TWI458934B - Heat dissipating device - Google Patents

Description

Heat sink

The invention relates to a heat dissipating device, in particular to a heat dissipating device for dissipating heat of electronic components.

The conventional heat dissipating device generally includes a heat absorbing plate, a heat pipe and a heat dissipating fin group formed by stacking the heat dissipating fins, and the heat absorbing plate is adhered to a heat generating electronic component disposed on the circuit board to absorb heat generated by the heat generating electronic component. The heat is transferred to the heat pipe, and is conducted to the heat dissipation fin group by the heat pipe, and the heat is radiated by the heat dissipation fin group.

Due to the internal structural design of the notebook computer, the heat dissipation fin group is often split into a first heat dissipation fin group and a second heat dissipation fin group which are adjacent to each other and have different heights. Due to the difference in height, the first heat dissipation fin group and the second heat dissipation fin group are easily overlapped during assembly, resulting in a decrease in the overall length of the heat dissipation fin group, and an increase in the gap between the heat dissipation fin group and other components of the notebook computer. Does not meet the security specifications of laptops.

In view of this, it is necessary to provide a heat sink that can be easily and accurately assembled.

A heat dissipation device includes a heat pipe, a first heat dissipation fin group and a second heat dissipation fin group, wherein the first heat dissipation fin group and the second heat dissipation fin group are each formed by stacking a plurality of heat dissipation fins, and each heat dissipation fin includes a body and a flange formed by the extension of the body, the heat pipe is attached to the first heat dissipation fin set and the second heat dissipation fin set, and the first heat dissipation fin set has a first adjacent to the second heat dissipation fin set a heat dissipation fin, the second heat dissipation fin group has a second heat dissipation fin adjacent to the first heat dissipation fin group, and the height of the first heat dissipation fin group Different from the height of the second heat dissipation fin group, the body of one of the first heat dissipation fin and the second heat dissipation fin forms a boss, and the protrusion abuts against the first heat dissipation fin and the second heat dissipation fin The film is on the other body.

A heat dissipation device includes a first heat dissipation fin group and a second heat dissipation fin group, wherein the first heat dissipation fin group and the second heat dissipation fin group are each formed by stacking a plurality of heat dissipation fins, each heat dissipation fin including a body And a flange formed by extending from a side edge of the body, the first heat dissipation fin set has a first heat dissipation fin adjacent to the second heat dissipation fin group, and the second heat dissipation fin group has a first heat dissipation fin An adjacent second heat dissipation fin, the height of the first heat dissipation fin group is different from the height of the second heat dissipation fin group, and the first heat dissipation fin and the second heat dissipation fin are integrally formed A boss is formed, and the other body of the first heat sink fin and the second heat sink fin abuts the boss.

Compared with the prior art, the heat dissipation device of the present invention abuts against the body of the adjacent heat dissipation fins by the boss, so that the overall structure of the first heat dissipation fin group and the second heat dissipation fin group is not easily deformed, and the overall The length will not be reduced, comply with the safety regulations of the notebook computer, and reduce the defective rate of the finished product.

10, 20‧‧‧ heat sink

11‧‧‧ cooling fan

110, 121‧‧‧ top

111, 122‧‧‧ bottom

112‧‧‧Air inlet

113‧‧‧ side wall

114‧‧‧air outlet

12‧‧‧ Heat pipe

123‧‧‧Condensation section

13, 23‧‧‧First heat sink fin set

15, 25‧‧‧Second heat sink fin set

14, 14c, 16, 16c, 24c, 26c‧‧‧ heat sink fins

14b, 16b‧‧‧Previous heat sink fins

14a, 16a‧‧‧A heat sink fin

140, 160, 240, 260‧‧‧ ontology

141, 161, 241‧‧ ‧ upper hem

142, 162‧‧‧ hem

143, 263‧‧ ‧ boss

144, 148‧‧‧ top board

145‧‧‧First connecting plate

146‧‧‧Second connection plate

14‧‧‧First depression

148, 168‧‧‧ top board

149, 169‧‧ ‧ bottom plate

1 is a perspective assembled view of a preferred embodiment of a heat sink of the present invention.

2 is an assembled, isometric view of the heat pipe, the first heat sink fin set, and the second heat sink fin set of FIG.

3 is a perspective view of the first heat sink fin of FIG. 1.

4 is a perspective assembled view of still another preferred embodiment of the heat sink of the present invention.

As shown in FIG. 1 and FIG. 2, the heat dissipation device 10 includes a heat dissipation fan 11, a heat pipe 12, and a first dispersion. The heat fin group 13 and the second heat sink fin group 15 are provided. The top end 110 and the bottom end 111 of the cooling fan 11 are provided with an air inlet 112, and the side wall 113 of the cooling fan 11 defines an air outlet 114. The heat pipe 12 is a flat heat pipe. The top end surface 121 and the bottom end surface 122 of the heat pipe 12 are flat, and the condensation section 123 of the heat pipe 12 is located at the top end of the air outlet 114 of the heat dissipation fan 11. The first heat dissipation fin group 13 and the second heat dissipation fin group 15 are located at the air outlet 114 of the heat dissipation fan 11 and are lined up at the bottom of the condensation section 123 of the heat pipe 12, and the second heat dissipation fin group 15 is located at the first heat dissipation. The height of the second heat dissipation fin group 15 is smaller than the height of the first heat radiation fin group 13 on the left side of the fin group 13.

The first heat dissipation fin group 13 is formed by stacking a plurality of first heat dissipation fins 14 in the same direction, and an air flow passage 17 is formed between the adjacent two first heat dissipation fins 14 . The first heat dissipation fin 14 includes a body 140, an upper flange 141 and a lower flange 142. The upper flange 141 and the lower flange 142 are integrally bent and extended by the upper and lower edges of the body 140. The body 140, the upper flange 141 and the lower flange 142 of the fin 14 together define a first recess 147. The upper edge 141 and the lower flange 142 of the first heat dissipation fin 14a respectively abut against the body 140 of the first first heat dissipation fin 14b, so that the upper edge 141 of the plurality of first heat dissipation fins 14 is The top surface 148 of the first heat dissipation fin group 13 is formed on the same horizontal surface and the lower surface 142 of the first heat dissipation fin 14 is on the same horizontal surface and together constitute the bottom surface 149 of the first heat dissipation fin group 13 .

Referring to FIG. 3, the center of the main body 140 of the first heat dissipation fin 14c of the leftmost end of the first heat dissipation fin group 13 is integrally stamped toward the second heat dissipation fin group 15 to form a boss 143. The protruding height is equivalent to the length of the folded edge 141 of the first heat radiating fin 14c. The boss 143 includes a top plate 144, a first connecting plate 145 and a second connecting plate 146. The top plate 144 is parallel to the body 140 of the first heat radiating fin 14c. The first connecting plate 145 and the second connecting plate 146 are opposite to the top plate 144. Upper and lower ends, the first connecting plate 145 is tilted The second connecting plate 146 is obliquely connected between the lower edge of the top plate 144 and the body 140 of the first heat radiating fin 14c.

The second heat dissipation fin group 15 is formed by stacking a plurality of second heat dissipation fins 16 in the same direction, and an air flow passage 17 is formed between the adjacent two second heat dissipation fins 16 . The second heat dissipation fin 16 includes a body 160, an upper flange 161 and a lower flange 162. The upper flange 161 and the lower flange 162 are integrally formed by the upper and lower edges of the body 160. The upper edge 161 and the lower edge 162 of the second heat dissipation fin 16a respectively abut against the body 160 of the first second heat dissipation fin 16b, and the upper edge 161 of the plurality of second heat dissipation fins 16 are in the same The top surface 168 of the second heat dissipation fin group 15 is formed on the horizontal surface and the lower surface 162 of the second heat dissipation fin 16 is on the same horizontal surface and together constitute the bottom surface 169 of the second heat dissipation fin group 15 .

The first heat dissipation fin group 13 and the second heat dissipation fin group 15 have the same extension directions of the upper flanges 141 and 161 and the lower flanges 142 and 162 , and all the first heat dissipation fins 14 and all the second heat dissipation fins 16 . The upper flanges 141, 161 are arranged in a row and attached to the bottom end surface 122 of the condensation section 123 of the heat pipe 12. The first heat dissipation fin 14c of the leftmost end of the first heat dissipation fin group 13 is adjacent to the second heat dissipation fin 16c of the rightmost end of the second heat dissipation fin group 15, that is, the first heat dissipation fin of the first heat dissipation fin group 13 14c is adjacent to the second heat dissipation fin 16c of the second heat dissipation fin group 15. The upper edge 144 of the first heat dissipation fin 14c abuts against the upper edge of the body 160 of the second heat dissipation fin 16c, and the top plate 144 of the boss 143 of the first heat dissipation fin 14c abuts against the second heat dissipation fin 16c. On the body 160.

The heat is transferred from the condensation section 123 of the heat pipe 12 to the first heat dissipation fin group 13 and the second heat dissipation fin group 15 , and the heat dissipation fan 11 generates an air flow and blows the first heat dissipation fin group 13 and the second heat dissipation fin group 15 , The air flow is provided by the first heat dissipation fin group 13 and the second heat dissipation fin group 15 The air flow passage 17 radiates heat of the first heat radiation fin group 13 and the second heat radiation fin group 15 to the outside air.

The heat sink 10 abuts against the body 160 of the second heat sink fin 16c by the boss 143 of the first heat sink fin 14c, so that the second heat sink fin 16c does not fit into the first recess 147 of the first heat sink fin 14c. The overall length of the first heat dissipation fin group 13 and the second heat dissipation fin group 15 is not reduced, conforms to the safety specifications of the notebook computer, and the first heat dissipation fin group 13 and the second heat dissipation fin group 15 can be ensured. The connection is open and the noise is low. Further, in the process of soldering the first heat dissipation fin group 13 and the second heat dissipation fin group 15 to the heat pipe 12, the solder paste is applied to all the first heat dissipation fins 14 and the second heat dissipation fins 16 The edge 141 of the first heat dissipation fin 14c abuts against the body 160 of the second heat dissipation fin 16c, and the upper edge 161 of the second heat dissipation fin 16c is not stacked on the first heat dissipation fin. The underside of the folded edge 141 of the sheet 14c ensures that all the first heat dissipating fins 14 in the subsequent manufacturing steps are at the same level as the upper 141, 161 of the second heat dissipating fins 16 to avoid uneven solder paste distribution. The partial heat resistance of the rear heat dissipating device 10 is relatively high, and in particular, the solder paste of the folded edge 161 of the second heat dissipating fin 16 is not in contact with the bottom end surface 122 of the condensation section 123 of the heat pipe 12, thereby improving the heat dissipation efficiency of the entire heat dissipating device 10. Reduce the defect rate of finished products.

4 shows a heat sink 20 according to another preferred embodiment of the present invention, which differs from the previous preferred embodiment in that the center of the body 260 of the second heat sink fin 26c at the rightmost end of the second heat sink fin group 25 is A protrusion 263 is formed on the side of the first heat dissipation fin group 23, and the protrusion height of the protrusion 263 is equal to the length of the upper edge 241 of the first heat dissipation fin 24c of the leftmost side of the first heat dissipation fin group 23. The boss 263 abuts against the body 240 of the first heat dissipation fin 24c. The specific structure of the boss 263 is the same as that of the boss 143.

In summary, the present invention conforms to the requirements of the invention patent, and proposes a patent application according to law. The above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art will be included in the following claims.

14, 14c, 16, 16c‧‧‧ heat sink fins

14b, 16b‧‧‧Previous heat sink fins

14a, 16a‧‧‧A heat sink fin

140, 160‧‧‧ ontology

141,161‧‧‧Upper fold

142, 162‧‧‧ hem

143‧‧‧Boss

144, 148‧‧‧ top board

145‧‧‧First connecting plate

146‧‧‧Second connection plate

14‧‧‧First depression

148, 168‧‧‧ top board

149, 169‧‧ ‧ bottom plate

Claims (11)

A heat dissipation device includes a heat pipe, a first heat dissipation fin group and a second heat dissipation fin group, wherein the first heat dissipation fin group and the second heat dissipation fin group are each formed by stacking a plurality of heat dissipation fins, and each heat dissipation fin includes a body and a flange formed by the extension of the body, the heat pipe is attached to the first heat dissipation fin set and the second heat dissipation fin set, and the first heat dissipation fin set has a first adjacent to the second heat dissipation fin set a heat dissipation fin, the second heat dissipation fin group has a second heat dissipation fin adjacent to the first heat dissipation fin group, and the improvement is that the first and second heat dissipation fin groups each have an upper folded edge on the same plane The lower flanges together form a top surface, and the lower flanges together form a bottom surface. The height of the first heat dissipation fin group is different from the height of the second heat dissipation fin group, and the first and second heat dissipation fin groups The top surface of the first heat dissipation fin and the second heat dissipation fin are separated from each other by a distance from the bottom surface of the first heat dissipation fin and the second heat dissipation fin. The boss abuts against the first heat sink fin and the second heat sink fin On the body. The heat dissipating device of claim 1, wherein the heat pipe is a flat heat pipe, the heat pipe has a bottom end surface, and the bottom end surface is attached to the top surface of the first heat dissipation fin group and the second heat dissipation fin group . The heat dissipation device of claim 1, wherein the height of the first heat dissipation fin group is greater than the height of the second heat dissipation fin group. The heat dissipation device of claim 3, wherein the first heat dissipation fin group and the second heat dissipation fin group have the same flange extending direction, and the first heat dissipation fin has a folded edge against the second heat dissipation fin The upper side edge of the body of the piece. The heat dissipation device of claim 4, wherein the protrusion is formed on the first heat dissipation fin, the protrusion protrudes toward a side of the second heat dissipation fin, and the protrusion height of the protrusion is the first The length of the flange of the heat sink fin is equal. The heat dissipation device of claim 4, wherein the protrusion is formed on the second heat dissipation fin, the protrusion protrudes toward a side of the first heat dissipation fin, and the protrusion height of the protrusion and the first The length of the flange of the heat sink fin is equal. The heat dissipation device of any one of claims 1 to 6, wherein the boss comprises a top plate and a first connecting plate and a second connecting plate on opposite sides of the top plate, wherein the top plate is parallel to the body of the heat dissipating fin, A connecting plate and a second connecting plate are respectively obliquely connected between the top plate and the body of the heat dissipating fin. The heat dissipation device of claim 7, further comprising a heat dissipation fan having an air outlet, the heat pipe comprising a condensation section, the condensation section of the heat pipe being located at the top of the air outlet of the heat dissipation fan, the first heat dissipation fin group and the first The two heat sink fin sets are located at the air outlet of the heat dissipation fan. A heat dissipation device includes a first heat dissipation fin group and a second heat dissipation fin group, wherein the first heat dissipation fin group and the second heat dissipation fin group are each formed by stacking a plurality of heat dissipation fins, each heat dissipation fin including a body And a flange formed by extending from a side edge of the body, the first heat dissipation fin set has a first heat dissipation fin adjacent to the second heat dissipation fin group, and the second heat dissipation fin group has a first heat dissipation fin The second heat-dissipating fins of the group are improved in that the first and second heat-dissipating fin groups each have an upper folded edge and a lower folded edge on the same plane, and the upper folded edge collectively constitutes a top surface, and the lower folded edge is common Forming the bottom surface, the height of the first heat dissipation fin group is different from the height of the second heat dissipation fin group, and the top surfaces of the first and second heat dissipation fin groups are coplanar and level with the heat pipe side, first, first The bottom surface of the two heat dissipating fins is separated by a distance, and the first heat dissipating fin and the main body of the second heat dissipating fin are integrally formed to form a boss, and the first heat dissipating fin and the second heat dissipating fin are respectively The body of one abuts against the boss. The heat dissipating device of claim 9, further comprising a heat pipe attached to the top surface. The heat dissipating device of claim 9 or 10, wherein the boss comprises a top plate and a first connecting plate and a second connecting plate on opposite sides of the top plate, the top plate being parallel to the body of the heat dissipating fin The first connecting plate and the second connecting plate are respectively obliquely connected between the top plate and the body of the heat dissipating fin.