CN105774184A - Glue laminating process - Google Patents
Glue laminating process Download PDFInfo
- Publication number
- CN105774184A CN105774184A CN201510977486.9A CN201510977486A CN105774184A CN 105774184 A CN105774184 A CN 105774184A CN 201510977486 A CN201510977486 A CN 201510977486A CN 105774184 A CN105774184 A CN 105774184A
- Authority
- CN
- China
- Prior art keywords
- substrate
- glue
- colloid
- surrounding
- finished product
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
- B32B37/1284—Application of adhesive
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/18—Handling of layers or the laminate
- B32B38/1825—Handling of layers or the laminate characterised by the control or constructional features of devices for tensioning, stretching or registration
- B32B38/1833—Positioning, e.g. registration or centering
- B32B38/1841—Positioning, e.g. registration or centering during laying up
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B2038/0052—Other operations not otherwise provided for
- B32B2038/0076—Curing, vulcanising, cross-linking
Landscapes
- Physics & Mathematics (AREA)
- Fluid Mechanics (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Abstract
The invention provides a glue laminating process. The glue laminating process comprises the following steps: (1) providing a first substrate and a second substrate; (2) dispensing a glue to the first substrate and/or the second substrate; (3) carrying out aligned press-fitting on the first substrate and the second substrate, and meanwhile, curing the periphery of the first substrate and/or the second substrate so as to obtain a semifinished product with a periphery-cured frame; and (4) carrying out surface-dressing curing on the semifinished product with the periphery-cured frame, thereby obtaining a finished product. According to the glue laminating process, the periphery of the substrates is cured while the aligned press-fitting of the substrates is completed so as to obtain the periphery-cured frame, thus, the problem of glue overflowing is effectively solved, the width of overflowed glue can be accurately controlled, the broadening of the glue does not occur after curing, secondary misalignment does not occur after curing, the accuracy of press-fitting is further improved, and the actual operation of a production line is facilitated; and the problem of press-fit bubbles can be effectively solved, the leveling of the glue is accelerated, the production time is shortened, and the production efficiency is further increased.
Description
Technical field
The present invention relates to a kind of colloid attaching process.
Background technology
The schematic diagram of excessive glue is produced when Fig. 1 is to carry out substrate pressure programming in prior art.Refer to Fig. 1, in the prior art, when being intended to that substrate 1 ' is pressed on display floater 2 ', it is common that first at the upper coating colloid 3 ' of display floater 2 ', then by overlapped for substrate 1 ' on display floater 2 '.Afterwards, apply pressure to substrate 1 ', with solderless substrate 1 ' and display floater 2 '.Then, carry out colloid curing process, make colloid 3 ' solidify, so can by colloid 3 ' come adhesive base plate 1 ' and display floater 2 '.But, when applying pressure to substrate 1 ', owing to colloid 3 ' can flow, so being easily caused the situation of substrate 1 ' and the excessive glue of surrounding generation of display floater 2 ', and glue overflow amount cannot be precisely controlled, and overflows after glue, can affect IR hole, cause product rejection.Meanwhile, the box content after pressing is easily generated vaporific bad, and in box, bad reprocessing causes scrapping and cannot avoid, and as produced bad cannot to reprocess in compartmentalized box for holding assorted fruits and candies, reprocessing rear quality cannot ensure, causes that colloid pressing yield is on the low side.
In prior art, have by carrying out, after a glue precuring forms cofferdam type pressing mode or some glue, colloid surrounding is carried out precuring to solve glue problem of overflowing in the surrounding of substrate, although glue problem of overflowing can be solved, but some is not enough below existing: the glue that 1) overflows cannot be precisely controlled, after precuring still there is certain mobility in glue, there will be precision problem, operation easier is big；2) after putting glue on substrate, colloid surrounding is carried out precuring, it is necessary to just can playing a role after glue nature levelling, practical operation difficulty is big, it is not easy to realize, and natural levelling requires time for, and reduces and produces actual efficiency；3) after putting glue on substrate, colloid surrounding is carried out precuring irradiation, levelling, edge precuring, then para-position pressing, now can there is pressing bubble, bubble can only use steam vent, has steam vent just to have excessive glue, still actual cannot solve glue problem of overflowing.
Summary of the invention
In order to solve above-mentioned the deficiencies in the prior art, the invention provides a kind of colloid attaching process, its surrounding is solidified by it while substrate para-position pressing completes, obtain four limits solidified, not only effectively solve glue problem of overflowing, and the width of excessive glue can be precisely controlled, colloid broadening is not had after solidification, do not have secondary dislocation after solidification, improve bonding accurcy further, it is simple to produce line practical operation；Can effectively solve pressing air bubble problem, accelerate the levelling of glue, shorten the production time, further increase production efficiency.
The technical problem to be solved is achieved by the following technical programs:
A kind of colloid attaching process, comprises the following steps:
(1) first substrate and second substrate are provided；
(2) on described first substrate and/or second substrate, glue is put；
(3) first substrate and second substrate described in para-position pressing, solidifies at first substrate and/or second substrate surrounding simultaneously, it is thus achieved that has surrounding and solidifies the semi-finished product of frame；
(4) semi-finished product with surrounding solidification frame are carried out whole solidification, it is thus achieved that finished product.
Further, also including checking the step whether semi-finished product are non-defective unit between step (3) and (4), if non-defective unit, then entering step (4), if not non-defective unit, then carry out doing over again program.
Further, described colloid includes at least one of UV glue, heat-curable glue.
Further, the para-position step in described step (3) is grabbed by aligning clamp or CCD para-position and has been marked.
Further, described surrounding solidifies the width of frame is 1 ~ 2.5mm.
There is advantages that
(1) described colloid attaching process, its surrounding is solidified by it while substrate para-position pressing completes, obtain four limits solidified, not only effectively solve glue problem of overflowing, and the width of excessive glue can be precisely controlled, do not have colloid broadening after solidification, after solidification, do not have secondary dislocation, improve bonding accurcy further, it is simple to produce line practical operation；Can effectively solve pressing air bubble problem, accelerate the levelling of glue, shorten the production time, further increase production efficiency；
(2) increase and check operation, when there being interior dirt etc. bad in box, it is possible to Repair timely, improve the success rate reprocessed after pressing solidifies, solve traditional to solidify in back box that bad causing cannot the problem of Repair.In the box produced bad can Repair timely, without influence on the function of its product, and the yield reprocessing operation can be improved；
(3) adopt the colloid attaching process of the present invention can control its glue overflow amount, reduce the waste of glue, improve yield, improve competitiveness, there is good economic benefit.
Accompanying drawing explanation
The schematic diagram of excessive glue is produced when Fig. 1 is carry out substrate process for pressing in prior art；
Fig. 2 is the flow chart of the colloid attaching process of one embodiment of the invention；
Fig. 3 is half-finished structural representation of colloid laminating in the present invention；
Fig. 4 is the structural representation of the finished product of colloid laminating in the present invention.
Detailed description of the invention
Below in conjunction with drawings and Examples, the present invention will be described in detail.
Refer to Fig. 2 to 4, the colloid attaching process of a preferred embodiment of the present invention comprises the following steps:
(1) first substrate 1 and second substrate 2 are provided；
When implementing, shown first substrate 1 and second substrate 2 can be touch screen (TouchPanel, TP), liquid crystal display module (LiquidCrystalModule, LCM), glass cover-plate (CoverGlass, CG) or sensing glass (SensorGlass, SG), but also do not limit to and this.
(2) on first substrate 1 and/or second substrate 2, a glue is carried out；
When implementing, colloid used can be UV glue, it is also possible to be heat-curable glue, it is also possible to be both combinations.Gluing can be coated on substrate by screen printing mode, it is also possible to pointwise print is coated with, but is not limited to both modes.
(3) first substrate 1 described in para-position pressing and second substrate 2, solidifies at first substrate 1 and/or second substrate 2 surrounding simultaneously, it is thus achieved that has surrounding and solidifies the semi-finished product of frame 31, as shown in Figure 3；
When implementing, described first substrate 1 and second substrate 2 para-position can be grabbed by aligning clamp or CCD para-position and marked.
First substrate 1 described in para-position pressing and while second substrate 2, solidify in its surrounding, by being provided previously by ultraviolet light and/or heating member in its surrounding, make light can only be irradiated to setting position or provide heat source in setting position, when when pressing levelling, colloid stream is to setting position, colloid is played solidification by light or thermal source so that colloid no longer flows, and accurately controls glue overflow amount.
It should be noted that described setting position refer to pressing complete after the edge of colloid coverage rate and surrounding to be solidified solidify frame 31.Preferably, surrounding solidifies the width of frame 31 and is preferably 1 ~ 2.5mm, this frame 31 width complete from pressing after 1 ~ 2.5mm of counting of the edge of colloid coverage rate, this width value needs to assess according to mobility and the adhesion of colloid, ordinary circumstance, the setting value relevant row that are inversely proportional to adhesion that are directly proportional to mobility are relevant.When implementing, the size of width according to practical situation, can be adjusted.
(4) semi-finished product with surrounding solidification frame 31 are carried out whole solidification, it is thus achieved that finished product, as shown in Figure 4.
It should be noted that, whole solidification refers to and whole semi-finished product is solidified, namely the uncured glue 32 surrounding being solidified frame 31 defined solidifies, glue overflow amount is controlled, thus glue no longer overflows product surrounding when solidifying for whole owing to half-finished surrounding has cured location (colloid levelling is to setting position).
When implementing, solidifying the solidification equipment adopted can be at least one in ultraviolet light, heating member, and this heating member can be infrared lamp.This solidification equipment includes the first solidification equipment and the second solidification equipment, described first solidification equipment is for carrying out surrounding cured to while pressing first substrate and second substrate to it, and described second solidification equipment is for carrying out whole solidification to the semi-finished product with surrounding solidification frame.
In the present invention, described colloid preferably employs the liquid glue in ultraviolet optical cement, then corresponding solidification equipment is ultraviolet curing device, according to the liquid glue adopting different model, the setup parameter of ultraviolet curing device is different, it is preferable that UV light accumulated amount is 3000 ~ 3500mj/cm2, UV light intensity be 50 ~ 400mw/cm2, set substrate surface temperature as 19 ~ 65 DEG C.
In order to improve product yield, can increase between step (3) and (4) inspection operation, namely to have surrounding solidify frame semi-finished product inspection whether be non-defective unit, if non-defective unit, then carry out step (4), if defective products, then enter reprocess operation.When surrounding solidify occur bad time, it is possible to Repair timely, improve the success rate reprocessed after pressing solidifies, solve traditional to solidify in back box that bad causing cannot the problem of Repair.Having surrounding and solidify the semi-finished product of frame, its vision area glue is also uncured, reduces and saves to obtain difficulty, promotes the success rate and yield saved.In the box produced bad can Repair timely, improve colloid pressing dirt shape bad, and without influence on the function of its product, and the yield reprocessing operation can be improved.
Colloid attaching process of the present invention, its surrounding is solidified by it while substrate para-position pressing completes, obtain four limits solidified, not only effectively solve glue problem of overflowing, and the width of excessive glue can be precisely controlled, do not have colloid broadening after solidification, improve bonding accurcy further, it is simple to produce line practical operation；Can effectively solve pressing air bubble problem, accelerate the levelling of glue, shorten the production time, further increase production efficiency.Owing to carrying out when pressing solidifies with surrounding simultaneously, therefore closely the problem that two pieces of substrates come off easily does not occur without periphery pressing after considering surrounding solidification；
Add inspection operation, when surrounding solidify occur bad time, it is possible to Repair timely, improve the success rate reprocessed after pressing solidifies, solve traditional to solidify in back box that bad causing cannot the problem of Repair.In the box produced bad can Repair timely, improve colloid pressing dirt shape bad, without influence on the function of its product, and the yield reprocessing operation can be improved.
The colloid attaching process adopting the present invention can control its glue overflow amount, reduces the waste of glue, improves yield, improves competitiveness, has good economic benefit.
Embodiment described above only have expressed embodiments of the present invention; it describes comparatively concrete and detailed; but therefore can not be interpreted as the restriction to the scope of the claims of the present invention; in every case the technical scheme adopting the form of equivalent replacement or equivalent transformation to obtain, all should drop within protection scope of the present invention.
Claims (5)
1. a colloid attaching process, comprises the following steps:
(1) first substrate and second substrate are provided；
(2) on described first substrate and/or second substrate, glue is put；
(3) first substrate and second substrate described in para-position pressing, solidifies at first substrate and/or second substrate surrounding simultaneously, it is thus achieved that has surrounding and solidifies the semi-finished product of frame；
(4) semi-finished product with surrounding solidification frame are carried out whole solidification, it is thus achieved that finished product.
2. colloid attaching process according to claim 1, it is characterised in that also include checking the step whether semi-finished product are non-defective unit between step (3) and (4), if non-defective unit, then entering step (4), if not non-defective unit, then carry out doing over again program.
3. colloid attaching process according to claim 1, it is characterised in that described colloid includes at least one of UV glue, heat-curable glue.
4. colloid attaching process according to claim 1, it is characterised in that the para-position step in described step (3) is grabbed by aligning clamp or CCD para-position and marked.
5. colloid attaching process according to claim 1, it is characterised in that it is 1 ~ 2.5mm that described surrounding solidifies the width of frame.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510977486.9A CN105774184A (en) | 2015-12-23 | 2015-12-23 | Glue laminating process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510977486.9A CN105774184A (en) | 2015-12-23 | 2015-12-23 | Glue laminating process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105774184A true CN105774184A (en) | 2016-07-20 |
Family
ID=56390291
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510977486.9A Pending CN105774184A (en) | 2015-12-23 | 2015-12-23 | Glue laminating process |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105774184A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106785549A (en) * | 2016-12-19 | 2017-05-31 | 维沃移动通信有限公司 | A kind of dispensing method of USB socket, mobile terminal and USB socket |
| CN106827547A (en) * | 2017-01-03 | 2017-06-13 | 广东欧珀移动通信有限公司 | The manufacture method of cover plate assembly, cover plate assembly and terminal |
| CN107526470A (en) * | 2017-08-23 | 2017-12-29 | 信利光电股份有限公司 | The glue fitting precuring fixture and sub-curing process of a kind of touch-screen |
| CN108073330A (en) * | 2018-02-09 | 2018-05-25 | 业成科技（成都）有限公司 | Touch device and preparation method thereof |
| CN109752780A (en) * | 2018-12-04 | 2019-05-14 | 浙江宝乐维科技有限公司 | A kind of processing method of eyeglass pad pasting |
| CN110136573A (en) * | 2019-05-06 | 2019-08-16 | Oppo广东移动通信有限公司 | Display screen and preparation method thereof, electronic equipment |
| CN112090709A (en) * | 2020-08-25 | 2020-12-18 | 信利光电股份有限公司 | Method and device for attaching touch screen to attaching piece |
| CN114425504A (en) * | 2022-02-08 | 2022-05-03 | 亚世光电(集团)股份有限公司 | Novel LOCA (local area array) glue overflow reducing process method |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102785453A (en) * | 2011-05-18 | 2012-11-21 | 宸鸿科技(厦门)有限公司 | Transparent multilayer board pasting device and method thereof for preventing liquid glue from overflowing |
| US20150230361A1 (en) * | 2014-02-07 | 2015-08-13 | Htc Corporation | Panel laminating method, panel assembly and electronic device |
-
2015
- 2015-12-23 CN CN201510977486.9A patent/CN105774184A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102785453A (en) * | 2011-05-18 | 2012-11-21 | 宸鸿科技(厦门)有限公司 | Transparent multilayer board pasting device and method thereof for preventing liquid glue from overflowing |
| US20150230361A1 (en) * | 2014-02-07 | 2015-08-13 | Htc Corporation | Panel laminating method, panel assembly and electronic device |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106785549A (en) * | 2016-12-19 | 2017-05-31 | 维沃移动通信有限公司 | A kind of dispensing method of USB socket, mobile terminal and USB socket |
| CN106827547A (en) * | 2017-01-03 | 2017-06-13 | 广东欧珀移动通信有限公司 | The manufacture method of cover plate assembly, cover plate assembly and terminal |
| CN107526470A (en) * | 2017-08-23 | 2017-12-29 | 信利光电股份有限公司 | The glue fitting precuring fixture and sub-curing process of a kind of touch-screen |
| CN108073330A (en) * | 2018-02-09 | 2018-05-25 | 业成科技（成都）有限公司 | Touch device and preparation method thereof |
| CN108073330B (en) * | 2018-02-09 | 2020-12-15 | 业成科技（成都）有限公司 | Touch device and manufacturing method thereof |
| CN109752780A (en) * | 2018-12-04 | 2019-05-14 | 浙江宝乐维科技有限公司 | A kind of processing method of eyeglass pad pasting |
| CN110136573A (en) * | 2019-05-06 | 2019-08-16 | Oppo广东移动通信有限公司 | Display screen and preparation method thereof, electronic equipment |
| CN112090709A (en) * | 2020-08-25 | 2020-12-18 | 信利光电股份有限公司 | Method and device for attaching touch screen to attaching piece |
| CN114425504A (en) * | 2022-02-08 | 2022-05-03 | 亚世光电(集团)股份有限公司 | Novel LOCA (local area array) glue overflow reducing process method |
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Application publication date: 20160720 |
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| RJ01 | Rejection of invention patent application after publication |