TWI455362B - Method of packaging light emitting element - Google Patents

Description

Light emitting device packaging method

The present invention relates to a method of packaging a semiconductor light emitting device.

A general light-emitting element such as a light-emitting diode needs to be packaged to form a single particle, which is then applied to various fields such as display, illumination, and the like.

The package of the light-emitting diode usually includes a process of solid crystal, wire bonding, potting, baking, cutting, and the like. In the solid crystal phase, the solid crystal glue is usually formed on the surface of the package carrier by using an implement, and the LED chips are fixed one by one on the solid crystal glue formed above, and when the LED is packaged in batches, it is necessary to package the LEDs in batches. Repeat the above steps and then proceed with the subsequent other packaging process.

However, the above-mentioned solid crystal process has many defects, and cannot meet the demand of rapidly and excellently packaged light-emitting diodes in large quantities in the industry. Firstly, the position of the luminescent diode and the solid crystal glue cannot be accurately positioned, and the amount of the solid crystal glue is inconsistent, causing the luminescent diode crystal grains to fall off easily or the position of the luminescent diode crystal grains is inconsistent, thereby affecting Yield. In addition, the steps of forming the solid crystal glue and fixing the light-emitting diode grains are repeated, which results in a long time for the solid crystal processing process and reduces the efficiency. Therefore, how to provide a more efficient LED package method is still a problem that the industry needs to solve.

In view of this, it is necessary to provide a more efficient method of packaging a light-emitting element.

A light emitting device packaging method, the steps comprising:

a first step of providing a package substrate;

a second step of forming a casing on the package substrate, wherein the casing is provided with a plurality of holes;

In the third step, the quantitative solid crystal glue is separately formed in the hole of the casing;

a fourth step of fixing a blue film having a plurality of light-emitting elements to a housing, wherein the light-emitting elements correspond to positions of the holes, and the light-emitting elements are fixed by a die bonding glue in the holes;

a fifth step of separating the blue film from the light emitting element and removing the blue film from the housing; and

In a sixth step, the housing is removed from the package substrate.

Compared with the prior art, the present invention utilizes a housing to assist in positioning the position of the solid glue and the light-emitting element, so that the position of the light-emitting element is uniform, thereby improving the process yield. At the same time, a quantitative solid crystal glue and a primary positioning light-emitting element can be formed at one time, which can simplify the process flow and improve the process efficiency.

Fig. 1 shows the flow of a method of packaging a light-emitting element according to an embodiment of the present invention. The light emitting device packaging method generally includes the following processes:

a first step, providing a package substrate 10;

a second step, forming a housing 20 on the package substrate 10, the housing 20 is provided with a plurality of holes 22;

In the third step, the quantitative solid glue 30 is formed in the hole 22 of the housing 20;

In a fourth step, the blue film 40 having the plurality of light-emitting elements 42 is fixed to the casing 20, the light-emitting elements 42 correspond to the positions of the holes 22 in the casing 20, and the light-emitting elements 42 are fixed by the solid crystals in the holes 22. The glue 30 is fixed;

In a fifth step, the blue film 40 is separated from the light emitting element 42 and the blue film 40 is removed from the housing 20;

In a sixth step, the housing 20 is removed from the package substrate 10.

The process will be described in detail below in conjunction with other diagrams. Referring also to FIG. 2, first, a package substrate 10 is provided. In some embodiments, a circuit structure (not shown) may be formed on the package substrate 10 for forming an electrical connection with the light emitting element 42. Next, a patterned housing 20 is formed on the package substrate 10, and a plurality of patterned holes 22 are formed on the housing 20.

Referring to FIG. 3, a die bond 30 is formed in the hole 22 by means of an implement. The manner in which the die bonding glue 30 is formed in the holes 22 can be various, for example, in the form of a printing coating. In the above manner, the solid crystal adhesive 30 can be formed on the package substrate 10 at one time. Compared with the conventional formation of the solid crystal glue in the conventional technology, the efficiency of the solid crystal process is greatly improved.

Referring to FIG. 4-5 again, a plurality of light-emitting elements 42 are bonded to a blue film 40. The light-emitting elements 42 may be light-emitting devices such as light-emitting diode crystal grains and organic light-emitting diode crystal grains. Light-emitting diode grains. The blue film 40 is fixed to the casing 20 with the light-emitting element 42 facing the hole 22 in the casing 20. By fixing the blue film 40, the light-emitting element 42 is fixed on the package substrate 10 by the die bonding paste 30.

Then, the viscosity of the blue film 40 is removed by, for example, ultraviolet light irradiation to separate the light-emitting element 42 from the blue film 40. Referring again to FIG. 6, the viscous blue film 40 is then removed from the housing 20. Finally, as shown in FIG. 7, the case 20 is removed from the package substrate 10, so that the light-emitting element 42 is fixed on the package substrate 10. The present invention utilizes the patterned housing 20 to assist in positioning the position and amount of the bonding adhesive 30, as well as assisting in locating the position of the illuminating element 42 such that the position of the illuminating element 42 is uniform, thereby improving process yield. At the same time, a uniform amount of solid crystal glue 30 and a primary positioning light-emitting element 42 can be formed at one time, which can simplify the process and improve the process efficiency.

Wherein, the electrical connection between the light-emitting element 42 and the circuit structure on the package substrate 10 can be performed in various ways. For example, a conductive solid glue 30 can be used, and in the fourth step, the light-emitting element 42 is fixed on the package substrate 10 in the form of a wafer flip-chip, and is electrically conductive with a bonding adhesive 30. The circuit structure forms an electrical connection. Of course, other methods may be employed. For example, the light-emitting element 42 may be electrically connected to the circuit structure on the package substrate 10 by wire bonding after the sixth step.

After the sixth step, an encapsulation layer (not shown) is also formed to cover the light-emitting elements 42. A phosphor layer may be formed on the surface of the encapsulation layer, the phosphor layer comprising garnet-based phosphor powder, citrate-based phosphor powder, orthosilicate-based phosphor powder, sulfide-based phosphor powder, sulfur One or more of a gallium-based phosphor powder, an oxynitride-based phosphor powder, and a nitride-based phosphor powder. In some embodiments, the phosphor powder may also be added in the encapsulation layer, and the phosphor powder may be garnet-based phosphor powder, citrate-based phosphor powder, orthosilicate-based phosphor powder, sulfide. One or more of a base fluorescent powder, a thiogallate-based fluorescent powder, an oxynitride-based fluorescent powder, and a nitride-based fluorescent powder.

In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Equivalent modifications or variations made by persons skilled in the art in light of the spirit of the invention are intended to be included within the scope of the following claims.

10. . . Package substrate

20. . . case

twenty two. . . Hole

30. . . Solid crystal glue

40. . . Blue film

42. . . Light-emitting element

1 is a flow chart of a method of packaging a light emitting device according to an embodiment of the present invention.

2 to FIG. 7 are schematic diagrams showing steps of a method of packaging a light-emitting element according to an embodiment of the present invention.

Claims (9)

A light emitting device packaging method, the steps comprising:
a first step of providing a package substrate;
a second step of forming a casing on the package substrate, wherein the casing is provided with a plurality of holes;
In the third step, the quantitative solid crystal glue is separately formed in the hole of the casing;
a fourth step of fixing a blue film having a plurality of light-emitting elements to a housing, wherein the light-emitting elements correspond to positions of the holes, and the light-emitting elements are fixed by a die bonding glue in the holes;
In a fifth step, the blue film is separated from the light emitting element and the blue film is removed from the housing; and in a sixth step, the housing is removed from the package substrate. The light-emitting device package method of claim 1, wherein the package substrate is provided with a circuit structure, and the die-bonding adhesive is a conductive paste, and the light-emitting component is flip-chip in the fourth step. Electrically connected to the circuit structure on the package substrate. The light-emitting device package method according to claim 1, wherein the package substrate is provided with a circuit structure, and the light-emitting element is electrically connected to the circuit structure on the package substrate in a wire bonding manner after the sixth step. The light-emitting device package method according to claim 1, wherein in the fifth step, the blue film is separated from the light-emitting element by ultraviolet light irradiation. The method of packaging a light-emitting element according to claim 1, further comprising the step of forming an encapsulation layer covering the light-emitting element after the sixth step. The method of packaging a light-emitting element according to claim 5, further comprising the step of forming a phosphor layer on a surface of the encapsulation layer. The light emitting device packaging method according to claim 5, wherein the encapsulating layer contains a phosphor powder. The light-emitting device package method according to any one of claims 1 to 7, wherein the light-emitting element is a light-emitting diode. The light-emitting device package method according to claim 6 or 7, wherein the phosphor layer or the phosphor powder comprises garnet-based phosphor powder, citrate-based phosphor powder, orthosilicate-based phosphor One or more of powder, sulfide-based phosphor powder, thiogallate-based phosphor powder, oxynitride-based phosphor powder, and nitride-based phosphor powder.