JP4933368B2 - Manufacturing method of liquid crystal parts - Google Patents

Description

  The present invention relates to a method for manufacturing a liquid crystal component, and in particular, when a specific resin is filled in a gap between a panel surface of a liquid crystal module and a transparent cover and the two are bonded together, the resin is spread in an optimal state between the two. The present invention relates to a method of manufacturing a liquid crystal component that can be obtained and can achieve a desired good bonding state in a short time.

  Conventionally, in a display unit using a liquid crystal module used in a mobile phone or various display devices, a liquid crystal module panel surface and a transparent cover (such as a tempered glass plate or an acrylic plate) provided on the panel surface are 0.5. By providing a gap (air gap) of about 1 mm, the liquid crystal module is not affected even if the cover is broken by an external impact (air gap structure).

  However, in such an air gap structure, the liquid crystal panels of the liquid crystal modules having different refractive indexes, the air layer forming the air gap, and the transparent cover made of glass or plastic are sequentially laminated. Reflection of light occurs at each interface (interface between the liquid crystal panel and the air layer, interface between the air layer and the transparent cover, interface between the surface of the transparent cover and the external atmosphere), and brightness is reduced. The contrast ratio may be deteriorated due to light scattering. For example, the display from the liquid crystal panel may be difficult to see under sunlight.

In response to such problems, recently, a technology has been announced in which a transparent optical resin having a refractive index close to that of glass or acrylic is enclosed in the air gap and cured by ultraviolet irradiation or the like (non-patent document). 1). By filling the air gap with this optical resin, the interface between the liquid crystal panel and the air layer and the interface between the air layer and the transparent cover are substantially eliminated, and reflection and light scattering at these interfaces are eliminated. As a result, the brightness and contrast ratio of the display from the liquid crystal panel can be greatly improved.
Nikkei Electronics 2007.5.7

  In the above-described excellent improvement technology, when the optical resin is further filled in the air gap, the optical resin is formed without air being caught, and in particular, the liquid crystal module panel surface and the transparent cover are formed. The gap between which the resin should be filled is controlled to an optimum gap in relation to the amount of resin applied, and there is no protrusion of unnecessary resin from the gap and does not affect the surrounding members. There is no shortage of filling resin amount, and it is demanded that the above-described improvement effect by resin filling is obtained over the entire desired range, and development of an optimal application and filling technology for optical resin for that purpose is urgently required.

  Therefore, the object of the present invention is to ensure that the layer of the optical resin is in a desirable form between the panel surface of the liquid crystal module and the transparent cover in order to satisfy further demands on the recently developed and announced optical resin technology. Another object of the present invention is to provide a method of manufacturing a liquid crystal component that can be formed by the above method.

  In order to solve the above-mentioned problems, a liquid crystal component manufacturing method according to the present invention provides a transparent cover with a gap with respect to the panel surface of the liquid crystal module, and after filling the gap with a transparent resin, the resin is cured and the liquid crystal module In the method of manufacturing a liquid crystal component for attaching a transparent cover to a transparent cover, a resin to be filled in the gap is applied to at least one of the panel surface of the liquid crystal module and the surface of the transparent cover facing the panel surface, and then the coating is applied. Weigh the total weight of the resin and the object to be coated and subtract the weight of the object to be coated from the total weight to obtain the weight of the coated resin alone, and fill the resin in the gap set in advance with the weight of the coated resin The size of the gap to be controlled is calculated from the area to be controlled, and the liquid crystal module panel surface is calculated based on the calculated size of the gap. Consists method characterized by controlling the relative position of the opposing surface to the serial transparent cover panel surface.

  In this method, the total weight of the coating resin and the coating object is obtained by weighing, and the coating weight is subtracted from the total weight, which is grasped in advance, or pre-metered before the resin coating. The weight of the resin alone is obtained, and the weight of the coated resin and the area to be filled with the resin in the above-mentioned gap (that is, the above-described reflection and light scattering at the interface of the conventional air gap are eliminated, and the liquid crystal panel The area of the region to be filled with resin required for making it possible to significantly improve the brightness and contrast ratio of the display from the display area, and the area of the region that does not protrude, etc.) The size of the gap to be done is calculated. By controlling the relative position of the surface facing the panel surface of the transparent cover with respect to the panel surface of the liquid crystal module (that is, the final gap size for bonding them together) so as to be the calculated gap size ( (In other words, the actual gap is reduced so as to be the size of the calculated gap), so that the intervening coating resin can be expanded over the entire desired area without causing protrusion from the area. Become. As a result, according to the amount of the applied resin, control to an optimal gap is achieved, and the resin is filled without causing the entire area of the optimal gap to protrude. In addition, since the gap size as the control target is calculated before the operation of actually shrinking the gap and pushing the resin out, the relative position of the facing surface of the transparent cover to the panel surface of the liquid crystal module is determined. When controlling (for example, controlling the height position of the surface facing the panel surface of the transparent cover with respect to the panel surface of the liquid crystal module), the control to the target position can be performed at high speed, and the entire bonding process can be performed. Tact time can also be shortened.

  Moreover, in the method according to the present invention, a dam is formed by applying the resin in the latter half of the periphery of at least one of the surfaces facing the panel surface of the liquid crystal module and the panel surface of the transparent cover, After the resin is applied to the center of at least one surface of the panel surface and the surface of the transparent cover facing the panel surface, the panel surface and the transparent cover face each other, and the panel surface and the transparent cover that face each other The gap between them is reduced to the size of the calculated gap, and the resin applied to the central part is expanded, and the expanded resin is dammed by the dam, and then all the resin interposed in the gap is cured. Can be.

  In such a method, since a dam cured in the latter half of the coating is formed around at least one of the surfaces of the panel surface of the liquid crystal module and the surface of the transparent cover facing the panel surface, the resin applied to the center portion is formed. When the resin is pushed and spread in the gap between the panel surface and the transparent cover, the spread resin is appropriately dammed by the dam, and it is possible to more reliably prevent the resin from being unnecessarily protruded to the positions of the surrounding members. Since the liquid resin blocked by the dam and the semi-cured resin that formed the dam are the same resin and both are in the state before full curing, both resins are easily assimilated and the interface between them is Is not formed, and becomes a single resin layer. In addition, the resin layer having a predetermined planar shape can be easily formed by simply spreading the resin by damming with a dam. Accordingly, it is possible to further increase the speed of control to the relative position, and it is possible to further shorten the tact time of the entire bonding process. Furthermore, air can be easily prevented from being caught by spreading the resin evenly. As a result, the transparent resin layer is surely formed in a desirable form in the gap.

  In the method according to the present invention, the resin is applied to the central portion of the facing surface with the facing surface facing the panel surface of the transparent cover facing upward, and the transparent cover is turned upside down. The applied resin hangs down so that the central part is located at the lower part, and the panel surface and the transparent cover are faced in that state so that the gap between the two is reduced to the calculated gap size. Is preferred. By reversing the top and bottom of the transparent cover with the resin applied to the center of the top surface, the coated resin becomes a smooth curved surface that hangs down so that the center of the resin covers the center part. By narrowing the gap between the transparent covers and expanding the resin, the air is pushed out from the center of the coated resin toward the periphery, and the air is more reliably prevented from getting caught while achieving uniform resin expansion. Will be. In this case, after the transparent cover is turned upside down and before the gap is reduced, a certain waiting time is required for the drooping shape of the resin to be a completely smooth curved surface. This waiting time can be shortened. That is, even if the resin sag shape is not in a completely smooth curved surface, the target control position of the operation of lowering the transparent cover and reducing the gap is determined from the calculated gap size. As long as the drooping shape of the resin is almost a curved surface shape, the air is directed from the center of the coated resin to the surroundings by narrowing the gap and expanding the resin in that state. It is possible to achieve uniform expansion of the resin in a state where it is pushed out and air is not caught. Therefore, the tact time of the whole bonding process can be further shortened.

  It is also preferable to control the pressurization of the transparent cover toward the panel surface of the liquid crystal module when the gap is reduced. By controlling the pressurization, it is possible to control the resin spreading speed. In this pressurization control, it is also possible to detect the pressure and perform feedback control so as to reach the target pressure. Further, if a sensor is provided at each corner and the pressure detected by each sensor is controlled to be uniform, the pressure distribution can be made uniform.

  In reducing the gap, it is also preferable to adjust the parallelism of the transparent cover with the panel surface of the liquid crystal module. If it is adjusted within the range of the predetermined parallelism, the resin to be expanded can be spread more evenly. In addition, the air can easily escape to the surroundings, and the air can be prevented from being caught more reliably. This parallelism adjustment is performed by adjusting the inclination of the holding means at the time of bonding, or by providing a sensor at each corner, and the gap detected by each sensor (or the height of the member to be bonded) It is possible to achieve this by setting the position (or the like) to a predetermined value.

  Further, when the panel surface and the transparent cover face each other, it is preferable to perform alignment between them. When providing a dam, it is preferable to form the dam only on one side of the panel surface and the transparent cover from the viewpoint of simplification of the process. The positional relationship between the resin and the dam is also determined to be a desirable positional relationship, and the resin is expanded and dammed by the dam in the present invention in a more desirable form.

  When the dam is provided, the application and formation of the dam can be performed by sequentially applying the resin to a predetermined portion with a dispenser or by applying the resin in a predetermined form with a stamper at a time. be able to. What is necessary is just to select suitably in consideration of an apparatus specification, the required tact time, etc.

  As the planar shape of the dam to be formed, for example, the dam can be formed over the entire circumference of the peripheral portion of the one surface. In this case, it is preferable to form a dam that is relatively low with respect to the size of the gap in order to facilitate the escape of air. It is also possible to form dams intermittently around the one surface. In this case, since the intermittently formed adjacent dams can function as air escape routes, it can be formed into a relatively high dam, and has a high damming function against the resin that has been expanded. It becomes possible to have.

  In principle, a thermosetting resin can be used as the transparent resin. However, since the optical resin disclosed in Non-Patent Document 1 is an ultraviolet curable resin, it is actually available. It is preferable to use this ultraviolet curable resin whose optical target function has been verified.

  According to the method for manufacturing a liquid crystal component according to the present invention, with respect to the recently developed technology related to optical resin, this optical resin layer is placed in the gap between the liquid crystal module panel surface and the transparent cover. Therefore, it can be reliably formed in a short time in a desirable form in which air entrapment is prevented. This makes it possible to cope with mass production using this optical resin while reducing the tact time of the bonding process.

Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings.
FIG. 1 shows an example of each step of a method for manufacturing a liquid crystal component according to one embodiment of the present invention, and FIG. 2 shows an example of an apparatus used for implementing the method for manufacturing a liquid crystal component according to one embodiment of the present invention. The schematic structure which shows is shown. First, in the example shown in FIG. 1, a transparent cover to be bonded to the liquid crystal module is loaded by a loader, for example, in step S1, and in step S2, a transparent dam forming optical resin is formed around the upper surface of the transparent cover. (Ultraviolet curable resin) is applied, and the applied resin is irradiated with ultraviolet rays (UV), so that the resin is semi-cured to form a dam having a predetermined shape. In step S3, an optical resin is applied to the central portion of the upper surface of the transparent cover (main application). In this state, in step S4, the total weight of the transparent cover as the resin coating object and all the resins applied thereto is weighed. From the total weight, the weight of the transparent cover previously determined or before the resin application The weight of the measured transparent cover is subtracted to obtain the weight of the coating resin alone. And the gap between the panel surface of the liquid crystal module to be actually controlled and the surface facing the panel surface of the transparent cover from the weight of the coating resin and the area of the gap to be filled with the preset resin (However, the calculation of the total weight, the resin weight, and the target gap size may be performed after the next inversion step). The transparent cover in which the semi-cured dam is formed in the peripheral portion and the uncured optical resin is applied to the central portion is inverted up and down in step S5, and the resin applied to the central portion is lower in the central portion. It hangs down into a curved surface so as to be positioned.

  At the pasting place, the liquid crystal module to be pasted in step S6 is carried in by the panel loader, and the transparent cover that has been flipped over is pasted after alignment (step S7). ). At this time, the transparent cover is lowered, and the gap between the surface of the liquid crystal module panel and the surface of the transparent cover facing the panel surface is reduced. Control is performed so that the relative position of the facing surface to the panel surface becomes a target value, that is, the gap between both surfaces is reduced to the calculated gap size. By the reduction control of this gap, the resin that has been applied and hung down to the center of the transparent cover is pushed and spread to the surroundings, and when it is spread to the dam position, it merges with the resin that was dammed by the dam and formed the dam. As a result, a single uncured resin layer that does not have an interface is formed, and the resin is completely filled in the portion surrounded by the dam in the gap between the transparent cover and the panel surface of the liquid crystal module. It will be. Along with the expansion of the resin, the air existing in the gap is also eliminated, and the air is prevented from getting into the resin layer. In the unlikely event that there is a defective product due to resin spreading failure or air entrainment, it is transferred to a repair stocker in step S8. Since the defective part transferred to the repair stocker is in a stage before the resin is fully cured, it can be easily repaired. All the resin interposed between the transparent cover and the panel surface of the liquid crystal module bonded together is cured by ultraviolet (UV) irradiation in step S9, and the target liquid crystal component is completed. The resin curing in step S9 can be completely cured at this stage, but when aiming for a relatively short tact time in consideration of mass production, in this step S9, the transparent cover bonded to each other It is sufficient if the liquid crystal module can maintain a fixed positional relationship (so-called precure is sufficient), and it is more efficient to completely cure a large number of units in a separate curing furnace or the like.

  The total weight can be measured by a weight sensor provided in the apparatus, for example, a weight sensor provided in the holding means of the transparent cover. The calculation of the weight of only the coating resin may be performed by a computer based on the signal from the weight sensor, and the target gap can also be calculated by the computer from the obtained weight of the coating resin and the preset gap area. That's fine.

  FIG. 2 shows a configuration example of an apparatus for manufacturing a liquid crystal component for carrying out the above method. A liquid crystal component manufacturing apparatus 11 shown in FIG. 2 includes, for example, an XY two-axis table 12 having an NC (numerical control) servo mechanism and capable of position control in the horizontal directions X and Y, and disposed on the XY two-axis table 12, for example. An XY biaxial table 13 whose position can be controlled in the directions X and Y, a bonding / reversing table 14 provided on the XY biaxial table 13, and a bonding / reversing base provided on the bonding / reversing table 14 A base 15 (a weight sensor can be provided on the base 15), an inverted mounting base 17 equipped with pins 16 and a repair stock base 18 can be position-controlled in the vertical direction Z and added at the time of bonding. And a bonding mechanism 19 capable of controlling the pressure. The bonding mechanism 19 is provided with dispensers 20 and 21 having large and small diameter lifting cylinders to which an optical resin made of an ultraviolet curable transparent resin is applied, and an observation camera 22 with a lifting cylinder (for example, a CCD camera having a predetermined viewing angle). And ultraviolet irradiation means 23 (ultraviolet light source) for irradiating ultraviolet rays (UV) in order to semi-cure and cure (for example, the above-mentioned precure) the applied resin.

  The operation of the device thus configured is described below together with an example of the method according to the invention. As shown in FIG. 3, a transparent cover 31 as a workpiece is set on the bonding / reversing base 15, and the set transparent cover 31 is moved to a predetermined position below the bonding mechanism 19 by position control by the XY biaxial table 13. While moving to a position, the bonding mechanism 19 is lowered and the dispensers 20 and 21 are brought closer to the transparent cover 31. At this time, the weight of only the transparent cover 31 may be measured by a weight sensor.

  Next, as shown in FIG. 4, the large and small dispensers 20 and 21 are properly used as necessary, the resin is applied in the shape of the dam described above around the upper surface of the transparent cover 31, and the applied resin is irradiated with ultraviolet rays. A semi-cured dam is formed by irradiating ultraviolet rays from the means 23, and an uncured liquid resin is applied to the central portion of the upper surface of the transparent cover 31 so as to rise in a mountain shape. The application shape is as shown in FIG. 5, for example. In FIG. 5, 32 is a dam and 33 is a resin applied to the center. At this time, what is necessary is just to measure the total weight of all application resin and the transparent cover 31 with a weight sensor. As described above, only the weight of the coating resin can be obtained from the measured total weight, and the size of the gap to be controlled is determined based on the weight of the coating resin and the area of the gap to be filled with the preset resin. Is calculated. Then, as shown in FIGS. 5 and 6, the upper and lower surfaces of the transparent cover 31 are reversed, and the transparent cover 31 is pasted from the reversing / reversing base 15 so that the resin application surface becomes the lower surface. 17 and the bonding mechanism 19 is retracted. The transferred transparent cover 31 is received by pins 16 provided at each corner so that the applied resin does not come into contact with the upper surface of the mounting base 17 after being inverted.

  Next, as shown in FIG. 7, the XY biaxial table 13 is driven to move the bonding / reversing table 14 to move the transparent cover 31 on the mounting base 17 after the reversing, and at that position, As shown in FIG. 8, the XY biaxial table 13 is driven to move the bonding / reversing table 14, the transparent cover 31 is moved below the bonding mechanism 19, and then the head 34 of the bonding mechanism 19 is lowered. The transparent cover 31 is transferred to the head 34 of the bonding mechanism 19. At this time, the head 34 holds the transparent cover 31 on its anti-resin application surface by suction or the like.

  Next, as shown in FIG. 9, the panel 35 forming the surface of the liquid crystal module as a substrate or the liquid crystal module itself having the panel 35 (hereinafter also simply referred to as “substrate”) is bonded / inverted. It is set on the base 15, the XY biaxial table 13 is driven to move the bonding / reversing table 14, and is held below the head 34 of the bonding mechanism 19 that is moved upward, that is, held by the head 34. The transparent cover 31 is positioned below.

  Next, as shown in FIG. 10, the transparent cover 31 held by the head 34 and the substrate 35 set on the bonding / reversing base 15 are aligned (aligned), and the head of the bonding mechanism 19 is aligned. 34 is lowered, and the transparent cover 31 and the substrate 35 are bonded to each other with a predetermined pressurizing force and a predetermined vertical position control while expanding the intervening resin. At this time, the relative positional relationship between the transparent cover 31 and the substrate 35, more precisely, the gap between the panel surface of the substrate 35 and the surface facing the panel surface of the transparent cover 31 with respect thereto is the calculated target gap. The lowering of the bonding mechanism 19 is controlled so as to be the size. Since such a target control position is obtained by calculation before the lowering operation of the bonding mechanism 19, extremely quick position control is possible, and the takt time of the entire bonding process can be greatly shortened. . Further, the target gap dimension is such that the resin is filled without causing protrusion in a predetermined form over the entire area of the gap between the panel surface of the substrate 35 and the surface of the transparent cover 31 facing the panel surface. Therefore, the resin is accurately filled in a desired form while performing a quick bonding operation in a short time.

  In the lowering control of the head 34 of the bonding mechanism 19 for the resin expansion, the head 34 is once lowered to a position corresponding to the target gap dimension or a slightly lower height, and immediately thereafter, It is also possible to raise the position to a position corresponding to the target gap dimension or to a slightly higher height position, and stop the position control operation at that position. In this way, it is possible to draw the resin portion at the end of the gap area that has once protruded toward the center of the gap area by a slight ascent operation, thereby preventing the resin from protruding more reliably. It becomes possible.

  Furthermore, in the above alignment, as shown in FIG. 11, the observation camera 22 is used to observe the outer shape of the transparent cover 31 positioned on the upper side (FIG. 11A), and the observation camera 22 is moved downward. The XY biaxial table 13 can be controlled so that the outer shape of the substrate 35 positioned on the lower side is observed and the predetermined positional relationship is obtained. At this time, if the tilt can be controlled on the XY biaxial table 13 side or the head 34 side of the bonding mechanism 19, the parallelism between the transparent cover 31 and the substrate 35 can be adjusted.

  When the predetermined bonding is completed, as shown in FIG. 12, the head 34 of the bonding mechanism 19 is retracted upward, and a bonded body 36 integrated by bonding remains on the bonding / reverse base 15. It is. In this bonded body 36, since the resin interposed between the transparent cover 31 and the substrate 35 is in an uncured state, as shown in FIG. 13, the XY biaxial table 13 is driven for bonding / reversing. The table 14 is moved, and the bonded body 36 on the bonding / reversing base 15 is moved below the ultraviolet irradiation means 23. While using the position control by the XY biaxial table 13, the resin 37 interposed between the transparent cover 31 and the substrate 35 can be obtained by applying the ultraviolet rays 37 irradiated from the ultraviolet irradiation means 23 over the entire surface of the bonded body 36. Cured. As described above, it is sufficient that this curing reaches a so-called precure stage.

  In the series of steps described above, the planar shape of the dam applied to the transparent cover 31 is not particularly limited, but can be applied to a shape as shown in FIG. 14, for example. A dam 32 a shown in FIG. 14A is formed in a shape extending over the entire circumference of the peripheral portion of the transparent cover 31. In this case, the resin pushed out from the central portion is more reliably damped, but considering the air leakage at that time, the dam 32a having a relatively low height is preferable. On the other hand, the dam 32b shown in FIG. 14B is formed in a shape extending intermittently (intermittently) around the transparent cover 31. In this case, since air easily escapes between adjacent dams 32b, the height of the dam 32b may be relatively high. Further, by setting the position where the gap between the adjacent dams 32b is set, it is possible to intentionally set the air escape location at a specific desired position (for example, a corner portion as shown).

  Further, as shown in FIG. 15, the dam 32 and the resin 33 applied to the central portion may be applied to the same side, in particular, the opposite surface side of the transparent cover 31 (FIG. 15A). The resin 33 formed on the substrate 35 side and applied to the central portion may be applied to the opposite surface side of the transparent cover 31. In any case, as long as the positional relationship between the dam 32 and the resin 33 applied to the central portion is set to a predetermined positional relationship, the target resin layer forming ability can be obtained.

  As shown in FIG. 16, the target resin layer is formed by calculating the gap between the lower surface (opposing surface) of the transparent cover 31 facing each other and the upper surface of the substrate 35 (panel surface in the present invention) as described above. (In this embodiment, by moving the head 34 of the bonding mechanism 19 downward to the target position and pressing the transparent cover 31 toward the substrate 35), the coating is applied to the center portion. The resin 33 that has been spread is pushed and expanded toward the dam 32 formed on the periphery (FIG. 16A), and the spread resin 33 is finally blocked by the dam 32 (FIG. 16). (B)). At this time, an interface 38 tends to be formed between the resin 33 (liquid resin) that has been spread and the semi-cured resin that has formed the dam 32, but both resins are in a liquid state. And the semi-cured state, both are the same resin and both are uncured resins, so that a single resin layer in which the assimilation is natural and the interface 38 disappears is formed. Since the outer peripheral portion of the resin layer is regulated by the dam 32, the protrusion from the gap between the transparent cover 31 and the substrate 35 is prevented. In addition, in the process in which the resin 33 applied to the curved portion of the transparent resin 31 applied to the central portion of the transparent cover 31 is positioned toward the lower portion, the air smoothly flows toward the peripheral portion. As a result, the air is prevented from being caught. As a result, a target resin layer is formed which is free from air entrapment and does not protrude.

  In the present invention, as long as the semi-cured dam 32 is formed as described above, the resin can be more reliably prevented from protruding, but the dam 32 may not necessarily be formed. That is, in the present invention, the optimum target gap dimension is calculated from the weight of the coating resin, that is, the amount of the coating resin, and the actual gap is controlled to the target gap dimension, so that the amount of the coating resin is actually controlled. Therefore, the protrusion of the coating resin is reliably prevented, and the coating resin is filled in the desired form over the entire target filling area of the actually controlled gap. It will be.

  The method of manufacturing a liquid crystal component according to the present invention can be applied to any application in which a specific resin is filled in a gap between a panel surface of a liquid crystal module and a transparent cover and the both are bonded together. It is suitable for use in applications that may be seen, for example, the manufacture of liquid crystal module parts of mobile phones.

It is a block diagram which shows an example of the manufacturing method of the liquid-crystal component which concerns on one embodiment of this invention. It is a schematic perspective view which shows an example of the apparatus for enforcing the manufacturing method of the liquid-crystal component which concerns on one embodiment of this invention. It is a schematic perspective view which shows one step of the manufacturing method of the liquid-crystal component based on one embodiment of this invention using the apparatus of FIG. It is a schematic perspective view which shows the next step of FIG. It is a schematic perspective view which shows the next step of FIG. It is a schematic perspective view which shows the next step of FIG. It is a schematic perspective view which shows the next step of FIG. It is a schematic perspective view which shows the next step of FIG. It is a schematic perspective view which shows the next step of FIG. FIG. 10 is a schematic perspective view showing the next step of FIG. 9. It is a schematic partial longitudinal cross-sectional view which shows the mode of the alignment of the upper-lower bonding member in the apparatus of FIG. It is a schematic perspective view which shows the next step of FIG. It is a schematic perspective view which shows the next step of FIG. It is a top view of the bonding member which shows the example of a shape of a dam. It is a side view of the bonding member which shows the example of an application form of resin. It is sectional drawing of the bonding member which shows the mode of resin expansion.

Explanation of symbols

DESCRIPTION OF SYMBOLS 11 Liquid crystal component manufacturing apparatus 12, 13 XY biaxial table 14 Bonding / reversing table 15 Bonding / reversing base 16 Pin 17 Inverted mounting base 18 Repair stock base 19 Bonding mechanism 20, 21 Dispenser 22 Observation Camera 23 Ultraviolet irradiation means 31 Transparent covers 32, 32a, 32b Dam 33 Resin 34 applied to the center part Bonding mechanism head 35 Substrate 36 Bonded body 37 Ultraviolet 38 Interface

Claims (4)

  In a method for manufacturing a liquid crystal component in which a transparent cover is provided with a gap with respect to the panel surface of the liquid crystal module, and the resin is cured after filling the gap with the transparent resin, the liquid crystal module panel surface is bonded to the liquid crystal module and the transparent cover. And after applying a resin to be filled in the gap on at least one surface of the transparent cover facing the panel surface, weigh the total weight of the coating resin and the object to be coated, and apply the resin from the total weight. Subtracting the weight of the product to obtain the weight of the coating resin alone, and calculating the size of the gap to be controlled from the weight of the coating resin and the area to be filled with the resin in the gap, Controlling the relative position of the facing surface of the transparent cover with respect to the panel surface of the liquid crystal module based on the calculated gap size. Manufacturing method of a liquid crystal component, characterized.   The panel surface of the liquid crystal module and the panel of the transparent cover are formed by forming a dam on the periphery of at least one surface facing the panel surface of the liquid crystal module and the panel surface of the transparent cover by curing the latter half by applying the resin. After the resin is applied to the central portion of at least one surface facing the surface, the panel surface and the transparent cover face each other, and the calculated gap between the faced panel surface and the transparent cover is calculated. 2. The liquid crystal component according to claim 1, wherein the resin applied to the central portion is shrunk to a size of 1 mm, and the spread resin is dammed by the dam, and then the entire resin interposed in the gap is cured. Production method.   With the surface facing the panel surface of the transparent cover facing upward, the resin is applied to the center portion of the facing surface, the transparent cover is turned upside down, and the applied resin is lowered to the lower portion of the center portion. 3. The method of manufacturing a liquid crystal component according to claim 1, wherein the panel surface and the transparent cover face each other in such a state that the gap therebetween is reduced to the size of the calculated gap.   The method for manufacturing a liquid crystal component according to claim 1, wherein an ultraviolet curable resin is used as the transparent resin.

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