TWI450911B - Production method of polishing pad and semiconductor device (1) - Google Patents

Production method of polishing pad and semiconductor device (1) Download PDF

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Publication number
TWI450911B
TWI450911B TW100144370A TW100144370A TWI450911B TW I450911 B TWI450911 B TW I450911B TW 100144370 A TW100144370 A TW 100144370A TW 100144370 A TW100144370 A TW 100144370A TW I450911 B TWI450911 B TW I450911B
Authority
TW
Taiwan
Prior art keywords
polishing
light
field
polishing pad
thickness
Prior art date
Application number
TW100144370A
Other languages
English (en)
Chinese (zh)
Other versions
TW201217415A (en
Inventor
下村哲生
中森雅彥
山田孝敏
小川一幸
數野淳
渡邊公浩
Original Assignee
東洋橡膠工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2004069423A external-priority patent/JP4849587B2/ja
Priority claimed from JP2004069498A external-priority patent/JP4890744B2/ja
Application filed by 東洋橡膠工業股份有限公司 filed Critical 東洋橡膠工業股份有限公司
Publication of TW201217415A publication Critical patent/TW201217415A/zh
Application granted granted Critical
Publication of TWI450911B publication Critical patent/TWI450911B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/402—Chemomechanical polishing [CMP] of semiconductor materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
TW100144370A 2004-03-11 2004-10-20 Production method of polishing pad and semiconductor device (1) TWI450911B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004069423A JP4849587B2 (ja) 2003-03-11 2004-03-11 研磨パッドおよび半導体デバイスの製造方法
JP2004069498A JP4890744B2 (ja) 2003-03-11 2004-03-11 研磨パッドおよび半導体デバイスの製造方法

Publications (2)

Publication Number Publication Date
TW201217415A TW201217415A (en) 2012-05-01
TWI450911B true TWI450911B (zh) 2014-09-01

Family

ID=34975856

Family Applications (2)

Application Number Title Priority Date Filing Date
TW093131805A TW200530378A (en) 2003-03-11 2004-10-20 Polishing pad and semiconductor device manufacturing method
TW100144370A TWI450911B (zh) 2004-03-11 2004-10-20 Production method of polishing pad and semiconductor device (1)

Family Applications Before (1)

Application Number Title Priority Date Filing Date
TW093131805A TW200530378A (en) 2003-03-11 2004-10-20 Polishing pad and semiconductor device manufacturing method

Country Status (5)

Country Link
US (1) US7731568B2 (https=)
KR (1) KR100817233B1 (https=)
CN (1) CN1926666A (https=)
TW (2) TW200530378A (https=)
WO (1) WO2005088690A1 (https=)

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JP2007307639A (ja) * 2006-05-17 2007-11-29 Toyo Tire & Rubber Co Ltd 研磨パッド
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JP5008927B2 (ja) 2006-08-31 2012-08-22 東洋ゴム工業株式会社 研磨パッド
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US8998677B2 (en) 2012-10-29 2015-04-07 Wayne O. Duescher Bellows driven floatation-type abrading workholder
US9604339B2 (en) 2012-10-29 2017-03-28 Wayne O. Duescher Vacuum-grooved membrane wafer polishing workholder
US9011207B2 (en) 2012-10-29 2015-04-21 Wayne O. Duescher Flexible diaphragm combination floating and rigid abrading workholder
US9199354B2 (en) 2012-10-29 2015-12-01 Wayne O. Duescher Flexible diaphragm post-type floating and rigid abrading workholder
US9233452B2 (en) 2012-10-29 2016-01-12 Wayne O. Duescher Vacuum-grooved membrane abrasive polishing wafer workholder
US8998678B2 (en) 2012-10-29 2015-04-07 Wayne O. Duescher Spider arm driven flexible chamber abrading workholder
US9446497B2 (en) * 2013-03-07 2016-09-20 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Broad spectrum, endpoint detection monophase olefin copolymer window with specific composition in multilayer chemical mechanical polishing pad
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US9873180B2 (en) 2014-10-17 2018-01-23 Applied Materials, Inc. CMP pad construction with composite material properties using additive manufacturing processes
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US11745302B2 (en) 2014-10-17 2023-09-05 Applied Materials, Inc. Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process
KR20240015167A (ko) 2014-10-17 2024-02-02 어플라이드 머티어리얼스, 인코포레이티드 애디티브 제조 프로세스들을 이용한 복합 재료 특성들을 갖는 ｃｍｐ 패드 구성
JP6940495B2 (ja) 2015-10-30 2021-09-29 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 所望のゼータ電位を有する研磨用物品を形成するための装置及び方法
US10593574B2 (en) 2015-11-06 2020-03-17 Applied Materials, Inc. Techniques for combining CMP process tracking data with 3D printed CMP consumables
US10391605B2 (en) 2016-01-19 2019-08-27 Applied Materials, Inc. Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process
CN106046313A (zh) * 2016-06-03 2016-10-26 湖北鼎龙化学股份有限公司 一种化学机械抛光垫、缓冲层及其制备方法
KR101952361B1 (ko) 2017-07-04 2019-02-26 에스케이씨 주식회사 폴리우레탄 조성물 및 이로부터 얻어진 고내산성 다층 연마패드
US10926378B2 (en) 2017-07-08 2021-02-23 Wayne O. Duescher Abrasive coated disk islands using magnetic font sheet
US11471999B2 (en) 2017-07-26 2022-10-18 Applied Materials, Inc. Integrated abrasive polishing pads and manufacturing methods
WO2019032286A1 (en) 2017-08-07 2019-02-14 Applied Materials, Inc. ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME
KR102102973B1 (ko) 2017-11-14 2020-04-22 에스케이씨 주식회사 연마패드
WO2020050932A1 (en) 2018-09-04 2020-03-12 Applied Materials, Inc. Formulations for advanced polishing pads
US11691241B1 (en) * 2019-08-05 2023-07-04 Keltech Engineering, Inc. Abrasive lapping head with floating and rigid workpiece carrier
US11878389B2 (en) 2021-02-10 2024-01-23 Applied Materials, Inc. Structures formed using an additive manufacturing process for regenerating surface texture in situ
CN117086736B (zh) * 2023-10-20 2023-12-26 南通南洋照明科技有限公司 一种led灯具制造的镜面抛光装置

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Also Published As

Publication number Publication date
TWI361217B (https=) 2012-04-01
TW201217415A (en) 2012-05-01
KR100817233B1 (ko) 2008-03-27
CN1926666A (zh) 2007-03-07
TW200530378A (en) 2005-09-16
WO2005088690A1 (ja) 2005-09-22
US20070190905A1 (en) 2007-08-16
KR20060118010A (ko) 2006-11-17
US7731568B2 (en) 2010-06-08

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