TWI462210B - Substrate processing apparatus and method of providing processing solution - Google Patents
Substrate processing apparatus and method of providing processing solution Download PDFInfo
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- TWI462210B TWI462210B TW101113401A TW101113401A TWI462210B TW I462210 B TWI462210 B TW I462210B TW 101113401 A TW101113401 A TW 101113401A TW 101113401 A TW101113401 A TW 101113401A TW I462210 B TWI462210 B TW I462210B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
- B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
- B05C11/1005—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves responsive to condition of liquid or other fluent material already applied to the surface, e.g. coating thickness, weight or pattern
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/26—Processes for applying liquids or other fluent materials performed by applying the liquid or other fluent material from an outlet device in contact with, or almost in contact with, the surface
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/02623—Liquid deposition
- H01L21/02628—Liquid deposition using solutions
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- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Coating Apparatus (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Spray Control Apparatus (AREA)
Description
本發明係關於一種保持半導體晶圓、液晶顯示裝置用玻璃基板、PDP(Plasma Display Panel，電漿顯示面板)用玻璃基板、有機EL(Electro-Luminescence，電致發光)顯示面板用玻璃基板、太陽電池用基板、磁碟或光碟用玻璃或陶瓷基板等各種被處理基板上所塗佈之處理液之流量的固定性之技術。The present invention relates to a glass substrate for holding a semiconductor wafer, a liquid crystal display device, a glass substrate for a PDP (Plasma Display Panel), a glass substrate for an organic EL (Electro-Luminescence) display panel, and a solar cell. A technique for fixing the flow rate of a treatment liquid applied to various substrates to be processed, such as a substrate for a battery, a disk, or a glass for a disc or a ceramic substrate.
已知有一種技術，吐出噴嘴一面掃描於表面形成有間隔壁之排列之基板之表面，一面塗佈如有機EL般之像素形成材料作為塗佈液。於該情形時，具有可撓性之配管係連接於進行掃描移動之吐出噴嘴，流過配管之塗佈液係自吐出噴嘴吐出。There is known a technique in which a discharge nozzle is applied to a surface of a substrate on which a partition wall is formed on one surface, and a pixel forming material such as an organic EL is applied as a coating liquid. In this case, the flexible piping is connected to the discharge nozzle for scanning movement, and the coating liquid flowing through the piping is discharged from the discharge nozzle.
作為此種技術，例如，於專利文獻1中揭示有一種塗佈裝置，其包含：導引部，其沿主掃描方向延伸；滑件，其於與導引部之間介有空氣層之狀態下由導引部以沿主掃描方向可移動地支持；噴嘴，其由滑件支持，並吐出塗佈液；及配管支持構件，其支持連接於滑件及噴嘴上之配管之中途部分。As such a technique, for example, Patent Document 1 discloses a coating apparatus including: a guiding portion that extends in a main scanning direction; and a slider that is in an air layer state with the guiding portion The lower portion is movably supported in the main scanning direction by the guide portion; the nozzle is supported by the slider and discharges the coating liquid; and the pipe supporting member supports the portion of the pipe connected to the slider and the nozzle.
又，於專利文獻2中揭示有一種塗佈裝置，其包含卡合於導引部並沿主掃描方向可移動地支持之滑件、及由滑件支持之噴嘴，且構成為向滑件及噴嘴導引流體之複數個配管係夾持導引部之軸而分別於兩側固定於噴嘴及滑件上。Further, Patent Document 2 discloses a coating device including a slider that is engaged with a guide portion and movably supported in a main scanning direction, and a nozzle supported by the slider, and configured to move the slider and The plurality of pipings of the nozzle guiding fluid are clamped to the shaft of the guiding portion and are respectively fixed to the nozzle and the sliding member on both sides.
[專利文獻1]日本專利特開2011-072974號公報[Patent Document 1] Japanese Patent Laid-Open No. 2011-072974
[專利文獻2]日本專利特開2011-072975號公報[Patent Document 2] Japanese Patent Laid-Open No. 2011-072975
然而，由於專利文獻1或專利文獻2中所揭示之該等配管係具有可撓性，因此藉由滑件之移動或振動而導致於配管之一部分易發生扭曲等變形。由於根據變形後之配管之形狀，於滑件之掃描移動時塗佈液在配管內會流向與本來之流動方向相反之方向，因此有時自吐出噴嘴吐出之塗佈液之流量會變動。However, since the pipings disclosed in Patent Document 1 or Patent Document 2 have flexibility, deformation of one of the pipes is likely to occur due to movement or vibration of the slider. Since the coating liquid flows in the pipe in the opposite direction to the original flow direction during the scanning movement of the slider according to the shape of the pipe after the deformation, the flow rate of the coating liquid discharged from the discharge nozzle may fluctuate.
本發明係鑒於上述問題而完成者，目的在於提供一種可抑制自移動之噴嘴吐出之處理液之流量的變動之技術。The present invention has been made in view of the above problems, and an object thereof is to provide a technique capable of suppressing fluctuations in a flow rate of a processing liquid discharged from a moving nozzle.
第1發明係一種基板處理裝置，其包括：基板保持部，其大致水平地保持基板；主掃描機構，其包含沿相對於上述基板大致平行之主掃描方向延伸之導引部、及由上述導引部以沿上述主掃描方向可移動地支持之移動部；吐出部，其由上述移動部以沿上述主掃描方向可移動地支持，並向上述基板吐出處理液；可撓性配管，其連接於上述吐出部並且向上述吐出部導引處理液；及可動配管支持部，其支持上述配管之中途之部分，且其朝向係追隨藉由主掃描之反覆進行引起之上述移動部之週期性之動作而週期性 地變化。A substrate processing apparatus includes: a substrate holding portion that holds a substrate substantially horizontally; a main scanning mechanism that includes a guiding portion that extends in a main scanning direction substantially parallel to the substrate, and the guiding portion The guiding portion is a moving portion movably supported in the main scanning direction; the discharging portion is movably supported by the moving portion in the main scanning direction, and discharges the processing liquid to the substrate; and the flexible pipe is connected And the movable pipe support portion supports the portion of the middle of the pipe in the discharge portion, and the orientation thereof follows the periodicity of the moving portion caused by the reverse of the main scan. Periodically Change in place.
第2發明係如第1發明之基板處理裝置，其中上述配管之中利用上述可動配管支持部之支持部位、與向上述吐出部之連接部位之間之區間係於鉛垂面內形成為拱形狀。According to a second aspect of the invention, in the substrate processing apparatus of the first aspect of the invention, the portion between the support portion of the movable pipe support portion and the connection portion to the discharge portion is formed in an arch shape in a vertical plane. .
第3發明係如第2發明之基板處理裝置，其中上述配管之上述區間係成為向上凸起之拱形狀。According to a third aspect of the invention, in the substrate processing apparatus of the second aspect of the invention, the section of the pipe is an upwardly convex arch shape.
第4發明係如第1發明之基板處理裝置，其進而包括輔助掃描機構，該輔助掃描機構包含沿上述導引部延伸之輔助導引部、及由上述輔助導引部以沿上述主掃描方向可移動地支持之輔助移動部；上述配管之中利用上述可動配管支持部之支持部位、與向上述吐出部之連接部位之間之特定部分係由上述輔助移動部支持。According to a fourth aspect of the invention, in the substrate processing apparatus of the first aspect of the invention, the auxiliary scanning mechanism includes an auxiliary guiding portion extending along the guiding portion, and the auxiliary guiding portion is along the main scanning direction The auxiliary moving unit that is movably supported; wherein the specific portion between the support portion of the movable pipe support portion and the connection portion to the discharge portion among the pipes is supported by the auxiliary moving portion.
第5發明係如第4發明之基板處理裝置，其特徵在於上述可動配管支持部係連結於上述輔助移動部上。According to a fourth aspect of the invention, in the substrate processing apparatus of the fourth aspect of the invention, the movable pipe supporting portion is coupled to the auxiliary moving portion.
第6發明係如第4發明之基板處理裝置，其中上述配管之中利用上述可動配管支持部之支持部位、與向上述輔助移動部之連接部位之間之區間係於鉛垂面內形成為拱形狀。According to a sixth aspect of the invention, in the substrate processing apparatus of the fourth aspect of the present invention, the portion between the support portion of the movable pipe support portion and the connection portion to the auxiliary moving portion is formed in the vertical plane as an arch. shape.
第7發明係如第4發明之基板處理裝置，其特徵在於上述主掃描機構較上述輔助掃描機構配置於更下方。According to a seventh aspect of the invention, in the substrate processing apparatus of the fourth aspect of the invention, the main scanning mechanism is disposed further below the auxiliary scanning mechanism.
第8發明係如第1發明至第7發明中任一發明之基板處理裝置，其進而包含調節上述可動配管支持部之朝向之驅動部。The substrate processing apparatus according to any one of the first to seventh aspects of the invention, further comprising a driving unit that adjusts an orientation of the movable pipe supporting portion.
第9發明係一種處理液賦予方法，其包含如下步驟：大致水平地保持基板；一面自吐出部吐出處理液，一面使支 持上述吐出部之移動部沿主掃描方向在基板上週期性地進行掃描移動；使支持向上述吐出部導引上述處理液之可撓性配管之中途部分的可動配管支持部之朝向追隨進行掃描移動之上述移動部而週期性地變化。According to a ninth aspect of the invention, there is provided a method of providing a treatment liquid, comprising the steps of: holding a substrate substantially horizontally; and discharging a treatment liquid from a discharge portion while making a branch The moving portion that holds the discharge portion periodically scans on the substrate in the main scanning direction, and scans the direction of the movable pipe support portion that supports the middle portion of the flexible pipe that guides the processing liquid to the discharge portion. The moving portion is moved to change periodically.
於第1發明至第9發明中，可動配管支持部係支持配管之中途之部分，且其朝向追隨移動部之週期性動作而週期性地變化。因此，即便移動部移動，可動配管支持部之朝向亦追隨其而變化，故而可抑制於由可動配管支持部支持之配管之部分中發生扭曲。其結果為，可抑制自吐出部吐出之處理液之流量之變動。In the first to ninth inventions, the movable pipe support portion supports a portion of the pipe, and periodically changes toward the periodic operation following the moving portion. Therefore, even if the moving portion moves, the orientation of the movable pipe support portion changes in accordance with this, and therefore, it is possible to suppress the occurrence of distortion in the portion of the pipe supported by the movable pipe support portion. As a result, it is possible to suppress fluctuations in the flow rate of the treatment liquid discharged from the discharge portion.
尤其係，於第2發明中，利用可動配管支持部之支持部位、與向吐出部之連接部位之間之區間係於鉛垂面內形成為拱形狀。因此配管變長，故而配管之失控或搖晃係由整個配管平滑化，從而可使其影響變小。藉此，可抑制自吐出部吐出之處理液之流量之變動。In the second aspect of the invention, the section between the support portion of the movable pipe support portion and the connection portion to the discharge portion is formed in an arch shape in the vertical plane. Therefore, the piping becomes long, and the out-of-control or shaking of the piping is smoothed by the entire piping, so that the influence thereof can be made small. Thereby, fluctuations in the flow rate of the treatment liquid discharged from the discharge portion can be suppressed.
尤其係，於第3發明中，配管之區間係成為向上凸起之拱形狀。因此，自連接於主掃描機構之吐出部延伸出之配管之末端向上方上升，故而即便移動部移動，亦難以於處理液在配管內逆流之方向上產生力。藉此，可抑制自吐出部吐出之處理液之流量變動。In particular, in the third aspect of the invention, the interval of the piping is an upwardly convex arch shape. Therefore, since the end of the pipe extending from the discharge portion connected to the main scanning mechanism rises upward, even if the moving portion moves, it is difficult to generate a force in the direction in which the treatment liquid flows back in the pipe. Thereby, it is possible to suppress the flow rate fluctuation of the treatment liquid discharged from the discharge portion.
尤其係，於第4發明中，利用可動配管支持部之支持部位、與向吐出部之連接部位之間之特定部分係由輔助移動部支持。因此，即便發生配管之搖晃或失控亦難以向吐出 部傳遞，因而可抑制自吐出部吐出之塗佈液之流量之變動。In particular, in the fourth aspect of the invention, the specific portion between the support portion of the movable pipe support portion and the connection portion to the discharge portion is supported by the auxiliary moving portion. Therefore, it is difficult to spit out even if the piping is shaken or out of control. Since the part is transferred, it is possible to suppress the fluctuation of the flow rate of the coating liquid discharged from the discharge portion.
尤其係，於第5發明中，可動配管支持部係連結於輔助移動部。因此，藉由輔助移動部之驅動，可確實地使可動配管支持部之朝向變化。In particular, in the fifth aspect of the invention, the movable pipe support portion is coupled to the auxiliary moving portion. Therefore, the direction of the movable pipe support portion can be surely changed by the driving of the auxiliary moving portion.
尤其係，於第6發明中，利用可動配管支持部之支持部位、與向吐出部之連接部位之間之區間係於鉛垂面內形成為拱形狀。因此，配管變長，故而配管之失控或搖晃係由整個配管平滑化，從而可使其影響變小。In the sixth aspect of the invention, the section between the support portion of the movable pipe support portion and the connection portion to the discharge portion is formed in an arch shape in the vertical plane. Therefore, since the piping becomes long, the uncontrolled or swaying of the piping is smoothed by the entire piping, so that the influence can be made small.
尤其係，於第7發明中，主掃描機構較輔助掃描機構配置於更下方。因此，連接於吐出部之配管之末端易於維持向上方上升之狀態。因此，即便移動部移動，亦難以於處理液逆流之方向上產生力，故而可抑制處理液之流量之變動。In particular, in the seventh aspect of the invention, the main scanning mechanism is disposed below the auxiliary scanning mechanism. Therefore, the end of the pipe connected to the discharge portion is likely to maintain a state of rising upward. Therefore, even if the moving portion moves, it is difficult to generate a force in the direction in which the processing liquid flows backward, so that fluctuations in the flow rate of the processing liquid can be suppressed.
尤其係，於第8發明中，藉由調節可動配管支持部之方向之驅動部，可動配管支持部係確實地追隨移動部而調節其朝向。In particular, in the eighth aspect of the invention, the movable pipe supporting portion reliably follows the moving portion by adjusting the driving portion in the direction of the movable pipe supporting portion.
以下，一面參照隨附圖式，一面說明本發明之實施形態。以下之實施形態係將本發明具體化之一例，而非限定本發明之技術性範圍之示例。Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. The following embodiments are illustrative of the invention and are not intended to limit the scope of the technical scope of the invention.
圖1係表示本實施形態之基板處理裝置20之概略平面圖。圖2係表示基板處理裝置20之概略前視圖。圖3係圖2所示之基板處理裝置20之I-I線概略剖面圖。又，圖4係概 略地記載基板處理裝置20之主要部分之配置關係之概略立體圖。Fig. 1 is a schematic plan view showing a substrate processing apparatus 20 of the present embodiment. FIG. 2 is a schematic front view showing the substrate processing apparatus 20. 3 is a schematic cross-sectional view taken along line I-I of the substrate processing apparatus 20 shown in FIG. 2. Also, Figure 4 is a summary A schematic perspective view of the arrangement relationship of the main parts of the substrate processing apparatus 20 is slightly described.
再者，於以下之說明中，表示方向及朝向時，適宜使用圖中所示之XYZ正交座標。此處，X軸及Y軸方向係表示水平方向，Z軸方向係表示鉛垂方向(+Z側為上側、-Z側為下側)。又，為便於說明，將Y軸方向設為基板之搬送方向(+Y側為下游側、-Y側為上游側)，將X軸方向設為移動部之主掃描方向(+X側、-X側)。In the following description, when indicating the direction and orientation, the XYZ orthogonal coordinates shown in the drawing are preferably used. Here, the X-axis and Y-axis directions indicate the horizontal direction, and the Z-axis direction indicates the vertical direction (the +Z side is the upper side and the -Z side is the lower side). Moreover, for convenience of explanation, the Y-axis direction is referred to as the substrate transport direction (the +Y side is the downstream side and the -Y side is the upstream side), and the X-axis direction is the main scanning direction of the moving portion (+X side, - X side).
基板處理裝置20係相對於基板200塗佈塗佈液作為處理液之裝置。作為基板200，可想到方形之基板，例如平面顯示裝置用玻璃基板等。又，作為塗佈液，可想到能形成於基板200上之圖案等之形成材料，例如於想到有機EL顯示裝置之製造之情形時，可想到包含有機EL材料及其溶劑等之液體等。The substrate processing apparatus 20 is a device that applies a coating liquid as a processing liquid to the substrate 200. As the substrate 200, a square substrate, for example, a glass substrate for a flat display device or the like is conceivable. In addition, as a coating liquid, a material for forming a pattern or the like on the substrate 200 is conceivable. For example, when a production of an organic EL display device is considered, a liquid containing an organic EL material, a solvent thereof, or the like is conceivable.
該基板處理裝置20係主要包括：保持基板200之基板保持部30、主掃描機構40、吐出塗佈液之吐出部50、輔助掃描機構60、及支持包含可撓性樹脂管等之塗佈液配管80b之可動配管支持部100。The substrate processing apparatus 20 mainly includes a substrate holding unit 30 for holding the substrate 200, a main scanning unit 40, a discharge unit 50 for discharging a coating liquid, an auxiliary scanning unit 60, and a coating liquid for supporting a flexible resin tube or the like. The movable pipe support portion 100 of the pipe 80b.
基板保持部30構成為能夠以大致水平姿勢保持基板200。此處，基板保持部30係包含載台32，其於特定高度位置且以朝上大致水平姿勢配設其主表面。並且，以使基板200之主表面抵接於載台32之朝上主表面之方式將基板200載置於載台32上，藉此構成為基板200能夠以固定位置及姿勢被保持。除此以外，基板保持部亦可構成為藉由固 持基板周圍而保持該基板。The substrate holding portion 30 is configured to be able to hold the substrate 200 in a substantially horizontal posture. Here, the substrate holding portion 30 includes a stage 32 that is disposed at a specific height position and has a main surface disposed in a substantially horizontal posture upward. Further, the substrate 200 is placed on the stage 32 such that the main surface of the substrate 200 abuts against the upper main surface of the stage 32, whereby the substrate 200 can be held at a fixed position and posture. In addition, the substrate holding portion may be configured to be solid The substrate is held around the substrate.
又，於基板保持部30之下方，設置有使基板200相對於吐出部50沿Y方向(副掃描方向)進行相對移動之基板移動機構34。此處，基板移動機構34係包含於上方支持載台32之台部36、與一對滑動支持通孔37。滑動支持通孔37構成為設置於台部36之下端部，且於沿Y方向延伸之一對副掃描方向導引部39上可滑動移動。並且，構成為藉由接受來自線性馬達等基板移動驅動部(圖示省略)之驅動力，使基板移動機構34與上述載台32及基板200一併沿Y方向移動。再者，亦可構成為代替使基板200沿Y方向移動而使主掃描機構40及吐出部50相對於基板20沿Y方向移動。再者，亦可構成為上述載台32相對於基板移動機構34而繞鉛垂軸可旋轉地驅動。Further, below the substrate holding portion 30, a substrate moving mechanism 34 that relatively moves the substrate 200 in the Y direction (sub-scanning direction) with respect to the discharge portion 50 is provided. Here, the substrate moving mechanism 34 is included in the table portion 36 of the upper support stage 32 and the pair of slide support through holes 37. The slide support through hole 37 is formed to be provided at the lower end portion of the table portion 36, and is slidably movable on the sub-scanning direction guiding portion 39 at one of the extensions in the Y direction. Further, the substrate moving mechanism 34 is moved in the Y direction together with the stage 32 and the substrate 200 by receiving a driving force from a substrate moving drive unit (not shown) such as a linear motor. Further, instead of moving the substrate 200 in the Y direction, the main scanning mechanism 40 and the discharge unit 50 may be moved in the Y direction with respect to the substrate 20. Furthermore, the stage 32 may be rotatably driven around the vertical axis with respect to the substrate moving mechanism 34.
主掃描機構40係包含主掃描機構導引部42、及沿主掃描機構導引部42移動之滑件44。主掃描機構導引部42係形成為於基板200之上方位置，沿相對於基板200大致平行之主掃描方向(X方向)延伸之長條狀構件。滑件44係包含可插通配置主掃描機構導引部42之內部空間之構件，且由該主掃描機構導引部42以沿X方向可移動地支持。再者，於本實施形態中，滑件44相當於移動部。移動部並不限於滑件，僅需為可沿主掃描機構導引部42移動之構件即可。The main scanning mechanism 40 includes a main scanning mechanism guiding portion 42 and a slider 44 that moves along the main scanning mechanism guiding portion 42. The main scanning mechanism guide portion 42 is formed as an elongated member extending in a main scanning direction (X direction) substantially parallel to the substrate 200 at a position above the substrate 200. The slider 44 includes a member that can be inserted into the internal space in which the main scanning mechanism guide portion 42 is disposed, and is movably supported in the X direction by the main scanning mechanism guiding portion 42. Further, in the present embodiment, the slider 44 corresponds to the moving portion. The moving portion is not limited to the slider, and only needs to be a member movable along the main scanning mechanism guiding portion 42.
更具體而言，主掃描機構導引部42係形成為大致方棒狀構件。滑件44之外形狀係如圖4所示，形成為大致長方體狀。又，於滑件44之內部，形成有可包含間隔而包圍主掃 描機構導引部42之外周面之內部空間44S。自下述之空氣供給源86經由空氣配管80a所供給之空氣之一部分係朝向滑件44之內周面吐出。藉此，滑件44係於與主掃描機構導引部42之外周面之間介有空氣層之狀態下變成沿X方向可移動地支持之狀態。其結果為，滑件44係以可高速高加速移動地、且耐久性優異之態樣被支持。More specifically, the main scanning mechanism guide portion 42 is formed as a substantially square rod-shaped member. The shape of the slider 44 is formed into a substantially rectangular parallelepiped shape as shown in FIG. Moreover, inside the slider 44, a main sweep can be included to include the interval The inner space 44S of the outer peripheral surface of the mechanism guide portion 42 is drawn. A part of the air supplied from the air supply source 86 via the air pipe 80a is discharged toward the inner circumferential surface of the slider 44. Thereby, the slider 44 is in a state of being movably supported in the X direction in a state in which an air layer is interposed between the outer peripheral surface of the main scanning mechanism guide portion 42. As a result, the slider 44 is supported in such a manner that it can be moved at a high speed and high acceleration, and the durability is excellent.
再者，此處，如圖3所示，於主掃描機構導引部42之上表面，形成有向上方開口且沿X方向延伸之凹槽43，於滑件44之上部寬度方向(Y方向)中間部，形成有與上述凹槽43相對應之寬度之狹縫45a。並且，於該狹縫45a部分，安裝有皮帶安裝托架45，於上述凹槽43內，用於驅動滑件44之驅動皮帶74係安裝於皮帶安裝托架45上。Here, as shown in FIG. 3, on the upper surface of the main scanning mechanism guide portion 42, a groove 43 that opens upward and extends in the X direction is formed in the width direction of the upper portion of the slider 44 (Y direction). The intermediate portion is formed with a slit 45a having a width corresponding to the above-described groove 43. Further, a belt attachment bracket 45 is attached to the slit 45a, and a drive belt 74 for driving the slider 44 is attached to the belt attachment bracket 45 in the recess 43.
然而，該等構成並非必需。例如，主掃描機構導引部亦可為單純之方棒狀或圓棒狀、且於滑件內形成有比該單純之方棒狀或圓棒狀大一圈之內部空間之構成。又，主掃描機構導引部亦可包含複數個棒狀構件。再者，滑件無須於相對於主掃描機構導引部而介有空氣層之狀態下自由移動地被支持。例如，滑件亦可構成為於相對於長條狀之主掃描機構導引部介隔其他低摩擦構件、滾動體等接觸之狀態下自由移動地被支持。However, such a composition is not required. For example, the main scanning mechanism guide portion may be a simple square rod or a round rod shape, and an inner space larger than the simple square rod shape or the round rod shape may be formed in the slider. Further, the main scanning mechanism guide portion may include a plurality of rod-shaped members. Further, the slider is not required to be freely movable in a state in which an air layer is interposed with respect to the main scanning mechanism guide. For example, the slider may be configured to be freely movable while being in contact with the elongated main scanning mechanism guide portion via other low friction members, rolling elements, or the like.
又，此處，於主掃描機構導引部42之上方，設置有計數器用導引部46及計數器用滑件48。Here, the counter guide portion 46 and the counter slider 48 are provided above the main scanning mechanism guide portion 42.
計數器用導引部46係形成為沿X方向延伸之長條棒狀構件。計數器用滑件48係包含可插通配置計數器用導引部46 之內部空間之構件，且由該計數器用導引部46以沿X方向可移動地支持。The counter guide portion 46 is formed as an elongated rod-shaped member that extends in the X direction. The counter slider 48 includes a guide portion 46 for insertable configuration counter The member of the internal space is movably supported by the counter guide portion 46 in the X direction.
此處，計數器用導引部46係形成為大致圓棒狀，且於上述主掃描機構導引部42之上方以大致平行狀態設置有2根。又，於計數器用滑件48之內部，形成有可包含間隔而包圍各計數器用導引部46之外周面之圓孔狀內部空間48S。自下述之空氣供給源86經由空氣配管80a所供給之空氣之一部分係朝向計數器用滑件48之內周面吐出。藉此，計數器用滑件48係以使空氣層介於其與計數器用導引部46之外周面之間之狀態，成為沿X方向可移動地支持之狀態。Here, the counter guide portion 46 is formed in a substantially round bar shape, and two of them are provided in a substantially parallel state above the main scanning mechanism guide portion 42. Further, inside the counter slider 48, a circular hole-shaped internal space 48S that can surround the outer peripheral surface of each of the counter guides 46 is formed. A part of the air supplied from the air supply source 86 via the air pipe 80a is discharged toward the inner circumferential surface of the counter slider 48. Thereby, the counter slider 48 is in a state in which the air layer is interposed between the outer peripheral surface of the counter guide portion 46 and is movably supported in the X direction.
再者，此處，計數器用滑件相對於計數器用導引部可移動地支持之構成係與關於上述主掃描機構40所述者同樣地，可以採用各種構成。即，計數器用滑件無須如上述般於相對於計數器用導引部而介有空氣層之狀態下可自由移動地被支持。例如，計數器用滑件亦可構成為於相對於長條狀計數器用導引部介隔其他低摩擦構件、滾動體等接觸之狀態下可自由移動地被支持。Here, the configuration in which the counter slider is movably supported by the counter guide portion can be variously configured as described above with respect to the main scanning mechanism 40. In other words, the counter slider does not need to be freely movable in a state in which an air layer is interposed with respect to the counter guide portion as described above. For example, the counter slider may be configured to be movably supported while being in contact with the elongated counter guide portion via other low friction members and rolling elements.
吐出部50係由上述滑件44以沿X方向可移動地支持，並且相對於基板200可吐出塗佈液地構成。此處，吐出部50係包含噴嘴支持部52與至少一個噴嘴54。於本實施形態中為便於圖示，設為設置有3個噴嘴54者。The discharge portion 50 is configured to be movably supported in the X direction by the slider 44 and to discharge the coating liquid with respect to the substrate 200. Here, the discharge portion 50 includes a nozzle support portion 52 and at least one nozzle 54. In the present embodiment, for convenience of illustration, it is assumed that three nozzles 54 are provided.
噴嘴支持部52係包含安裝於滑件44之一側面之基端部52a、與自基端部52a之下端部朝向外方延出之噴嘴安裝板 部52b。並且，複數個噴嘴54係向X方向及Y方向錯開位置，並且安裝固定於噴嘴安裝板部52b上。各噴嘴54係分別包含可吐出塗佈液之吐出口，並將該吐出口以噴嘴安裝板部52b朝下之姿勢固定於噴嘴安裝板部52b上。並且，一面使上述滑件44向X方向移動，一面自各噴嘴54吐出塗佈液，藉此將該塗佈液塗佈在載置於載台32上之基板200上。The nozzle support portion 52 includes a base end portion 52a attached to one side surface of the slider 44 and a nozzle mounting plate extending outward from the lower end portion of the base end portion 52a. Part 52b. Further, a plurality of nozzles 54 are shifted in the X direction and the Y direction, and are attached and fixed to the nozzle mounting plate portion 52b. Each of the nozzles 54 includes a discharge port through which the coating liquid can be discharged, and the discharge port is fixed to the nozzle attachment plate portion 52b with the nozzle attachment plate portion 52b facing downward. Then, while the slider 44 is moved in the X direction, the coating liquid is discharged from each of the nozzles 54, whereby the coating liquid is applied onto the substrate 200 placed on the stage 32.
再者，於上述滑件44之中相對於吐出部50為相反側之側部上，設置有噴嘴計數器44C。Further, a nozzle counter 44C is provided on a side portion of the slider 44 opposite to the discharge portion 50.
輔助掃描機構60係包含輔助掃描機構導引部62、及沿輔助掃描機構導引部62移動之輔助滑件65。輔助掃描機構60之輔助滑件65係可追隨滑件44沿X方向移動地構成。此處，該輔助掃描機構60係較主掃描機構40設置於更上方、且較主掃描機構40設置於基板200之搬送方向更下游側。再者，輔助滑件65相當於本實施形態中之輔助移動部。輔助移動部係可沿輔助掃描機構導引部移動之構件。The auxiliary scanning mechanism 60 includes an auxiliary scanning mechanism guiding portion 62 and an auxiliary slider 65 that moves along the auxiliary scanning mechanism guiding portion 62. The auxiliary slider 65 of the auxiliary scanning mechanism 60 is configured to follow the movement of the slider 44 in the X direction. Here, the auxiliary scanning mechanism 60 is disposed above the main scanning mechanism 40 and on the downstream side of the main scanning mechanism 40 in the conveying direction of the substrate 200. Further, the auxiliary slider 65 corresponds to the auxiliary moving portion in the present embodiment. The auxiliary moving portion is a member that is movable along the auxiliary scanning mechanism guiding portion.
輔助掃描機構導引部62係形成為於基板200之上方位置、沿X方向延伸之長條狀構件。即，輔助掃描機構導引部62係沿主掃描機構導引部42之延伸方向形成。又，輔助滑件65係包含可插通配置輔助掃描機構導引部62之內部空間之構件，且由該輔助掃描機構導引部62以沿X方向可移動地支持。雖該輔助掃描機構60係與主掃描機構40同步驅動，但關於此於下文詳述。The auxiliary scanning mechanism guide portion 62 is formed as an elongated member extending in the X direction at a position above the substrate 200. That is, the auxiliary scanning mechanism guide portion 62 is formed along the extending direction of the main scanning mechanism guiding portion 42. Further, the auxiliary slider 65 includes a member that can be inserted into the internal space in which the auxiliary scanning mechanism guide portion 62 is disposed, and is movably supported in the X direction by the auxiliary scanning mechanism guiding portion 62. Although the auxiliary scanning mechanism 60 is driven in synchronization with the main scanning mechanism 40, it will be described in detail below.
更具體而言，輔助掃描機構導引部62係形成為大致方棒 狀之構件。輔助滑件65之外形狀係形成為大致長方體狀，於輔助滑件65內，形成有可包含間隔而包圍輔助掃描機構導引部62之外周面之內部空間64S。自下述之空氣供給源86經由空氣配管80a所供給之空氣之一部分係朝向輔助滑件65之內周面吐出。藉此，輔助滑件65係於與輔助掃描機構導引部62之外周面之間介有空氣層之狀態下變成沿X方向可移動地被支持的狀態。More specifically, the auxiliary scanning mechanism guiding portion 62 is formed as a substantially square bar Shaped component. The shape of the auxiliary slider 65 is formed into a substantially rectangular parallelepiped shape, and an internal space 64S that surrounds the outer peripheral surface of the auxiliary scanning mechanism guide portion 62 is formed in the auxiliary slider 65. A part of the air supplied from the air supply source 86 via the air pipe 80a is discharged toward the inner peripheral surface of the auxiliary slider 65. Thereby, the auxiliary slider 65 is in a state of being movably supported in the X direction in a state in which an air layer is interposed between the outer peripheral surface of the auxiliary scanning mechanism guide portion 62.
再者，此處，輔助滑件65相對於輔助掃描機構導引部62可移動地支持之構成係與關於上述主掃描機構40所述者同樣地，可採用各種構成。然而，該輔助滑件無須如上述般於相對於配管支持用導引部而介有空氣層之狀態下可自由移動地被支持。例如，輔助滑件亦可構成為於相對於長條狀輔助掃描機構導引部介隔其他低摩擦構件、滾動體等接觸之狀態下可自由移動地被支持。Here, the configuration in which the auxiliary slider 65 is movably supported with respect to the auxiliary scanning mechanism guide portion 62 can be variously configured as described above with respect to the main scanning mechanism 40. However, the auxiliary slider does not need to be freely movable in a state in which an air layer is interposed with respect to the piping support guide as described above. For example, the auxiliary slider may be configured to be movably supported while being in contact with the elongated auxiliary scanning mechanism guide portion via other low friction members, rolling elements, or the like.
可動配管支持部100係設置於載台32之上方、且可根據沿X方向移動之滑件44及輔助滑件65之位置而使其方向變化之可動構件。該可動配管支持部100係包含：擺動軸61，其一端之部分61a係固定於以橫跨搬送基板200之路徑之方式設置之台部69上，並且另一端之部分61b係作為自由端自由旋轉；板狀之平板部63，其連接於擺動軸61上；支臂構件67，其自平板部63沿大致水平方向延伸出並且連接於輔助滑件65上。The movable pipe support portion 100 is a movable member that is disposed above the stage 32 and that is changeable in accordance with the position of the slider 44 and the auxiliary slider 65 that move in the X direction. The movable pipe support portion 100 includes a swing shaft 61 whose one end portion 61a is fixed to the land portion 69 provided so as to straddle the path of the conveyance substrate 200, and the other end portion 61b is freely rotated as a free end. A plate-like flat portion 63 connected to the swing shaft 61; an arm member 67 extending from the flat plate portion 63 in a substantially horizontal direction and connected to the auxiliary slider 65.
平板部63係於其主表面包含下述之支持塗佈液配管80b之部分之支持機構630。該支持機構630係例如相對於平板 部63套結塗佈液配管80b之帶狀套結構件、或夾子狀之夾持構件等，只要不對塗佈液配管80b之口徑產生影響，則可採用各種形態。The flat plate portion 63 is a support mechanism 630 whose main surface includes a portion that supports the coating liquid pipe 80b described below. The support mechanism 630 is for example relative to a tablet In the portion 63, the band-shaped sheath member of the coating liquid pipe 80b or the clip-like holding member or the like can be used in various forms as long as it does not affect the diameter of the coating liquid pipe 80b.
該平板部63之一端係連接於沿鉛垂方向配置軸心方向之擺動軸61之可動部分61b之外周面上。即，平板部63係根據擺動軸61之動作可擺動地配置，於X方向及Y方向所規定之面內可自由地使其方向變化。One end of the flat plate portion 63 is connected to the outer peripheral surface of the movable portion 61b of the swing shaft 61 in the axial direction in the vertical direction. In other words, the flat plate portion 63 is swingably arranged in accordance with the operation of the swing shaft 61, and the direction can be freely changed in the plane defined by the X direction and the Y direction.
支臂構件67係使與向擺動軸61之連接部分63a為相反側之平板部63之端部63b與輔助滑件65連接且具有剛性之構件。因此，當輔助滑件65沿輔助掃描機構導引部62往復移動時，平板部63及擺動軸61係經由支臂構件67而從動，且平板部63係以擺動軸61為中心繞其擺動。即，輔助掃描機構60發揮作為平板部63之驅動源之功能。The arm member 67 is a member that connects the end portion 63b of the flat plate portion 63 opposite to the connecting portion 63a of the swing shaft 61 to the auxiliary slider 65 and has rigidity. Therefore, when the auxiliary slider 65 reciprocates along the auxiliary scanning mechanism guiding portion 62, the flat plate portion 63 and the swing shaft 61 are driven via the arm member 67, and the flat plate portion 63 swings around the swing shaft 61. . That is, the auxiliary scanning mechanism 60 functions as a driving source of the flat plate portion 63.
更具體而言，根據輔助掃描機構60之輔助滑件65之移動，支臂構件67係自輔助滑件65受到拉伸力或按壓力。藉由該等力之中沿X方向作用之力之成分，平板部63之朝向係追隨輔助滑件65而週期性地變化。More specifically, the arm member 67 receives a tensile force or a pressing force from the auxiliary slider 65 in accordance with the movement of the auxiliary slider 65 of the auxiliary scanning mechanism 60. The orientation of the flat plate portion 63 follows the auxiliary slider 65 periodically by the components of the force acting in the X direction among the forces.
再者，亦可使用其他形狀之構件代替板狀之平板部63。例如棒狀之構件等，只要可支持塗佈液配管80b則關於其形狀可採用各種形態。又，平板部63與支臂構件67亦可作為具有剛性之一體物而構成。Further, a member of another shape may be used instead of the flat plate portion 63. For example, a rod-shaped member or the like can be used in various forms as long as it can support the coating liquid pipe 80b. Further, the flat plate portion 63 and the arm member 67 may be configured as a body having rigidity.
又，根據輔助滑件65之位置，更具體而言，當輔助滑件65位於輔助掃描機構導引部62之中間部時、與當其位於輔助掃描機構導引部62之兩端部時，輔助滑件65與可動配管 支持部100之距離發生變動。因此，作為支臂構件67，例如可採用自由伸縮地組合具有相互不同直徑之一對筒狀構件67a、67b之套筒構造，亦可利用縮放儀構造等。又，作為該等之替代，亦可採用於支臂構件67與輔助滑件65之連接部分、或支臂構件67與平板部63之連接部分等，可調節輔助滑件65與可動配管支持部100之間之距離之構造。藉此，根據直線移動之輔助滑件65之位置調節支臂構件67之長度。Further, according to the position of the auxiliary slider 65, more specifically, when the auxiliary slider 65 is located at the intermediate portion of the auxiliary scanning mechanism guiding portion 62, and when it is located at both ends of the auxiliary scanning mechanism guiding portion 62, Auxiliary slider 65 and movable piping The distance of the support unit 100 varies. Therefore, as the arm member 67, for example, a sleeve structure having a pair of cylindrical members 67a and 67b having mutually different diameters can be combined, and a scaler structure or the like can be used. Further, as an alternative to the above, the connecting portion of the arm member 67 and the auxiliary slider 65, or the connecting portion of the arm member 67 and the flat plate portion 63 may be used, and the auxiliary slider 65 and the movable pipe supporting portion may be adjusted. The construction of the distance between 100. Thereby, the length of the arm member 67 is adjusted in accordance with the position of the auxiliary slider 65 which is linearly moved.
配管80係包含空氣配管80a、及塗佈液配管80b。各配管80a、80b係於空氣或塗佈液之輸送方向上游側連接於空氣供給源86或塗佈液供給源88，並且以懸吊於本基板處理裝置20之上方之方式支持。於以下之說明中，於區別兩配管之情形時，稱為空氣配管80a或塗佈液配管80b，而於統稱之情形時有時稱為配管80。再者，於圖3中，省略空氣配管80a之記載。The pipe 80 includes an air pipe 80a and a coating liquid pipe 80b. Each of the pipes 80a and 80b is connected to the air supply source 86 or the coating liquid supply source 88 on the upstream side in the air or coating liquid transport direction, and is supported so as to be suspended above the substrate processing apparatus 20. In the following description, when the two pipes are distinguished, it is referred to as an air pipe 80a or a coating liquid pipe 80b, and is sometimes referred to as a pipe 80 in the case of collectively. In addition, in FIG. 3, description of the air piping 80a is abbreviate|omitted.
空氣配管80a係導引來自空氣供給源86之空氣，且包含由具有可撓性之樹脂等之管，此處，包含2根空氣配管80a。2根空氣配管80a之一端部係分別連接於空氣供給源86上。一根空氣配管80a之另一端部係可供給空氣地連接於滑件44上，另一根空氣配管80a之另一端部係可供給空氣地連接於輔助滑件65上。一根空氣配管80a之另一端部亦可直接地固定於滑件44上，亦可經由吐出部50之固定部位而連接於滑件44上。The air pipe 80a guides air from the air supply source 86, and includes a tube made of a flexible resin or the like. Here, two air pipes 80a are included. One of the ends of the two air pipes 80a is connected to the air supply source 86, respectively. The other end of one air pipe 80a is connected to the slider 44 by air supply, and the other end of the other air pipe 80a is air-connected to the auxiliary slider 65. The other end portion of one of the air pipes 80a may be directly fixed to the slider 44 or may be connected to the slider 44 via a fixed portion of the discharge portion 50.
塗佈液配管80b係導引來自塗佈液供給源88之塗佈液， 且包含具有可撓性之樹脂等之管，並設置有與噴嘴54相同數量根。各塗佈液配管80b之一端部係分別連接於塗佈液供給源88，另一端部係可供給塗佈液地分別連接於噴嘴54上。塗佈液配管80b之另一端部亦可直接地固定於吐出部50上，亦可經由向滑件44或噴嘴支持部52之固定部位而連接於噴嘴54上。The coating liquid pipe 80b guides the coating liquid from the coating liquid supply source 88, Further, a tube having a flexible resin or the like is provided, and the same number of roots as the nozzle 54 are provided. One end of each of the coating liquid pipes 80b is connected to the coating liquid supply source 88, and the other end portion is connected to the nozzle 54 by the supply of the coating liquid. The other end portion of the coating liquid pipe 80b may be directly fixed to the discharge portion 50, or may be connected to the nozzle 54 via a fixed portion to the slider 44 or the nozzle support portion 52.
此種塗佈液配管80b係以捆紮複數根之狀態收容於塗佈液配管保護構件85中。該塗佈液配管保護構件85係包含樹脂等具有可撓性之材料，且複數根塗佈液配管80b係總括地被保持。此處，如圖3所示，塗佈液配管保護構件85係經由噴嘴支持部52之固定部位，而使各塗佈液配管80b連接於各個噴嘴54上。關於在噴嘴支持部52中固定該塗佈液配管保護構件85之機構，亦可採用與上述之平板部63中之支持機構630相同之各種形態。The coating liquid pipe 80b is housed in the coating liquid pipe protection member 85 in a state in which a plurality of bundles are bundled. The coating liquid pipe protection member 85 is made of a flexible material such as a resin, and the plurality of coating liquid pipes 80b are collectively held. Here, as shown in FIG. 3, the coating liquid pipe protection member 85 is connected to each of the nozzles 54 via the fixing portion of the nozzle support portion 52. The mechanism for fixing the coating liquid pipe protecting member 85 to the nozzle supporting portion 52 may be in the same manner as the supporting mechanism 630 of the flat plate portion 63 described above.
較吐出部50中之固定部位或滑件44或噴嘴支持部52中之固定部位更靠塗佈液之流動方向上游側之塗佈液配管80b之一部分係由輔助滑件65之輔助滑件保持部621支持。關於該輔助滑件保持部621所包含之支持塗佈液配管80b之機構，亦可採用與上述之平板部63中之支持機構630相同之各種形態。A portion of the coating liquid pipe 80b that is closer to the upstream side of the flow direction of the coating liquid than the fixing portion of the discharge portion 50 or the fixed portion of the slider 44 or the nozzle support portion 52 is held by the auxiliary slider of the auxiliary slider 65. Department 621 support. The mechanism for supporting the coating liquid pipe 80b included in the auxiliary slider holding portion 621 may be the same as the above-described supporting mechanism 630 of the flat plate portion 63.
此處，輔助掃描機構60係較主掃描機構40位於更上方。因此，關於塗佈液配管80b係易於維持自吐出部50中之固定部位或滑件44或噴嘴支持部52中之固定部位向上方上升之狀態。Here, the auxiliary scanning mechanism 60 is located above the main scanning mechanism 40. Therefore, the coating liquid pipe 80b is easily maintained in a state in which the fixing portion from the discharge portion 50 or the fixing portion of the slider 44 or the nozzle supporting portion 52 is raised upward.
並且，較該輔助滑件65中之固定部位更靠塗佈液之流動方向上游側之塗佈液配管80b之一部分係如上所述由平板部63固定。如此，於本實施形態中，塗佈液配管80b之中途之部分係由輔助滑件65與平板部63之2個部位支持。Further, a portion of the coating liquid pipe 80b on the upstream side in the flow direction of the coating liquid from the fixed portion in the auxiliary slider 65 is fixed by the flat plate portion 63 as described above. As described above, in the present embodiment, the portion of the coating liquid pipe 80b is supported by the two portions of the auxiliary slider 65 and the flat plate portion 63.
此處，位於由輔助滑件65支持之部分與由平板部63支持之部分之間的塗佈液配管80b之部分係保持於塗佈液配管保護構件85中，並且如圖3所示般形成為向上方凸起之拱形狀。因此，該部分中之塗佈液配管80b之長度長於輔助滑件65與平板部63之間之長度。再者，塗佈液配管80b亦可形成為向下方凸起之拱形狀。即，較理想為塗佈液配管80b之中利用可動配管支持部100之支持部位、與向吐出部50之連接部位之間之區間於鉛垂面內形成為拱形狀。Here, a portion of the coating liquid pipe 80b between the portion supported by the auxiliary slider 65 and the portion supported by the flat plate portion 63 is held in the coating liquid pipe protection member 85, and is formed as shown in FIG. It is an arch shape that is convex upward. Therefore, the length of the coating liquid pipe 80b in this portion is longer than the length between the auxiliary slider 65 and the flat plate portion 63. Further, the coating liquid pipe 80b may be formed in an arch shape that is convex downward. In other words, it is preferable that the portion between the support portion of the movable pipe support portion 100 and the connection portion to the discharge portion 50 among the coating liquid pipe 80b is formed in an arch shape in the vertical plane.
該基板處理裝置20係包含沿X方向週期性地同步驅動滑件44與輔助滑件65之掃描驅動機構70。此處，同步驅動滑件44與輔助滑件65係指，以大致相同速度及大致相同移動範圍移動驅動滑件44與輔助滑件65。此處，掃描驅動機構70係包含驅動滑件44之滑件驅動機構72、與驅動輔助滑件65之輔助滑件驅動機構76。The substrate processing apparatus 20 includes a scan driving mechanism 70 that periodically drives the slider 44 and the auxiliary slider 65 in the X direction. Here, the synchronous drive slider 44 and the auxiliary slider 65 mean that the drive slider 44 and the auxiliary slider 65 are moved at substantially the same speed and substantially the same range of movement. Here, the scan driving mechanism 70 includes a slider driving mechanism 72 that drives the slider 44, and an auxiliary slider driving mechanism 76 that drives the auxiliary slider 65.
滑件驅動機構72係包含設置於主掃描機構導引部42之兩端部之一對滑輪體73、73、捲掛於一對滑輪體73、73上之驅動皮帶74、及可向正反兩方向旋轉驅動一個滑輪體73之馬達75。於在一對滑輪體73、73之間移動之2條路徑之驅動皮帶74之中一側(下側)，連結固定有上述滑件44之皮帶安裝托架45。又，於在一對滑輪體73、73之間移動之2條 路徑之驅動皮帶74之中另一側(上側)，連結固定上述計數器用滑件48。再者，計數器用滑件48係以夾持滑件44之往復移動範圍之中央位置(通常為一對滑輪體73、73之中央位置)而配置於與滑件44大致對稱位置之方式，連結固定於驅動皮帶74上。並且，一面控制旋轉方向及旋轉速度、旋轉量等，一面旋轉驅動馬達75，藉此驅動滑件44及吐出部50沿X方向往復移動。又，此時，計數器用滑件48係一面相對於滑件44夾持一對滑輪體73、73之中央位置而保持對稱位置，一面沿X方向往復移動。The slider driving mechanism 72 includes a pair of pulley bodies 73 and 73 provided at both end portions of the main scanning mechanism guiding portion 42, a driving belt 74 wound around the pair of pulley bodies 73 and 73, and a forward and reverseable The motor 75 of one pulley body 73 is rotationally driven in both directions. The belt attachment bracket 45 to which the slider 44 is attached is connected to one side (lower side) of the drive belts 74 of the two paths that move between the pair of pulley bodies 73 and 73. Moreover, two movements between the pair of pulley bodies 73, 73 The counter slider 48 is connected and fixed to the other side (upper side) of the drive belt 74 of the path. Further, the counter slider 48 is disposed so as to be disposed at a central position of the reciprocating range of the grip slider 44 (generally the center position of the pair of pulley bodies 73 and 73) so as to be substantially symmetrical with the slider 44. It is fixed to the drive belt 74. Then, the motor 75 is rotationally driven while controlling the rotation direction, the rotation speed, the amount of rotation, and the like, thereby driving the slider 44 and the discharge portion 50 to reciprocate in the X direction. Further, at this time, the counter slider 48 reciprocates in the X direction while holding the center position of the pair of pulley bodies 73 and 73 with respect to the slider 44 while maintaining the symmetrical position.
輔助滑件驅動機構76係包含設置於輔助掃描機構導引部62之兩端部之一對滑輪體77、77、捲掛於一對滑輪體77、77上之驅動皮帶78、及可向正反兩方向旋轉驅動一個滑輪體77之馬達79。於在一對滑輪體77、77之間移動之2條路徑之驅動皮帶78之中一側(下側)，連結固定有上述輔助滑件65。並且，以同步驅動上述滑件44與輔助滑件65之方式，即一面控制旋轉方向及旋轉速度、旋轉量等，一面旋轉驅動馬達79，藉此驅動輔助滑件65沿X方向往復移動。然而，於可抑制作用於通過滑件44與輔助滑件65之間之配管80的較大之拉伸力之範圍內，輔助滑件65與滑件44亦可沿X方向稍微錯開。The auxiliary slider drive mechanism 76 includes one of the opposite end portions of the auxiliary scanning mechanism guide portion 62, the pulley body 77, 77, the drive belt 78 wound around the pair of pulley bodies 77, 77, and the positive direction The motor 79 of one pulley body 77 is rotationally driven in opposite directions. The auxiliary slider 65 is coupled and fixed to one side (lower side) of the drive belts 78 of the two paths that move between the pair of pulley bodies 77 and 77. Further, the drive slider 79 is rotationally driven while the slide member 44 and the auxiliary slider 65 are synchronously driven, that is, the rotation direction, the rotation speed, the rotation amount, and the like are controlled, thereby driving the auxiliary slider 65 to reciprocate in the X direction. However, the auxiliary slider 65 and the slider 44 may be slightly shifted in the X direction within a range in which the large tensile force acting on the pipe 80 between the slider 44 and the auxiliary slider 65 can be suppressed.
再者，此處，雖以藉由個別之馬達75、79驅動滑件44與輔助滑件65之例進行說明，但亦可將來自共同之馬達之旋轉驅動力藉由使用齒輪或滑輪及皮帶等之傳遞機構一分為二進行傳遞，藉此進行驅動。又，亦可藉由將滑件44與輔 助滑件65連接於共同之驅動皮帶上進行同步驅動。又，驅動滑件44或輔助滑件65之機構，尤其是驅動輔助滑件65之機構並不限於上述例，除此以外，亦可使用線性馬達等各種線性致動器。Here, although the example in which the slider 44 and the auxiliary slider 65 are driven by the individual motors 75 and 79 will be described, the rotational driving force from the common motor may be used by using gears or pulleys and belts. The transmission mechanism is divided into two and transmitted to drive. Also, by using the slider 44 and the auxiliary The slides 65 are coupled to a common drive belt for synchronous drive. Further, the mechanism for driving the slider 44 or the auxiliary slider 65, in particular, the mechanism for driving the auxiliary slider 65 is not limited to the above example, and various linear actuators such as a linear motor may be used.
作為控制部90之硬體之構成係與一般之電腦相同。即，控制部90係將進行各種運算處理之CPU(Central Processing Unit，中央處理單元)、記憶基本程式之讀出專用記憶體即ROM(Read-Only Memory，唯讀記憶體)、記憶各種資訊之自由讀寫之記憶體即RAM(random access memory，隨機存取記憶體)及控制用軟體、或記憶有資料等之磁碟、鍵盤及滑鼠等輸入部連接於匯流排線而構成。根據預先儲存於此種控制部90中之軟體程序進行基板處理裝置20之動作控制。於匯流排線中，連接有塗佈液供給源88、空氣供給源86、馬達75、79。控制部90係以自空氣供給源86供給空氣，同時開始來自塗佈液供給源88之塗佈液供給而使塗佈液自各噴嘴54吐出之狀態，以同步驅動滑件44與輔助滑件65之方式，且以進行驅動控制各馬達75、79之處理之方式構成。The hardware of the control unit 90 is the same as that of a general computer. In other words, the control unit 90 is a CPU (Central Processing Unit) that performs various kinds of arithmetic processing, and a ROM (Read-Only Memory) that reads a dedicated memory for storing a basic program, and memorizes various kinds of information. A freely readable and writable memory, that is, a RAM (random access memory) and a control software, or an input unit such as a disk, a keyboard, and a mouse in which data is stored is connected to a bus bar. The operation control of the substrate processing apparatus 20 is performed based on a software program stored in advance in such a control unit 90. A coating liquid supply source 88, an air supply source 86, and motors 75 and 79 are connected to the bus bar. The control unit 90 supplies the air from the air supply source 86, starts the supply of the coating liquid from the coating liquid supply source 88, and discharges the coating liquid from the respective nozzles 54 to synchronously drive the slider 44 and the auxiliary slider 65. In this manner, it is configured to drive and control the processing of the motors 75 and 79.
於以此種方式構成之基板處理裝置20中，當滑件44及輔助滑件65沿X方向週期性地往復移動時，經由支臂構件67連結於輔助滑件65上之平板部63繞擺動軸61週期性地往復擺動。即，追隨與輔助滑件65同步驅動之滑件44而使平板部63之朝向週期性地變化。於圖1中，此時之支臂構件67之水平擺動係例示為箭頭SW及支臂構件67之另一狀態 67m。In the substrate processing apparatus 20 configured in this manner, when the slider 44 and the auxiliary slider 65 periodically reciprocate in the X direction, the flat plate portion 63 coupled to the auxiliary slider 65 via the arm member 67 swings around. The shaft 61 periodically reciprocates. That is, the slider 44 that is driven in synchronization with the auxiliary slider 65 is followed to periodically change the orientation of the flat plate portion 63. In Fig. 1, the horizontal swing of the arm member 67 at this time is exemplified as another state of the arrow SW and the arm member 67. 67m.
於下文中，使用圖5所示之流程圖說明使用此種基板處理裝置20之處理之流程。Hereinafter, the flow of processing using such a substrate processing apparatus 20 will be described using a flowchart shown in FIG.
首先，將於前步驟中實施處理之基板200以保持在基板保持部30之載台32上之狀態，以特定速度向基板處理裝置20搬送(步驟S1)。控制部90係用例如感測器等檢測基板200之搬送，且亦向塗佈液供給源88傳送信號，使塗佈液之供給開始(步驟S2)。First, the substrate 200 subjected to the previous step is conveyed to the substrate processing apparatus 20 at a specific speed while being held on the stage 32 of the substrate holding unit 30 (step S1). The control unit 90 detects the conveyance of the substrate 200 by, for example, a sensor, and also transmits a signal to the coating liquid supply source 88 to start the supply of the coating liquid (step S2).
進而，控制部90係向作為主掃描機構40之驅動機構之馬達75、及作為輔助掃描機構60之驅動機構之馬達79傳送信號。接收到該信號，主掃描機構40之滑件44及輔助掃描機構60之輔助滑件65係一面沿X方向同步移動一面進行掃描移動(步驟S3)。藉由反覆週期性地進行該掃描移動，於基板200之表面上形成塗佈液之區域。Further, the control unit 90 transmits a signal to the motor 75 as the drive mechanism of the main scanning mechanism 40 and the motor 79 as the drive mechanism of the auxiliary scanning mechanism 60. Upon receiving this signal, the slider 44 of the main scanning mechanism 40 and the auxiliary slider 65 of the auxiliary scanning mechanism 60 perform scanning movement while moving synchronously in the X direction (step S3). The region of the coating liquid is formed on the surface of the substrate 200 by periodically performing the scanning movement in reverse.
藉由該輔助掃描機構60之輔助滑件65進行掃描移動，經由連接於輔助滑件65上之支臂構件67使可動配管支持部100之平板部63擺動。即，可動配管支持部100之平板部63之朝向係追隨輔助滑件65、並且追隨與輔助滑件65同步驅動之滑件44而變化(步驟S4)。The scanning operation of the auxiliary slider 65 of the auxiliary scanning mechanism 60 causes the flat plate portion 63 of the movable pipe support portion 100 to swing via the arm member 67 connected to the auxiliary slider 65. In other words, the orientation of the flat plate portion 63 of the movable pipe support portion 100 follows the auxiliary slider 65 and follows the slider 44 that is driven in synchronization with the auxiliary slider 65 (step S4).
如此，以自噴嘴54吐出塗佈液之狀態，反覆進行藉由主掃描機構40之X軸方向之主掃描與基板200之向Y軸方向之移動，藉此塗佈液向基板200之整個表面吐出。In this manner, the main scanning in the X-axis direction of the main scanning mechanism 40 and the movement in the Y-axis direction of the substrate 200 are repeatedly performed in a state where the coating liquid is discharged from the nozzle 54, whereby the coating liquid is applied to the entire surface of the substrate 200. Spit out.
控制部90判斷塗佈液是否塗佈於基板200之整個面上(步驟S5)，塗佈有塗佈液之基板200係藉由基板保持部30向下 游步驟搬送。The control unit 90 determines whether or not the coating liquid is applied to the entire surface of the substrate 200 (step S5), and the substrate 200 coated with the coating liquid is passed down by the substrate holding portion 30. The tour steps are carried.
如上所述，基板處理裝置20係包含可動配管支持部100，其支持塗佈液配管80b之中途之部分，並且追隨藉由主掃描之反覆進行引起之滑件44之週期性動作而使其朝向週期性地變化。即，可動配管支持部100之朝向並不維持在固定方向，而追隨滑件44之動作週期性地變化。因此，於由可動配管支持部100所支持之塗佈液配管80b之部分中可抑制扭曲發生。又，由於難以自外部向由可動配管支持部100所支持之塗佈液配管80b之部分施加力，因此易於維持初始狀態中之塗佈液配管80b之姿勢。即，難以發生塗佈液配管80b之失控。該等之結果為，可抑制自吐出部50吐出之塗佈液之流量之變動。As described above, the substrate processing apparatus 20 includes the movable pipe support portion 100 that supports the portion of the coating liquid pipe 80b and follows the periodic operation of the slider 44 caused by the reverse of the main scanning. Change periodically. That is, the orientation of the movable pipe support portion 100 is not maintained in the fixed direction, and the operation following the slider 44 periodically changes. Therefore, occurrence of distortion can be suppressed in the portion of the coating liquid pipe 80b supported by the movable pipe support portion 100. Moreover, since it is difficult to apply a force to the portion of the coating liquid pipe 80b supported by the movable pipe support portion 100 from the outside, it is easy to maintain the posture of the coating liquid pipe 80b in the initial state. That is, it is difficult to cause runaway of the coating liquid pipe 80b. As a result of this, it is possible to suppress fluctuations in the flow rate of the coating liquid discharged from the discharge unit 50.
尤其係，於伴隨製品所使用之基板之大型化而引起基板處理裝置大型化之情形時，由於噴嘴之根數增加從而塗佈液配管之根數增加，因此可認為塗佈液配管之失控進一步增大。因此，將本發明應用於較先前更大型之基板處理裝置係更加有效。In particular, when the substrate processing apparatus is increased in size due to the increase in the size of the substrate used for the product, the number of the nozzles increases, and the number of coating liquid pipes increases. Therefore, it is considered that the coating liquid piping is out of control. Increase. Therefore, it is more effective to apply the present invention to a larger substrate processing apparatus than before.
又，基板處理裝置20係進而包含輔助掃描機構60，塗佈液配管80b之部分係由輔助掃描機構60之輔助滑件65所支持。因此，塗佈液配管80b之搖晃或失控難以向直接吐出部50傳遞。又，由於支持塗佈液配管80b之部位增加，因此塗佈液配管80b之姿勢係更加穩定。藉由該等，可抑制自吐出部50吐出之塗佈液之流量之變動。Further, the substrate processing apparatus 20 further includes an auxiliary scanning mechanism 60, and a portion of the coating liquid pipe 80b is supported by the auxiliary slider 65 of the auxiliary scanning mechanism 60. Therefore, it is difficult for the coating liquid pipe 80b to be shaken or out of control to be transmitted to the direct discharge portion 50. Moreover, since the portion supporting the coating liquid pipe 80b is increased, the posture of the coating liquid pipe 80b is more stable. By these, it is possible to suppress fluctuations in the flow rate of the coating liquid discharged from the discharge unit 50.
又，可動配管支持部100係經由支臂構件67而連結於輔 助滑件65。可動配管支持部100可藉由支臂構件67之驅動，確實地使其朝向變化。Further, the movable pipe support portion 100 is coupled to the auxiliary via the arm member 67. Sliding member 65. The movable pipe support portion 100 can be surely changed in orientation by the driving of the arm member 67.
又，塗佈液配管80b係於利用可動配管支持部100之支持部位、與向輔助滑件65之連接部位之間形成為向上凸起之拱形狀。因此，該部位中之塗佈液配管80b變長，故而輔助掃描機構60之搖晃係由拱形狀之塗佈液配管80b整體平滑化，從而可使其影響變小。又，由於自輔助滑件65之連接部位延伸出之塗佈液配管80b之部分801向上方上升，因此即便輔助掃描機構60之滑件44進行往復移動，亦難以於塗佈液在塗佈液配管80b內逆流之方向上產生力。藉由此等，自吐出部50吐出之塗佈液之流量之變動得以抑制。Further, the coating liquid pipe 80b is formed in an arch shape that is formed to be upwardly convex between the support portion of the movable pipe support portion 100 and the connection portion to the auxiliary slider 65. Therefore, since the coating liquid pipe 80b in this portion becomes long, the sway of the auxiliary scanning mechanism 60 is smoothed by the entire coating liquid pipe 80b of the arch shape, and the influence thereof can be made small. Further, since the portion 801 of the coating liquid pipe 80b extending from the connection portion of the auxiliary slider 65 rises upward, even if the slider 44 of the auxiliary scanning mechanism 60 reciprocates, it is difficult to apply the coating liquid to the coating liquid. A force is generated in the direction of the counterflow in the pipe 80b. By this, the fluctuation of the flow rate of the coating liquid discharged from the discharge unit 50 is suppressed.
關於塗佈液配管80b之搖晃之平滑化效果，即便利用可動配管支持部100之支持部位、與向輔助滑件65之連接部位之間之塗佈液配管80b之區間形成為向下凸起之拱形狀亦可達成。因此，於著眼於此種平滑化效果之情形時，一般而言，較佳為塗佈液配管80b(可撓性之處理液配管)中之上述區間於鉛垂面內設置為拱形狀。此處所說之拱形狀係指塗佈液配管80b長於所需最小長度(即，考慮最小之主掃描之振幅而利用可動配管支持部100之支持部分與向輔助滑件65之連接部分之間所需之最小距離)，而具有冗餘度。In the smoothing effect of the shaking of the coating liquid pipe 80b, the section of the coating liquid pipe 80b between the support portion of the movable pipe support portion 100 and the connection portion to the auxiliary slider 65 is formed to be downwardly convex. The arch shape can also be achieved. Therefore, in view of such a smoothing effect, it is preferable that the above-described section in the coating liquid pipe 80b (flexible treatment liquid pipe) is provided in an arch shape in the vertical plane. The arch shape referred to herein means that the coating liquid pipe 80b is longer than the required minimum length (that is, between the supporting portion of the movable pipe supporting portion 100 and the connecting portion to the auxiliary sliding member 65 in consideration of the amplitude of the minimum main scanning. Minimum distance required) with redundancy.
又，主掃描機構40係較輔助掃描機構60配置於更下方。因此，主掃描機構40所包含之連接於吐出部50之塗佈液配管80b之末端802係易於維持向上方上升之狀態。因此，即 便主掃描機構40所包含之滑件44進行往復移動塗佈液亦難以於逆流方向上產生力，從而可抑制塗佈液之流量變動。Further, the main scanning mechanism 40 is disposed below the auxiliary scanning mechanism 60. Therefore, the end 802 of the coating liquid pipe 80b connected to the discharge unit 50 included in the main scanning mechanism 40 is easily maintained in a state of being raised upward. Therefore, that is It is also difficult for the slider 44 included in the main scanning mechanism 40 to reciprocate the coating liquid to generate a force in the counterflow direction, thereby suppressing the flow rate fluctuation of the coating liquid.
以下，說明各種變形例。Hereinafter, various modifications will be described.
首先，於上述實施形態中，塗佈液配管80b中由可動配管支持部100支持之部位、與向吐出部50之連接部位之間之區間形成為向上凸起拱形狀，但並不限定於此種形態。於圖6中表示由可動配管支持部100支持之部位、與向吐出部50之連接部位之間之區間沿支臂構件67配設之形態。如圖6所示，該區間中之塗佈液配管80b亦可沿支臂構件67之延出方向，以與支臂構件67相接之方式配設。又，除此以外，塗佈液配管80b亦可為纏繞於支臂構件67周圍之構成。於該等情形時，因上述區間中之塗佈液配管80b係由支臂構件67確實地得到支持，故該區間中之塗佈液配管80b之搖晃或失控係確實地得以抑制。藉此，可抑制自吐出部50吐出之塗佈液之流量變動。First, in the above-described embodiment, the section between the portion supported by the movable pipe support portion 100 and the connection portion to the discharge portion 50 in the coating liquid pipe 80b is formed in an upwardly convex arch shape, but is not limited thereto. Form. FIG. 6 shows a configuration in which the portion supported by the movable pipe support portion 100 and the portion connected to the discharge portion 50 are disposed along the arm member 67. As shown in Fig. 6, the coating liquid pipe 80b in this section may be disposed in contact with the arm member 67 in the extending direction of the arm member 67. Further, the coating liquid pipe 80b may be configured to be wound around the arm member 67. In such a case, since the coating liquid pipe 80b in the above section is reliably supported by the arm member 67, the shaking or runaway of the coating liquid pipe 80b in the section is surely suppressed. Thereby, the flow rate fluctuation of the coating liquid discharged from the discharge unit 50 can be suppressed.
又，於上述實施形態中，雖輔助掃描機構60係包含驅動機構，但未必限定於此種形態。輔助掃描機構60之輔助滑件65亦可為藉由主掃描機構40之滑件44利用驅動機構驅動而進行動作、往復移動之機構。即，主掃描機構40亦可為使輔助掃描機構60與可動配管支持部100從動之形態。Further, in the above embodiment, the auxiliary scanning mechanism 60 includes a driving mechanism, but is not necessarily limited to such a form. The auxiliary slider 65 of the auxiliary scanning mechanism 60 may be a mechanism that is operated by the drive mechanism of the slider 44 of the main scanning mechanism 40 to operate and reciprocate. That is, the main scanning mechanism 40 may be in a form in which the auxiliary scanning mechanism 60 and the movable pipe support unit 100 are driven.
又，可動配管支持部100並不限於從動於輔助掃描機構60或主掃描機構40之形態。可動配管支持部100亦可包含例如馬達等驅動機構。於可動配管支持部100本身包含調 節其朝向之驅動機構之情形時，可動配管支持部100之朝向可確實地追隨滑件44及輔助滑件65而週期性地變化。Further, the movable pipe support portion 100 is not limited to the form of the auxiliary scanning mechanism 60 or the main scanning mechanism 40. The movable pipe support portion 100 may also include a drive mechanism such as a motor. The movable piping support unit 100 itself includes a tone In the case of the drive mechanism that is oriented, the orientation of the movable pipe support portion 100 can be periodically changed following the slider 44 and the auxiliary slider 65.
又，於可動配管支持部包含驅動機構之情形時，可動配管支持部亦可為以旋轉馬達、與包含連接於旋轉馬達上之連桿機構之支臂構件構成之形態。於該情形時，包含連桿機構之支臂構件自旋轉馬達受到旋轉驅動力，從而使連接於包含連桿機構之支臂構件上之輔助滑件及滑件進行直線運動。Further, when the movable pipe support portion includes the drive mechanism, the movable pipe support portion may be configured by a rotary motor and an arm member including a link mechanism connected to the rotary motor. In this case, the arm member including the link mechanism receives a rotational driving force from the rotary motor, thereby linearly moving the auxiliary slider and the slider connected to the arm member including the link mechanism.
又，於圖7中，表示有於平板部63與輔助滑件65之間未設置支臂構件67之狀態之基板處理裝置的主要部分之配置關係。圖7中所示之可動配管支持部100b不包含支臂構件67。亦可為此種形態。於該情形時，較理想為設置有用於使可動配管支持部100b之平板部63之朝向變化之驅動機構，例如馬達68。馬達68係藉由控制部90控制，控制部90係以平板部63之朝向追隨往復移動之滑件44及輔助滑件65而週期性地變化之方式，使馬達68驅動而使擺動軸61之可動部分61b擺動。In addition, in FIG. 7, the arrangement relationship of the main part of the substrate processing apparatus in which the arm member 67 is not provided between the flat plate portion 63 and the auxiliary slider 65 is shown. The movable pipe support portion 100b shown in Fig. 7 does not include the arm member 67. It can also be in this form. In this case, it is preferable to provide a drive mechanism for changing the orientation of the flat plate portion 63 of the movable pipe support portion 100b, for example, the motor 68. The motor 68 is controlled by the control unit 90, and the control unit 90 drives the motor 68 so that the swing shaft 61 is driven so that the direction of the flat plate portion 63 follows the reciprocating slider 44 and the auxiliary slider 65 periodically. The movable portion 61b swings.
如此，於可動配管支持部100本身包含調節其方向之驅動機構之情形時，可確實地使可動配管支持部100之朝向追隨滑件44及輔助滑件65而週期性地變化。In the case where the movable pipe support portion 100 itself includes the drive mechanism for adjusting the direction thereof, the direction of the movable pipe support portion 100 can be surely changed periodically following the slider 44 and the auxiliary slider 65.
再者，可動配管支持部100b並非必須包含驅動機構。亦可為根據輔助滑件65之移動，藉由塗佈液配管80b拉伸可動配管支持部100b而使可動配管支持部100b之朝向變化之形態。Furthermore, the movable pipe support portion 100b does not necessarily have to include a drive mechanism. The movable pipe support portion 100b may be stretched by the coating liquid pipe 80b to change the orientation of the movable pipe support portion 100b in accordance with the movement of the auxiliary slider 65.
又，基板處理裝置20並非必須包含輔助掃描機構60。即，亦可為將主掃描機構40、可動配管支持部100c設為主要構成之基板處理裝置。Further, the substrate processing apparatus 20 does not necessarily have to include the auxiliary scanning mechanism 60. In other words, the main processing unit 40 and the movable piping support unit 100c may be a main substrate processing apparatus.
於圖8中，概略地記載有於該情形時之主要部分之配置關係。平板部63之朝向係追隨主掃描機構40之滑件44之往復移動而週期性地變化。此處，可動配管支持部100c係包含馬達68作為驅動機構。再者，較理想為如上所述塗佈液配管80b係於可動配管支持部100c、與吐出部50之間之區間形成為拱形狀。更理想為，該區間係設為向上凸起之拱形狀。其原因與圖1~圖4中所示之關於實施形態所述之原因相同。又，可動配管支持部100c亦可為包含支臂構件之形態。即，可動配管支持部100c亦可連接於滑件44上。In Fig. 8, the arrangement relationship of the main parts in this case is schematically described. The orientation of the flat plate portion 63 periodically changes in accordance with the reciprocating movement of the slider 44 of the main scanning mechanism 40. Here, the movable pipe support portion 100c includes a motor 68 as a drive mechanism. In addition, it is preferable that the coating liquid pipe 80b is formed in an arch shape in a section between the movable pipe support portion 100c and the discharge portion 50 as described above. More preferably, the interval is set to an upwardly convex arch shape. The reason for this is the same as that described in the embodiment shown in FIGS. 1 to 4. Further, the movable pipe support portion 100c may be in the form of a support arm member. That is, the movable pipe support portion 100c may be connected to the slider 44.
一般而言，本發明可應用於不僅賦予塗佈液、且向大致水平姿勢之基板供給處理液之基板處理裝置及處理液賦予方法。In general, the present invention can be applied to a substrate processing apparatus and a processing liquid applying method that supply a processing liquid to a substrate in a substantially horizontal posture.
20‧‧‧基板處理裝置20‧‧‧Substrate processing unit
30‧‧‧基板保持部30‧‧‧Substrate retention department
32‧‧‧載台32‧‧‧ stage
34‧‧‧移動機構34‧‧‧Mobile agencies
36‧‧‧台部36‧‧‧Department
37‧‧‧滑動支持通孔37‧‧‧Sliding support through hole
39‧‧‧導引部39‧‧‧Guide
40‧‧‧主掃描機構40‧‧‧Main scanning mechanism
42‧‧‧主掃描機構導引部42‧‧‧Main scanning mechanism guide
43‧‧‧凹槽43‧‧‧ Groove
44‧‧‧滑件44‧‧‧Sliding parts
44C‧‧‧噴嘴計數器44C‧‧‧Nozzle counter
44S‧‧‧滑件之內部空間44S‧‧‧Sliding interior space
45‧‧‧皮帶安裝托架45‧‧‧Belt mounting bracket
45a‧‧‧狹縫45a‧‧‧slit
46‧‧‧計數器用導引部46‧‧‧Counter guide
48‧‧‧計數器用滑件48‧‧‧Counter slider
48S‧‧‧計數器用滑件之內部空間48S‧‧‧ internal space for counter slides
50‧‧‧吐出部50‧‧‧ spit out
52‧‧‧噴嘴支持部52‧‧‧Nozzle Support
52a‧‧‧基端部52a‧‧‧ base end
52b‧‧‧噴嘴安裝板部52b‧‧‧Nozzle mounting plate
54‧‧‧噴嘴54‧‧‧Nozzles
60‧‧‧輔助掃描機構60‧‧‧Auxiliary scanning mechanism
61‧‧‧擺動軸61‧‧‧Swing axis
61a‧‧‧擺動軸固定端61a‧‧‧Swing shaft fixed end
61b‧‧‧擺動軸自由端61b‧‧‧ free end of the swing shaft
62‧‧‧輔助掃描機構導引部62‧‧‧Auxiliary scanning mechanism guide
63‧‧‧平板部63‧‧‧ Flat section
63a‧‧‧與擺動軸之連接部分63a‧‧‧Connected to the swing shaft
63b‧‧‧平板部之端部63b‧‧‧End of the flat section
64S‧‧‧輔助滑件之內部空間64S‧‧‧Internal space for auxiliary slides
65‧‧‧輔助滑件65‧‧‧Auxiliary slider
67‧‧‧支臂構件67‧‧‧ Arm members
67a‧‧‧筒狀構件67a‧‧‧Cylinder components
67b‧‧‧筒狀構件67b‧‧‧Cylinder members
67m‧‧‧支臂構件之另一狀態Another state of the 67m‧‧‧ arm member
68‧‧‧馬達68‧‧‧Motor
69‧‧‧台部69‧‧‧Department
70‧‧‧掃描驅動機構70‧‧‧Scan drive mechanism
72‧‧‧滑件驅動機構72‧‧‧Slider drive mechanism
73‧‧‧滑輪體73‧‧‧ pulley body
74‧‧‧驅動皮帶74‧‧‧Drive belt
75‧‧‧馬達75‧‧‧Motor
76‧‧‧輔助滑件驅動機構76‧‧‧Auxiliary slider drive mechanism
77‧‧‧滑輪體77‧‧‧ pulley body
78‧‧‧驅動皮帶78‧‧‧Drive belt
79‧‧‧馬達79‧‧‧Motor
80‧‧‧配管80‧‧‧Pipe
80a‧‧‧空氣配管80a‧‧‧Air piping
80b‧‧‧塗佈液配管80b‧‧‧coating liquid piping
85‧‧‧塗佈液配管保護構件85‧‧‧ Coating liquid piping protection member
86‧‧‧空氣供給源86‧‧‧Air supply source
88‧‧‧塗佈液供給源88‧‧‧ Coating liquid supply source
90‧‧‧控制部90‧‧‧Control Department
100‧‧‧可動配管支持部100‧‧‧ movable piping support department
100c‧‧‧可動配管支持部100c‧‧‧ movable piping support department
200‧‧‧基板200‧‧‧Substrate
621‧‧‧輔助滑件保持部621‧‧‧Auxiliary slider holding unit
630‧‧‧支持機構630‧‧‧Support institutions
801‧‧‧塗佈液配管之中途部分801‧‧‧The middle part of the coating liquid piping
802‧‧‧塗佈液配管之末端End of 802‧‧‧ coating liquid piping
圖1係表示實施形態之基板處理裝置之概略平面圖。Fig. 1 is a schematic plan view showing a substrate processing apparatus according to an embodiment.
圖2係表示同上之基板處理裝置之概略前視圖。Fig. 2 is a schematic front view showing the substrate processing apparatus of the above.
圖3係圖2中之I-I線概略剖面圖。Figure 3 is a schematic cross-sectional view taken along line I-I of Figure 2.
圖4係表示實施形態之基板處理裝置之主要構成要素之配置關係之概略立體圖。Fig. 4 is a schematic perspective view showing an arrangement relationship of main components of a substrate processing apparatus according to an embodiment.
圖5係表示處理之流程之流程圖。Figure 5 is a flow chart showing the flow of processing.
圖6係表示變形例之基板處理裝置之主要構成要素之配置關係的概略立體圖。Fig. 6 is a schematic perspective view showing an arrangement relationship of main components of a substrate processing apparatus according to a modification.
圖7係表示變形例之基板處理裝置之主要構成要素之配置關係的概略立體圖。FIG. 7 is a schematic perspective view showing an arrangement relationship of main components of a substrate processing apparatus according to a modification.
圖8係表示變形例之基板處理裝置之主要構成要素之配置關係的概略立體圖。8 is a schematic perspective view showing an arrangement relationship of main components of a substrate processing apparatus according to a modification.
20‧‧‧基板處理裝置20‧‧‧Substrate processing unit
32‧‧‧載台32‧‧‧ stage
40‧‧‧主掃描機構40‧‧‧Main scanning mechanism
42‧‧‧主掃描機構導引部42‧‧‧Main scanning mechanism guide
43‧‧‧凹槽43‧‧‧ Groove
44‧‧‧滑件44‧‧‧Sliding parts
44C‧‧‧噴嘴計數器44C‧‧‧Nozzle counter
44S‧‧‧滑件之內部空間44S‧‧‧Sliding interior space
45‧‧‧皮帶安裝托架45‧‧‧Belt mounting bracket
45a‧‧‧狹縫45a‧‧‧slit
46‧‧‧計數器用導引部46‧‧‧Counter guide
48‧‧‧計數器用滑件48‧‧‧Counter slider
48S‧‧‧計數器用滑件之內部空間48S‧‧‧ internal space for counter slides
50‧‧‧吐出部50‧‧‧ spit out
52‧‧‧噴嘴支持部52‧‧‧Nozzle Support
52a‧‧‧基端部52a‧‧‧ base end
52b‧‧‧噴嘴安裝板部52b‧‧‧Nozzle mounting plate
54‧‧‧噴嘴54‧‧‧Nozzles
60‧‧‧輔助掃描機構60‧‧‧Auxiliary scanning mechanism
61‧‧‧擺動軸61‧‧‧Swing axis
61a‧‧‧擺動軸固定端61a‧‧‧Swing shaft fixed end
61b‧‧‧擺動軸自由端61b‧‧‧ free end of the swing shaft
62‧‧‧輔助掃描機構導引部62‧‧‧Auxiliary scanning mechanism guide
63‧‧‧平板部63‧‧‧ Flat section
63a‧‧‧與擺動軸之連接部分63a‧‧‧Connected to the swing shaft
63b‧‧‧平板部之端部63b‧‧‧End of the flat section
64S‧‧‧輔助滑件之內部空間64S‧‧‧Internal space for auxiliary slides
65‧‧‧輔助滑件65‧‧‧Auxiliary slider
67‧‧‧支臂構件67‧‧‧ Arm members
67a‧‧‧筒狀構件67a‧‧‧Cylinder components
67b‧‧‧筒狀構件67b‧‧‧Cylinder members
69‧‧‧台部69‧‧‧Department
74‧‧‧驅動皮帶74‧‧‧Drive belt
78‧‧‧驅動皮帶78‧‧‧Drive belt
80b‧‧‧塗佈液配管80b‧‧‧coating liquid piping
85‧‧‧塗佈液配管保護構件85‧‧‧ Coating liquid piping protection member
100‧‧‧可動配管支持部100‧‧‧ movable piping support department
200‧‧‧基板200‧‧‧Substrate
621‧‧‧輔助滑件保持部621‧‧‧Auxiliary slider holding unit
630‧‧‧支持機構630‧‧‧Support institutions
801‧‧‧塗佈液配管之中途部分801‧‧‧The middle part of the coating liquid piping
802‧‧‧塗佈液配管之末端End of 802‧‧‧ coating liquid piping
Claims (9)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011197998A JP5844099B2 (en) | 2011-09-12 | 2011-09-12 | Substrate processing apparatus and processing liquid application method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201312677A TW201312677A (en) | 2013-03-16 |
| TWI462210B true TWI462210B (en) | 2014-11-21 |
Family
ID=47921831
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW101113401A TWI462210B (en) | 2011-09-12 | 2012-04-13 | Substrate processing apparatus and method of providing processing solution |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP5844099B2 (en) |
| KR (1) | KR101376850B1 (en) |
| CN (1) | CN102992641B (en) |
| TW (1) | TWI462210B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6220693B2 (en) * | 2014-02-14 | 2017-10-25 | 株式会社Ｓｃｒｅｅｎホールディングス | Coating device |
| JP6527716B2 (en) * | 2015-02-27 | 2019-06-05 | 株式会社Ｓｃｒｅｅｎホールディングス | Substrate processing apparatus and control method of substrate processing apparatus |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200401329A (en) * | 2002-03-04 | 2004-01-16 | Tokyo Electron Ltd | Solution treatment method and solution treatment unit |
| JP2011072974A (en) * | 2009-10-02 | 2011-04-14 | Dainippon Screen Mfg Co Ltd | Coater |
| JP2011072975A (en) * | 2009-10-02 | 2011-04-14 | Dainippon Screen Mfg Co Ltd | Coating apparatus |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10217496A (en) * | 1997-02-06 | 1998-08-18 | Citizen Watch Co Ltd | Ink jet recording device |
| JP4321270B2 (en) * | 2004-01-14 | 2009-08-26 | ブラザー工業株式会社 | Inkjet recording device |
| JP2009195851A (en) | 2008-02-22 | 2009-09-03 | Dainippon Screen Mfg Co Ltd | Coating machine |
| JP5154991B2 (en) * | 2008-03-27 | 2013-02-27 | 大日本スクリーン製造株式会社 | Substrate processing equipment |
-
2011
- 2011-09-12 JP JP2011197998A patent/JP5844099B2/en not_active Expired - Fee Related
-
2012
- 2012-04-13 TW TW101113401A patent/TWI462210B/en not_active IP Right Cessation
- 2012-06-20 CN CN201210210429.4A patent/CN102992641B/en not_active Expired - Fee Related
- 2012-07-20 KR KR1020120079235A patent/KR101376850B1/en not_active IP Right Cessation
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200401329A (en) * | 2002-03-04 | 2004-01-16 | Tokyo Electron Ltd | Solution treatment method and solution treatment unit |
| JP2011072974A (en) * | 2009-10-02 | 2011-04-14 | Dainippon Screen Mfg Co Ltd | Coater |
| JP2011072975A (en) * | 2009-10-02 | 2011-04-14 | Dainippon Screen Mfg Co Ltd | Coating apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| KR101376850B1 (en) | 2014-03-20 |
| CN102992641B (en) | 2016-02-10 |
| KR20130028852A (en) | 2013-03-20 |
| TW201312677A (en) | 2013-03-16 |
| JP5844099B2 (en) | 2016-01-13 |
| JP2013059706A (en) | 2013-04-04 |
| CN102992641A (en) | 2013-03-27 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |