TWI457060B - 觸控面板及其製造方法 - Google Patents

觸控面板及其製造方法 Download PDF

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Publication number
TWI457060B
TWI457060B TW101100163A TW101100163A TWI457060B TW I457060 B TWI457060 B TW I457060B TW 101100163 A TW101100163 A TW 101100163A TW 101100163 A TW101100163 A TW 101100163A TW I457060 B TWI457060 B TW I457060B
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TW
Taiwan
Prior art keywords
electrode
connection electrode
parts
weight
substrate
Prior art date
Application number
TW101100163A
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English (en)
Other versions
TW201236526A (en
Inventor
Young Sun You
Yong Jin Lee
Kyoung Hoon Chai
Dong Youl Lee
Young Jin Noh
Sun Young Lee
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Lg Innotek Co Ltd
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Application filed by Lg Innotek Co Ltd filed Critical Lg Innotek Co Ltd
Publication of TW201236526A publication Critical patent/TW201236526A/zh
Application granted granted Critical
Publication of TWI457060B publication Critical patent/TWI457060B/zh

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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0446—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0443—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a single layer of sensing electrodes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04112—Electrode mesh in capacitive digitiser: electrode for touch sensing is formed of a mesh of very fine, normally metallic, interconnected lines that are almost invisible to see. This provides a quite large but transparent electrode surface, without need for ITO or similar transparent conductive material
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Position Input By Displaying (AREA)
  • Manufacture Of Switches (AREA)

Claims (19)

  1. 一種觸控面板之製造方法，包括：提供一基板；形成一透明電極於該基板上；藉由印刷，塗覆一連接電極材料於該基板；藉由烘乾該連接電極材料而形成一連接電極；以及形成一電路板於該連接電極上，其中該連接電極具有一等於或少於100μm的寬度。
  2. 如申請專利範圍第1項所述之方法，其中塗覆該連接電極材料係藉由包括凹板膠印印刷(gravure offset printing)、反轉膠印印刷(reverse offset printing)、網版印刷(screen printing)、以及凹版印刷(gravure printing)中之至少一者。
  3. 如申請專利範圍第1項所述之方法，其中在塗覆該連接電極材料中，藉由一單一製程而形成一單層。
  4. 如申請專利範圍第1項所述之方法，其中該連接電極材料包括一金屬漿料(paste)。
  5. 如申請專利範圍第4項所述之方法，其中該漿料包含一銀粉末、一粘合劑、以及一溶劑。
  6. 如申請專利範圍第5項所述之方法，其中該漿料包括對於每100重量份(100 parts by weight)之漿料中，該銀粉末為60至85重量份。
  7. 如申請專利範圍第5項所述之方法，其中該粘合劑包括一含有環氧化合物之粘合劑。
  8. 如申請專利範圍第5項所述之方法，其中該漿料包括對於每100重量份之漿料中，該粘合劑為5至15重量份。
  9. 如申請專利範圍第5項所述之方法，其中該溶劑包括一含有乙醚之溶劑。
  10. 如申請專利範圍第9項所述之方法，其中對於每100重量份之漿料中，該溶劑為10至25重量份。
  11. 如申請專利範圍第2項所述之方法，其中形成該連接電極的溫度在150℃至200℃的範圍內進行。
  12. 如申請專利範圍第11項所述之方法，其中該連接電極材料係藉由一熱風烘乾法和紅外線烘乾法中至少一者來進行烘乾。
  13. 如申請專利範圍第1項所述之方法，其中該連接電極具有1μm至10μm範圍的厚度。
  14. 如申請專利範圍第1項所述之方法，其中該連接電極具有30μm至100μm範圍的寬度。
  15. 如申請專利範圍第1項所述之方法，其中該印刷電路板係與該連接電極直接接觸。
  16. 一種觸控面板，包含：一基板；一透明電極在該基板上；一連接電極連接至該透明電極；以及 一印刷電路板連接至該連接電極，其中該連接電極和該印刷電路板係相互直接接觸，以及其中該連接電極具有一等於或少於100μm的寬度。
  17. 如申請專利範圍第16項所述之觸控面板，其中該連接電極具有1μm至10μm範圍的厚度。
  18. 如申請專利範圍第16項所述之觸控面板，其中該連接電極具有30μm至100μm範圍的寬度。
  19. 一種觸控面板，包括：一基板；一透明電極在該基板上；一連接電極，與該透明電極連接；以及一電路板，與該連接電極連接，其中該連接電極與該電路板相互直接接觸，以及其中該連接電極包括，對於該連接電極之每100重量份(100 parts by weight)中，銀粉末佔60至85重量份。
TW101100163A 2011-01-03 2012-01-03 觸控面板及其製造方法 TWI457060B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020110000297A KR101734555B1 (ko) 2011-01-03 2011-01-03 터치 패널의 제조 방법

Publications (2)

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TW201236526A TW201236526A (en) 2012-09-01
TWI457060B true TWI457060B (zh) 2014-10-11

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US (1) US9900995B2 (zh)
KR (1) KR101734555B1 (zh)
TW (1) TWI457060B (zh)
WO (1) WO2012093827A2 (zh)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103677389A (zh) * 2012-09-20 2014-03-26 东友精细化工有限公司 触摸屏面板及其制备方法
CN103677390A (zh) * 2012-09-21 2014-03-26 东友精细化工有限公司 触摸屏面板及其制备方法
CN103699253B (zh) * 2012-09-27 2017-10-03 宝宸（厦门）光学科技有限公司 触控装置结构及其制造方法
TWI537782B (zh) 2012-11-30 2016-06-11 Ｌｇ化學股份有限公司 觸控螢幕及顯示裝置
TWI450653B (zh) * 2012-12-06 2014-08-21 Wintek Corp 接墊結構
KR102119810B1 (ko) * 2013-09-11 2020-06-05 엘지이노텍 주식회사 디스플레이 장치
KR102119834B1 (ko) * 2013-09-11 2020-06-05 엘지이노텍 주식회사 터치 윈도우 및 이를 포함하는 디스플레이 장치
KR102108844B1 (ko) * 2013-09-11 2020-05-11 엘지이노텍 주식회사 디스플레이 장치
KR102108837B1 (ko) * 2013-09-11 2020-05-11 엘지이노텍 주식회사 디스플레이 장치
KR102152843B1 (ko) * 2013-10-02 2020-09-07 엘지이노텍 주식회사 터치 패널
KR102212889B1 (ko) * 2014-01-23 2021-02-08 엘지이노텍 주식회사 터치 윈도우 및 이를 포함하는 디스플레이 장치
KR102275892B1 (ko) * 2014-03-11 2021-07-12 엘지이노텍 주식회사 터치패널
CN106299148B (zh) * 2015-06-10 2018-04-03 上海和辉光电有限公司 显示面板的封装结构及封装方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201022383A (en) * 2008-09-22 2010-06-16 Shinetsu Polymer Co Conductive polymer solution, conductive coating film and input device

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100611878B1 (ko) * 1999-06-30 2006-08-11 다이요 유덴 가부시키가이샤 전자재료 조성물, 전자 용품 및 전자재료 조성물의 사용방법
KR100337026B1 (ko) * 2000-05-16 2002-05-17 한승국 터치판넬 제조 방법 및 그에 사용되는 아이티오 필름 제조장치
KR100417803B1 (ko) 2000-07-22 2004-02-05 아이티엠 주식회사 마스크를 이용한 터치패널 제조방법
US20050046622A1 (en) * 2003-08-26 2005-03-03 Akira Nakanishi Touch panel and electronic device using the same
US8243032B2 (en) * 2006-06-12 2012-08-14 Sharp Kabushiki Kaisha Touch panel, display device and touch panel manufacturing method
US7582403B2 (en) * 2006-07-17 2009-09-01 E. I. Du Pont De Nemours And Company Metal compositions, thermal imaging donors and patterned multilayer compositions derived therefrom
WO2009122473A1 (ja) * 2008-03-31 2009-10-08 シャープ株式会社 表示装置及びそれを備えた電子機器並びにタッチパネル
KR100894710B1 (ko) * 2008-06-27 2009-04-24 (주) 월드비젼 윈도우 일체형 터치스크린 및 이의 제조방법
KR101048980B1 (ko) * 2009-01-16 2011-07-12 삼성모바일디스플레이주식회사 터치 스크린 패널 및 그 제조방법
JP2010267223A (ja) 2009-05-18 2010-11-25 Seiko Epson Corp タッチパネルの製造方法及び表示装置製造方法並びに電子機器製造方法
JP5407599B2 (ja) * 2009-07-01 2014-02-05 パナソニック株式会社 タッチパネル
KR20110083381A (ko) * 2010-01-14 2011-07-20 삼성전기주식회사 터치스크린 입력장치
KR20120038194A (ko) * 2010-10-13 2012-04-23 삼성전기주식회사 전도성 필름 및 그 제조방법

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201022383A (en) * 2008-09-22 2010-06-16 Shinetsu Polymer Co Conductive polymer solution, conductive coating film and input device

Also Published As

Publication number Publication date
KR101734555B1 (ko) 2017-05-11
WO2012093827A3 (en) 2012-11-08
TW201236526A (en) 2012-09-01
KR20120078972A (ko) 2012-07-11
US20130279138A1 (en) 2013-10-24
US9900995B2 (en) 2018-02-20
WO2012093827A2 (en) 2012-07-12

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