality of liquid crystal screens on one work. Along with this, the area for irradiating light has increased, and the output and size (length) of the lamp used have also increased. The adhesive is applied in a thin line shape so as to surround the screen display portion as shown in FIG. The portion which needs light irradiation is this linear portion. This linear portion is less than 5% of the area of the entire work. That is, in the conventional collective irradiation, most of the light is irradiated to a portion where there is no adhesive, and there is a problem that the light use efficiency is extremely low.

[0015] Further, the light applied to the portion where there is no adhesive increases the temperature of the substrate. Therefore, the substrate expands due to the temperature rise, and the two substrates are displaced during bonding and curing,
This was causing product failure. As a means for solving this problem, it is conceivable to irradiate only necessary portions with light using a light guide fiber. When the substrate is large or the length of the applied adhesive (sealant) is long, the light may be irradiated while moving the light to be irradiated relative to the adhesive by moving the light guide fiber or the like.

According to this method, it is possible to reduce the amount of light applied to the portion where there is no adhesive, and it is possible to use light efficiently. Further, the temperature rise of the substrate can be suppressed.
For example, Japanese Patent Application Laid-Open No. HEI 4-178629 discloses a technique in which an optical fiber and a pressure roller are integrated, and the adhesive is cured by moving the optical fiber and the pressure roller. Among the publications, a part for moving an optical fiber can be applied to solve the above-mentioned problem (the technique disclosed in the publication is a technique for simultaneously performing light irradiation and pressurization). It does not solve the problems of light utilization efficiency and temperature rise as described above, and there is no indication or suggestion about these problems.)

[0017]

By the way, as a result of various experiments, it has been found that a uniform gap cannot be obtained over the entire surface of the work if the irradiation light is simply moved and irradiated. This is thought to be due to the following reasons. That is, when moving the irradiation light to cure the adhesive,
The portion of the adhesive that is exposed to the light is locally cured, and proceeds sequentially over the entire length of the adhesive as the light moves.

On the other hand, when the adhesive is cured, the curing reaction causes a change in the volume of the adhesive. This is because the photocurable adhesive is cured using a photopolymerization reaction or a photocrosslinking reaction, and the volume decreases when such a reaction occurs. Therefore, the hardened portion irradiated with light exerts a strong force in a direction in which the two substrates are pulled by the volume reduction and the gap becomes smaller. At this time, the uncured portion that has not been irradiated with light is still in a gel-like and fluid state. Therefore, the uncured portion that has just been irradiated with light is dragged by the cured portion and the gap is reduced. In the hardened part, the gap is widened by leverage with the spacer as a fulcrum. As a result, curing proceeds with the two substrates tilted, and the gap becomes non-uniform. This is a problem peculiar to the liquid crystal panel using the spacer.

Further, when the adhesive is applied using a dispenser, the position of the applied adhesive may fluctuate due to the variation in the moving speed of the push-out probe and the control accuracy of the amount of the pushed-out adhesive. When the adhesive in such a state is irradiated with light in a movement pattern set in advance simply by a combination of the light guide fiber and the fiber moving mechanism, the uncured portion is not irradiated with the light at the portion of the adhesive whose position has changed. Can occur.

If the liquid crystal is injected in a state where the adhesive is not sufficiently cured, as described above, the uncured component of the adhesive dissolves in the liquid crystal, thereby deteriorating the characteristics of the liquid crystal and causing a defective product. In order to avoid this, it is necessary to increase the spot diameter of the light in consideration of the change in the position of the adhesive, and there is a problem that the light use efficiency is poor. The present invention has been made in consideration of the above-described problems of the related art, and a first object of the present invention is to provide a uniform gap over the entire surface of a work, thereby improving light use efficiency. Another object of the present invention is to provide a method and an apparatus for bonding a liquid crystal panel, which can efficiently cure an adhesive without substantially increasing the temperature of a substrate.

A second object of the present invention is to provide a method and an apparatus for bonding a liquid crystal panel, which can accurately irradiate light to a portion of an adhesive and do not generate a portion which is not cured. A third object of the present invention is to provide a method and an apparatus for bonding a liquid crystal panel, which can accurately irradiate light to a portion of the adhesive even if the position of the adhesive changes.

[0022]

According to a first aspect of the present invention, there is provided a liquid crystal panel bonding method for bonding a transparent substrate and a transparent substrate or a transparent substrate and a semiconductor substrate with a photocurable adhesive. The light guided by the light guide fiber from the irradiation unit is irradiated while being moved relatively to the adhesive, and the adhesive is cured for the first time.
After irradiation, return the light irradiation unit to the light irradiation start position,
The second and subsequent irradiations are performed on the same area as the first irradiation area.
The amount of radiation required to cure the adhesive.
It is made to look like.

According to a second aspect of the present invention, in the first aspect of the present invention, the irradiation amount of the first irradiation light is smaller than the irradiation amount of the second irradiation light. . According to a third aspect of the present invention, in the first or second aspect of the present invention, the irradiation amount is controlled by making the moving speed of the light guided by the light guide fiber variable. is there.

The invention according to claim 4 of the present invention relates to claims 1 and 2
Alternatively, in the invention according to claim 3, the irradiation amount is controlled by making the irradiation intensity of the light guided by the light guide fiber variable. The invention of claim 5 of the present invention is the invention according to claim 1, 2, 3, or 4
A movement origin of the light guide fiber and a reference point for positioning the work are set in advance, and the position information of the adhesive with respect to the reference point of the work relative to the movement origin of the light guide fiber and the reference point of the work alignment are set in advance. Is stored in the storage means, first, the work is aligned so that the alignment reference point of the work is at a predetermined position with respect to the moving origin of the light guide fiber, and then the position read from the storage means is read. On the basis of the information, the work is irradiated with light while the emitting end of the light guide fiber is moved to a predetermined position by a control means to cure the adhesive.

The invention of claim 6 of the present invention provides the method of claim 1,
In the second, third or fourth aspect of the present invention, the position of the adhesive is detected by a sensor, and a signal from the sensor is used to control the output end of the light guide fiber to be held at a predetermined position with respect to the adhesive. In addition, the adhesive is cured by irradiating light while moving the emission end of the light guide fiber.

The seventh aspect of the present invention provides the first aspect.
In the second, third, fourth, fifth or sixth aspect of the present invention, the light emitted from the light guide fiber is condensed by a lens and irradiated to an adhesive. According to an eighth aspect of the present invention, there is provided a liquid crystal panel bonding apparatus, wherein a light, a light converging mirror, a light irradiating section having a shutter, and a light guide fiber for guiding light from the light irradiating section to an output end. A processing chamber having a light transmission window for irradiating light from the light irradiation unit to an adhesive of a work integrally formed by sandwiching an adhesive between the transparent substrate and the transparent substrate or between the transparent substrate and the semiconductor substrate. A stage for placing a work placed in the processing chamber, a pressing mechanism for applying pressure in a direction in which the two substrates of the work relatively approach, and holding an emission end of the light guide fiber; a moving mechanism for moving the emission end, a storage means for storing the radiation count information, provided a control unit for controlling the light irradiation unit and the moving mechanism by irradiation frequency information from the storage means, from the light irradiation unit Light guide fiber
While moving the guided light relative to the adhesive
After irradiating the adhesive for the first time, light irradiate the
Return to the firing start position and place it in the same area as the first irradiation area
On the other hand, by performing the second and subsequent irradiations, the irradiation amount required for curing the adhesive is reached.

According to a ninth aspect of the present invention, in the eighth aspect of the present invention, the control unit is provided with a speed control function for variably controlling the moving speed of the moving mechanism. According to a tenth aspect of the present invention, in the eighth or ninth aspect, a light irradiation unit is provided with an irradiation intensity variable mechanism.
According to an eleventh aspect of the present invention, in the eighth, ninth or tenth aspect of the present invention, there is provided an alignment mechanism for aligning a work at a predetermined position, and a storage means for storing positional information of the adhesive. The control unit controls the moving mechanism based on the position information from the storage unit, and moves the emission end along the adhesive on the work while irradiating light.

The invention according to claim 12 of the present invention is directed to claim 8,
In the ninth or tenth aspect of the present invention, a sensor for detecting a position of the adhesive integrally supported with the emission end of the light guide fiber is provided, and the control unit controls a moving mechanism based on a signal from the sensor, and The emission end is moved along the adhesive on the work while irradiating light while controlling the emission end of the fiber to be kept at a predetermined position with respect to the adhesive.

According to the thirteenth aspect of the present invention,
According to the ninth, tenth, eleventh or twelfth aspect, a lens for condensing light emitted from the light guide fiber is provided.

[0030]

According to the first and eighth aspects of the present invention, since the amount of light required for curing the adhesive is divided into a plurality of times, the amount of light to be irradiated for each irradiation is adjusted. Is small, and distortion occurring between a portion irradiated with light and a portion not irradiated with light is also small. Therefore, the liquid crystal panels can be bonded together while maintaining good gap uniformity.

[0031] That is, at the time the single irradiation is terminated remains is kept gap uniformity, once irradiation
Each time the light irradiation section is returned to the light irradiation start position and such irradiation is repeated several times, the required irradiation amount can be reached while maintaining the uniformity of the gap, and good gap uniformity is maintained. The liquid crystal panels can be attached together. In the invention of claim 2 of the present invention, since the irradiation amount of the first irradiation light is smaller than the irradiation amount of the second irradiation light and thereafter, the adhesive by the first irradiation is used. Can be reduced, and the gap can be kept uniform even if the second irradiation dose is increased.

That is, if the irradiation amount in the first irradiation is made sufficiently small, the volume of the adhesive hardly decreases, and the uniformity of the gap is maintained. On the other hand, since the adhesive is hardened by the first irradiation, the fluidity of the entire adhesive is small at the time when the irradiation is completed.
In this state, when the second and subsequent irradiations are performed with a larger irradiation amount than the first irradiation, even if a strong force due to the volume reduction of the light-irradiated portion acts, the portion not irradiated with the light is the first.
Since the fluidity is reduced by the second irradiation, the gap is not shrunk or widened by being dragged by the irradiated portion.

In particular, when the light transmittance of the adhesive is poor,
By sufficiently reducing the first dose and increasing the second and subsequent doses, it is possible to perform processing with good gap uniformity and high throughput. According to the third and ninth aspects of the present invention, since the irradiation amount is controlled by making the moving speed of the light guided by the light guide fiber variable, the irradiation intensity of the light is kept at a constant value. Can be fixed. For this reason, it is not necessary to provide a special mechanism for varying the light intensity in the light irradiation unit, and it is possible to provide an inexpensive device and reduce the cost.

According to the fourth and tenth aspects of the present invention, since the irradiation intensity of the light guided by the light guide fiber is made variable, the moving speed of the light can be fixed at a constant value. . Therefore, even when the irradiation amount is largely changed, the time required for the processing can be kept constant, and a stable throughput can be obtained. In addition, it is possible to match the processing capacity with the devices in the preceding and following processes, and the design of the liquid crystal panel manufacturing line is facilitated.

According to the fifth and eleventh aspects of the present invention, the positional information of the adhesive is stored, and the reference point for work alignment is set at a predetermined position with respect to the origin of movement of the light guide fiber. After the work is aligned, the light is irradiated and the adhesive is cured while moving the emission end of the light guide fiber to a predetermined position based on the position information. The adhesive can be accurately irradiated with light without deviating. For this reason, there is no portion that is not cured without being irradiated with light.

Further, since the spot diameter of the light can be made equal to or slightly wider than the width of the adhesive, the light use efficiency can be improved. Further, since the light irradiated to the portion without the adhesive is greatly reduced, the temperature of the substrate hardly rises. Therefore, the substrate does not expand due to the temperature rise, and the two substrates do not shift during bonding / curing, thereby preventing a product defect.

According to the sixth and twelfth aspects of the present invention, the position of the adhesive is detected by a sensor, and the output end of the light guide fiber is held at a predetermined position with respect to the adhesive by a signal from the sensor. Irradiating light while moving the light emitting end of the light guide fiber to cure the adhesive, so that even if the position of the adhesive fluctuates, it irradiates light while faithfully following the adhesive. can do. For this reason, there is no portion that is not cured without being irradiated with light.

Further, since the spot diameter of the light can be made equal to or slightly wider than the width of the adhesive, the light use efficiency can be improved. Further, since the light irradiated to the portion without the adhesive is greatly reduced, the temperature of the substrate hardly rises. Therefore, the substrate does not expand due to the temperature rise, and the two substrates do not shift during bonding / curing, thereby preventing a product defect.

According to the seventh and thirteenth aspects of the present invention, since the light emitted from the light guide fiber is condensed by the lens and irradiated onto the adhesive, the distance between the light emitting end and the surface to be irradiated is determined. Even if the distance is large, light can be intensively irradiated onto the adhesive, the irradiation intensity does not decrease, and the time for the curing treatment can be shortened. In addition, since light is not irradiated to a portion that does not need to be irradiated, light use efficiency can be improved.

[0040]

FIG. 1 is a diagram showing the overall configuration of an embodiment of the present invention. In the figure, reference numeral 20 denotes a light irradiating device. The light irradiating device 20 includes a condenser mirror 21, a lamp 22 such as an ultra-high pressure mercury lamp or a metal halide lamp that emits ultraviolet light, and a reflecting mirror 2.
3, a shutter 24, an optical filter 25, a lamp power supply unit (not shown) for supplying power to the lamp,
The light emitted from the lamp 22 is collected by the collecting mirror 21 and when the shutter 24 is open, the reflecting mirror 23 → the shutter 24
→ The light enters the light guide fiber 31 via the optical filter 25. Reference numeral 24a denotes an air cylinder. The air cylinder 24a is controlled by a control device 50 described later, and opens and closes the shutter 24.

Reference numeral 3 denotes a work, and the work 3 corresponds to FIG.
As shown in FIG. 2, an adhesive is applied linearly between a transparent substrate and a transparent substrate or between a transparent substrate and a semiconductor substrate, and at least two positions are aligned on the work 3 as shown in FIG. Are marked with an alignment mark AM which is a reference for. Reference numeral 4 denotes an alignment unit, which receives the alignment mark AM marked on the work by the alignment unit 4 and performs position adjustment of the work as described later.

Reference numeral 10 denotes a work processing chamber. The work processing chamber 10 includes a light transmission window 11, a stage 12, and the like. The stage 12 is in the X, Y, and Z-axis directions (X-axis is , The Y-axis is movable in the left-right direction, and the Z-axis is movable in the up-down direction, and rotates about an axis orthogonal to a plane formed by the X and Y axes (this is referred to as a θ-axis). It is configured to be possible.

The stage 12 is provided with a means for pressing the work 3 from below. When the work 3 is irradiated with light to cure the adhesive, the work 3 is pressed from below.
Reference numeral 31 denotes a light guide fiber, and an output end 32 is provided at the other end of the light guide fiber 31. Light incident from one end of the light guide fiber 31 is emitted from the output end 32 and irradiated to the work 3. You.

Reference numeral 40 denotes an emission end moving mechanism for moving the emission end 32, and reference numeral 50 denotes a control device for controlling the emission end moving mechanism 40 and the like. The control device 50 includes a storage unit 50a,
The storage unit 50a stores irradiation number information indicating the number of light irradiations to the adhesive, speed control information indicating the moving speed of the emission end 32, and adhesion to the alignment mark AM on the work 3 shown in FIG. The adhesive application position information (X, Y) indicating the application position of the agent, the relative position information (xo, yo) of the reference position Q with respect to the movement origin P of the emission end 32, and the light irradiation start position S are stored in advance. .

The reference position Q is a point at which the alignment mark AM on the work 3 is aligned. After the alignment of the work 3 described later, the reference position Q and the alignment mark AM are aligned as shown in FIG. The positions of the AMs coincide. Then, based on the stored information, the control device 50 drives the emission end moving mechanism 40 to move the emission end 32 along the adhesive while controlling the moving speed and position, and performs the number of times set by the irradiation number information. Irradiate the adhesive with light.

FIG. 3 shows the alignment unit 4 described above.
FIG. 2 is a diagram illustrating an example of a configuration of a work processing chamber 10.
In the figure, reference numeral 4 denotes an alignment unit, and the alignment unit 4 includes a lens 4a and a half mirror 4.
b, a lens 4c, a mirror 4d, a light receiving element 4e composed of a CCD or the like, a mirror 4h, and a lens 4g.
Light for illumination introduced from the optical fiber 4f is
g → mirror 4h → half mirror 4b → lens 4c → mirror 4d is irradiated around the alignment mark AM of the work 3 and the reflected light is received by the mirror 4d → lens 4c → half mirror 4b → lens 4a. 4e.

The alignment marks AM are marked on at least two places on the work 3, and the alignment units 4 are provided corresponding to them. Reference numeral 10 denotes a work processing chamber. The processing chamber 10 includes a light transmission window 11, a θ stage 12a, an X stage 12b, a Y stage 12c,
The stage 3 includes a base 12 d and the like, and the work 3 is placed on the stage 12.

The θ stage 12a is mounted on the X stage 12b via a bearing 12e, and is rotated about a θ axis by a drive motor (not shown). The X stage 12b is mounted on the Y stage 12c via a slide guide 12f, and is driven in the X-axis direction (a front-rear method on the paper of FIG. 1) by a drive motor (not shown).

The Y stage 12c is a slide guide 12g.
, And is driven in the Y-axis direction (the left-right direction in the figure) by a drive motor (not shown). Further, although not shown in FIG.
d is provided in the Z-axis direction.
The whole is driven in the Z-axis direction by a motor (not shown) or the like.

The θ stage 12a has a water cooling tube 14
And an air introduction pipe 17 are provided, and by flowing cold water through the water cooling pipe 14, undesired heating of the work 3 is prevented.
In addition, by supplying air to the lower surface of the work 3 through the air introduction pipe 17, the work 3 is pushed up and pressurized. In FIG. 3, in order to position the work 3,
The alignment unit 4 receives an image of the alignment mark AM marked on the work, and sends the received image to the control device 50. The control device 50 processes the received image data, and moves the stage 12 to X,
Move in the Y-axis direction (or rotate around the θ-axis)
The alignment mark AM is made to coincide with a predetermined reference position Q (see FIG. 2).

FIG. 4 is a view showing an example of the configuration of the above-mentioned emission end moving mechanism 40. In FIG. 4, reference numeral 32 denotes the above-mentioned emission end, and a light guide fiber 31 is attached to the emission end 32. Light is introduced into the light guide fiber 31 from the light irradiation device 20 described above. Further, a light transmission window 11 of the work processing chamber 10 (shown by a dotted line in FIG. 1) is disposed to face the emission end 32.

Reference numeral 41 denotes a frame, and reference numeral 42 denotes an X-axis arm to which the emission end 32 is attached. The X-axis arm 42 is engaged with a ball screw 43c, and the ball screw 43c is further driven by an X-axis via a coupling 43b. Motor 43a
Is joined to. Therefore, when the X-axis drive motor 43a rotates, the ball screw 43c rotates, and the X-axis arm 42
Moves in the X-axis direction.

The X-axis drive motor 43a, the coupling 43b, and the ball screw 43c are supported by a Y-axis arm 44. The Y-axis arm 44 is provided on first and second guide members 46 and 47. 46a, 47a
Movable along is mounted. Further, the guide members 46 and 47 are fixed to the frame 41. One end of the Y-axis arm is engaged with a ball screw 45c, and the ball screw 45c is further coupled to a Y-axis drive motor 45a via a coupling 45b.

Therefore, when the Y-axis drive motor 45a rotates, the ball screw 45c rotates, and the Y-axis arm 44, that is, the emission end 32 moves in the Y-axis direction. Therefore,
By driving the X-axis drive motor 43a and the Y-axis drive motor 45a, the emission end 32 can be moved to any position within the movable range of the X-axis arm 42 and the Y-axis arm 44.

FIG. 5 is a view showing the structure of the emission end 32.
In the figure, 3 is a work, 11 is a light transmission window, 31 is a light guide fiber, and 32 is an emission end. As shown in the figure,
A condenser lens 32a is provided in the emission end 32,
Light emitted from the light guide fiber 31 is collected by a condenser lens 32a.
And is irradiated on the adhesive applied portion of the work 3.

In this embodiment, since the condenser lens 32a is provided in the emission end 32 as described above, the work 3
The intensity of the light applied to the light can be increased. FIG.
7A and 7B are diagrams showing the relationship between the irradiation distance and the irradiation intensity. FIG. 7A shows the irradiation intensity when the condenser lens 32a is provided as shown in FIG. 5, and FIG. This shows the irradiation intensity when no lens is provided. When no condenser lens is provided, the light emitted from the light guide fiber 31 spreads at an angle of about 60 ° as shown in FIG.

Here, the light transmission window 11 needs to have a strength that can withstand the force for pressing the work 3, so that it is somewhat thick. When quartz glass is used for the light transmission window 11, the thickness is usually about 15 mm to 40 mm, and the distance between the emission end 32 and the irradiated surface cannot be less than this thickness. Therefore, considering the distance between the emission end 32 and the light transmission window 11, the distance from the emission end 32 to the work 3 is about 50 mm.

In the case of an irradiation distance of 50 mm, as can be seen from FIG. 6, the maximum illuminance can be obtained by providing a condenser lens, and compared with the case where no condenser lens is provided (B in FIG. 6). The strength can be significantly increased. Next, a description will be given of a liquid crystal panel bonding step in the present embodiment. (1) On a substrate of a liquid crystal panel, a photocurable adhesive is applied in a linear manner by screen printing or the like as shown in FIG.
The two substrates are combined and temporarily fixed with a temporary fixing adhesive as necessary. (2) The stage 3 of the processing chamber 10 is lowered in the Z-axis direction by a driving unit (not shown), and the work 3 is placed on the stage 12. At this time, the work 3 is placed at a predetermined position on the stage 12 so that the alignment mark AM of the work 3 is in the field of view of the alignment unit 4. Next, the stage 12 is raised to a predetermined position. (3) Position the work 3. This alignment is performed as follows.

The work 3 is adjusted by the alignment unit 4.
An image of the alignment mark AM marked above is received and sent to the control device 50. The control device 50 identifies the alignment mark AM from the received image data, detects the position of the alignment mark AM, drives the X stage 12b, the Y stage 12c, and the θ stage 12a to set the position of the alignment mark AM to a predetermined reference position. Q (see FIG. 2).

The above-mentioned positioning operation can be performed manually. That is, the alignment unit 4
Is displayed on a monitor (not shown), and the operator drives the X stage 12b, the Y stage 12c, and the θ stage 12a while looking at the monitor to perform alignment. (4) Air is introduced from the air introduction pipe 17 to push up the work 3 by air pressure and pressurize the work. (5) The control device 50 drives the emission end moving mechanism 40 to move the emission end 32 to the movement origin.

Next, the control device 50 reads out the adhesive application position information (X, Y) for the position of the alignment mark and the relative position information (xo, yo) of the reference position Q with respect to the movement origin P from the storage unit 50a. The amount of movement from the movement origin P to the light irradiation start position S is obtained based on the information of the above, and the emission end 32 is moved to the light irradiation start position S on the work 3. (6) The control device 50 drives the air cylinder 24a to open the shutter 24 of the light irradiation device 20. As a result, the light emitted from the lamp 22 of the light irradiation device 20 is transmitted to the light guide fiber 31.
And irradiates the adhesive applied portion of the work 3 from the emission end 32. Further, a wavelength range of the light irradiated by the optical filter 25 is selected as needed. (5) The control device 50 reads the adhesive application position information (X, Y) stored in the storage unit 50a and the speed control information, and moves the emission end 32 along the adhesive application position of the work 3 to the speed. The light is emitted at the speed specified by the control information, and the light emitted from the emission end 32 is applied to the application point of the adhesive.

During the irradiation, the stage 12 is cooled by supplying cold water to the water cooling tube 14 as needed in order to prevent undesired heating of the work 3. Then, when the first irradiation to the adhesive is completed and the emission end 32 returns to the light irradiation start position S, the control device 50 moves the emission end 32 along the adhesive in the same manner as described above to perform the second and subsequent irradiations. Do.

The irradiation of the adhesive is performed until the number of times of irradiation reaches the number of times of irradiation stored in the storage unit 50a of the control device 50, and the adhesive is applied to the work 3 by the energy of the light irradiated from the emission end 32. The photocurable adhesive cures. Here, by changing the moving speed of the emission end 32 during the light irradiation, the amount of light irradiation on the adhesive can be controlled. For example, the light irradiation amount can be reduced by increasing the moving speed of the emission end 32, and the light irradiation amount can be increased by decreasing the speed of the emission end 32.

Therefore, by appropriately setting the speed control information stored in the storage unit 50a, it is possible to obtain an optimum irradiation amount according to the adhesive, and thereby, the uniformity of the gap can be obtained regardless of the properties of the adhesive. The adhesive can be cured while maintaining the same. When the light transmittance of the adhesive is poor, such as when the concentration of the photosensitive agent (photoreaction initiator) added to the photocurable adhesive is high or when the light transmittance of the base resin itself of the adhesive is poor By sufficiently reducing the first-time irradiation amount and increasing the second-time and subsequent irradiation amounts, it is possible to perform processing with good gap uniformity and high throughput.

That is, when the light transmittance of the adhesive is poor, the irradiated light is strongly absorbed by the surface of the adhesive, and
The intensity of light reaching the inside of the adhesive becomes small. Therefore, the irradiation amount necessary for curing is reached in a short time at the surface portion, but it takes a long time to reach the irradiation amount required for curing due to weak light reaching inside. In other words, most of the total dose is used for hardening the inside, and the surface portion reaches the required dose in a very short time at the beginning of the irradiation.

In the case of using such an adhesive, if the irradiation amount of the first irradiation light is large, the curing of the surface portion of the adhesive is completed by the first irradiation, and the surface portion is hardened. Concentration causes a volume reduction. At this time, since the inside is in an uncured gel state, the shape of the adhesive is deformed so as to be pulled by the decrease in volume of the surface portion. As a result, the same problem as the conventional example in which the adhesive is cured by one irradiation occurs,
The gap becomes non-uniform.

On the other hand, if the amount of the first irradiation is sufficiently small, the above-mentioned deformation does not occur because the curing is not completed even on the surface of the adhesive when the first irradiation is completed. Good gap uniformity is maintained. Although the curing has not been completed, the curing reaction is progressing, and the fluidity has decreased over the entire length of the applied adhesive. In this state, the second and subsequent irradiations are performed. However, irradiation is performed with a larger irradiation amount than the first irradiation, and even if a partial force due to a decrease in volume at the irradiated portion is applied, the irradiation is performed over the entire length of the adhesive. Since the fluidity of the adhesive is reduced, the above-described partial force can be counteracted, and the deformation of the entire work such that the gap becomes uneven does not occur.

On the other hand, when the concentration of the photosensitizer (photoreaction initiator) added to the photocurable adhesive is low,
When the light transmittance of the adhesive is good, such as when the resin itself has a good light transmittance, the irradiated light reaches the inside of the adhesive without being strongly absorbed by the surface of the adhesive. Therefore, curing proceeds in the same manner in both the surface portion and the inside. When such an adhesive is used, even when the first light irradiation amount is relatively large as compared with an adhesive having a low light transmittance, only the surface portion is intensively cured, and The gap does not occur, and thus the gap does not become uneven as described above. In the case of such an adhesive,
It is advantageous to increase the first irradiation dose within a range where there is no problem because the throughput is improved. (6) When the irradiation of the adhesive on all the applied portions is completed, the control device 50 drives the air cylinder 24a and
4 is closed, and the movement of the emission end 32 by the emission end moving mechanism 40 is stopped. (7) After the adhesive is cured, pressurization of the work 3 is stopped, the stage 12 is lowered in the Z-axis direction, and the bonded work 3 is taken out of the work processing chamber 10.

As described above, in this embodiment, since the irradiation amount of light necessary for curing the adhesive is divided into a plurality of times, the liquid crystal panel is adhered while maintaining good gap uniformity. Can be matched. Further, by increasing the moving speed of the emission end at the time of the first irradiation, and decreasing the moving speed of the emission end after the second irradiation to reduce the first irradiation amount and increase the second irradiation amount, In particular, when an adhesive having a low light transmittance is used, a decrease in the volume of the adhesive due to the first irradiation can be reduced, and the gap can be kept uniform.

Further, in this embodiment, after the alignment unit 4 receives the alignment mark AM on the work and aligns the work 3, the adhesive unit stored in the storage unit 50a of the control device 50 is applied. Based on the position information (X, Y) and the relative position information (xo, yo) of the reference position Q with respect to the movement origin P, the emission end 32 is moved along the adhesive application position, and the adhesive is irradiated with light. Because the light spot does not come off from the adhesive,
The adhesive can be accurately irradiated with light.

For this reason, the light utilization factor can be greatly improved, and the adhesive can be effectively cured with a small lamp. Further, since the light spot does not come off from the adhesive, there is no danger that the undesired portion is irradiated with the light and deteriorated. In the above embodiment,
Although the irradiation amount of light to the adhesive is controlled by the moving speed of the emission end 32, even if the intensity of light emitted by the light irradiation device 20 is changed, the irradiation amount of light to be applied to the adhesive is similarly changed. Can be controlled. In this case, the irradiation intensity control information is stored in the storage unit 50a instead of the speed control information.

The means for controlling the intensity of light emitted from the light irradiation device 20 can be realized by, for example, providing a light-reducing filter or the like to the light irradiation device 20 in a detachable manner. Alternatively, a circuit for varying the power supplied to the lamp may be provided in a lamp power supply unit (not shown). A known technology such as a half bridge circuit can be used for this circuit.

By changing the intensity of the light emitted by the light irradiating means and controlling the amount of light irradiating the adhesive, the emission end 32
Can be moved at a constant speed, a stable throughput can be obtained, and it is possible to match the processing capacity with the steps before and after. FIG. 8 is a view showing another embodiment of the work processing chamber. In this embodiment, the positioning of the work 3 is performed by the stopper 19 and the air cylinder 18 shown in FIG. 8, and is shown in the embodiment of FIG. As described above, the alignment unit 4 and the work 3
No X, Y, and θ stages are required to move.

In the figure, 11 is a light transmitting window, 12 is a stage on which a work is placed, 14 is a water cooling pipe for cooling the work 3, 17 is an air introduction pipe for introducing air for pressurizing the work 3, and 18 is air. The cylinder 19 is a stopper, and although not shown in the figure, another pair of air cylinders and a stopper are also provided in the X-axis direction. As in the case of FIG. 2, means for moving the stage 12 in the Z-axis direction is provided (not shown).

In FIG. 8, in order to position the work 3, the work 3 is moved to the stopper 1 by an air cylinder 18 and an air cylinder (not shown) arranged in the X-axis direction.
9 and a stopper (not shown) arranged in the X-axis direction. Thereby, the work 3 is positioned at a predetermined reference position on the stage 12. In addition,
Other steps in this embodiment are as described above in (1) to (7).
In this embodiment, the work is aligned by the air cylinder and the stopper as described above, so that the configuration of the apparatus can be simplified as compared with the previous embodiment.

FIG. 9 is a diagram showing the overall configuration of a second embodiment of the present invention. In this embodiment, a sensor is provided at the output end, and the output end is moved along the adhesive while detecting the position of the adhesive. An embodiment in which the adhesive is moved is shown. According to this embodiment, even if the position of the adhesive changes, the adhesive can be irradiated with light without increasing the spot diameter of the light. In FIG. 9, the same components as those shown in FIG. 1 are denoted by the same reference numerals.
Are emitted by the condenser mirror 21 and, when the shutter 24 is open, enter the light guide fiber 31 via the reflector 23 → the shutter 24 → the optical filter 25. Also,
Reference numeral 24a denotes an air cylinder. The air cylinder 24a is controlled by a control device 50 described later, and opens and closes the shutter 24.

3 is a work, 10 is a work processing room,
The work processing chamber 10 includes a light transmission window 11, a stage 12, and the like. When the adhesive of the work 3 is cured, the work 3 is pressed from below. Reference numeral 31 denotes the light guide fiber, and an emission end 32 is provided at the other end of the light guide fiber 31. Light incident from one end of the light guide fiber 31 is emitted from the emission end 32 and irradiates the work 3. Is done.

The output end 32 is provided with a sensor 33. The sensor 33 receives, for example, light emitted from the light emitting portion 33a and reflected by the work 3 at the light receiving portion 33b, thereby forming an adhesive on the work 3 Is optically detected. As shown in FIG. 5, the exit end 32 is provided with a condensing lens 32a, and the light emitted from the light guide fiber 31 is condensed by the condensing lens 32a. Part is irradiated.

Although not shown in the figure, a sensor comprising a light emitting portion 33a and a light receiving portion 33b is provided at the emission end 32, and another pair of sensors is attached in a direction orthogonal to the sensor. Have been. Reference numeral 40 denotes an emission end moving mechanism for moving the emission end 32. The emission end moving mechanism 40 has the same configuration as that of FIG.
By driving the Y-axis arm 44, the emission end 32 can be moved to an arbitrary position on the work 3.

Reference numeral 50 denotes a control device for controlling the emission end moving mechanism 40 and the like. The control device 50 includes a storage unit 50a. The storage unit 50a has an irradiation instruction for instructing the number of times of light irradiation to the adhesive. Frequency information and speed control information for instructing the moving speed of the emission end 32 are stored in advance. Then, the control device 50, based on the output of the sensor 33 and the stored information,
The emission end moving mechanism 40 is driven to move the emission end 32 along the adhesive while controlling the moving speed and position, and the adhesive is irradiated with light the number of times set by the irradiation number information.

FIG. 10 is a view showing an example of the structure of the above-described work processing chamber 10. This embodiment has the same structure as that shown in FIG.
Is a stage on which a work is placed, 13 is a guide, and 14 is a water cooling tube. By flowing cold water through the water cooling tube 14 as described above, undesired heating of the work 3 is prevented. Reference numeral 15 denotes a through hole. As described above, when the work is bonded, air is supplied from the air inlet 16 below the stage to the lower surface of the work 3 through the through hole 15 to push the work 3 upward. Press.

Although not shown in the figure, a means for driving the stage 12 in the vertical direction is provided.
Is placed on the stage, the entire stage 12 moves downward. FIG. 11 is a view showing another embodiment of the work processing chamber, in which 11 is a light transmitting window, 12 is a stage on which a work is placed, 5 is a linear guide, 6 is a pressure mechanism, and FIG. In the embodiment, when the work is bonded, the pressing mechanism 6 is used.
By pressing the stage 12 upward, the work 3 is pressed.

In the case of FIG. 11, similarly to FIG. 10, a water cooling tube 14 is provided on the stage 12 to prevent undesired heating of the work 3. As in FIG. 10, a means for driving the stage 12 in the vertical direction is provided. When the work 3 is placed on the stage, the entire stage 12 is moved downward by a motor (not shown). Next, a description will be given of a liquid crystal panel bonding step in the present embodiment. (1) A photo-curable adhesive is applied to the substrate of the liquid crystal panel by a dispenser or the like as shown in FIG.
The substrates are combined and temporarily fixed with a temporary fixing adhesive as necessary. (2) The stage 12 shown in FIG. 10 or 11 is lowered, the work 3 is placed on the stage 12 of the processing chamber 10 shown in FIG. 10 or 11, and the stage 12 is raised to a predetermined position. (3) The work 3 is pressed.

That is, in the case of FIG. 10, air is introduced from the air inlet 16 and the work 3 is pushed up by air pressure to pressurize the work. In the case of FIG. 11, the pressing mechanism 6 is driven by hydraulic pressure or the like, and the stage 12 is moved upward to press the work 3. (3) The control device 50 drives the emission end moving mechanism 40 to move the emission end 32, and the sensor 33 searches for a location where the adhesive is applied.

Incidentally, the place where the adhesive is applied is usually
Since the reflectance of light is different from that of a portion that is cloudy and is not applied, it can be easily detected by the sensor 33. (4) When the application position of the adhesive is found, the control device 50 drives the air cylinder 24a to open the shutter 24 of the light irradiation device 20. Thereby, the lamp 22 of the light irradiation device 20
Is emitted into the light guide fiber 31 and is emitted from the output end 3.
Irradiation is performed from 2 on the adhesive applied portion of the work 3. Also,
The wavelength range of the light irradiated by the optical filter 25 is selected as needed. (5) The control device 50 detects the adhesive application location by the sensor 33 and moves the output end 32 to the adhesive application location of the work 3 at the speed indicated by the speed control information stored in the storage unit 50a. The light is emitted from the emission end to irradiate the adhesive application location.

During the irradiation, in order to prevent undesired heating of the work 3, if necessary, cold water is supplied to the water cooling pipe 14 to cool the stage 12. When the first irradiation to the adhesive is completed and the emission end 32 returns to the light irradiation start position, the control device 50 moves the emission end 32 along the adhesive in the same manner as described above, and performs the second and subsequent irradiations. .

The irradiation of light to the adhesive is performed until the number of times of irradiation reaches the number of times of irradiation stored in the storage unit 50a of the control device 50, and the adhesive is applied to the work 3 by the energy of the light irradiated from the emission end 32. The photocurable adhesive cures. As in the first embodiment, by changing the moving speed of the emission end 32 during the light irradiation, the amount of light irradiation on the adhesive can be controlled, and the speed control stored in the storage unit 50a can be controlled. By appropriately setting the information, it is possible to obtain an optimum irradiation amount according to the adhesive, and thus the adhesive can be cured while maintaining the uniformity of the gap regardless of the properties of the adhesive.

In the above embodiment, as in the first embodiment, the intensity of the light emitted from the light irradiation device 20 can be changed to control the amount of light applied to the adhesive. (6) When the irradiation of the adhesive on all the applied portions is completed, the control device 50 drives the air cylinder 24a and
4 is closed, and the movement of the emission end 32 by the emission end moving mechanism 40 is stopped. (7) After the adhesive is cured, the pressurization of the work 3 is stopped, and the bonded work 3 is taken out of the work processing chamber 10.

In this embodiment, the position of the adhesive is detected by the sensor as described above, and the signal from the sensor is used to control the output end of the light guide fiber to be held at a predetermined position with respect to the adhesive. While moving the exit end of the light guide fiber, even if the position of the adhesive changes,
Light can be irradiated while faithfully following the adhesive.

For this reason, even when the position where the adhesive is applied fluctuates, as in the case where the adhesive is applied by a dispenser, there is no portion that is not cured without being exposed to light, and the uncured adhesive is not applied. The agent does not melt and cause product failure. Further, even when the application position of the adhesive changes, the spot diameter of the light can be equal to or slightly larger than the width of the adhesive, so that the light use efficiency can be improved. .

In the first and second embodiments, an example has been described in which the work is pressurized by a pneumatic or hydraulic mechanism, but a diaphragm or the like may be used instead of the above-described means. That is, a diaphragm can be provided between the work stage and the work, and air can be supplied to the diaphragm to pressurize the work. Further, as described in JP-A-5-34653,
A method of applying pressure by vacuuming the space between the substrates can also be used.

[0092]

As described above, the following effects can be obtained in the present invention. (1) Since the irradiation amount of light necessary for curing the adhesive is divided into multiple irradiations, the distortion that occurs between the light-irradiated part and the light-irradiated part should be small. The liquid crystal panels can be bonded together while maintaining good gap uniformity. Therefore, a liquid crystal panel free from product defects can be obtained. (2) By reducing the irradiation amount of the light irradiated for the first time from the irradiation amount of the light irradiated for the second and subsequent times,
The decrease in the volume of the adhesive due to the second irradiation can be reduced, and the gap can be kept uniform.

In particular, when an adhesive having a low light transmittance is used, the first irradiation dose is sufficiently small.
By increasing the irradiation dose after the first time, processing with good uniformity of the gap and good throughput can be performed. (3) By controlling the irradiation amount by changing the moving speed of the light guided by the light guide fiber, the irradiation intensity of the light can be fixed at a constant value, so that an inexpensive device can be obtained and the cost can be reduced. Can be reduced.

Further, if the irradiation intensity of the light guided by the light guide fiber is made variable, the moving speed of the light can be fixed at a constant value. The required time can be made constant, and a stable throughput can be obtained. In addition, it is possible to match the processing capacity with the devices in the preceding and following processes, and the design of the liquid crystal panel manufacturing line is facilitated. (4) The position information of the adhesive is stored, and the work is aligned so that the reference point for the work alignment is at a predetermined position with respect to the moving origin of the light guide fiber. By irradiating light while moving the emission end of the light guide fiber to a predetermined position to cure the adhesive, it is possible to accurately irradiate the adhesive with light without a light spot coming off the adhesive. it can. For this reason, there is no portion that is not cured without being irradiated with light.

Further, since the spot diameter of light can be the same as or slightly larger than the width of the adhesive, the light use efficiency can be improved. Further, since the light irradiated to the portion without the adhesive is greatly reduced, the temperature of the substrate hardly rises. Therefore, the substrate does not expand due to the temperature rise, and the two substrates do not shift during bonding / curing, thereby preventing a product defect. (5) The position of the adhesive is detected by a sensor, and the output end of the light guide fiber is moved while controlling the output end of the light guide fiber at a predetermined position with respect to the adhesive by a signal from the sensor. By irradiating light while curing the adhesive, the light can be irradiated while faithfully imitating the adhesive even if the position of the adhesive fluctuates. Because of this,
The same effect as (4) can be obtained, and even if the position of the adhesive fluctuates, as in the case where the adhesive is applied with a dispenser, a portion that is not cured without being irradiated with light is generated. There is no. (6) By condensing light emitted from the light guide fiber by a lens and irradiating the adhesive, the light is intensively applied to the adhesive even if the distance between the emitting end and the irradiated surface is long. And the irradiation intensity does not decrease, and the time for the curing treatment can be shortened. In addition, since light is not irradiated to a portion that does not need to be irradiated, light use efficiency can be improved.

[Brief description of the drawings]

FIG. 1 is a diagram showing an overall configuration of a first embodiment of the present invention.

FIG. 2 is a diagram illustrating a relationship between a movement origin of an emission end, a reference position, and an adhesive application position.

FIG. 3 shows a configuration of a work processing chamber in the first embodiment.
It is a figure showing an example.

FIG. 4 is a diagram illustrating an example of an emission end moving mechanism according to the first embodiment.

FIG. 5 is a diagram illustrating an example of a configuration of an emission end according to the first embodiment.

FIG. 6 is a diagram showing the relationship between irradiation distance and irradiation intensity.

FIG. 7 is a diagram showing a light irradiation range when a condenser lens is not provided at an emission end.

FIG. 8 is a view showing another embodiment of the work processing chamber in the first embodiment.

FIG. 9 is a diagram showing the overall configuration of a second embodiment of the present invention.

FIG. 10 is a diagram illustrating an example of a work processing chamber according to a second embodiment.

FIG. 11 is a view showing another embodiment of the work processing chamber in the second embodiment.

FIG. 12 is a diagram illustrating an example of a liquid crystal panel (color liquid crystal panel).

FIG. 13 is a view showing a state in which an adhesive (sealant) is applied on a glass substrate.

FIG. 14 is a diagram showing a conventional example of irradiating light to cure an adhesive on a substrate.

[Description of Signs] 1 Mirror 2 Lamp 3 Work 4 Alignment Unit 5 Linear Guide 6 Pressure Mechanism 10 Processing Room 11 Light Transmission Window 12 Stage 12a θ Stage 12b X Stage 12c Y Stage 12d Base 13 Guide 14 Water Cooling Tube 15 Penetration Hole 16 Air inlet 17 Air inlet tube 18 Air cylinder 19 Stopper 20 Light irradiation device 21 Condensing mirror 22 Lamp 23 Reflector 24 Shutter 24a Air cylinder 25 Filter 31 Light guide fiber 32 Outgoing end 33 Sensor 40 Outgoing end moving mechanism 41 Frame 42 X-axis arm 43a X-axis drive motor 43b, 45b Coupling 43c, 45c Ball screw 44 Y-axis arm 45a Y-axis drive motor 46, 47 Guide member 46a, 47a Guide rail 50 Control device 50a Storage means

──────────────────────────────────────────────────続 き Continued on front page (58) Field surveyed (Int.Cl. ⁶ , DB name) C09J 5/00 G02F 1/1339

Claims (13)

(57) [Claims] 1. A method for bonding a liquid crystal panel, wherein a transparent substrate and a transparent substrate or a transparent substrate and a semiconductor substrate are bonded with a photocurable adhesive, wherein light guided by a light guide fiber from a light irradiation unit is bonded. When curing the adhesive by irradiating it while moving it relative to the adhesive , after irradiating the adhesive for the first time, the light irradiating part is illuminated.
Return to the firing start position and place it in the same area as the first irradiation area
On the other hand, by performing the second and subsequent irradiations,
A method for bonding liquid crystal panels, characterized in that the amount of irradiation required for conversion is achieved . 2. The method according to claim 1, wherein the first light irradiation amount is a second irradiation amount.
2. The method for bonding liquid crystal panels according to claim 1, wherein the irradiation amount is smaller than the irradiation amount of light irradiated after the first time. 3. The method according to claim 1, wherein the irradiation amount is controlled by making the moving speed of the light guided by the light guide fiber variable. 4. The method for bonding liquid crystal panels according to claim 1, wherein the irradiation amount is controlled by changing the irradiation intensity of the light guided by the light guide fiber. 5. A moving origin of the light guide fiber and a reference point for positioning of the work are set, and a reference point for positioning the work relative to the moving origin of the light guide fiber and a reference point for positioning the work are set in advance. The position information of the adhesive is stored in the storage means. First, the work is aligned so that the work alignment reference point is at a predetermined position with respect to the movement origin of the light guide fiber. 4. The method according to claim 1, further comprising: irradiating the work with light while the output end of the light guide fiber is moved to a predetermined position by a control unit based on the position information read from the unit to cure the adhesive. The method for bonding liquid crystal panels according to claim 3 or 4. 6. The light guide fiber, wherein the position of the adhesive is detected by a sensor, and a signal from the sensor is used to control the output end of the light guide fiber to be held at a predetermined position with respect to the adhesive. The adhesive is cured by irradiating light while moving the light emitting end of the adhesive.
5. The method for bonding liquid crystal panels according to claim 2, 3, or 4. 7. The liquid crystal panel as claimed in claim 1, wherein the light emitted from the light guide fiber is condensed by a lens and irradiated onto an adhesive. Method. 8. A lamp, a condenser mirror, a light irradiator provided with a shutter, a light guide fiber for guiding light from the light irradiator to an emission end,
A processing chamber having a light transmission window for irradiating the light from the light irradiating part to the adhesive of a work integrally molded by sandwiching the adhesive between the transparent substrate and the transparent substrate or the transparent substrate and the semiconductor substrate, A stage for placing a work placed in the processing chamber, a pressurizing mechanism for applying pressure in a direction in which the two substrates of the work are relatively close to each other, and an emission end of the light guide fiber, a moving mechanism for moving the emission end, a storage means for storing the radiation count information, the irradiation frequency information from the storage means, and a control unit for controlling the light irradiation section and the moving mechanism, the light irradiation unit The light guided by the light guide fiber is
And illuminating the adhesive for the first time
After irradiation, return the light irradiation unit to the light irradiation start position, and
The second and subsequent irradiations on the same area as the eye irradiation area
By doing so, the irradiation dose required to cure the adhesive
Bonding apparatus of the liquid crystal panel, wherein the mel. 9. The apparatus according to claim 8, wherein the control unit has a speed control function of variably controlling the moving speed of the moving mechanism. 10. The liquid crystal panel bonding apparatus according to claim 8, wherein the light irradiation section has an irradiation intensity variable mechanism. 11. A positioning mechanism for positioning a work at a predetermined position, and a storage unit for storing position information of the adhesive, wherein the control unit controls the moving mechanism based on the position information from the storage unit. 10. The control device according to claim 8, wherein the emission end is moved along the adhesive on the workpiece while irradiating the light.
0 liquid crystal panel bonding device. 12. A sensor, comprising: a sensor for detecting a position of an adhesive supported integrally with an emission end of the light guide fiber, wherein the control unit controls a moving mechanism by a signal from the sensor. While controlling to keep the output end of the light guide fiber at a predetermined position with respect to the adhesive by a signal from
The light-emitting end is moved along the adhesive on the work while irradiating light.
0 liquid crystal panel bonding device. 13. A lens according to claim 8, wherein a lens for condensing light emitted from the light guide fiber is provided.
13. The liquid crystal panel bonding apparatus according to claim 11, wherein