TWI455791B - Method for manufacturing suction cup plate for electrostatic chuck - Google Patents

Method for manufacturing suction cup plate for electrostatic chuck Download PDF

Info

Publication number
TWI455791B
TWI455791B TW098144477A TW98144477A TWI455791B TW I455791 B TWI455791 B TW I455791B TW 098144477 A TW098144477 A TW 098144477A TW 98144477 A TW98144477 A TW 98144477A TW I455791 B TWI455791 B TW I455791B
Authority
TW
Taiwan
Prior art keywords
chuck
electrostatic chuck
manufacturing
wet blasting
sintered body
Prior art date
Application number
TW098144477A
Other languages
Chinese (zh)
Other versions
TW201032943A (en
Inventor
Takahiro Nanba
Naoki Morimoto
Kouji Sogabe
Masahiko Ishida
Original Assignee
Ulvac Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ulvac Inc filed Critical Ulvac Inc
Publication of TW201032943A publication Critical patent/TW201032943A/en
Application granted granted Critical
Publication of TWI455791B publication Critical patent/TWI455791B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
    • B23Q3/15—Devices for holding work using magnetic or electric force acting directly on the work
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating or a hardness or a material

Claims (2)

一種靜電吸盤用之吸盤平板的製造方法，係為將具備有電極之吸盤本體的表面作覆蓋之由介電質所成的靜電吸盤用之吸盤平板之製造方法，其特徵為，包含有：將原料粉末壓縮成形為特定之形狀，而後進行燒結並得到燒結體之工程：和對於前述燒結體中之與應吸著的基板相抵接之表面，藉由研磨加工而形成為特定之表面粗度以及平坦度之工程；和施加僅將伴隨著前述研磨加工而在前述表面上所產生之即將脫粒的粒子作選擇性除去的濕噴砂處理之工程，將藉由濕噴砂而噴吹之水壓設定為0.01~0.05MPa，並且將壓縮空氣之壓力設定為0.1~0.3MPa。 A method for manufacturing a chuck plate for an electrostatic chuck is a method for manufacturing a chuck plate for electrostatic chucks comprising a surface of a chuck body having an electrode covered with a dielectric body, characterized in that: The raw material powder is compression-molded into a specific shape, and then sintered to obtain a sintered body: and a surface abutting on the substrate to be sucked in the sintered body is formed into a specific surface roughness by grinding processing and The work of flatness; and the application of wet blasting which selectively removes the particles to be threshed which are generated on the aforementioned surface along with the aforementioned grinding process, and sets the water pressure to be sprayed by wet blasting to 0.01~0.05MPa, and the pressure of the compressed air is set to 0.1~0.3MPa. 如申請專利範圍第1項所記載之靜電吸盤用之吸盤平板的製造方法，其中，將在濕噴砂中所使用之砥粒的粒徑，設為前述燒結體之平均粒徑以下。 The method for producing a chuck plate for an electrostatic chuck according to the first aspect of the invention, wherein the particle size of the niobium particles used in wet blasting is equal to or less than an average particle diameter of the sintered body.
TW098144477A 2008-12-25 2009-12-23 Method for manufacturing suction cup plate for electrostatic chuck TWI455791B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008329612 2008-12-25

Publications (2)

Publication Number Publication Date
TW201032943A TW201032943A (en) 2010-09-16
TWI455791B true TWI455791B (en) 2014-10-11

Family

ID=42287172

Family Applications (1)

Application Number Title Priority Date Filing Date
TW098144477A TWI455791B (en) 2008-12-25 2009-12-23 Method for manufacturing suction cup plate for electrostatic chuck

Country Status (9)

Country Link
US (1) US20110256810A1 (en)
JP (1) JP5188584B2 (en)
KR (1) KR101316804B1 (en)
CN (1) CN102265390B (en)
DE (1) DE112009003808T5 (en)
RU (1) RU2486631C2 (en)
SG (1) SG171819A1 (en)
TW (1) TWI455791B (en)
WO (1) WO2010073514A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT521222B1 (en) * 2018-05-07 2020-04-15 Engel Austria Gmbh Device for handling and local fixing

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TW527264B (en) * 2001-06-28 2003-04-11 Lam Res Corp Ceramic electrostatic chuck assembly and method of making
TW200423250A (en) * 2003-02-03 2004-11-01 Octec Inc Plasma processing device, electrode plate for the same, and manufacturing method for electrode plate
TWI247646B (en) * 2003-10-29 2006-01-21 Taiwan Semiconductor Mfg Disassembling device
TW200715357A (en) * 2005-07-21 2007-04-16 Sumitomo Heavy Industries Stage device

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TW472500B (en) * 1999-08-12 2002-01-11 Ibiden Co Ltd Ceramic substrate, ceramic heater, electrostatic chuck and wafer probe for semiconductor manufacturing and checking device
TW527264B (en) * 2001-06-28 2003-04-11 Lam Res Corp Ceramic electrostatic chuck assembly and method of making
TW200423250A (en) * 2003-02-03 2004-11-01 Octec Inc Plasma processing device, electrode plate for the same, and manufacturing method for electrode plate
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Also Published As

Publication number Publication date
KR101316804B1 (en) 2013-10-11
CN102265390A (en) 2011-11-30
SG171819A1 (en) 2011-07-28
RU2011130815A (en) 2013-01-27
WO2010073514A1 (en) 2010-07-01
RU2486631C2 (en) 2013-06-27
JP5188584B2 (en) 2013-04-24
US20110256810A1 (en) 2011-10-20
DE112009003808T5 (en) 2012-06-06
KR20110107796A (en) 2011-10-04
JPWO2010073514A1 (en) 2012-06-07
TW201032943A (en) 2010-09-16
CN102265390B (en) 2014-10-15

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