TWI448710B - A test handler - Google Patents

Description

Test sorter

The present invention relates to a test sorter that supports testing of a produced semiconductor device performed prior to the semiconductor device being shipped.

The test sorter is a device that supports testing so that the test machine can test a semiconductor device manufactured by a predetermined manufacturing process and classify the semiconductor device according to the test result before loading the semiconductor device into the object tray.

1 is a conceptual view of a universal test handler 100 as viewed from above, the universal test handler 100 including a test handler in accordance with the present invention. Referring to FIG. 1, the test sorter 100 includes a test tray 110, a loading unit 120, a soaking chamber 130, a test chamber 140, a pushing device 150, a de-soaking chamber 160, and an unloading unit 170.

Referring to FIG. 2, in the test tray 110, a plurality of inserts 111 in which the semiconductor device D can be disposed are mounted to be movable to some extent, and are looped along a determined closed path C by a plurality of feeding units (not shown). .

The loading unit 120 loads the untested semiconductor device D onto the test tray 110 at the loading position LP.

The infusion chamber 130 is disposed to preheat or pre-cool the semiconductor device D loaded on the test tray 110 fed from the loading position LP according to test environmental conditions before the semiconductor device D is tested.

The test chamber 140 is configured to support testing so that the semiconductor device D placed on the insert 111 of the test tray 110 fed to the test position TP after preheating or pre-cooling in the infusion chamber 130 can be tested.

The pushing device 150 is arranged to push the test tray 110 at the test position TP toward a tester that is docked (coupled) with the test chamber 140 to electrically connect the semiconductor device D disposed on the insert 111 to the tester. The present invention relates to a pushing device 150, which will be described in more detail below.

The de-soaking chamber 160 is arranged to resume the heated or cooled semiconductor device loaded on the test tray 110 fed from the test chamber 140.

The unloading unit 170 classifies the semiconductor device loaded on the test tray 110 fed from the de-soaking chamber 160 to the unloading position UP according to the test level, and unloads the semiconductor device into the empty object tray.

As described above, the semiconductor device D is recirculated along the closed path C extending from the loading position LP through the infusion chamber 130, the test chamber 140, the de-soaking chamber 160, and the unloading position UP to the loading position LP, while the semiconductor device D is loaded in the test. On the tray 110.

The test sorter 100 with the basic loop path of the test tray is divided into two types: one is a docking test sorter below the head, and the other is a side docking test sorter, and the head below is docked. The sorter allows the loaded semiconductor device to be tested while the test tray 110 remains level, while the side docked test sorter allows the loaded semiconductor device to be tested while the test tray 110 remains vertical. Therefore, the side docking test sorter 100 needs to include one or two posture transition units for converting the posture of the level test tray that has been loaded with the semiconductor into a vertical state, or converting the posture of the vertical test tray into The level state is to unload the semiconductor device that has been tested.

Next, the pushing device 150 related to the present invention will be described in more detail.

As can be seen from the schematic side view of FIG. 3, the universal pusher 150 disposed in the conventional test handler 100 includes a mating plate 50 and a drive source 60.

The mating plate 50 includes a plurality of pushing units 51 and a mounting plate 52.

The pushing unit 51 includes a pusher 51a for supporting the semiconductor device D disposed on the insert 111 of the test tray 110, a base 51b contacting one surface of the insert 111 (facing the pusher), and a guide pin 51c Installed in the base 51b such that the end of the pusher 51a is in precise contact with the semiconductor device D disposed on the loading groove 111b of the insert 111 when the guide pin 51c is inserted into the matching hole 111a formed in the insert 111. For reference, one pushing unit 51 may include at least one pusher according to an embodiment. For example, one pushing unit 51 may include two pushers 51a as shown in FIG. 3 or only one pusher. The pusher 51a and the base 51b may be integrally formed.

A plurality of pushing units 51 are mounted in the form of a matrix in the mounting plate 52.

The drive source 60 may be a cylinder (or engine) and move the mating plate 50 securely attached to a rail (not shown) to attach the mating plate 50 to the already-moving rail (the track for testing the pallet movement) The test tray 110 moved on (not shown), then pushes the test tray toward the tester, and thereby pushes or releases the semiconductor device D placed on the insert 111 of the test tray toward the tester. Then, when the semiconductor device is pushed by the elastic force of the terminal (specifically, the high-precision positioning plate) in the opposite direction to the tester while the tester and the semiconductor device D are in contact with each other, the pusher 51a uniformly supports the pushed Semiconductor device D. In general, the matching plate 50 is configured such that when a pushing force of a terminal (for example, a spring pin) of a high-precision fixing plate is applied to the semiconductor device D, the pusher 51a or the base is pushed rearward.

For reference, the spacing between the push unit 51, the test tray 110, and the tester is exaggerated.

At the same time, the most important technical part of the test sorter is the electrical contact between the semiconductor device and the tester. Therefore, the test tray fed into the test chamber needs to be accurately fed to the desired position between the matching plate and the tester. Thus, the feed unit for feeding the test tray to the test chamber needs to be precisely controlled.

However, component wear due to continuous use of the device makes it difficult to feed the test tray to a precise position solely relying on the feeding unit. Therefore, in most cases, the test handler includes a sensor to detect the position of the test handler fed into the test chamber.

4 is a schematic, reference view illustrating a technique for detecting the position of test tray 110 by sensor 180 for detecting the position of test tray 110. (For reference, FIG. 4 shows that the detection of the correct position of the test trays on the upper and lower sides allows the test trays located on the upper and lower sides to be tested by simultaneously detecting the correct positions of the test trays located on the upper and lower sides.)

The two detecting grooves 111c-1 and 111c-2 are formed in the test tray 110 at a certain interval, and the sensor 180 includes first to fourth detecting portions 181 to 184 to identify the detecting groove 111c.

If it is assumed that the detecting sections 181 to 184 recognize the detecting grooves 111c-1 and 111c-2 formed in the test tray 110 fed into the test chamber 140 as "1", and the detecting grooves 111c-1 and 111c-2 are not The state of existence is identified as "0", and the state of FIG. 4 can be read as "1010" (read in the order from the first detecting portion of reference numeral 181 to the fourth detecting portion of reference numeral 184). If it is assumed that the test tray 110 is in the correct position in the state of FIG. 4, when the test tray 110 fed to the test chamber 140 is in the state of FIG. 4, the sensor 180 determines that the test tray 110 is fed to the correct position and then pushes Device 150 pushes semiconductor device D on test tray 110 toward the tester to electrically contact semiconductor device 110 with the tester. For reference, since all the read digits except "1010" indicate that the test tray is deviated from the correct position, an error occurs (at the same time, the number of sensors, the number of readout detection slots, the detection method, and the error of reading the numbers) The generation conditions and the like may differ depending on the use conditions, and a sensor may be used to detect the arrival of the predetermined position if necessary).

However, as described above, even if the sensor 180 is provided, the widths of the detecting grooves 111c-1 and 111c-2 need to be surely recognized by the sensor 180. Moreover, it is necessary to ensure that the widths of the detecting grooves 111c-1 and 111c-2 recognized in this manner often cause an error in the process of recognizing the position of the test tray 110. That is, when the widths of the detecting grooves 111c-1 and 111c-2 are too narrow, it is difficult to detect the detecting grooves 111c-1 and 111c-2, and even if the test tray 110 is at the correct position, the detection cannot be performed correctly, An error is generated, so the detecting grooves 111c-1 and 111c-2 need to be formed to have the minimum width necessary for the sensing of the sensor 180. Thus, even if the detection tray 110 is read by the sensor 180 to exist in a precise position, the detection tray 110 can be offset from the allowable error (in this case, the allowable error can be understood as a guide pin having a sharp end. The error inserted into the range of the guide hole).

If the test tray 110 is fed to a position offset from the allowable error in this manner, the insert 111 is damaged, and during the operation of the pushing device 150, the pusher 51a, the guide pin 51c, and the test slot provided in the tester Slot pins (used to guide matching pins between the insert and the test slot) can cause defects.

Therefore, the applicant of the present invention has already filed a Korean Patent Application No. 10-2011-0090991 (the "Pushing apparatus of Match Plate for Test Handler, Match Plate, and Test Hander" for promoting the matching plate of the sorting machine. The device, the matching plate, and the test sorter) (hereinafter referred to as "Prior Art 1") recommend a technique of mounting a roller (position moving unit) in the pushing device to correct the position of the test tray.

In addition, the applicant of the present invention has already filed a Korean Patent Application No. 10-2011-0125482 (the "Test Handler of Sensor and Method of Operating the Same") (hereinafter referred to as "Prior Art 2") It is recommended to accurately identify the position of the test tray and the technique of changing the operation method by the separated second detector.

As with the prior art 1 and 2, the present invention is a technique for correcting the position of a test tray and identifying the precise position of the test tray.

The present invention proposes another technique for automatically correcting the position of the test tray to the appropriate position with the push unit, even when the test tray is offset from the proper position in the test chamber to produce an error.

According to an aspect of the present invention, a test sorter is provided, the test sorter comprising: a test tray, looped in a predetermined loop path extending from a loading position to a loading position via a test position and an unloading position, and a semiconductor device is disposed on the test tray; a loading unit that loads the semiconductor device when the test tray is in the loading position; and an infusion chamber that is configured to preheat or pre-cool the semiconductor device that is placed on the test tray when the loading unit completes loading; a test chamber that electrically contacts a semiconductor device mounted on the insert of the test tray fed from the infusion chamber with the tester; the push device is configured to attach the semiconductor disposed on the test tray by attaching the test tray to the tester The device is in electrical contact with the tester; a de-soaking chamber for returning the semiconductor device disposed on the test tray fed from the test chamber to room temperature; and an unloading unit for feeding the test tray from the de-soaking chamber to the unloading position The semiconductor device is unloaded, wherein the test tray includes: an insert, and a semi-conductive portion is disposed on the insert The device has a guiding hole; and a frame, the insert is mounted in the frame, and the frame has at least one position correcting hole; the pushing device includes: a pushing unit that supports the semiconductor device disposed on the insert and has an insertion guiding hole a mounting plate, the push unit is mounted on the mounting plate, the mounting plate has a position correction pin inserted into the at least one position correction hole to correct the position of the test tray; and a moving source is disposed such that the mounting plate faces the test tray forward or Move backwards.

The test sorter further includes a first detector for detecting whether the test tray is accurately positioned at the test position, and a second detector for detecting whether the test tray is directed toward the tester by the operation of the push device Move forward.

The position correction pin can protrude further toward the test tray than the guide pin.

The thickness of the position correction pin may be greater than the thickness of the guide pin.

The number of position correction holes may be greater than the number of position correction pins.

Hereinafter, exemplary embodiments of the present invention will be described with reference to the drawings, in which the repeated description will be omitted or compressed for the sake of clarity.

Referring to FIG. 5, the test sorter 500 includes a test tray 510, a loading unit 520, a soaking chamber 530, a test chamber 540, a pushing device 550, a de-soaking chamber 560, an unloading unit 570, a first detector 580, and a second detector 590. .

Among the constituent elements, the loading unit 520, the infusion chamber 530, the test chamber 540, the de-soaking chamber 560, and the unloading unit 570 have been described in the background section, and their description will be omitted.

Referring to FIG. 6, the test tray 510 includes a plurality of inserts 511 and a frame 512.

The semiconductor device may be located on a plurality of inserts, and the guide holes 511a are formed in the insert as described in the related art description.

A plurality of inserts 511 are mounted and supported in a matrix on the frame 512 for slight movement, and two position correcting holes 512a and 512b are formed in the frame 512 and spaced apart from each other at a certain interval.

Referring to FIG. 7, the pushing device 550 includes a plurality of pushing units 551, a mounting plate 552, and a moving source 553.

Each of the plurality of pushing units 551 has a pusher 551a, a base 551b, and a guide pin 551c inserted into the guide hole 511a, which is the same as the related art

A plurality of pushing units 551 are mounted on the mounting board 552 in a matrix form. The mounting plate 552 has two position correction pins 552a and 552b each having a relatively sharp end and insertable into the position correction holes 512a and 512b of the test tray 510, between the two position correction pins 552a and 552b The interval is the same as the interval between the two position correction holes 512a and 512b.

For reference, the number of position correction holes and position correction pins may be one, respectively, but two or more position correction holes and position correction pins may be provided to reliably correct the position.

Meanwhile, since the position correction pins 552a and 552b should correct the position of the test tray 510 while being inserted into the position correction holes 512a and 512b and before the guide pins 551c are inserted into the guide holes 511a of the insert 511, they should also be The guide pin 551c protrudes toward the test tray 510 by a predetermined length L, with reference to the schematic side sectional view of FIG. Further, since the position correction pins 552a and 552b function to correct a large deviation of the correction range from the position of the insert 511, the thickness of the position correction pins 552a and 552b is preferably larger than the thickness of the guide pin 551c (W ₁ >W ₂ ), wherein the guide pin 551c can be corrected within the position correction range of the insert 511.

The moving source 553 is arranged to move the mounting plate forward or backward toward the test tray 510 and may include a stepper motor or a servo motor.

The first detector 580 is arranged to detect whether the test tray 510 fed to the test chamber 540 is in the proper position (precise test position).

The second detector 590 is arranged to detect whether the test tray 510 is moving forward toward the tester.

Next, the operation of the main portion of the test handler 500 having the above configuration will be described with reference to the drawings.

If the test tray 510 is fed to the test position of Figure 9A, the first detector 580 is operated to detect if the test tray 510 is in the proper position.

Then, if it is detected that the test tray 510 is in the proper position, the moving source 553 is operated to move the mounting plate 552 forward, thereby causing the semiconductor device disposed on the test tray 510 by attaching the test tray 510 to the tester Electrical contact with the tester.

However, if it is detected that the test tray 510 is not in the proper position and an error occurs, the moving source 553 is operated to first move the mounting plate 552 toward the test tray 510 as shown in FIG. 9B. Here, by the first forward movement, the ends of the position correcting pins 552a and 552b are inserted into the position correcting holes 512a and 512b, but the ends of the guide pins 551c are not inserted into the guiding holes 511a. Additionally, the second detector 590 is operative to detect whether the test tray 510 is moving forward toward the tester. Then, as shown in FIG. 9C, if the test tray 510 is deviated from the appropriate position within the error range corrected by the position correction pins 552a and 552b, the position correction holes 512a and 512b are inserted during the first forward movement of the position correction pins 552a and 552b. At the same time, the position of the test tray 510 is corrected to an appropriate position. However, as shown in FIG. 9D, if the test tray 510 is offset from the error range that can be corrected by the position correction pins 552a and 552b, the test tray 510 is tested toward orientation by the position correction pins 552a and 552b and other mechanical interference members during the first forward movement. The device moves forward, so the second detector 590 detects the movement and thereby produces an error. Of course, when the second detector 590 does not detect that the test tray 510 is moving forward during the first forward movement, the movement source 553 is again operated to move the mounting plate 552 a second time forward, thereby attaching the test tray 510 Connected to the tester, the semiconductor device disposed on the interposer 511 of the test tray 510 is in electrical contact with the tester.

Meanwhile, since the first detector 580 detects that the position of the test tray 510 is not an appropriate position and the second detector 590 does not detect the forward movement of the test tray 510 after the first forward movement, the first detector 580 There may be an error in itself, so the detection of the first detector 580 is reconfirmed and it is confirmed whether the first detector 580 is operating normally. If it is determined that the first detector 580 is not operating normally, the first detector 580 is again set. This is because when the first detector 580 is continuously used in a high temperature or low temperature environment, sensitivity errors may be temporarily caused, and foreign matter may stick to the test tray 510 to generate a sensitivity error.

Moreover, in addition to the above-described methods of operation, the above configuration can be implemented by various application methods.

For example, the detection of the first detector 580 may be performed before the first forward movement as in the above example, may be performed after the first forward movement, or may be performed before and after the first forward movement. For reference, when the detection of the first detector 580 is performed after the first forward movement, the configuration of the second detector 590 may preferably be omitted.

Furthermore, the forward movement of the mounting plate 552 can be performed separately in the first step and the second step, regardless of whether an error is caused by the detection of the first detector 580; or when the detector at the first detector 580 is not generated The forward movement of the mounting plate 552 at the time of error can be performed without classifying the first step and the second step. Of course, the detection of the second detector 590 can be selectively performed according to the corresponding situation, and as described above, the second detector 590 itself can be selectively configured.

That is, the primary configuration of test sorter 500 can implement a variety of operational methods to identify and correct the position of test tray 510.

At the same time, Korean Patent No. 10-0801927 (published on February 12, 2008 and entitled "Test Tray for Test Handler and Test Handler") As described in the related art, it is necessary to continuously test a semiconductor device disposed on one test tray in two or more steps. Then, since it is necessary to continuously move the test tray by a predetermined distance when the steps are continuously performed, the number of position correction holes formed in the test tray is preferably a predetermined multiple of the number of position correction pins of the mounting board (for example, 2 times, 3 times or 4 times). That is, it is necessary to correspond to the position correcting hole corresponding to the position correcting pin of the pushing device at the position of the test tray according to the first step, and to the position correcting pin of the pushing device at the position of the test tray according to the second step. Position correction hole (in addition, a third step, a fourth step, etc. are also required).

In the above example, a spring may be mounted between the position correcting pin and the mounting plate such that the position correcting pin is elastically supported by the mounting plate to move forward and backward. This is because when the semiconductor device is brought into contact with the tester by the pushing device, as shown in FIG. 9E, the repulsive force of the tester can be applied to the semiconductor device. Then, when the test tray is pushed by the repulsive force toward the pushing device, the test tray may be damaged when the position correcting pin that pushes the test tray is also pushed backward.

According to the present invention, the stability of the apparatus can be improved by the position correcting pin having the position correcting function, by the above-described correcting function, during the mounting of the pushing means for pushing the semiconductor device placed on the insert toward the tester, The test tray that is offset from the proper position can be moved to the appropriate position.

First, even when the error deviates from the error range allowed by the first detector, by allowing the pushing device to automatically correct the position of the test tray to an appropriate position, it is possible to reduce the error operation and increase the operating rate of the device, thereby preventing the insert from being damaged. .

Second, the cause of the error can be quickly identified and processed.

As described above, the present invention has been described in detail with reference to the embodiments and the accompanying drawings, which are merely illustrative of preferred embodiments of the invention. Therefore, the invention is not limited by the embodiments, and the scope of the invention should be construed by the claims and their equivalents.

<知知〉

100. . . Universal test sorter

110. . . Test tray

111. . . Insert

111a. . . Matching hole

111b. . . Loading groove

120. . . Loading unit

130. . . Soaking chamber

140. . . Test room

150. . . Push device

50. . . Matching board

51. . . Push unit

51a. . . Pusher

51b. . . Base

51c. . . Guide pin

52. . . Mounting plate

60. . . Drive source

160. . . De-soaking room

170. . . Unloading unit

180. . . Sensor

111c. . . Detection slot

111c-1, 111c-2. . . Detection slot

181. . . First detection unit

182. . . Second detection unit

183. . . Third detection unit

184. . . Fourth detection department

C. . . Closed path

D. . . Semiconductor device

LP. . . Loading position

TP. . . Test location

UP. . . Unloading location

<this invention>

500. . . Test sorter

510. . . Test tray

511. . . Insert

511a. . . Guide hole

512. . . frame

512a, 512b. . . Correction hole

520. . . Loading unit

530. . . Soaking chamber

540. . . Test room

550. . . Push device

551. . . Push unit

551a. . . Pusher

551b. . . Base

551c. . . Guide pin

552. . . Mounting plate

552a, 552b. . . Calibration pin

553. . . Mobile source

560. . . De-soaking room

570. . . Unloading unit

580. . . First detector

590. . . Second detector

C. . . Closed path

LP. . . Loading position

TP. . . Test location

UP. . . Unloading location

L. . . length

W ₁ , W ₂ . . . thickness

Figure 1 is a conceptual plan view of a universal test sorter;

Figure 2 is a schematic view of a test tray for a universal test sorter;

3 is a schematic view for explaining a matching relationship between a matching board, a test tray, and a tester of a universal test sorter;

Figure 4 is a reference view for explaining the identification of the position of the test tray;

Figure 5 is a conceptual view of a test handler in accordance with one embodiment of the present invention;

Figure 6 is a schematic plan view of a test tray applied to the test handler of Figure 5;

Figure 7 is a schematic perspective view of a pushing device applied to the test sorter of Figure 5;

Figure 8 is a schematic side sectional view of a main portion of the pushing device of Figure 7;

9A to 9E are operational state views of main portions of the test sorter of Fig. 5.

550. . . Push device

551. . . Push unit

551a. . . Pusher

551b. . . Base

551c. . . Guide pin

552. . . Mounting plate

552a, 552b. . . Calibration pin

553. . . Mobile source

Claims (5)

A test sorter that includes:
Testing the tray, looping in a predetermined loop path extending from the loading position to the loading position via the test position and the unloading position, and mounting the semiconductor device on the test tray;
a loading unit that loads the semiconductor device when the test tray is in the loading position;
a soaking chamber configured to preheat or pre-cool the semiconductor device placed on the test tray when the loading unit completes loading;
a test chamber that electrically contacts the semiconductor device mounted on the insert of the test tray fed from the infusion chamber with the tester;
a pushing device configured to electrically contact the semiconductor device disposed on the test tray with the tester by attaching the test tray to the tester;
De-sinking chamber for returning the semiconductor device disposed on the test tray fed from the test chamber to room temperature; and an unloading unit for feeding from the de-soaking chamber to the unloading position Unloading the semiconductor device of the test tray;
Wherein the test tray comprises:
An insert having a semiconductor device disposed thereon and having a guide hole; and a frame mounted in the frame, the frame having at least one position correction hole; and the pushing device comprising:
a pushing unit supporting the semiconductor device disposed on the insert and having a guide pin inserted into the guiding hole;
a mounting plate on which the push unit is mounted, the mounting plate having a position correction pin inserted into the at least one position correction hole to correct a position of the test tray; and a moving source configured to The mounting plate moves forward or backward toward the test tray. The test sorter of claim 1, further comprising: a first detector and a second detector, the first detector for detecting whether the test tray is accurately positioned at a test position, the second detecting The device is configured to detect whether the test tray is moved forward toward the tester by the operation of the pushing device. The test sorter of claim 1, wherein the position correction pin protrudes further toward the test tray than the guide pin. The test sorter of claim 1, wherein the position correction pin has a thickness greater than a thickness of the guide pin. The test sorter of claim 1, wherein the number of position correction holes is greater than the number of position correction pins.