TWI453943B - 具簡化之光擷取的降頻轉換發光二極體 - Google Patents

具簡化之光擷取的降頻轉換發光二極體 Download PDF

Info

Publication number
TWI453943B
TWI453943B TW097145372A TW97145372A TWI453943B TW I453943 B TWI453943 B TW I453943B TW 097145372 A TW097145372 A TW 097145372A TW 97145372 A TW97145372 A TW 97145372A TW I453943 B TWI453943 B TW I453943B
Authority
TW
Taiwan
Prior art keywords
led
wavelength converter
light
wavelength
layer
Prior art date
Application number
TW097145372A
Other languages
English (en)
Chinese (zh)
Other versions
TW200939538A (en
Inventor
李 史密斯 泰瑞
艾爾伯特 赫斯 麥克
威爾森 凱莉 湯米
安 麗瑟戴爾 凱瑟琳
Original Assignee
3M新設資產公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M新設資產公司 filed Critical 3M新設資產公司
Publication of TW200939538A publication Critical patent/TW200939538A/zh
Application granted granted Critical
Publication of TWI453943B publication Critical patent/TWI453943B/zh

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/30Die-attach connectors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01Manufacture or treatment
    • H10H20/011Manufacture or treatment of bodies, e.g. forming semiconductor layers
    • H10H20/018Bonding of wafers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/81Bodies
    • H10H20/813Bodies having a plurality of light-emitting regions, e.g. multi-junction LEDs or light-emitting devices having photoluminescent regions within the bodies
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/84Coatings, e.g. passivation layers or antireflective coatings
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/851Wavelength conversion means
    • H10H20/8511Wavelength conversion means characterised by their material, e.g. binder
    • H10H20/8512Wavelength conversion materials

Landscapes

  • Led Device Packages (AREA)
  • Optical Filters (AREA)
TW097145372A 2007-12-10 2008-11-24 具簡化之光擷取的降頻轉換發光二極體 TWI453943B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US1260407P 2007-12-10 2007-12-10

Publications (2)

Publication Number Publication Date
TW200939538A TW200939538A (en) 2009-09-16
TWI453943B true TWI453943B (zh) 2014-09-21

Family

ID=40756057

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097145372A TWI453943B (zh) 2007-12-10 2008-11-24 具簡化之光擷取的降頻轉換發光二極體

Country Status (7)

Country Link
US (1) US20100295075A1 (https=)
EP (1) EP2232591A4 (https=)
JP (1) JP2011507272A (https=)
KR (1) KR20100097205A (https=)
CN (1) CN101897038B (https=)
TW (1) TWI453943B (https=)
WO (1) WO2009075972A2 (https=)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8338838B2 (en) * 2007-12-28 2012-12-25 3M Innovative Properties Company Down-converted light source with uniform wavelength emission
KR20110031953A (ko) * 2008-06-26 2011-03-29 쓰리엠 이노베이티브 프로퍼티즈 컴파니 반도체 광 변환 구조체
CN102124582B (zh) 2008-06-26 2013-11-06 3M创新有限公司 半导体光转换构造
JP2012514329A (ja) 2008-12-24 2012-06-21 スリーエム イノベイティブ プロパティズ カンパニー 両方の側に波長変換器を有する光生成デバイス
EP2380217A2 (en) 2008-12-24 2011-10-26 3M Innovative Properties Company Method of making double-sided wavelength converter and light generating device using same
DE102009020127B4 (de) * 2009-03-25 2025-12-31 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Leuchtdiode
DE102009023351A1 (de) 2009-05-29 2010-12-02 Osram Opto Semiconductors Gmbh Optoelektronischer Halbleiterchip und Verfahren zur Herstellung eines optoelektronischen Halbleiterchips
DE102009048401A1 (de) * 2009-10-06 2011-04-07 Osram Opto Semiconductors Gmbh Verfahren zum Herstellen eines optoelektronischen Halbleiterbauteils und optoelektronisches Halbleiterbauteil
DE102010008605A1 (de) * 2010-02-19 2011-08-25 OSRAM Opto Semiconductors GmbH, 93055 Optoelektronisches Bauteil
CN102270724B (zh) * 2010-06-01 2014-04-09 陈文彬 发光二极管晶片级色彩纯化的方法
TW201208143A (en) * 2010-08-06 2012-02-16 Semileds Optoelectronics Co White LED device and manufacturing method thereof
CN102593269A (zh) * 2011-01-11 2012-07-18 旭明光电股份有限公司 白光led装置及其制造方法
DE102011014845B4 (de) 2011-03-23 2023-05-17 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Licht emittierendes Halbleiterbauteil und Verfahren zur Herstellung eines Licht emittierenden Halbleiterbauteils
TWI466343B (zh) * 2012-01-06 2014-12-21 華夏光股份有限公司 發光二極體裝置
JP6396419B2 (ja) 2013-03-29 2018-09-26 フィリップス ライティング ホールディング ビー ヴィ 波長変換素子を有する発光装置
JP2015072751A (ja) * 2013-10-01 2015-04-16 株式会社ジャパンディスプレイ 有機el表示装置
WO2015112946A1 (en) 2014-01-27 2015-07-30 Osram Sylvania Inc. Ceramic wavelength converter having a high reflectivity reflector
US9529969B2 (en) * 2014-01-27 2016-12-27 RDFISolutions, LLC Event based tracking, health management, and patient and treatment monitoring system
DE102016101442B4 (de) * 2016-01-27 2025-03-13 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Konversionselement und strahlungsemittierendes Halbleiterbauelement mit einem solchen Konversionselement
CN106410006B (zh) * 2016-06-22 2018-08-17 厦门乾照光电股份有限公司 一种集成可见光指示装置的紫外发光二极管及其生产方法
DE102016113002B4 (de) 2016-07-14 2022-09-29 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Bauelemente mit verbesserter Effizienz und Verfahren zur Herstellung von Bauelementen
DE102018101089A1 (de) * 2018-01-18 2019-07-18 Osram Opto Semiconductors Gmbh Epitaktisches konversionselement, verfahren zur herstellung eines epitaktischen konversionselements, strahlungsemittierender halbleiterchip und verfahren zur herstellung eines strahlungsemittierenden halbleiterchips
EP4050666A1 (en) 2021-02-26 2022-08-31 Nichia Corporation Semiconductor light emitting element and method of manufacturing the same

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW465130B (en) * 1999-12-03 2001-11-21 Cree Lighting Co Enchanced light extraction through the use of micro-led arrays
US20050224835A1 (en) * 2002-02-04 2005-10-13 Sanyo Electric Co., Ltd. Nitride-based semiconductor laser device
US20060124917A1 (en) * 2004-12-09 2006-06-15 3M Innovative Properties Comapany Adapting short-wavelength LED's for polychromatic, Broadband, or "white" emission
US20070045609A1 (en) * 2005-06-16 2007-03-01 Cree, Inc. Quantum wells for light conversion
US20070200492A1 (en) * 2006-02-24 2007-08-30 Eastman Kodak Company Top-emitter OLED device structure and method

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3739217A (en) * 1969-06-23 1973-06-12 Bell Telephone Labor Inc Surface roughening of electroluminescent diodes
US6252896B1 (en) * 1999-03-05 2001-06-26 Agilent Technologies, Inc. Long-Wavelength VCSEL using buried bragg reflectors
JP4044261B2 (ja) * 2000-03-10 2008-02-06 株式会社東芝 半導体発光素子及びその製造方法
US6987613B2 (en) * 2001-03-30 2006-01-17 Lumileds Lighting U.S., Llc Forming an optical element on the surface of a light emitting device for improved light extraction
WO2002084631A1 (en) * 2001-04-11 2002-10-24 Sony Corporation Element transfer method, element arrangmenet method using the same, and image display apparatus production method
JP2003124504A (ja) * 2001-10-18 2003-04-25 Toshiba Corp 半導体発光装置、および半導体発光装置の製造方法
TW591811B (en) * 2003-01-02 2004-06-11 Epitech Technology Corp Ltd Color mixing light emitting diode
DE60341314C5 (de) * 2003-12-09 2023-03-23 The Regents Of The University Of California Hocheffiziente leuchtdioden auf galliumnitridbasis mit oberflächenaufrauhung
JP2005277374A (ja) * 2004-02-26 2005-10-06 Toyoda Gosei Co Ltd Iii族窒化物系化合物半導体発光素子及びその製造方法
US7361938B2 (en) * 2004-06-03 2008-04-22 Philips Lumileds Lighting Company Llc Luminescent ceramic for a light emitting device
US7534633B2 (en) * 2004-07-02 2009-05-19 Cree, Inc. LED with substrate modifications for enhanced light extraction and method of making same
US7964884B2 (en) * 2004-10-22 2011-06-21 Seoul Opto Device Co., Ltd. GaN compound semiconductor light emitting element and method of manufacturing the same
US7045375B1 (en) * 2005-01-14 2006-05-16 Au Optronics Corporation White light emitting device and method of making same
JP2006310721A (ja) * 2005-03-28 2006-11-09 Yokohama National Univ 自発光デバイス
JP2007109792A (ja) * 2005-10-12 2007-04-26 Sony Corp 半導体発光素子および波長変換基板
WO2007053624A2 (en) * 2005-10-31 2007-05-10 Trustees Of Boston University Optical devices featuring textured semiconductor layers
CN101395728B (zh) * 2006-03-10 2011-04-13 松下电工株式会社 发光元件及其制造方法
US20070284565A1 (en) * 2006-06-12 2007-12-13 3M Innovative Properties Company Led device with re-emitting semiconductor construction and optical element
US7863634B2 (en) * 2006-06-12 2011-01-04 3M Innovative Properties Company LED device with re-emitting semiconductor construction and reflector
US7902542B2 (en) * 2006-06-14 2011-03-08 3M Innovative Properties Company Adapted LED device with re-emitting semiconductor construction
US7627017B2 (en) * 2006-08-25 2009-12-01 Stc. Unm Laser amplifier and method of making the same
US20080121903A1 (en) * 2006-11-24 2008-05-29 Sony Corporation Method for manufacturing light-emitting diode, light-emitting diode, lightsource cell unit, light-emitting diode backlight, light-emitting diode illuminating device, light-emitting diode display, and electronic apparatus
EP2206164A2 (en) * 2007-10-08 2010-07-14 3M Innovative Properties Company Light emitting diode with bonded semiconductor wavelength converter

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW465130B (en) * 1999-12-03 2001-11-21 Cree Lighting Co Enchanced light extraction through the use of micro-led arrays
US20050224835A1 (en) * 2002-02-04 2005-10-13 Sanyo Electric Co., Ltd. Nitride-based semiconductor laser device
US20060124917A1 (en) * 2004-12-09 2006-06-15 3M Innovative Properties Comapany Adapting short-wavelength LED's for polychromatic, Broadband, or "white" emission
US20070045609A1 (en) * 2005-06-16 2007-03-01 Cree, Inc. Quantum wells for light conversion
US20070200492A1 (en) * 2006-02-24 2007-08-30 Eastman Kodak Company Top-emitter OLED device structure and method

Also Published As

Publication number Publication date
EP2232591A4 (en) 2013-12-25
WO2009075972A3 (en) 2009-08-20
US20100295075A1 (en) 2010-11-25
JP2011507272A (ja) 2011-03-03
TW200939538A (en) 2009-09-16
CN101897038A (zh) 2010-11-24
WO2009075972A2 (en) 2009-06-18
CN101897038B (zh) 2012-08-29
EP2232591A2 (en) 2010-09-29
KR20100097205A (ko) 2010-09-02

Similar Documents

Publication Publication Date Title
TWI453943B (zh) 具簡化之光擷取的降頻轉換發光二極體
CN101821866B (zh) 具有粘接的半导体波长转换器的发光二极管
TWI545353B (zh) 改良的高反射率鏡及其製造方法
CA2393081C (en) Enhanced light extraction in leds through the use of internal and external optical elements
EP2453490B1 (en) Light emitting devices with improved light extraction efficiency
CN101467274B (zh) 具有再发射半导体构造和光学元件的led装置
JP5623074B2 (ja) 光電子半導体部品
TWI636584B (zh) 發光二極體組件、包括該發光二極體組件的發光二極體、及微光學多層結構
US9419185B2 (en) Method of singulating LED wafer substrates into dice with LED device with Bragg reflector
US20090026471A1 (en) Light-scattering structure, light emitting device comprising the same and method of forming the same
CN108141011B (zh) 发光设备
US7915621B2 (en) Inverted LED structure with improved light extraction
Pynn et al. Enhanced light extraction from free-standing InGaN/GaN light emitters using bio-inspired backside surface structuring
CN104160518A (zh) 用于具有较高光提取率的led的结构化基底
Kang et al. Increased Light Extraction From GaN Light-Emitting Diodes by ${\rm SiN} _ {{\rm x}} $ Compound Eyes
JP2019522363A (ja) 性能の改善されたコンポーネント及びコンポーネントを製造するための方法
CN116314530B (zh) 无衬底的红光微型发光二极管及其制备方法
Pynn et al. Enhanced light extraction from free-standing InGaN/GaN light
Horng et al. Fabrication of nitride LEDs
CN101471388A (zh) 光电半导体装置
Ma Optically functional structures on GaN-based light-emitting diodes for light-extraction efficiency enhancement and emission pattern control

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees