TWI445121B - Vacuum processing device - Google Patents
Vacuum processing device Download PDFInfo
- Publication number
- TWI445121B TWI445121B TW100101804A TW100101804A TWI445121B TW I445121 B TWI445121 B TW I445121B TW 100101804 A TW100101804 A TW 100101804A TW 100101804 A TW100101804 A TW 100101804A TW I445121 B TWI445121 B TW I445121B
- Authority
- TW
- Taiwan
- Prior art keywords
- vacuum
- chamber
- wafer
- vacuum transfer
- transfer
- Prior art date
Links
- 238000012545 processing Methods 0.000 title claims description 325
- 238000012546 transfer Methods 0.000 claims description 397
- 235000012431 wafers Nutrition 0.000 claims description 230
- 238000002955 isolation Methods 0.000 claims description 39
- 238000004891 communication Methods 0.000 claims description 10
- 238000003860 storage Methods 0.000 claims description 5
- 230000000903 blocking effect Effects 0.000 claims description 2
- 238000007789 sealing Methods 0.000 claims 1
- 239000007789 gas Substances 0.000 description 23
- 230000032258 transport Effects 0.000 description 23
- 238000000034 method Methods 0.000 description 11
- 230000008569 process Effects 0.000 description 10
- 230000008602 contraction Effects 0.000 description 8
- 230000004044 response Effects 0.000 description 8
- 238000012423 maintenance Methods 0.000 description 6
- 238000011109 contamination Methods 0.000 description 5
- 230000005684 electric field Effects 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 239000013078 crystal Substances 0.000 description 4
- 230000006837 decompression Effects 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000005192 partition Methods 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000001771 impaired effect Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- 230000001133 acceleration Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000012790 confirmation Methods 0.000 description 1
- 238000012864 cross contamination Methods 0.000 description 1
- 230000001186 cumulative effect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 230000037361 pathway Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67184—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the presence of more than one transfer chamber
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
- F16K51/00—Other details not peculiar to particular types of valves or cut-off apparatus
- F16K51/02—Other details not peculiar to particular types of valves or cut-off apparatus specially adapted for high-vacuum installations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010291542A JP5785712B2 (ja) | 2010-12-28 | 2010-12-28 | 真空処理装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201227864A TW201227864A (en) | 2012-07-01 |
| TWI445121B true TWI445121B (zh) | 2014-07-11 |
Family
ID=46317003
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW100101804A TWI445121B (zh) | 2010-12-28 | 2011-01-18 | Vacuum processing device |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US8747046B2 (cg-RX-API-DMAC7.html) |
| JP (1) | JP5785712B2 (cg-RX-API-DMAC7.html) |
| KR (1) | KR101238768B1 (cg-RX-API-DMAC7.html) |
| CN (1) | CN102569016B (cg-RX-API-DMAC7.html) |
| TW (1) | TWI445121B (cg-RX-API-DMAC7.html) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5926694B2 (ja) * | 2011-02-08 | 2016-05-25 | 東京エレクトロン株式会社 | 基板中継装置，基板中継方法，基板処理装置 |
| JP2014036025A (ja) * | 2012-08-07 | 2014-02-24 | Hitachi High-Technologies Corp | 真空処理装置または真空処理装置の運転方法 |
| JP6059934B2 (ja) * | 2012-09-28 | 2017-01-11 | 株式会社日立ハイテクノロジーズ | 試料搬送装置のティーチング方法 |
| JP6120621B2 (ja) * | 2013-03-14 | 2017-04-26 | 株式会社日立ハイテクノロジーズ | 真空処理装置及びその運転方法 |
| JP6293499B2 (ja) * | 2014-01-27 | 2018-03-14 | 株式会社日立ハイテクノロジーズ | 真空処理装置 |
| CN106449466A (zh) * | 2015-08-11 | 2017-02-22 | 中微半导体设备(上海)有限公司 | 一种基片处理系统 |
| JP6625098B2 (ja) * | 2017-07-20 | 2019-12-25 | 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ | 基板処理システム、半導体装置の製造方法およびプログラム |
| US11769682B2 (en) | 2017-08-09 | 2023-09-26 | Asm Ip Holding B.V. | Storage apparatus for storing cassettes for substrates and processing apparatus equipped therewith |
| TWI813430B (zh) * | 2017-08-09 | 2023-08-21 | 荷蘭商Ａｓｍ智慧財產控股公司 | 用於儲存基板用之卡匣的儲存設備及備有其之處理設備 |
| JP7115879B2 (ja) | 2018-03-23 | 2022-08-09 | 株式会社日立ハイテク | 真空処理装置の運転方法 |
| US10483142B1 (en) * | 2018-09-14 | 2019-11-19 | Lam Research Corporation | Vacuum robot positioning system with reduced sensitivity to chamber pressure |
| CN110467151A (zh) * | 2019-09-04 | 2019-11-19 | 烟台睿创微纳技术股份有限公司 | 一种mems晶圆封装设备及方法 |
| CN113728422B (zh) | 2020-03-24 | 2024-01-09 | 株式会社日立高新技术 | 真空处理装置 |
| CN115910886B (zh) * | 2022-12-28 | 2024-04-16 | 深圳市纳设智能装备股份有限公司 | 传输腔、半导体设备及晶圆传输方法 |
| CN119890085B (zh) * | 2024-12-31 | 2025-11-25 | 东方晶源微电子科技(北京)股份有限公司 | 前道检测设备及其控制方法 |
Family Cites Families (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07519B2 (ja) | 1987-06-15 | 1995-01-11 | 日新電機株式会社 | 分子線エピタキシ−装置 |
| US5067218A (en) * | 1990-05-21 | 1991-11-26 | Motorola, Inc. | Vacuum wafer transport and processing system and method using a plurality of wafer transport arms |
| US5286296A (en) * | 1991-01-10 | 1994-02-15 | Sony Corporation | Multi-chamber wafer process equipment having plural, physically communicating transfer means |
| US5766360A (en) * | 1992-03-27 | 1998-06-16 | Kabushiki Kaisha Toshiba | Substrate processing apparatus and substrate processing method |
| TW295677B (cg-RX-API-DMAC7.html) * | 1994-08-19 | 1997-01-11 | Tokyo Electron Co Ltd | |
| JPH08340034A (ja) * | 1995-06-09 | 1996-12-24 | Mitsui Toatsu Chem Inc | 薄膜形成装置 |
| TW442891B (en) * | 1998-11-17 | 2001-06-23 | Tokyo Electron Ltd | Vacuum processing system |
| JP2003045947A (ja) * | 2001-07-27 | 2003-02-14 | Canon Inc | 基板処理装置及び露光装置 |
| CN1996552B (zh) * | 2001-08-31 | 2012-09-05 | 克罗辛自动化公司 | 晶片机 |
| JP4531557B2 (ja) * | 2002-05-21 | 2010-08-25 | エーエスエム アメリカ インコーポレイテッド | 半導体処理ツール内チャンバ間の相互汚染の減少 |
| US7458763B2 (en) * | 2003-11-10 | 2008-12-02 | Blueshift Technologies, Inc. | Mid-entry load lock for semiconductor handling system |
| US8029226B2 (en) * | 2003-11-10 | 2011-10-04 | Brooks Automation, Inc. | Semiconductor manufacturing systems |
| US20070282480A1 (en) * | 2003-11-10 | 2007-12-06 | Pannese Patrick D | Methods and systems for controlling a semiconductor fabrication process |
| SG132670A1 (en) | 2003-11-10 | 2007-06-28 | Blueshift Technologies Inc | Methods and systems for handling workpieces in a vacuum-based semiconductor handling system |
| CN1902031A (zh) * | 2003-11-10 | 2007-01-24 | 布卢希弗特科技公司 | 用于处理基于真空的半导体处理系统中的工件的方法和系统 |
| JP2007186757A (ja) * | 2006-01-13 | 2007-07-26 | Tokyo Electron Ltd | 真空処理装置及び真空処理方法 |
| KR100847888B1 (ko) * | 2006-12-12 | 2008-07-23 | 세메스 주식회사 | 반도체 소자 제조 장치 |
| JP2009062604A (ja) * | 2007-09-10 | 2009-03-26 | Tokyo Electron Ltd | 真空処理システムおよび基板搬送方法 |
| WO2009060539A1 (ja) * | 2007-11-09 | 2009-05-14 | Canon Anelva Corporation | インライン型ウェハ搬送装置 |
| JP5586271B2 (ja) * | 2010-03-02 | 2014-09-10 | 株式会社日立ハイテクノロジーズ | 真空処理装置及びプログラム |
| JP2012028659A (ja) * | 2010-07-27 | 2012-02-09 | Hitachi High-Technologies Corp | 真空処理装置 |
| JP2013143513A (ja) * | 2012-01-12 | 2013-07-22 | Hitachi High-Technologies Corp | 真空処理装置 |
-
2010
- 2010-12-28 JP JP2010291542A patent/JP5785712B2/ja active Active
-
2011
- 2011-01-18 TW TW100101804A patent/TWI445121B/zh active
- 2011-02-07 US US13/022,313 patent/US8747046B2/en active Active
- 2011-02-08 KR KR1020110011081A patent/KR101238768B1/ko active Active
- 2011-02-09 CN CN201110036139.8A patent/CN102569016B/zh active Active
Also Published As
| Publication number | Publication date |
|---|---|
| TW201227864A (en) | 2012-07-01 |
| CN102569016B (zh) | 2015-04-15 |
| KR101238768B1 (ko) | 2013-03-04 |
| JP2012138542A (ja) | 2012-07-19 |
| JP5785712B2 (ja) | 2015-09-30 |
| CN102569016A (zh) | 2012-07-11 |
| US20120163943A1 (en) | 2012-06-28 |
| US8747046B2 (en) | 2014-06-10 |
| KR20120075313A (ko) | 2012-07-06 |
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