201247410 六、發明說明： 【發明所屬之技術頜域】 本發明係涉及一種透明多層板貼合裝置及其防止液態 膠溢滿之方法，特別係指一種利用光固型液態膠來進行貼 合的透明多層板貼合裝置及其貼合時防止液態膠溢滿之方 法。 【先前技術】 近幾年來，由於液態膠的發展曰益成熟，因此越來越 多的多層板貼合製程，已逐漸採用液態膠來做為貼合的媒 ”’其中針對透明多層板而δ ’又以光固型液態滕的使用 最為普遍。然而，由於液態膠在溢膠貼合的過程中，容易 產生包圍氣泡及膠體溢滿的情形，因此在貼合製程及環境 上相對就需要較新或改良過的技術。 ’基於液態膠所塗佈之圖形的因素， 距離基板 鲁 6ft SE 4f db Tv _L« Γ=Γ» 板時，液 如此一來 圍内均勻： 的貼合邊； 在夕層板的貼合製私上’為了避免液態膠貼合時容易 產生包圍氣泡的情形，往往會因應不隨板㈣狀而將液 態膠塗佈成不同_形，例如在方形的基板上，通常就會 將液態膠塗佈成米字型的圖形’藉以在實際溢膠時能由中 心向外圍進行溢膠擴散，減少產生包圍氣泡的機會。然而 使得塗佈後的液態膠201247410 VI. Description of the invention: [Technical jaw region to which the invention pertains] The present invention relates to a transparent multi-layer board bonding apparatus and a method thereof for preventing liquid glue from overflowing, in particular to a method of bonding using a photo-setting liquid glue. The transparent multi-layer board bonding device and the method for preventing the liquid glue from overflowing when it is attached. [Prior Art] In recent years, as the development of liquid glue has matured, more and more multi-layer board bonding processes have gradually adopted liquid glue as a medium for bonding. 'The use of photo-solid liquid tanning is the most common. However, since the liquid glue is prone to enveloping bubbles and colloid overflow during the process of laminating, it is relatively necessary in the bonding process and environment. New or improved technology. 'Based on the factor of the coating applied by the liquid glue, when the substrate is 6ft SE 4f db Tv _L« Γ=Γ» plate, the liquid is so uniform: the fit side; The lamination of the slab is privately 'in order to avoid the possibility of enveloping bubbles when the liquid glue is adhered, the liquid glue is often applied in a different shape depending on the shape of the plate (four), for example, on a square substrate. Usually, the liquid glue is coated into a m-shaped pattern, so that the glue can be diffused from the center to the periphery during the actual overflow, reducing the chance of enclosing the bubble. However, the liquid glue after coating is applied.
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膠時的流動 的製程上 4/18 201247410 方向及溢膠至各預定貼合邊界線的時間點。因此，在貼合 製程上，如何避免液態膠溢滿的現象，確實有進—步改善 的空間。 【發明内容】 有鑑於此’本發明所要解決的技術問題在於，針對透 明多層板的貼合來改善，防止在利用光固蜇液態膠來進行 貼合時，產生膠體溢滿的情形。本發明透過光源的循環掃 描來形成光線在透明多層板上，讓光線所照射的位置得以 形成一貼合邊界範圍，使得透明多層板在貼合時，該溢膠 至貼合邊界範_光_液轉㈣受光線照射而形成固 化。 士很m不蝥明所徒出之一方案，提供一種透明多層板貼 合裝置，其包括：一壓合機構及一光源裝置。其中，壓合 機構是用來承載透明多層板的—[基板及—第二基^， 並且第一基板的貼合面及/或第二基板的貼合面塗佈有一光 固型液,¾膠。錢裝置是對應壓合機構來設置，並且控制 光，裝置形成-光線於透明多層板，使得該光線的照射位 置=形成-貼合邊界線。於是，當麼合機構壓合第一基板 及第二基板’使光_液態膠進行溢膠時，該溢膠至貼合 邊界線的光固型液態膠是形成固化。 σ 根=本發明所提出之另—方案，提供—種防止液態膠 步驟包括1合第—基板及第二基板來讓 塗佈於第-基板及/或第二基板之貼合_光固型液 膠，並且形成一光線於透明多層板，使光線的 光固型液態膠形成固化。 運，踝的 5/18 201247410 藉此’本發明所能達到的功效在於，不需特別針對透 明多層板的基板來進行結構性的設計，便可形成有貼合邊 界線的功效。如此可以有效地防止光固型液態膠貼合時容 易產生的溢滿現象，改善利用光固型液態膠來做為貼合媒 介的製程’提咼透明多層板產品的品質。 以上之概述與接下來的詳細說明及附圖，皆是為了能 進一步說明本發明為達成預定目的所採取之方式、手段及 功效。而有關本發明的其他目的及優點，將在後續的說明 及圖式中加以闡述。 【實施方式】 本發明是利用光源裝置以循環掃描的方式，來形成光 線於透明多層板上，讓光線所照射的位置得以形成貼合邊 界範圍。在光固型液態膠進行溢膠時，該溢膠至貼合邊界 範圍的光固型液態膠隨即能形成固化，藉此能夠簡單且有 效地防止光固型液態膠溢滿出實際設計的貼合範圍，讓透 明多層板只在貼合邊界範圍内均勻地充滿光固型液態膠， 提高透明多層板的生產品質。 此外，先予以敘明的是’本發明所述及的透明多層板 是指由本質上透明的至少兩層基板所貼合成之架構，例如 .觸控面板、液晶顯示面板、塑膠合成基板、玻璃合成美 板等產品。其中，不同基板的板材並不偈限於同一材質， 亦可分別是不同材質(如玻璃、薄膜、塑膠等）的板材或者經 過不同加工製程之後的板材來相互貼合而成，本發明並無 加以限制。 請參考第一圖’為本發明透明多層板貼合裝置的第— 實施例架構示意圖。如圖所示’本實施例是提供一種貼合 6/18 201247410 裝置1，包括：一壓合機構11、一光源裝置12、一控制器 13及一支撐架14。其中，壓合機構11是用來承載透明多 層板10的一第一基板101及一第二基板102，並且第一基 板101的貼合面或第二基板102的貼合面是點膠塗佈有— 光固型液態膠103,以做為第一基板101及第二基板1〇2貼 合時的貼合媒介。當然，實際亦可依設計上的需求，將光 固型液態膠103同時點膠塗佈於第一基板1〇1的貼合面及 第二基板102的貼合面。 有關光固型液態膠103的點膠裝置（圖未示)部分，所屬 技術領域具有通常知識者可以了解，點膠裝置除了可以直 接设计整合於貼合裝置1之中’並搭配壓合機構11來點膠 運作之外。實際上也可以是設計為獨立於貼合裝置1的上 游裝置，在此並非為本實施例所限制。 接下來’本實施例的壓合機構11進一步包含：一載板 110、一第一定位治具ill、一第二定位治具112及一升降 機構113。其中’第一定位治具111是設置於載板】〗〇,用 來承載及定位第一基板101 ’第二定位治具112是用來承載 及定位第二基板102。並且，第一定位治具hi及第二定位 治具112可進一步搭配不同或相同的定位結構(如：吸風結 構、夾扣結構等）來分別定位第一基板101及第二基板川2 。本實施例的第一定位治具111及第二定位治具η)是舉 例分別設計第一吸風結構1U0及第二吸風結構U2〇來^ 現承載及定位功能。升降機構113是連接第—定位户具^ j 及第二定位治具1〗2 ’用來操作第一定位治具〗丨1及第二定 位治具112的垂直位移，用以在運作時進行壓合第一基板 101及第二基板102。 i 7/18 201247410 附帶一提的是，在實際貼合製程上，本實施例的第二 基板102可以是等到點膠裝置點膠塗佈光固型液態膠1〇3 於第一基板101的貼合面或第二基板102的貼合面之後才 進行翻轉，讓第二基板1〇2的貼合面是面向第一基板ι〇1 的貼合面。另外，也可以是第二基板1〇2的貼合面在面向 第一基板101的貼合面之後，再直接由點膠裝置伸入第一 基板101及第二基板1〇2之間來進行點膠塗佈光固型液態 膠103於第一基板1〇1的貼合面或第二基板1〇2的貼合面 。藉此，以形成第一圖中第一基板1(n、第二基板]〇2及光 固型液態膠103所架構出的疊層態樣。 接下來，光源裝置12是對應壓合機構n來設置。控 ,1,3疋電性連接壓合機構u及光源裝置，用來儲存 圖升/在運作上’控制器13便是依據圖形來控制光源茫 =2形成—光線於透Μ層板ig，使得該級的照射位置 。從而’當控制器13控制壓合機構 進日Γ 第二基板102，使光固型液態膠103 會形岭邊界線L的光_態勝⑻ i^L· 透明多層板:;的:周：：型:祕㈣ 控制光源騎13實際上是 的循環掃描來在透明多層'支“、射光線1利用光線 範圍。換句話說，虛擬出貼合邊界 光線之照純置將會彳㈣地出現由 其中，光源裝置〗2可*&^ a 為—點光源裝置或-線光的控制需求而設計 々、裝置，亚且光源裝置〗2的規格 8/18 201247410 則是依據實際所搭配使用的光固型液態膠1〇3之特性來決 疋，例如可以是採用355±50 nm的波長範圍之紫外光(uvThe flow of the glue is on the process of 4/18 201247410 direction and the time of overflow to each predetermined boundary line. Therefore, in the lamination process, how to avoid the phenomenon that the liquid glue overflows, there is indeed room for improvement. SUMMARY OF THE INVENTION In view of the above, the technical problem to be solved by the present invention is to improve the adhesion of a transparent multilayer board and prevent colloid overflow when the film is bonded by a light-solid liquid glue. The invention scans the light source to form light on the transparent multi-layer board, so that the position irradiated by the light can form a conforming boundary range, so that the transparent multi-layer board is glued to the conforming boundary when the bonding is performed. The liquid turns (4) is cured by light. One of the solutions is not clear, and a transparent multi-layer board bonding apparatus is provided, which comprises: a pressing mechanism and a light source device. Wherein, the pressing mechanism is for carrying the transparent multi-layer board - the substrate and the second substrate, and the bonding surface of the first substrate and/or the bonding surface of the second substrate is coated with a light-solid liquid, 3⁄4 gum. The money device is arranged corresponding to the pressing mechanism, and controls the light, and the device forms a light-light on the transparent multilayer board such that the illumination position of the light = forming-bonding boundary line. Therefore, when the bonding mechanism presses the first substrate and the second substrate ‘ to make the photo-liquid glue overflow, the photo-solid liquid glue which adheres to the boundary line is cured. σ root = another solution proposed by the present invention, providing a step of preventing liquid glue comprising a first substrate and a second substrate for bonding to the first substrate and/or the second substrate The liquid glues and forms a light on the transparent multi-layer board to cure the light-solid liquid glue of the light. 5/18 201247410 The effect of the present invention is that the structural design of the substrate of the transparent multilayer board is not required, and the effect of bonding the boundary line can be formed. This can effectively prevent the overflow of the photo-curable liquid glue and improve the quality of the transparent multi-layer board product by using the photo-curable liquid glue as the bonding medium. The above summary, the following detailed description and the annexed drawings are intended to further illustrate the manner, the Other objects and advantages of the present invention will be described in the following description and drawings. [Embodiment] In the present invention, a light source device is used to form a light line on a transparent multilayer board by means of a cyclic scanning, so that the position where the light is irradiated can form a bonding boundary range. When the light-solid liquid glue is overflowed, the light-solid liquid glue which adheres to the bonding boundary can be solidified, thereby being able to easily and effectively prevent the light-solid liquid glue from overflowing with the actual designed sticker. In combination, the transparent multi-layer board is uniformly filled with the photo-solid liquid glue only within the bonding boundary, thereby improving the production quality of the transparent multi-layer board. In addition, it is first described that the transparent transparent board according to the present invention refers to a structure in which at least two layers of substrates are substantially transparent, such as a touch panel, a liquid crystal display panel, a plastic composite substrate, and a glass. Synthetic beauty boards and other products. The plates of different substrates are not limited to the same material, and may be made of plates of different materials (such as glass, film, plastic, etc.) or plates after different processing processes, and the invention does not limit. Please refer to the first figure as a schematic diagram of the first embodiment of the transparent multi-layer board bonding apparatus of the present invention. As shown in the figure, the present embodiment provides a fitting 6/18 201247410 device 1, comprising: a pressing mechanism 11, a light source device 12, a controller 13, and a support frame 14. The pressing mechanism 11 is a first substrate 101 and a second substrate 102 for carrying the transparent multilayer board 10, and the bonding surface of the first substrate 101 or the bonding surface of the second substrate 102 is dispensed. The light-solid liquid adhesive 103 is used as a bonding medium when the first substrate 101 and the second substrate 1〇2 are bonded together. Of course, the photo-curable liquid glue 103 may be simultaneously dispensed onto the bonding surface of the first substrate 1〇1 and the bonding surface of the second substrate 102 in accordance with the design requirements. Regarding the dispensing device (not shown) of the photo-curable liquid glue 103, those skilled in the art can understand that the dispensing device can be directly integrated into the laminating device 1 and is equipped with the pressing mechanism 11 Come out of the dispensing operation. In fact, it may also be an upstream device designed to be independent of the laminating device 1, which is not limited by this embodiment. Next, the pressing mechanism 11 of the present embodiment further includes a carrier plate 110, a first positioning fixture ill, a second positioning fixture 112, and a lifting mechanism 113. The first positioning fixture 111 is disposed on the carrier, and is used to carry and position the first substrate 101. The second positioning fixture 112 is used to carry and position the second substrate 102. Moreover, the first positioning fixture hi and the second positioning fixture 112 can be further combined with different or the same positioning structures (eg, suction structure, clip structure, etc.) to respectively position the first substrate 101 and the second substrate 2 . The first positioning jig 111 and the second positioning jig η) of the present embodiment are respectively designed to design the first air suction structure 1U0 and the second air suction structure U2 to perform the bearing and positioning functions. The lifting mechanism 113 is a vertical displacement connecting the first positioning fixture ^ j and the second positioning fixture 1 2 ' to operate the first positioning fixture 丨 1 and the second positioning fixture 112 for operation The first substrate 101 and the second substrate 102 are pressed together. It is to be noted that, in the actual bonding process, the second substrate 102 of the embodiment may be a dispensing device that dispenses the photo-curable liquid glue 1 to the first substrate 101. After the bonding surface or the bonding surface of the second substrate 102 is turned over, the bonding surface of the second substrate 1 2 is a bonding surface facing the first substrate ι 1 . In addition, the bonding surface of the second substrate 1〇2 may be directly inserted between the first substrate 101 and the second substrate 1〇2 by the dispensing device after the bonding surface facing the first substrate 101. The adhesive-coated photo-curable liquid glue 103 is applied to the bonding surface of the first substrate 1〇1 or the bonding surface of the second substrate 1〇2. Thereby, a laminated pattern formed by the first substrate 1 (n, the second substrate] 〇 2 and the photo-setting liquid glue 103 in the first figure is formed. Next, the light source device 12 is a corresponding pressing mechanism n To set, control, 1, 3 疋 electrical connection pressing mechanism u and light source device, used to store the map liter / in operation 'controller 13 is based on the graphics to control the light source 茫 = 2 formed - light in the transparent layer The plate ig makes the irradiation position of the stage. Thus, when the controller 13 controls the pressing mechanism to enter the second substrate 102, the light-solid liquid glue 103 will shape the light of the boundary line L. (8) i^L · Transparent multi-layer board:;: Week:: Type: Secret (4) Control light source ride 13 is actually a cyclic scan to use the transparent multi-layer 'branch', shoot light 1 to utilize the light range. In other words, virtual out the bound boundary light The pure position will be displayed in the fourth place. The light source device 〖2 can be used as the light source device or the light control device. /18 201247410 is based on the characteristics of the photo-solid liquid glue 1〇3 used in practice, for example, it can be Ultraviolet light of a wavelength range of 355 ± 50 nm (uv
Light)來照射’在此並無加以限制。舉—實例來說明，假設 光源裝置12是採用點光源裝置的話，則㈣器13可依據 光固型液祕103的黏稠度特性，進行調整點光源裝置的 ^苗速度’例如㈣率3 Hz的速度來依據_座標進行循 環掃描並照射光線。 乐按考，在本貫鉍例之貼合裝置丨的架構上，支撐架 Η是用來⑽及定㈣合鋪u，使得錢裝置12是對 應设置於壓合機構11所承載的透明多層板1Q的下方，用 來向上形成練。當然，除了本實施例所賴_之外， 在應=上、，支料14亦可設計用來支樓及定位光源裝置ι2 ’使付光源裝置12是對應設置於壓合機構u所承載的透 ，多層板10的上方，絲向下形成光線。對此，所屬技術 :員域具有it常知财可以了解，任何相實現統裝置12 二透:月多層板IQ相距—距離，以方便光源裝置12照射光 線的架構，皆是涵蓋於本發明所界定的範圍。 值得-提的是，為了避免触別、第―定位治具⑴ 定位治具112在設計上阻播到光源裝置如照射的 j。载板11G可例如是在部分或全部的區域採用透明材 =的設計，或者採用開設有至少一通孔的設計。其中，載 透質的區域或相設通孔的位置是取決於 12 1Q ㈣需的貼合邊界’以不_到光源裝置 圖形所形成的光線路徑為主。本實施例的載板n〇 如㈣全部透腎_設計。附帶—提的是，若載 板則讀關設通孔的設計的話，败可 9/18Light) is not limited here. For example, if the light source device 12 is a point light source device, the (four) device 13 can adjust the seedling speed of the point source device according to the viscosity characteristic of the light-solid liquid solution 103, for example, (4) rate 3 Hz. The speed is cyclically scanned and illuminated according to the _ coordinates. According to the test, in the structure of the fitting device of the present example, the support frame is used for (10) and fixed (four) jointing, so that the money device 12 is correspondingly disposed on the transparent multi-layer board carried by the pressing mechanism 11. Below the 1Q, used to form upwards. Of course, in addition to the embodiment, the support material 14 can also be designed to support the light source device ι2 'the light source device 12 is correspondingly disposed on the pressing mechanism u. Through, above the multilayer board 10, the filaments form a downward light. In this regard, the technology: the domain has IT knows the wealth can understand, any phase realization device 12 two transparent: monthly multi-layer board IQ distance - distance, to facilitate the light source device 12 to illuminate the light structure, are covered by the present invention The scope of the definition. It is worth mentioning that, in order to avoid touching, the first positioning jig (1) the positioning jig 112 is designed to block the light source device such as the illumination j. The carrier 11G may be, for example, a design in which a transparent material is used in part or all of the area, or a design in which at least one through hole is opened. Wherein, the position of the transmissive region or the position of the through hole is determined by the light path formed by the pattern of the light source device depending on the bonding boundary required by 12 1Q (4). The carrier plate n of this embodiment is, for example, (four) fully permeable. Incidentally, if the carrier is read and the design of the through hole is read, the defeat can be 9/18.
I I201247410 設一導光柱，以增加照射光線的導光效果。 同理’第-定位治具ln及第二定位治具112也 於相同原理來設計，以採用透明材質來設計，並且讓=二 定位治具m及第^料具⑴所包含的粒結構(魏 結構或夾扣結料），不纽朗光絲置丨2依 成的光線路徑。 所形 進-步針對S源裝置u的架構來說明，本實施例 源裝置12是屬於機械滑執式的光源發射裝置，其包含 動滑轨120、一光源發射器、121及一控制單元122 動滑執120的部分，請再同時參考第二圖，為本發^ 滑轨的實施前構示意圖。移歸執12G包括至少 = 導軌1201及至少-第二導轨·。其中，第二導軌咖 是垂直架設於第-導執·，並且利用第一導執咖來運 作-第-方向之位移。錢發射器121是設置於第 1202，並且利用第二導軌12〇2來運作一第二方向之位移。 控制單元122是電性連接移動滑軌m、光源發射器12 器13的控制來操作移動滑執12。 及光源發射益121之運作。 =計士，移動滑軌】2〇除了如第二圖實施例所示， 將-支第二導執12〇2架設於兩支第—導執咖， 設成工字形(T-shaped)的態樣之外。實際上亦可 二 支第二導執1202與-支第一導#咖進行十字带 設。本發明並無限制移動滑軌咖 藉此，上述所揭露之架構即可實現 明多層板1G的貼合裝置卜附帶__1器^所= 10/18 201247410 f圖形之狀，舉—實際態絲賊制。首先，在設定 2二=器13可以依據透明多層板10實際所需的貼 口把圍來心描圖形’並且定義該掃描圖形的起始點 。接著’調整光源裝置12的位置，讓光源裝置12的光線 照射位置能對準該起始點’並且記錄此時光源裝置12的位 置為-起始座標。如此-來，在運作狀態時，控制器 是控制光源裝置12從該起始座標開始根據該掃描圖。形 行循環地掃描並形成光線。 請再參考第三圖，為本發明透明多層板貼合裝 =實施例架構示意圖。如圖所示，本實施例所提供的貼人 政置1’的架構與:IL作原理大致與第—實施例之貼合裝置^ 相同’主要的差異點在於’本實施例所搭配的光置 是屬於-振鏡式技、發射裝置。所㈣術領域具有通 識者可^ 了解，振狀光源發㈣置技含—模組化 源發射器121’及一控制單元122,，其原理Θ、泰、、…* 器121，内部的橫、縱鏡片（圖未示）的振動光源發射 路徑，以省去外部機械滑轨心:細來==的 :再加以贅述。如此—來，本實施例之辆、裝置12，i^ =ΓΓ奐速度將會快於第一實施例中的機械滑執式光 請參考第四圖’為本發明透明多層板的貼合 施例示意圖。由於本發明是由光源裝置12，12，= 一貝 ’讓光線的照射位置是形成貼合邊界線L 》成光線 膠103溢滿超出貼合邊界線L。因此，如第、^型液態 ，在壓合第一基板101及第二基板102來瓖^ 卩所不 103進行溢膠的狀態下，假設部分的光固型液態膠== 11/18 201247410 膠至透明多層板1G右側由統裝置12，12，所照射之光 位置所形成的貼合邊界線L，該部分的光固型液態膠1〇3 隨即受到光照影響而形成固化。 接著’如第四圖下半部所示，當繼續等待光固型液態 膠103進行溢膠時’也能防止光固型液態膠103持續向^ 明多層板10白勺右側進行溢膠，而造成溢滿。並且，者 型液態膠103溢膠至由光源裳置12，12，所照射之光二位置 所形成的左娜合邊界線L時，光_液態膠1()3隨即也 會受到光照影響而形成固化。如此—來，即可讓透明多層 板10在所設定賴合邊界線L内均勻充滿光固型液態膠 103，並且不會產生膠體溢滿的情形。 / —請再參考第五圖’為本發明防止液轉溢滿之方法合 ^施例流程®。如圖所示’本實闕是提供—種防止液髮 膠溢滿之方法，其應用於—透明多層板貼合I置，所= 透明多層板貼合裝置是預先承載透明多層板的一第一基相 及-第二基板，並且第—基板的貼合面或第二基板的貝土占么 面點膠塗佈有—光_液態膠。此外，此時所承载的第二 ，板及第二基板較佳是形成疊合的狀態，㈣過光 態膝來相互貼近，並形成尚未完全壓合的透明多層板。’ 在上述狀態下，本實施例防止液態膠溢滿 驟包括：壓合第一其柘及笼-其, 々次的步 進行、、⑽光固型液態膠開始 光固型液態膠會自由地進行溢膠擴 二届t 圖形絲成—光線⑽姐鱗麵)於透明 夕層板，使該光_照射位置得以形成—貼合邊界線⑽ :如此—來L由錢騎位置卿成⑽/ ★固化任何祕至貼合邊界線的光_絲膠⑽习。藉此 12/18 201247410 ，以達，，固型液態膠在貼合時產生膠體溢滿情形。 附帶-提的是，本實施例所述及的步驟卿])及步驟 (S509 ’在實際的執行轉亦可相互交換，以在確認光線形 基板及第二基板來讓光固型液態膠進 订膠。在此並非為本實施例所限制。 ㈣=貼=根==，_化 容易產生溢跡_。其中，㈣化的區』: = = 界線上，並不會實際對於貼合邊界線内的光 能= 行=，讓透明多層板是實際進入後端所謂的固化ί = 、1才'全面固化光固型液態膠。如此一來，本發似不: 層板的基板來進行結構::改=:需 邊界線的功效。如此以有效地防止光合 之申請專利範圍為準，任何熟悉該項 =專：:思及之變― 【圖式簡單說明】 構示L—輯發明物層板猶_-實施例架 第-圖^本發卿騎細實施媽構示意圖. 13/18 201247410 第三圖係本發明透明多層板貼合裝置的第二實施例架 構不意圖， 第四圖係本發明透明多層板的貼合狀態之實施例示意 圖；及 第五圖係本發明防止液態膠溢滿之方法的實施例流程 圖。 【主要元件符號說明】 1，γ 貼合裝置 10透明多層板 101第一基板 102第二基板 103光固型液態膠 11壓合機構 110載板 111第一定位治具 1110第一吸風結構 112第二定位治具 1120第二吸風結構 113升降機構 ]2，12’ 光源裝置. 120移動滑執 1201第一導軌 1202第二導執 121，121’ 光源發射器 122，122’ 控制單元 13控制器 14/18 201247410 14支撐架 L貼合邊界線 S501至S505流程圖步驟說明 15/18I I201247410 Set a light guide to increase the light guiding effect of the illumination. Similarly, the 'first-position fixture ln and the second positioning fixture 112 are also designed on the same principle, designed with a transparent material, and let the grain structure contained in the second positioning fixture m and the first material (1) ( Wei structure or clip material), not the light path of the New Zealand light wire. The source device 12 is a mechanical sliding type light source emitting device, which includes a moving rail 120, a light source emitter, 121 and a control unit 122. For the part of the movable slippery 120, please refer to the second figure at the same time, which is a schematic diagram of the pre-configuration of the slide rail of the present invention. The shifting 12G includes at least = rail 1201 and at least - second rail. Wherein, the second rail coffee is vertically mounted on the first guide, and the first guide coffee is used to operate the displacement of the first direction. The money emitter 121 is disposed at 1202 and utilizes the second rail 12〇2 to operate a displacement in a second direction. The control unit 122 is electrically connected to the control of the moving rail m and the light source transmitter 12 to operate the moving slider 12. And the operation of the light source launch benefit 121. = 士士, 移动滑滑] 2〇 In addition to the embodiment shown in the second figure, the second branch 12〇2 is erected on two first-leading coffee, set to T-shaped Beyond the situation. In fact, it is also possible to use two second guides 1202 and a first guide to make a cross. The invention does not limit the moving rail coffee. Therefore, the above-mentioned disclosed structure can realize the laminating device of the bright multi-layer board 1G, and the actual state of the wire is as follows: 10:18 201247410 f Thief system. First, in setting 2 2 = the device 13 can be surrounded by the actual desired opening of the transparent multilayer board 10 and define the starting point of the scanned pattern. Then, the position of the light source device 12 is adjusted so that the light irradiation position of the light source device 12 can be aligned with the starting point' and the position of the light source device 12 at this time is recorded as the -starting coordinate. So, in the operational state, the controller controls the light source device 12 to start from the starting coordinate according to the scan. The lines are scanned cyclically and form light. Please refer to the third figure again for the transparent multi-layer board assembly of the present invention. As shown in the figure, the structure of the affixed government 1' provided in this embodiment and the principle of IL are substantially the same as those of the bonding apparatus of the first embodiment. The main difference lies in the light of the embodiment. It belongs to the galvanometer technology and launcher. (4) The general knowledge of the field of surgery can be understood, the vibrating light source (4) technology contains - modular source transmitter 121' and a control unit 122, the principle of Θ, Thai, ... * 121, internal The vibration light source emission path of the horizontal and vertical lenses (not shown) is omitted to save the external mechanical slide rail: fine ==: In this way, the vehicle and device 12 of the present embodiment will have a faster speed than the mechanical sliding light in the first embodiment. Please refer to the fourth figure 'the bonding method of the transparent multi-layer board of the present invention. Illustration of the example. Since the present invention is made up of the light source means 12, 12, = one Å, the irradiation position of the light is formed to form the bonding boundary line L", and the ray 103 is overflowed beyond the bonding boundary line L. Therefore, in the liquid state of the first type, the first substrate 101 and the second substrate 102 are pressed together, and a part of the photo-solid liquid glue is assumed to be 11/18 201247410. The bonding boundary line L formed by the position of the light irradiated by the unit 12, 12 on the right side of the transparent multilayer board 1G, the portion of the photo-curable liquid glue 1〇3 is then subjected to illumination to form a solidification. Then, as shown in the lower half of the fourth figure, when waiting for the photo-curable liquid glue 103 to overflow, it can also prevent the photo-curable liquid glue 103 from continuously overflowing to the right side of the multilayer board 10, and Causes overflow. Moreover, when the liquid glue 103 overflows to the left-hand boundary line L formed by the light source 12, 12 and the position of the irradiated light, the light_liquid glue 1 () 3 is also affected by the light. Cured. In this way, the transparent multi-layer board 10 can be uniformly filled with the photo-setting liquid glue 103 in the set boundary line L, and the colloid overflow does not occur. / - Please refer to the fifth figure again as a method for preventing liquid overflow in the present invention. As shown in the figure, 'this method is to provide a method for preventing the overflow of the liquid hair gel, which is applied to the transparent multi-layer board I. The transparent multi-layer board bonding device is the first one to carry the transparent multi-layer board in advance. The base phase and the second substrate, and the bonding surface of the first substrate or the shell of the second substrate is coated with a light-liquid glue. Further, the second, the plate and the second substrate carried at this time are preferably in a superposed state, and (4) the over-optical knees are in close proximity to each other, and a transparent multi-layered plate which has not been completely pressed is formed. In the above state, the liquid glue overflow prevention step of the embodiment includes: pressing the first one and the cage - the step of the liquid layer is carried out, and (10) the light solid liquid glue starts the light solid liquid glue to be freely Carry out the overflow glue to expand the second t-pattern silk into the light (10) sister scale surface on the transparent eve layer, so that the light _ irradiation position can be formed - fit the boundary line (10): So - L by the money riding position Qingcheng (10) / ★ Curing any secret to the boundary line of light _ sericin (10) ha. By this 12/18 201247410, in order to achieve, the solid liquid glue will produce a colloid overflow when it is applied. Incidentally, the steps described in the present embodiment and the steps (S509' can also be exchanged in actual execution to confirm the light-shaped substrate and the second substrate to allow the light-solid liquid glue to enter. The glue is not limited by this embodiment. (4) = paste = root ==, _ is easy to produce overflow _. Among them, (four) zone 』: = = boundary, and will not actually fit the boundary The light energy in the line = line =, so that the transparent multi-layer board is actually entering the back end, so-called curing ί = , 1 is 'completely curing the light-solid liquid glue. So, the hair does not seem to: the substrate of the laminate Structure::Change=:The effect of the boundary line is required. So in order to effectively prevent the patent application scope of photosynthesis, any familiarity with this item: special:: think and change - [simple description of the diagram] construct L-series invention The object layer board is still _-example frame - Figure ^ Benfa Qing riding fine implementation of the mother structure diagram. 13/18 201247410 The third figure is the second embodiment of the transparent multi-layer board bonding apparatus of the present invention, the structure is not intended, the fourth BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic view showing an embodiment of a state in which a transparent multilayer board of the present invention is attached; and a fifth diagram of the present invention. Flow chart of embodiment of the method of overflowing state. [Main component symbol description] 1, γ bonding device 10 transparent multilayer plate 101 first substrate 102 second substrate 103 light-solid liquid glue 11 pressing mechanism 110 carrier plate 111 First positioning fixture 1110 first suction structure 112 second positioning fixture 1120 second suction structure 113 lifting mechanism] 2, 12' light source device. 120 moving slip 1201 first rail 1202 second guide 121, 121 'Light source transmitter 122, 122' Control unit 13 controller 14/18 201247410 14 support frame L bonding boundary line S501 to S505 flow chart step description 15/18