TWI466328B - Flip-chip light emitting diode and manufacturing method and application thereof - Google Patents

Description

Flip-chip luminescent diode and its preparation method and application

The present invention relates to a flip-chip light-emitting diode, a method of fabricating the same, and a package structure on a wafer board using the same, in particular, a structure that can achieve a coefficient of thermal expansion mismatch and an increase in output light rate. A crystalline light-emitting diode and a method of manufacturing the same, and a package structure on a wafer board using the same.

In 1962, Nick of General Electric Company. Nick Holonyak Jr. developed the first practical application of Light Emitting Diode (LED), and with the ever-increasing technology, various color LEDs should also be developed. . Under the premise of the pursuit of sustainable development by human beings today, the low power consumption of LEDs and the long-lasting illumination have gradually replaced the indicators used in daily life for lighting or various electrical equipment. Or use of light sources. What's more, the development of light-emitting diodes towards multi-color and high brightness has been applied to large outdoor display billboards or traffic signs.

Since the beginning of the 21st century, the electronic industry has flourished, and electronic products have become an indispensable part of life. Therefore, enterprises are mainly engaged in the development of electronic products with versatility and high-efficiency development. For a variety of electronic products. In particular, there are an increasing number of portable electronic products, and the volume and weight of electronic products are getting smaller and smaller. The volume of the road carrier board also becomes smaller. Therefore, the heat dissipation effect of the circuit carrier board becomes one of the problems worthy of attention.

In the case of a light-emitting diode wafer which is frequently used today, since the light-emitting luminance is high enough, it can be widely used in various electronic devices such as a display backlight, a small projector, and illumination. However, at present, nearly 80% of the input power of the LED is converted into thermal energy. If the carrier carrying the LED component cannot effectively dissipate heat, the temperature of the interface of the LED array is increased, in addition to affecting the luminous intensity. In addition, the heat may be accumulated in the LED chip to cause thermal expansion of the layers, which may cause damage to the structure and adversely affect the life of the product. In addition, the light excited by the LED is diffused by radiation. Not all light is scattered through the surface of the light-emitting diode, resulting in poor light output and the most effective light output rate.

Accordingly, if the heat dissipation efficiency of the light-emitting diode can be further improved and the adverse effect of the thermal expansion of the light-emitting diode is alleviated or removed, and a structural overall design is sought to enhance the light-emitting rate, the development of the overall electronics industry can be promoted. .

The main object of the present invention is to provide a flip-chip type light-emitting diode having a structural design that buffers the difference in thermal expansion coefficient and enhances the output light rate, and can continuously dissipate heat during the operation of the light-emitting diode to generate heat. Even if some of the heat is not lost in the self-luminous diode, the whole structure is thermally expanded, and the multi-layer composite structure of the diamond-like carbon/conductive material is also provided. The corresponding thermal stress can be buffered while the protection is not damaged, and the output light rate can be improved by concentrating the light beam by the insulating protective layer.

To achieve the above object, an aspect of the present invention provides a flip-chip light emitting diode comprising: a substrate having a first surface and a second surface opposite to the first surface; a semiconductor epitaxial multilayer composite The structure is disposed above the second surface of the substrate and includes a first semiconductor epitaxial layer, a second semiconductor epitaxial layer, and a blind via, wherein the first semiconductor epitaxial layer and the second semiconductor epitaxial layer Layers are stacked, and the blind holes penetrate through the second semiconductor epitaxial layer; a first electrode is disposed above the first semiconductor epitaxial layer of the semiconductor epitaxial multilayer composite structure; a first type of drilled carbon/conductive material a multilayer composite structure is filled in the blind via of the semiconductor epitaxial multilayer composite structure and overlying the first electrode, and electrically connected to the first semiconductor epitaxial layer of the semiconductor epitaxial multilayer composite structure; a second electrode located above the second semiconductor epitaxial layer of the semiconductor epitaxial multilayer composite structure; a second type of carbon/conductive material multilayer composite structure located in the semiconductor epitaxial multilayer composite a second semiconductor epitaxial layer over the second electrode and electrically connected to the semiconductor epitaxial multilayer composite structure; and an insulating protective layer covering the first semiconductor epitaxial layer of the semiconductor epitaxial multilayer composite structure a sidewall and a sidewall of the second semiconductor epitaxial layer, and an inner wall surface of the blind via to isolate contact between the first diamond-like carbon/conductive material multilayer composite structure and the second semiconductor epitaxial layer.

The above-mentioned flip-chip light-emitting diode of the present invention is electrically connected to the corresponding electrode of the N-type semiconductor epitaxial layer and the P-type semiconductor epitaxial layer in the semiconductor epitaxial multilayer composite structure, and is designed on the corresponding electrode thereof. Sputtered into a diamond Carbon/conductive material multilayer composite structure. In other words, the corresponding N-type electrode disposed on the surface of the epitaxial layer of the N-type semiconductor can deposit a metal generally as an N-type electrode, deposit a diamond-like carbon, and selectively deposit a suitable conductive material layer and a diamond-like carbon layer. According to this, a multi-layer composite structure of a diamond-like carbon/conductive material is formed to serve as an N-type composite structure corresponding to the N-type electrode. Similarly, for the P-type semiconductor epitaxial layer, the metal generally used as the P-type electrode can be deposited first, and then the diamond-like carbon can be deposited, and the applicable conductive material layer and the diamond-like carbon layer can be selectively deposited repeatedly, thereby forming a diamond-like drill. A carbon/conductive material multilayer composite structure is used as a P-type composite structure corresponding to a P-type electrode.

The insulating protective layer is a stacked structure having different refractive index materials. When the light emitting diode is supplied with current, the electrons can be excited to form light, and the light is diffused toward the surface and the side surface of the light emitting diode. The light diffusing can be enhanced by reflecting the diffused side light to the light-emitting surface of the flip-chip light-emitting diode by an insulating protective layer.

The above-mentioned diamond-like carbon/conductive material multilayer composite structure can make the flip-chip light-emitting diode of the present invention have a buffering capacity for stress caused by a difference in thermal expansion coefficient. In other words, the above-mentioned diamond-like carbon/conductive material multi-layer composite structure can accelerate the heat loss in the process of generating heat of the light-emitting diode, even if part of the heat is not lost in the self-luminous diode, and the thermal expansion of the whole structure occurs, the diamond-like drilling The carbon/conductive material multilayer composite structure can also buffer the corresponding thermal stress, and can protect the remaining components of the flip-chip light-emitting diode from damage.

In summary, the flip-chip light-emitting diode of the present invention can improve the overall output light rate and avoid the deterioration of the photoelectric characteristics of the component, thereby improving the reliability and the lifetime.

In the above flip-chip light-emitting diode of the present invention, the insulating protective layer is provided by stacking two or more different refractive index materials; wherein the different refractive index materials may be at least one selected from the group consisting of diamond-like carbon (DLC), a group consisting of titanium oxide (Ti _x O _y ), cerium oxide (SiO ₂ ), cerium nitride (SiN), gallium arsenide (GaAs), and aluminum arsenide (AlAs), wherein titanium oxide (Ti _{x )} O _y ) may be used, for example, titanium oxide (TiO), titanium dioxide (TiO ₂ ) or titanous oxide (Ti ₂ O ₃ ), etc.; in the present invention, different refractive index materials in the insulating protective layer may be periodically stacked in sequence It is provided with the characteristics of a Bragg Reflector (DBR), and the light emitted to the side of the light-emitting diode can be reflected by the insulating protective layer to the light-emitting surface of the flip-chip light-emitting diode, thereby improving the output. In addition, in the present invention, a metal protective layer may be further disposed on the outer side of the insulating protective layer, and the metal protective layer may be at least one selected from the group consisting of aluminum (Al), titanium (Ti), molybdenum (Mo), and nickel ( a group of Ni), silver (Ag), gold (Au), platinum (Pt), or an alloy thereof, and thus, by the metal The protective layer can further increase the reflectance of the light emitted from the light emitting diode to the side surface to the light emitting surface of the flip chip type light emitting diode, thereby further improving the output light rate.

Preferably, the second surface can be formed into a patterned surface by etching or development treatment, and the light-emitting diode can be effectively improved in light-emitting rate, and the polarization and the light field distribution can be controlled.

In addition, the first surface may be formed into a patterned surface or a roughened surface by etching or development treatment, and the light extraction rate of the light emitting diode may be effectively improved.

In the above flip-chip light-emitting diode of the present invention, the semiconductor epitaxial multilayer composite structure may further comprise an undoped semiconductor epitaxial layer, the undoped semiconductor epitaxial layer being sandwiched between the first semiconductor epitaxial layer Between the second surface of the substrate; therefore, the undoped semiconductor epitaxial layer acts as a buffer layer between the first semiconductor epitaxial layer and the substrate, avoiding the first semiconductor epitaxial layer and the The degree of lattice mismatch between the substrates is too large, and the epitaxial defect density is prevented from being excessively high when the first semiconductor epitaxial layer is grown, and the above-mentioned flip-chip light-emitting diode can be prevented from having electrostatic discharge and current leakage. The situation.

In the above flip-chip light-emitting diode of the present invention, the semiconductor epitaxial multilayer composite structure may selectively further comprise an active intermediate layer sandwiched between the first semiconductor epitaxial layer and the second semiconductor Lei Between the layers. In addition, the blind via hole is disposed in the flip-chip light emitting diode structure of the present invention, and the blind via penetrates through the active intermediate layer. In the present invention, the active intermediate layer may be a multiple quantum well layer for improving the efficiency of converting electrical energy into light energy in the light-emitting diode.

Preferably, the first semiconductor epitaxial layer, the first electrode, and the first diamond-like carbon/conductive material multilayer composite structure are N-type, the second semiconductor epitaxial layer, the second electrode, and the second The diamond-like carbon/conductive material multilayer composite structure is P type. Wherein, the first type of carbon/conductive material multilayer composite structure, and the second type of carbon/conductive material multilayer composite structure are optionally freely conductive At least one of a group of a material layer and a conductive carbon drill layer stack structure, a conductive material and a diamond-like carbon mixture multilayer structure, and a conductive structure and a conductive diamond-like carbon mixture multilayer structure.

The conductive material layer or the conductive material may be selected from the group consisting of indium tin oxide (ITO), aluminum zinc oxide (AZO), zinc oxide (ZnO), graphene, titanium. (Ti), aluminum (Al), chromium (Cr), nickel (Ni), platinum (Pt), molybdenum (Mo), tungsten (W), silver (Ag), platinum (Pt), and gold (Au) At least one of the group groups. In other words, the conductive material layer or the metal may be composed of an alloy or a metal mixture of the above materials. Since the diamond-like carbon has a better coefficient of thermal expansion (CTE), the multi-layer composite structure of the drilled carbon/conductive material as an electrode can be used to buffer thermal expansion when the overall light-emitting diode is thermally expanded. The stress, so the overall structure of the light-emitting diode is not easily affected, and at the same time, the heat loss of the light-emitting diode during operation can be accelerated, and the possibility that the overall structure of the light-emitting diode is damaged by heat is reduced. For example, aluminum (Al), titanium (Ti), nickel (Ni), platinum (Pt), and gold (Au) may be used as the conductive material layer and laminated with the conductive diamond-like carbon layer. A multi-layer composite structure of a carbon/conductive material of the type described in the present invention is constructed.

In the flip-chip light emitting diode of the present invention, the surface of the first type of carbon/conductive material multilayer composite structure and the surface of the second type of carbon/conductive material multilayer composite structure may form a coplanar plane; or, the first type The surface of the conductive diamond-like carbon layer of the carbon/conductive material multilayer composite structure and the surface of the conductive diamond-like carbon layer of the second type of carbon/conductive material multilayer composite structure may form a common plane; Alternatively, the surface of the first type of carbon/conductive material multilayer composite structure and the surface of the second type of carbon/conductive material multilayer composite structure may form a coplanar surface.

The flip-chip light-emitting diode of the present invention may further optionally include: a first metal solder layer on the first type of carbon/conductive material multilayer composite structure; and a second metal solder layer in the second The diamond-like carbon/conductive material multilayer composite structure, wherein a surface of the second metal solder layer forms a coplanar with a surface of the first metal solder layer. The above-mentioned flip-chip light-emitting diode of the present invention, as the name implies, is flip-chip bonded to another circuit carrier, so that the surface of the P-type electrode and the N-type electrode of the final LED is used for bonding the metal solder layer. They usually form a coplanar plane with each other.

The material of the first metal solder layer or the second metal solder layer may be selected from the group consisting of bismuth (Si), nickel (Ni), titanium (Ti), aluminum (Al), platinum (Pt), gold (Au), and tin (Sn). At least one of the group of chromium (Cr), or an alloy thereof. In other words, the first metal solder layer or the second metal solder layer may be formed using an alloy or a metal mixture of the above materials, and is selected to have a material having a high thermal diffusivity, so that the heat dissipation efficiency is improved when the flip-chip light-emitting diode is used.

The flip-chip light-emitting diode of the present invention may optionally further comprise a reflective layer sandwiched between the semiconductor epitaxial multilayer composite structure and the second electrode, and the reflective layer may be made of indium tin oxide (indium). Tin oxide, ITO), aluminum zinc oxide (AZO), zinc oxide (ZnO), graphene, aluminum, silver, nickel (Ni), cobalt (Co), palladium (Pd), platinum ( Pt), gold (Au), zinc (Zn), tin (Sn), antimony (Sb), lead (Pb), copper (Cu), copper silver (CuAg), nickel silver (NiAg), alloys thereof, or Metal mixture. The above copper silver (CuAg) and nickel silver (NiAg) Etc. refers to eutectic metal. In other words, it can also be a multi-layer metal structure, in addition to achieving the reflection effect, the effect of forming an ohmic contact can also be achieved.

Another object of the present invention is to provide a method for fabricating a flip-chip light-emitting diode by layer-depositing a conductive material layer and a diamond-like carbon layer, so that a diamond-like carbon/conductive material multilayer composite structure can be constructed as a semiconductor. a buffered thermal stress composite structure of the corresponding electrode of the epitaxial layer, thereby buffering the thermal stress caused by the difference in thermal expansion coefficient, thereby improving the heat dissipation efficiency and life of the light emitting diode; and forming a stacked structure having different reflective materials The insulating protective layer is such that the light that is originally emitted to the insulating protective layer is reflected to the light emitting surface of the flip-chip emitting diode, thereby increasing the light transmittance.

In summary, the overall output light rate of the flip-chip light-emitting diode can be improved and the photoelectric characteristics of the component can be prevented from deteriorating, thereby improving the reliability and life of the component.

Another aspect of the present invention provides a method of fabricating a flip-chip light emitting diode, comprising the steps of: providing a substrate having a first surface and a second surface opposite to the first surface; Forming a semiconductor epitaxial multilayer composite structure over the second surface, wherein the semiconductor epitaxial multilayer composite structure comprises a first semiconductor epitaxial layer and a second semiconductor epitaxial layer, wherein the first semiconductor epitaxial layer The layer is stacked on the second semiconductor epitaxial layer; a blind via is formed in the semiconductor epitaxial multilayer composite structure, wherein the blind via penetrates the second semiconductor epitaxial layer; above the second semiconductor epitaxial layer And forming a second electrode in the blind hole of the semiconductor epitaxial multilayer composite structure, and forming a first electricity a first electrode is disposed above the first semiconductor epitaxial layer of the semiconductor epitaxial multilayer composite structure; forming an insulating protective layer covering a sidewall of the first semiconductor epitaxial layer of the semiconductor epitaxial multilayer composite structure and a sidewall of the second semiconductor epitaxial layer and an inner wall surface of the blind via to isolate contact between the first electrode and the second semiconductor epitaxial layer; and the first electrode and the second electrode Forming a first type of carbon/conductive material multilayer composite structure and a second type of carbon/conductive material multilayer composite structure respectively; wherein the insulating protective layer isolates the first type of carbon/conductive material multilayer composite structure and Contact between the second semiconductor epitaxial layers.

In the above method for fabricating a flip-chip light-emitting diode according to the present invention, the insulating protective layer is provided by stacking two or more different refractive index materials; wherein the different refractive index material may be at least one selected from the group consisting of diamond-like carbon (DLC), a group consisting of titanium oxide, cerium oxide (SiO ₂ ), lanthanum nitride (SiN), gallium arsenide (GaAs), and aluminum arsenide (AlAs), among which titanium oxide (Ti _x O _y For example, titanium oxide (TiO), titanium oxide (TiO ₂ ) or titanium oxide (Ti ₂ O ₃ ) may be used; in the present invention, different refractive index materials in the insulating protective layer may be periodically stacked and arranged in sequence. It has the characteristics of a Bragg Reflector (DBR), and the light emitted to the side of the light-emitting diode can be reflected by the insulating protective layer to the light-emitting surface of the flip-chip light-emitting diode, thereby improving the output light rate. In addition, in the present invention, a metal protective layer may be further disposed on the outer side of the insulating protective layer, and the metal protective layer may be at least one selected from the group consisting of aluminum (Al), titanium (Ti), molybdenum (Mo), and nickel (Ni). a group of silver (Ag), gold (Au), platinum (Pt), or an alloy thereof, Metal protective layer, a light emitting diode but also increase the reflectivity of the surface to emit light is reflected to the side surface of the flip chip type light emitting diode, the further more to enhance the light output ratio.

In the method for fabricating the above-mentioned flip-chip type light-emitting diode of the present invention, the second surface can be formed into a patterned surface by etching or development treatment, and the light-emitting rate of the light-emitting diode can be effectively improved. And can control its polarization and light field distribution.

In the method for fabricating the above-mentioned flip-chip light-emitting diode of the present invention, the first surface can be formed into a patterned surface or a roughened surface by etching or development treatment on the first surface, and the light-emitting diode can be effectively improved. The light output rate of the body.

In the above method for fabricating a flip-chip light-emitting diode of the present invention, the semiconductor epitaxial multilayer composite structure may further comprise an undoped semiconductor epitaxial layer, the undoped semiconductor epitaxial layer being sandwiched between the first Between the semiconductor epitaxial layer and the second surface of the substrate; therefore, the undoped semiconductor epitaxial layer acts as a buffer layer between the first semiconductor epitaxial layer and the substrate, avoiding the first semiconductor The lattice mismatch between the crystal layer and the substrate is excessively large, and the epitaxial defect density is prevented from being excessively high when the first semiconductor epitaxial layer is grown, and the above-mentioned flip-chip emitting diode is prevented from being electrostatically charged. Discharge and current leakage.

In the above method for fabricating a flip-chip light-emitting diode of the present invention, the semiconductor epitaxial multilayer composite structure may selectively further comprise an active intermediate layer sandwiched between the first semiconductor epitaxial layer and the Between the second semiconductor epitaxial layers. In addition, the blind via hole is disposed in the flip-chip light emitting diode structure of the present invention, and the blind via penetrates through the active intermediate layer. In the present invention, the active intermediate layer can be a multiple quantum well layer (multiple quantum well) Layer) is used to improve the efficiency of converting electrical energy into light energy in the light-emitting diode. For example, the first semiconductor epitaxial layer, the first electrode, and the first diamond-like carbon/conductive material multilayer composite structure are N-type, the second semiconductor epitaxial layer, the second electrode, and the second type Drilling carbon/conductive material multilayer composite structure is P type.

In the above method for manufacturing a flip-chip light-emitting diode of the present invention, the first type of carbon/conductive material multilayer composite structure and the second type of carbon/conductive material multilayer composite structure are selected from a conductive material layer and a conductive material. At least one of a carbon-like drill layer stack structure, a multilayer structure of a conductive material and a diamond-like carbon mixture, and a multi-layered structure of a conductive material and a conductive diamond-like carbon mixture. The material of the conductive material or the conductive material may be selected from the group consisting of indium tin oxide (ITO), aluminum zinc oxide (AZO), zinc oxide (ZnO), graphene, and graphene. Titanium (Ti), aluminum (Al), chromium (Cr), nickel (Ni), platinum (Pt), molybdenum (Mo), tungsten (W), silver (Ag), platinum (Pt), and gold (Au) At least one of the grouped groups.

The method for fabricating the above flip-chip light-emitting diode of the present invention may further comprise the steps of: surface of the first type of carbon/conductive material multilayer composite structure and surface of the second type of carbon/conductive material multilayer composite structure Forming a coplanar plane; or, the surface of the conductive diamond-like carbon layer of the first type of carbon/conductive material multilayer composite structure forms a common plane with the surface of the conductive diamond-like carbon layer of the second type of carbon/conductive material multilayer composite structure Or, the surface of the first type of carbon/conductive material multilayer composite structure and the surface of the second type of carbon/conductive material multilayer composite structure form a common plane.

The method for fabricating the above-mentioned flip-chip light-emitting diode of the present invention may further include the following steps: on the first type of carbon/conductive material multilayer composite structure, and the second type of carbon/conductive material multilayer composite structure, Forming a first metal solder layer and a second metal solder layer, respectively, wherein a surface of the second metal solder layer and the surface of the first metal solder layer form a coplanar plane.

The material of the first metal solder layer or the second metal solder layer may be selected from the group consisting of bismuth (Si), nickel (Ni), titanium (Ti), aluminum (Al), platinum (Pt), gold (Au), and tin (Sn). At least one of the group of chromium (Cr), or an alloy thereof. In other words, the first metal solder layer or the second metal solder layer may be formed using an alloy or a metal mixture of the above materials, and is selected to have a material having a high thermal diffusivity, so that the heat dissipation efficiency is improved when the flip-chip light-emitting diode is used.

In a specific embodiment of the present invention, the method for fabricating the flip-chip light-emitting diode further includes the step of forming a reflective layer on the semiconductor epitaxial multilayer composite structure before the second electrode is formed.

In order to achieve the above object, another aspect of the present invention provides a chip on board (COB) including: a circuit carrier board; and the above-mentioned flip chip type light emitting diode of the present invention The first metal solder layer and the second metal solder layer are packaged on the circuit carrier.

In the above-mentioned wafer-on-board package structure, the circuit carrier board may comprise an insulating layer and a circuit substrate, wherein the insulating layer is made of insulating diamond-like carbon, aluminum oxide, ceramic, diamond-containing epoxy. The resin, or a composition thereof, or a metal material having a surface covered with the insulating layer, and the circuit substrate may be a metal plate, a ceramic plate or a substrate. In addition, the The surface of the circuit carrier can also optionally include a type of drilled carbon layer to increase heat dissipation.

The embodiments of the present invention are described by way of specific examples, and those skilled in the art can readily appreciate the other advantages and advantages of the present invention. The present invention may be embodied or applied in various other specific embodiments, and various modifications and changes can be made without departing from the spirit and scope of the invention.

The drawings in the embodiments of the present invention are simplified schematic diagrams. However, the drawings show only the components related to the present invention, and the components shown therein are not in actual implementation, and the number of components, the shape, and the like in actual implementation are a selective design, and the component layout thereof. The pattern may be more complicated.

Embodiment 1

1A to FIG. 1H are schematic diagrams showing the flow structure of a method for preparing a flip-chip light-emitting diode according to Embodiment 1 of the present invention. First, as shown in FIG. 1A, a substrate 20 is provided having a first surface 201 and a second surface 202 opposite to the first surface 201. Next, as shown in FIG. 2B, a semiconductor epitaxial multilayer composite structure 21 is formed over the second surface 202 of the substrate 20, wherein the semiconductor epitaxial multilayer composite structure 21 comprises an undoped semiconductor epitaxial layer 211, a first semiconductor epitaxial layer 212, an active intermediate layer 213, and a second semiconductor epitaxial layer 214, wherein the undoped semiconductor epitaxial layer 211, the first semiconductor epitaxial layer 212, the active intermediate layer 213 and the second semiconductor epitaxial layer 214 are stacked, and the undoped semiconductor epitaxial layer 211 is sandwiched between the first semiconductor epitaxial layer 212. The active intermediate layer 213 is interposed between the first semiconductor epitaxial layer 212 and the second semiconductor epitaxial layer 214. In this embodiment, the material of the semiconductor epitaxial multilayer composite structure 21 is gallium nitride (GaN), and the first semiconductor epitaxial layer 212 is N-type, and the second semiconductor epitaxial layer 214 is P-type. The undoped semiconductor epitaxial layer 211 serves as a buffer layer between the first semiconductor epitaxial layer 212 and the substrate 20 to avoid lattice mismatch between the first semiconductor epitaxial layer 21 and the substrate 20. When the degree of the epitaxial defect is too high, the epitaxial defect density is excessively high, and the electrostatic discharge and current leakage of the flip-chip emitting diode of the embodiment can be avoided. However, the material suitable for the semiconductor epitaxial multilayer composite structure of the present invention is not limited thereto, and other materials commonly used in the art may also be used. In addition, the active intermediate layer can be selected according to requirements. In the embodiment, the active intermediate layer 213 is a multi-quantum well layer for improving the efficiency of converting electrical energy into light energy in the light-emitting diode.

Referring to FIG. 1B, a reflective layer 22 is formed on the surface of the second semiconductor epitaxial layer 214 of the semiconductor epitaxial multilayer composite structure 21. In this embodiment, the reflective layer 22 may be selected from indium tin oxide (ITO), aluminum zinc oxide (AZO), zinc oxide (ZnO), graphene, aluminum, and silver. , nickel (Ni), cobalt (Co), palladium (Pd), platinum (Pt), gold (Au), zinc (Zn), tin (Sn), antimony (Sb), lead (Pb), copper (Cu) , copper and silver (CuAg), And at least one of the groups of nickel silver (NiAg), in other words, it can also be a multi-layer metal structure, in addition to achieving a reflection effect, the effect of forming an ohmic contact can also be achieved. This step of forming a reflective layer can be selectively performed as desired by those skilled in the art to which the present invention pertains. In other words, if a reflective layer is not intended to be provided, the step of forming the reflective layer 22 can be skipped without being performed.

Then, referring to FIG. 1C, a blind via 23 is formed in the semiconductor epitaxial multilayer composite structure 21, wherein the blind via 23 penetrates the second semiconductor epitaxial layer 214, and the blind via 23 abuts the first semiconductor On the epitaxial layer 212. Next, referring to FIG. 1 , a second electrode 241 is formed over the second semiconductor epitaxial layer 214 . Referring to FIG. 1E , a first electrode 251 is formed in the blind via 23 , and the first electrode 251 is located on the first semiconductor epitaxial layer 212 of the semiconductor epitaxial multilayer composite structure 21 . In this embodiment, the material of the second electrode 241 and the first electrode 251 is a chromium/gold/platinum alloy, and the second electrode 241 is a P-type, and the first electrode 251 is an N-type.

Next, referring to FIG. 1F, an insulating protective layer 26 is formed covering the sidewall of the reflective layer 22, the sidewall of the second electrode 241 is exposed to a portion of the surface of the second electrode 241, and the semiconductor epitaxial multilayer composite structure 21 is covered. a sidewall of the first semiconductor epitaxial layer 212, a sidewall of the active intermediate layer 213, a sidewall of the second semiconductor epitaxial layer 214, and an inner wall surface of the blind via 23 and exposed by the blind via 23 The surface of the first electrode 251. The insulating protective layer 26 is a stacked structure having different reflective materials (described in FIG. 2A) for protecting the first semiconductor epitaxial layer 212, the second semiconductor epitaxial layer 214, and the The side wall of the active intermediate layer 213, and isolates the The first electrode 251, the second semiconductor epitaxial layer 214, and the active intermediate layer 213 are in direct contact with another subsequently formed member.

Then, as shown in FIG. 1G, a first diamond-like carbon/conductive material multilayer composite structure 252 and a second diamond-like carbon/conductive material multilayer composite are respectively formed on the first electrode 251 and the second electrode 241. a structure 242, and the first type of drilled carbon/conductive material multilayer composite structure 252 is filled in the blind hole 23 of the inner wall surface covered with the insulating protective layer 26, and contacts the first electrode 251, so that the first type of drill The carbon/conductive material multilayer composite structure 252 forms a coplanar with the second type of carbon/conductive material multilayer composite structure 242. The first type of carbon/conductive material multilayer composite structure 252 and the second type of carbon/conductive material multilayer composite structure 242 may be selected from a conductive material layer and a conductive carbon drill layer stack structure, a conductive material and a diamond-like carbon mixture, And at least one of the group of the conductive material and the conductive diamond-like carbon mixture, wherein the conductive material layer or the conductive material is selected from the group consisting of indium tin oxide (ITO), aluminum oxide zinc ( Aluminum zinc oxide, AZO), zinc oxide (ZnO), graphene, titanium (Ti), aluminum (Al), chromium (Cr), nickel (Ni), platinum (Pt), molybdenum (Mo), tungsten At least one of the group of (W), silver (Ag), platinum (Pt), and gold (Au). In this embodiment, the first type of carbon/conductive material multilayer composite structure 252 is a titanium conductive material layer, an aluminum conductive material layer and a diamond-like carbon layer repeatedly laminated structure, and the second type of carbon/conductive material multilayer composite structure The 242 series titanium conductive material layer and the diamond-like carbon layer are repeatedly laminated.

Finally, as shown in FIG. 1H, the surface of the first type of carbon/conductive material multilayer composite structure 252 and the second type of carbon/conductive material multilayer composite structure A first metal solder layer 29 and a second metal solder layer 28 are formed on the surface of the 242, wherein the surface of the first metal solder layer 29 and the surface of the second metal solder layer 28 form a coplanar plane. In this embodiment, the first metal solder layer 29 and the second metal solder layer 28 are composed of a gold layer and a gold tin layer, and the gold tin layer is a eutectic conductive material layer.

Accordingly, as shown in FIG. 1A to FIG. 1H, the above-mentioned flip-chip light-emitting diode comprises a substrate 20 having a first surface 201 and a second surface 202 opposite to the first surface 201. a semiconductor epitaxial multilayer composite structure 21 is disposed on the second surface 202 of the substrate 20, and the semiconductor epitaxial multilayer composite structure 21 includes an undoped semiconductor epitaxial layer 211, a first semiconductor epitaxial layer 212, An active intermediate layer 213 and a second semiconductor epitaxial layer 214, wherein the undoped semiconductor epitaxial layer 211, the first semiconductor epitaxial layer 212, the active intermediate layer 213, and the second semiconductor epitaxial layer The layer 214 is stacked, and the undoped semiconductor epitaxial layer 211 is sandwiched between the first semiconductor epitaxial layer 212 and the substrate 20, and the active intermediate layer 213 is sandwiched between the first semiconductor. Between the epitaxial layer 212 and the second semiconductor epitaxial layer 214; a reflective layer 22 on the surface of the second semiconductor epitaxial layer 214 of the semiconductor epitaxial multilayer composite structure 21; a blind via 23 disposed in the semiconductor In the epitaxial multilayer composite structure 21, and through the reflective layer 22 The second semiconductor epitaxial layer 214 and the active intermediate layer 213, and the blind via 23 is resisted on the first semiconductor epitaxial layer 212; a first electrode 251, the first electrode 251 is disposed on the semiconductor stripper The blind hole 23 of the crystalline multilayer composite structure 21 is located above the first semiconductor epitaxial layer 212 of the semiconductor epitaxial multilayer composite structure 21; a first type of carbon/conductive material multilayer composite structure 252 is filled in the blind via 23 of the semiconductor epitaxial multilayer composite structure 21 and over the first electrode 251, and electrically connected to the first semiconductor epitaxial layer of the semiconductor epitaxial multilayer composite structure 21 212; a first metal solder layer 29 on the first type of carbon/conductive material multilayer composite structure 252; a second electrode 241 located in the second semiconductor epitaxial layer 214 of the semiconductor epitaxial multilayer structure 21 Upper, and electrically connected to the second semiconductor epitaxial layer 214 of the semiconductor epitaxial multilayer composite structure 21 via the reflective layer 22; a second type of carbon/conductive material multilayer composite structure 242 is located in the semiconductor epitaxial multilayer Above the second electrode 241 of the composite structure 21, and electrically connected to the second semiconductor epitaxial layer 214 of the semiconductor epitaxial multilayer composite structure 21; a second metal solder layer 28 located in the second diamond-like carbon/conducting layer a material multi-layer composite structure 242; wherein a surface of the second type of carbon/conductive material multilayer composite structure 242 forms a coplanar surface with a surface of the first type of carbon/conductive material multilayer composite structure 252, and the second metal The surface of the solder layer 28 and the surface of the first metal solder layer 29 also form a coplanar surface; and an insulating protective layer 26 that isolates the first electrode 251, the second electrode 241, the reflective layer 22, and the a sidewall of the first semiconductor epitaxial layer 212 and the second semiconductor epitaxial layer 214, and an inner wall surface of the blind via 23, and isolating the first diamond-like carbon/conductive material multilayer composite structure 252 and the second semiconductor Lei Direct contact between the layers 214.

2A and 2B are schematic views showing the side structure of the first embodiment of the present invention. 2A is a side view of the embodiment of the present invention, which is taken from the portion A taken by the dotted line in FIG. 1H, and the insulating protective layer 26 is disposed on the outer side of the semiconductor epitaxial multilayer composite structure 21, which includes a first An insulating layer 261 and a second insulating layer 262, the first insulating layer 261 and the second insulating layer 262 are stacked; wherein the materials of the first insulating layer 261 and the second insulating layer 262 are respectively Different refractive index materials may be made, and at least one of different refractive index materials may be selected from the group consisting of diamond-like carbon (DLC), titanium oxide (Ti _x O _y ), cerium oxide (SiO ₂ ), and tantalum nitride (SiN). a group of gallium arsenide (GaAs) and aluminum arsenide (AlAs); the first insulating layer 261 and the second insulating layer 262 are periodically stacked periodically to have a Bragg reflector The light emitted from the surface of the flip-chip light-emitting diode of the present embodiment can be reflected by the insulating protective layer 26 to the light-emitting surface of the flip-chip light-emitting diode, thereby improving the output light rate. In this embodiment, the material of the first insulating layer 261 is cerium oxide (SiO2, refractive index: 1.55), and the material of the second insulating layer 262 is titanium dioxide (TiO ₂ , refractive index: 2.51), and the first An insulating layer 261 and the second insulating layer 262 are alternately formed into a 14-layer stacked structure.

2B is a schematic view showing another side structure of the present embodiment, except that the insulating protective layer 26 is disposed on the outer side of the semiconductor epitaxial multilayer composite structure 21, and includes a first insulating layer 261 and a second insulating layer. A metal protective layer 27 is disposed on the outermost side of the insulating protective layer 26, and the metal protective layer 27 can be at least one selected from the group consisting of aluminum (Al), titanium (Ti), molybdenum (Mo), and nickel (Ni). a group of silver (Ag), gold (Au), platinum (Pt), or an alloy thereof, and therefore, the flip-chip light emitting diode emission of the present embodiment can be further increased by the metal protective layer 27. The light from the side is reflected to the reflectivity of the light-emitting surface of the flip-chip light-emitting diode, thereby further increasing the output light rate. In the present embodiment, the metal protective layer 27 is composed of silver (Ag, refractive index: 0.329).

Embodiment 2

Please refer to FIG. 3 , which is a schematic structural diagram of a flip-chip light-emitting diode according to Embodiment 2 of the present invention. As shown in FIG. 3 , the present embodiment is substantially the same as the flip-chip LED of the first embodiment, and includes a substrate 40 having a first surface 401 and a first surface 401 opposite to the first surface 401 . a second surface 402; a semiconductor epitaxial multilayer composite structure 41 on the second surface 402 of the substrate 40 and the semiconductor epitaxial multilayer composite structure 41 includes an undoped semiconductor epitaxial layer 411, a first semiconductor a seed layer 412, an active intermediate layer 413, and a second semiconductor epitaxial layer 414, wherein the undoped semiconductor epitaxial layer 411, the first semiconductor epitaxial layer 412, the active intermediate layer 413, and the first The two semiconductor epitaxial layers 414 are stacked, and the undoped semiconductor epitaxial layer 411 is interposed between the first semiconductor epitaxial layer 412 and the substrate 40, and the active intermediate layer 413 is interposed. Between the first semiconductor epitaxial layer 412 and the second semiconductor epitaxial layer 414; a reflective layer 42 on the surface of the second semiconductor epitaxial layer 414 of the semiconductor epitaxial multilayer composite structure 41; a blind via 43 Provided in the semiconductor epitaxial multilayer composite structure 41 And penetrating the reflective layer 42, the second semiconductor epitaxial layer 414, and the active intermediate layer 413, and the blind via 43 is resisted on the first semiconductor epitaxial layer 412; a first electrode 451, the first The electrode 451 is disposed on the blind hole 43 of the semiconductor epitaxial multilayer composite structure 41, and is located above the first semiconductor epitaxial layer 412 of the semiconductor epitaxial multilayer composite structure 41; a first type of drilled carbon/conducting The material multilayer composite structure 452 is filled in the blind via 43 of the semiconductor epitaxial multilayer composite structure 41 and covers the first electrode 451, and is electrically connected to the first of the semiconductor epitaxial multilayer composite structure 41. a semiconductor epitaxial layer 412; a first metal solder layer 49 on the first diamond-like carbon/conductive material multilayer composite structure 452; a second electrode 441 located in the second semiconductor of the semiconductor epitaxial multilayer composite structure 41 Above the epitaxial layer 414, the second semiconductor epitaxial layer 414 of the semiconductor epitaxial multilayer composite structure 41 is electrically connected via the reflective layer 42; a second type of carbon/conductive material multilayer composite structure 442 is located Above the second electrode 441 of the semiconductor epitaxial multilayer composite structure 41, and electrically connected to the second semiconductor epitaxial layer 414 of the semiconductor epitaxial multilayer composite structure 41; a second metal solder layer 48, located in the second type Drilling a carbon/conductive material multilayer composite structure 442; wherein a surface of the second type of carbon/conductive material multilayer composite structure 442 forms a coplanar surface with a surface of the first type of carbon/conductive material multilayer composite structure 452, and The surface of the second metal solder layer 48 and the surface of the first metal solder layer 49 also form a coplanar surface; and an insulating protective layer 46 for isolating the first electrode 451, the second electrode 441, and the opposite a sidewall 42, a sidewall of the first semiconductor epitaxial layer 412 and the second semiconductor epitaxial layer 414, and an inner wall surface of the blind via 43 and isolating the first diamond-like carbon/conductive material multilayer composite structure 452 from In the first embodiment, the first surface 401 of the substrate 40 can be roughened by an etching process. The surface, on the other hand, the second surface 402 of the substrate 40 can form a patterned surface by a lithography, thereby effectively improving the light-emitting rate of the flip-chip light-emitting diode of the present invention, and can control the implementation. For example, the flip-chip light-emitting diode is polarized and the light field is distributed.

Embodiment 3

Referring to FIG. 4, it is a schematic structural view of a package structure on a wafer board of the present embodiment. As shown in FIG. 4, the package structure on the wafer board includes: a circuit carrier board 6; and the flip chip type light emitting diode 2 obtained in the first embodiment, through the first metal solder layer 29 and the first The two-metal soldering layer 28 is electrically connected to the circuit carrier board 6. The circuit carrier board 6 includes an insulating layer 61, a circuit board 60, and an electrical connection pad 63. The material of the insulating layer 61 can be selected from diamond-like carbon. The aluminum oxide, the ceramic, the diamond-containing epoxy resin, or a mixture of the above materials, the circuit substrate 60 is a metal plate, a ceramic plate or a substrate.

In the package structure of the wafer board, the first metal solder layer 29 and the second metal solder layer 28 and the circuit carrier 6 can be formed by soldering through the solder 62 formed on the surface of the electrical connection pad 63. The electrical connection pads 63 are electrically connected.

Embodiment 4

Referring to FIG. 5, it is a schematic structural view of a package structure on a wafer board of the present embodiment. As shown in FIG. 5, the package structure on the wafer board includes: a circuit carrier 6; and the flip chip type light emitting diode 4 obtained in the second embodiment, through the first metal solder layer 49 and the first The second metal soldering layer 48 is electrically connected to the circuit carrier board 6. The circuit carrier board 6 includes an insulating layer 61, a circuit board 60, and an electrical connection pad 63. The insulating layer 61 is made of a diamond-like carbon. The aluminum oxide, the ceramic, the diamond-containing epoxy resin, or a mixture of the above materials, the circuit substrate 60 is a metal plate, a ceramic plate or a substrate.

In the package structure of the wafer board, the first metal solder layer 49 and the second metal solder layer 48 and the circuit carrier 6 can be formed by soldering through the solder 62 formed on the surface of the electrical connection pad 63. The electrical connection pads 63 are electrically connected.

In summary, the flip-chip light-emitting diode of the present invention has a structural thermal expansion mismatch and a concentrated light-emitting structure design, and can continuously heat the heat generated by the light-emitting diode. Lost. Even if some of the heat is not dissipated in the self-luminous diode to promote thermal expansion of the overall structure, the multi-layer composite structure of the diamond-like carbon/conductive material disposed therein can buffer the corresponding thermal stress, and the protection is not damaged, and the beam can be concentrated. Glow out the light and increase the light rate.

The above-mentioned embodiments are merely examples for convenience of description, and the scope of the claims is intended to be limited to the above embodiments.

2, 4‧‧‧ flip-chip light-emitting diode

20, 40‧‧‧ substrate

201, 401‧‧‧ first surface

202, 402‧‧‧ second surface

21, 41‧‧‧Semiconductor epitaxial multilayer composite structure

211, 411‧‧‧ undoped semiconductor epitaxial layer

212, 412‧‧‧ first semiconductor epitaxial layer

213, 413‧‧‧ active intermediate layer

214, 414‧‧‧Second semiconductor epitaxial layer

22, 42‧‧‧reflective layer

23, 43‧‧ ‧ blind holes

2411, 441‧‧‧ second electrode

242, 442‧‧‧Second type of carbon/conductive material multilayer composite structure

251, ‧‧‧‧first electrode

252, 452‧‧‧First class of carbon/conductive material multilayer composite structures

26, 46‧‧‧Insulating protective layer

261‧‧‧First insulation

262‧‧‧Second insulation

27‧‧‧Metal protective layer

28, 48‧‧‧Second metal welding layer

29, 49‧‧‧First metal welding layer

6‧‧‧Circuit carrier board

60‧‧‧ circuit board

61‧‧‧Insulation

62‧‧‧ solder

63‧‧‧Electric mat

1A to FIG. 1H are schematic structural diagrams showing a method for preparing a flip-chip light-emitting diode according to Embodiment 1 of the present invention.

2A and 2B are schematic views showing the side structure of the first embodiment of the present invention.

3 is a schematic structural view of a flip-chip type light emitting diode according to Embodiment 2 of the present invention.

4 is a schematic view showing the structure of a package structure on a wafer board in the first embodiment of the present invention.

FIG. 5 is a schematic structural view showing a package structure on a wafer board according to Embodiment 2 of the present invention.

2‧‧‧Flip-chip light-emitting diode

20‧‧‧Substrate

201‧‧‧ first surface

202‧‧‧ second surface

21‧‧‧Semiconductor epitaxial multilayer composite structure

211‧‧‧ Undoped semiconductor epitaxial layer

212‧‧‧First semiconductor epitaxial layer

213‧‧‧Active intermediate layer

214‧‧‧Second semiconductor epitaxial layer

22‧‧‧reflective layer

23‧‧‧Blind holes

241‧‧‧second electrode

242‧‧‧Second type of carbon/conductive material multilayer composite structure

251‧‧‧First electrode

252‧‧‧First class of carbon/conductive material multilayer composite structure

26‧‧‧Insulation protection layer

28‧‧‧Second metal soldering layer

29‧‧‧First metal soldering layer

Claims (34)

A flip-chip light emitting diode comprising: a substrate having a first surface and a second surface opposite to the first surface; a semiconductor epitaxial multilayer composite structure over the second surface of the substrate And including a first semiconductor epitaxial layer, a second semiconductor epitaxial layer, and a blind via, wherein the first semiconductor epitaxial layer and the second semiconductor epitaxial layer are stacked, and the blind via extends through the a semiconductor epitaxial layer; a first electrode located above the first semiconductor epitaxial layer of the semiconductor epitaxial multilayer composite structure; a first type of carbon/conductive material multilayer composite structure filled with the semiconductor epitaxial multilayer The blind hole of the composite structure covers the first electrode and is electrically connected to the first semiconductor epitaxial layer of the semiconductor epitaxial multilayer composite structure; and a second electrode is disposed on the semiconductor epitaxial multilayer composite structure Above the second semiconductor epitaxial layer; a second type of carbon/conductive material multilayer composite structure, located above the second electrode of the semiconductor epitaxial multilayer composite structure, and electrically connected to the a second semiconductor epitaxial layer of the conductor epitaxial multilayer composite structure; and an insulating protective layer covering sidewalls of the first semiconductor epitaxial layer and sidewalls of the second semiconductor epitaxial layer of the semiconductor epitaxial multilayer composite structure And an inner wall surface of the blind hole to isolate the contact between the first type of carbon/conductive material multilayer composite structure and the second semiconductor epitaxial layer; Wherein, further comprising a metal protective layer disposed on the outer side of the insulating protective layer. The flip-chip light-emitting diode according to claim 1, wherein the insulating protective layer is provided by stacking two or more different refractive index materials. The flip-chip light-emitting diode according to claim 2, wherein the different refractive index material is at least one selected from the group consisting of insulated carbon (Isolated DLC), titanium oxide (Ti _x O _y ), and dioxide. A group consisting of yttrium (SiO2), gallium arsenide (GaAs), and aluminum arsenide (AlAs). The flip-chip light-emitting diode according to claim 1, wherein the metal protective layer is at least one selected from the group consisting of aluminum (Al), titanium (Ti), molybdenum (Mo), nickel (Ni), and silver. A group consisting of (Ag), gold (Au), platinum (Pt), or an alloy thereof. The flip-chip light-emitting diode according to claim 1, wherein the second surface is a patterned surface. The flip-chip light-emitting diode according to claim 1, wherein the first surface is a patterned surface or a roughened surface. The flip-chip light-emitting diode of claim 1, wherein the semiconductor epitaxial multilayer composite further comprises an undoped semiconductor epitaxial layer, the undoped semiconductor epitaxial layer is interposed The first semiconductor epitaxial layer is between the second surface of the substrate. The flip-chip light-emitting diode according to claim 1, wherein the semiconductor epitaxial multilayer composite structure further comprises an active intermediate layer sandwiched between the first semiconductor epitaxial layer and Between the second semiconductor epitaxial layers. The flip-chip light emitting diode according to claim 1, wherein the first type of carbon/conductive material multilayer composite structure and the second type of carbon/conductive material multilayer composite structure are selected from conductive At least one of a group of a material layer and a conductive carbon drill layer stack structure, a conductive material and a diamond-like carbon mixture multilayer structure, and a conductive structure and a conductive diamond-like carbon mixture multilayer structure. The flip-chip light-emitting diode according to claim 8, wherein the conductive material layer or the conductive material is selected from the group consisting of indium tin oxide (ITO) and aluminum zinc oxide (aluminum). Zinc oxide, AZO), zinc oxide (ZnO), graphene, titanium (Ti), aluminum (Al), chromium (Cr), nickel (Ni), platinum (Pt), molybdenum (Mo), tungsten ( At least one of the group of W), silver (Ag), and gold (Au). The flip-chip light-emitting diode according to claim 1, wherein the surface of the first type of carbon/conductive material multilayer composite structure and the surface structure of the second type of carbon/conductive material multilayer composite structure Form a common plane. The flip-chip light-emitting diode according to claim 1, further comprising: a first metal solder layer on the first type of carbon/conductive material multilayer composite structure; and a second metal solder layer The second metal-welded layer has a surface that is coplanar with the surface of the first metal solder layer. The flip-chip light-emitting diode according to claim 12, wherein the material of the first metal solder layer or the second metal solder layer is selected from At least one of the group consisting of nickel (Ni), titanium (Ti), aluminum (Al), platinum (Pt), gold (Au), and chromium (Cr). The flip-chip light-emitting diode according to claim 1, further comprising a reflective layer sandwiched between the semiconductor epitaxial multilayer composite structure and the second electrode. The flip-chip light-emitting diode according to claim 1, wherein the first semiconductor epitaxial layer, the first electrode, and the first diamond-like carbon/conductive material multilayer composite structure are N-type, The second semiconductor epitaxial layer, the second electrode, and the second diamond-like carbon/conductive material multilayer composite structure are P-type. A method for fabricating a flip-chip light-emitting diode, comprising the steps of: providing a substrate having a first surface and a second surface opposite to the first surface; forming a semiconductor over the second surface of the substrate The epitaxial multilayer composite structure, wherein the semiconductor epitaxial multilayer composite structure comprises a first semiconductor epitaxial layer and a second semiconductor epitaxial layer, wherein the first semiconductor epitaxial layer and the second semiconductor epitaxial layer a layered arrangement; a blind via is formed in the semiconductor epitaxial multilayer composite structure, wherein the blind via penetrates the second semiconductor epitaxial layer; above the second semiconductor epitaxial layer, and the semiconductor epitaxial multilayer composite structure Forming a second electrode in the blind hole, and forming a first electrode, and the first electrode is located above the first semiconductor epitaxial layer of the semiconductor epitaxial multilayer composite structure; Forming an insulating protective layer covering sidewalls of the first semiconductor epitaxial layer of the semiconductor epitaxial multilayer composite structure and sidewalls of the second semiconductor epitaxial layer, and an inner wall surface of the blind via; and a first diamond-like carbon/conductive material multilayer composite structure and a second diamond-like carbon/conductive material multilayer composite structure are respectively formed on the electrode and the second electrode; wherein the insulating protective layer isolates the first diamond-like carbon Contact between the multilayer composite structure of conductive material and the second semiconductor epitaxial layer. The method for manufacturing a flip-chip light-emitting diode according to claim 16, wherein the insulating protective layer is provided by stacking two or more different refractive index materials. The method for manufacturing a flip-chip light-emitting diode according to claim 17, wherein the different refractive index material is at least one selected from the group consisting of insulated diamond (Isolated DLC) and titanium oxide (Ti _x O _y ). a group consisting of cerium oxide (SiO2), gallium arsenide (GaAs), and aluminum arsenide (AlAs). The method for manufacturing a flip-chip type light-emitting diode according to claim 16, further comprising providing a metal protective layer on the outer side of the insulating protective layer. The method for manufacturing a flip-chip light-emitting diode according to claim 19, wherein the metal protective layer is at least one selected from the group consisting of aluminum (Al), titanium (Ti), molybdenum (Mo), and nickel (Ni). ), a group of silver (Ag), gold (Au), platinum (Pt), or an alloy thereof. The method for fabricating a flip-chip type light emitting diode according to claim 16, wherein the second surface of the substrate is formed by etching or development to form a patterned surface. The method of manufacturing a flip-chip type light emitting diode according to claim 16, wherein the first surface of the substrate is formed by etching or development to form a patterned surface or a first surface. Roughened surface. The method for fabricating a flip-chip light-emitting diode according to claim 16, wherein the semiconductor epitaxial multilayer composite further comprises an undoped semiconductor epitaxial layer, the undoped semiconductor epitaxial layer Sandwiched between the first semiconductor epitaxial layer and the second surface of the substrate. The method for fabricating a flip-chip light-emitting diode according to claim 16, wherein the semiconductor epitaxial multilayer composite structure further comprises an active intermediate layer, the active intermediate layer being sandwiched between the first semiconductor beam Between the crystal layer and the second semiconductor epitaxial layer. The method for manufacturing a flip-chip light-emitting diode according to claim 16, wherein the first type of carbon/conductive material multilayer composite structure, and the second type of carbon/conductive material multilayer composite structure The at least one of the group of the conductive material layer and the conductive carbon-drill layer stack structure, the conductive material and the diamond-like carbon mixture multilayer structure, and the conductive material and the conductive diamond-like carbon mixture multilayer structure are selected. The method for manufacturing a flip-chip light-emitting diode according to claim 25, wherein the conductive material layer or the conductive material is selected from the group consisting of indium tin oxide (ITO) and aluminum oxide. Aluminum zinc oxide (AZO), zinc oxide (ZnO), graphene (graphene), titanium (Ti), aluminum (Al), chromium (Cr), nickel (Ni), platinum (Pt), molybdenum (Mo), tungsten (W), silver (Ag), and gold (Au) At least one of the group groups. The method for manufacturing a flip-chip type light emitting diode according to claim 16, wherein the surface of the first type of carbon/conductive material multilayer composite structure and the second type of carbon/conductive material multilayer composite structure The surface forms a coplanar plane. The method for manufacturing a flip-chip light-emitting diode according to claim 16, further comprising the steps of: drilling a carbon/conductive material multilayer composite structure of the first type, and drilling a carbon/conductive material of the second type A first metal solder layer and a second metal solder layer are respectively formed on the multi-layer composite structure, wherein a surface of the second metal solder layer and the surface of the first metal solder layer form a coplanar plane. The method for manufacturing a flip-chip type light emitting diode according to claim 28, wherein the material of the first metal solder layer or the second metal solder layer is selected from the group consisting of nickel (Ni) and titanium (Ti). At least one of the group consisting of aluminum (Al), platinum (Pt), gold (Au), and chromium (Cr). The method for manufacturing a flip-chip type light-emitting diode according to claim 16, further comprising the step of forming a reflective layer on the semiconductor epitaxial multilayer composite structure before the second electrode is formed. The method for manufacturing a flip-chip light-emitting diode according to claim 16, wherein the first semiconductor epitaxial layer, the first electrode, and the first diamond-like carbon/conductive material multilayer composite structure N Type, the second half The conductor epitaxial layer, the second electrode, and the second diamond-like carbon/conductive material multilayer composite structure are P-type. A chip on board (COB), comprising: a circuit carrier board; and a flip chip type light emitting diode according to any one of claims 1 to 15, wherein The circuit carrier is packaged via the first metal solder layer and the second metal solder layer. The package structure on a wafer-on-board according to claim 32, wherein the circuit carrier comprises an insulating layer and a circuit substrate 60, the material of the insulating layer is selected from the group consisting of diamond-like carbon, alumina, ceramic And at least one of the groups of diamond-containing epoxy resins. The package structure on a wafer-on-board according to claim 32, wherein the circuit substrate is a metal plate, a ceramic plate or a substrate.