TWI453424B - 電氣檢查用治具及配線基板之製造方法 - Google Patents

電氣檢查用治具及配線基板之製造方法 Download PDF

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Publication number
TWI453424B
TWI453424B TW100110683A TW100110683A TWI453424B TW I453424 B TWI453424 B TW I453424B TW 100110683 A TW100110683 A TW 100110683A TW 100110683 A TW100110683 A TW 100110683A TW I453424 B TWI453424 B TW I453424B
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TW
Taiwan
Prior art keywords
jig
electrical inspection
electrical
inspection
wires
Prior art date
Application number
TW100110683A
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English (en)
Chinese (zh)
Other versions
TW201142307A (en
Inventor
Yasuharu Yamada
Original Assignee
Ngk Spark Plug Co
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Publication date
Application filed by Ngk Spark Plug Co filed Critical Ngk Spark Plug Co
Publication of TW201142307A publication Critical patent/TW201142307A/zh
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Publication of TWI453424B publication Critical patent/TWI453424B/zh

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  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
  • Measuring Leads Or Probes (AREA)
TW100110683A 2010-03-30 2011-03-29 電氣檢查用治具及配線基板之製造方法 TWI453424B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010079020 2010-03-30
JP2011046319A JP5492808B2 (ja) 2010-03-30 2011-03-03 電気検査用治具、及び配線基板の製造方法

Publications (2)

Publication Number Publication Date
TW201142307A TW201142307A (en) 2011-12-01
TWI453424B true TWI453424B (zh) 2014-09-21

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Family Applications (1)

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TW100110683A TWI453424B (zh) 2010-03-30 2011-03-29 電氣檢查用治具及配線基板之製造方法

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JP (1) JP5492808B2 (ja)
TW (1) TWI453424B (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5966688B2 (ja) * 2012-07-04 2016-08-10 日本電産リード株式会社 配線構造及び基板検査装置

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000249738A (ja) * 1999-02-26 2000-09-14 Uht Corp テープ状物の導通検査装置
JP2005069954A (ja) * 2003-08-27 2005-03-17 Hioki Ee Corp 基板検査装置のための基板検査用治具および基板検査方法
TW200716997A (en) * 2005-10-21 2007-05-01 Advanced Semiconductor Eng Electrical testing device
TW200723989A (en) * 2005-12-09 2007-06-16 High Tech Comp Corp Printed circuit board and manufacturing method thereof
CN201035106Y (zh) * 2007-04-19 2008-03-12 纬创资通股份有限公司 测试模块
JP2008309587A (ja) * 2007-06-13 2008-12-25 Taiyo Kogyo Co Ltd プリント基板のユニバーサル機能を有する検査装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5376874U (ja) * 1976-11-29 1978-06-27
JPS6453429A (en) * 1987-08-24 1989-03-01 Mitsubishi Electric Corp Device for testing semiconductor chip

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000249738A (ja) * 1999-02-26 2000-09-14 Uht Corp テープ状物の導通検査装置
JP2005069954A (ja) * 2003-08-27 2005-03-17 Hioki Ee Corp 基板検査装置のための基板検査用治具および基板検査方法
TW200716997A (en) * 2005-10-21 2007-05-01 Advanced Semiconductor Eng Electrical testing device
TW200723989A (en) * 2005-12-09 2007-06-16 High Tech Comp Corp Printed circuit board and manufacturing method thereof
CN201035106Y (zh) * 2007-04-19 2008-03-12 纬创资通股份有限公司 测试模块
JP2008309587A (ja) * 2007-06-13 2008-12-25 Taiyo Kogyo Co Ltd プリント基板のユニバーサル機能を有する検査装置

Also Published As

Publication number Publication date
TW201142307A (en) 2011-12-01
JP2011227059A (ja) 2011-11-10
JP5492808B2 (ja) 2014-05-14

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