TWI444784B - Light irradiation device - Google Patents
Light irradiation device Download PDFInfo
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- TWI444784B TWI444784B TW099138354A TW99138354A TWI444784B TW I444784 B TWI444784 B TW I444784B TW 099138354 A TW099138354 A TW 099138354A TW 99138354 A TW99138354 A TW 99138354A TW I444784 B TWI444784 B TW I444784B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
- H01L21/0274—Photolithographic processes
- H01L21/0275—Photolithographic processes using lasers
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
- G03F7/2004—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image characterised by the use of a particular light source, e.g. fluorescent lamps or deep UV light
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/7055—Exposure light control in all parts of the microlithographic apparatus, e.g. pulse length control or light interruption
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
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- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Liquid Crystal (AREA)
Description
本發明係關於光照射裝置，尤其是關於半導體、印刷電路基板、液晶基板等的圖案形成所使用之曝光裝置、將液晶面板等之面板貼合的貼合裝置中，經由被遮罩保持手段保持之遮罩，對被照射物照射光的光照射裝置。The present invention relates to a light irradiation device, in particular, to an exposure device used for pattern formation of a semiconductor, a printed circuit board, a liquid crystal substrate, or the like, and a bonding device for bonding a panel such as a liquid crystal panel, and is held by a mask holding means. The mask is a light irradiation device that irradiates the irradiated object with light.
於用以製造半導體、印刷電路基板、液晶基板等的曝光工程中，使用經由形成圖案的遮罩，照射包含紫外線(曝光光)的光，將遮罩圖案轉印於工件的曝光裝置。作為此種曝光裝置，使遮罩與工件接近，將遮罩圖案轉印於工件上的近接式(proximity exposure)曝光裝置。又，即使於貼合液晶面板的貼合裝置中，也進行利用近接式曝光裝置的貼合。In an exposure process for manufacturing a semiconductor, a printed circuit board, a liquid crystal substrate, or the like, an exposure apparatus that transfers a mask pattern to a workpiece by irradiating light including ultraviolet rays (exposure light) through a mask that forms a pattern is used. As such an exposure apparatus, a proximity exposure apparatus that transfers a mask pattern to a workpiece and transfers the mask pattern onto the workpiece is used. Further, even in a bonding apparatus in which a liquid crystal panel is bonded, bonding by a proximity exposure apparatus is performed.
例如，液晶面板的貼合採用以下的方法。首先，於透光性基板上，形成身為光(紫外線)硬化樹脂的密封劑之包圍，於其中滴下液晶。接著，於其上，再載置1張透光性基板，透過透光性基板，對密封劑照射包含紫外線的光。藉此，貼合兩張透光性基板。液晶被紫外線照射的話則會引起特性變化，故以對於密封部以外不照射紫外線之方式，使用將密封部以外之部份予以遮光的遮罩，經由遮光遮罩，使與遮光遮罩進行貼合之透光性基板接近，照射光(紫外線)。For example, the bonding of the liquid crystal panel employs the following method. First, a light-insulating substrate is surrounded by a sealant which is a light (ultraviolet) curing resin, and a liquid crystal is dropped therein. Next, one light-transmissive substrate is placed thereon, and the light-transmitting substrate is passed through, and the sealant is irradiated with light containing ultraviolet rays. Thereby, two translucent substrates are bonded together. When the liquid crystal is irradiated with the ultraviolet ray, the characteristic change is caused. Therefore, a mask that shields a portion other than the sealing portion from the outside of the sealing portion is used, and the opaque mask is attached to the opaque mask. The light-transmitting substrate is close to the light (ultraviolet light).
然而，近年來，液晶基板也有1邊超過2m者，年年有大型化的趨勢。用以貼合此種液晶基板的光照射係以基板整體來進行。為此，前述的遮光遮罩也因應基板而大型化。However, in recent years, there has been a tendency for the liquid crystal substrate to have a size of more than 2 m on one side. The light irradiation for bonding such a liquid crystal substrate is performed on the entire substrate. For this reason, the aforementioned light-shielding mask is also increased in size in response to the substrate.
先前，遮罩係藉由遮罩台保持其周邊部而使用。但是，遮罩大型化的話，會產生本身重量所致之彎曲，對於曝光精度有不好影響。在此，為了讓遮罩即使大型化也可保持不彎曲，例如專利文獻1記載有利用透光性的遮罩保持手段來保持遮罩整面之方法。又，於專利文獻2及專利文獻3揭示有於液晶面板的貼合裝置中，使用透光性的遮罩保持手段，整面吸附遮罩，藉此，可保持不彎曲的構造。Previously, the mask was used by holding the peripheral portion of the mask. However, if the size of the mask is increased, bending due to its own weight will occur, which has a bad influence on the exposure accuracy. Here, in order to keep the mask from being bent even if it is enlarged, for example, Patent Document 1 describes a method of holding the entire surface of the mask by a light-shielding mask holding means. Further, in Patent Document 2 and Patent Document 3, in the bonding apparatus for a liquid crystal panel, a translucent mask holding means is used, and the mask is adsorbed over the entire surface, whereby a structure that does not bend can be maintained.
藉由遮罩保持手段，保持遮罩的話，於遮罩不需要如先前般，設置用以將遮罩安裝(保持)於遮罩台的保持材。為此，可將遮罩小型化至與曝光之基板(工件)同等程度為止。尤其，於液晶面板的貼合裝置中，作為製作遮罩的基板材料而轉用液晶面板基板，可謀求降低成本。By the mask holding means, if the mask is held, it is not necessary to provide the holding material for mounting (holding) the mask to the mask table as in the prior art. For this reason, the mask can be miniaturized to the same extent as the exposed substrate (workpiece). In particular, in a bonding apparatus for a liquid crystal panel, a liquid crystal panel substrate is used as a substrate material for forming a mask, and cost can be reduced.
[專利文獻][Patent Literature]
[專利文獻1] 日本特開5-100416號公報[Patent Document 1] Japanese Patent Laid-Open No. 5-100416
[專利文獻2] 日本特開2009-237442號公報[Patent Document 2] Japanese Patent Laid-Open Publication No. 2009-237442
[專利文獻3] 日本特開2006-66585號公報[Patent Document 3] Japanese Laid-Open Patent Publication No. 2006-66585
如前述般，液晶基板年年大型化，最近例如也使用2200nm×2500nm或其以上之大小者。如此基板大型化時，因此遮罩也大型化，用以保持遮罩之透光性的遮罩保持手段也會大型化。透光性的遮罩保持手段具體來說是1張大的玻璃。對於為了將遮罩的彎曲保持為允許範圍(例如2mm以下)來說，遮罩保持手段的本身重量彎曲也必須保持在前述允許範圍(2mm)以下。所以，以前述之大小來製作遮罩保持手段時，則為厚度是約20mm，重量是300kg以上。亦即，製作遮罩保持手段的成本提高，搭載其之裝置的重量變重。又，今後也預測會有液晶基板的大型化所致之遮罩的大型化，但是，現在以上之大小的遮罩保持手段製作本身較為困難。As described above, the liquid crystal substrate has been increasing in size year by year, and recently, for example, 2200 nm × 2,500 nm or more has been used. When the size of the substrate is increased, the size of the mask is also increased, and the mask holding means for maintaining the light transmittance of the mask is also increased in size. The translucent mask holding means is specifically one large glass. In order to maintain the bending of the mask to an allowable range (for example, 2 mm or less), the weight of the mask holding means itself must be kept below the allowable range (2 mm). Therefore, when the mask holding means is manufactured in the above-mentioned size, the thickness is about 20 mm and the weight is 300 kg or more. That is, the cost of fabricating the mask holding means is increased, and the weight of the device in which it is mounted becomes heavier. In addition, in the future, it is predicted that the size of the mask due to the increase in the size of the liquid crystal substrate is increased. However, it is difficult to fabricate the mask holding means of the above size.
本發明的目的係有鑒於前述問題點，提供製作廉價且盡可能不使裝置重量變重的遮罩保持手段之同時，具備也可保持今後大型化之遮罩的遮罩保持手段的光照射裝置。In view of the above problems, an object of the present invention is to provide a light-shielding device that can provide a mask holding means that can reduce the weight of the device as much as possible while reducing the weight of the device. .
本發明係為了解決前述課題，採用以下手段。In order to solve the above problems, the present invention employs the following means.
第1手段是一種光照射裝置，係藉由透光性的遮罩保持手段，吸附保持形成圖案的遮罩，並將從光照射部射出之光，經由前述遮罩，照射被照射物的光照射裝置，其特徵為：前述遮罩保持手段，係具備：比遮罩一方的長度長，於下表面形成有用以吸附保持遮罩的真空吸附溝或真空吸附孔之透光性的棒狀構件，與從下方支持前述棒狀構件的支持框架。The first means is a light irradiation device that absorbs and holds a mask forming a pattern by a translucent mask holding means, and irradiates the light emitted from the light irradiation portion through the mask to illuminate the light of the object to be irradiated In the illuminating device, the mask holding means includes a rod-shaped member that is longer than the length of the mask and that has a light absorbing groove or a vacuum absorbing hole that absorbs and holds the mask on the lower surface. And a support frame that supports the aforementioned rod-shaped member from below.
第2手段是一種光照射裝置，其特徵為於第1手段中，前述棒狀構件，係剖面的高度比寬度長。The second means is a light irradiation device characterized in that in the first means, the height of the cross section of the rod-shaped member is longer than the width.
第3手段是一種光照射裝置，其特徵為於第1手段或第2手段中，前述棒狀構件，係藉由安裝於前述支持框架的定位構件來定位而被前述支持框架支持；前述定位構件，係不限制前述棒狀構件往上方向移動。A third aspect is a light irradiation device characterized in that, in the first means or the second means, the rod-shaped member is supported by the positioning frame by a positioning member attached to the support frame; and the positioning member is The movement of the rod-shaped member in the upward direction is not restricted.
第4手段是一種光照射裝置，其特徵為於第3手段中，前述定位構件，係以在前述支持框架上往水平方向的位置可變動之方式安裝。A fourth aspect is a light irradiation device, characterized in that in the third aspect, the positioning member is attached so as to be movable in a horizontal direction on the support frame.
依據申請項第1項所記載的發明，因為利用棒狀構件構成遮罩保持手段而保持遮罩，故遮罩保持手段被輕量化，光照射裝置的製作成本也變便宜。According to the invention of the first aspect of the invention, since the mask is held by the rod-shaped member and the mask is held, the mask holding means is lightened, and the manufacturing cost of the light irradiation apparatus is also reduced.
依據申請項第2項所記載的發明，可減少棒狀構件的本身重量所致之彎曲。According to the invention described in claim 2, the bending of the rod member itself can be reduced.
依據申請項第3項所記載的發明，棒狀構件因為上方向的移動未被限制，在使遮罩從下面側接近棒狀構件的下面並加以保持時，可抬高棒狀構件，故可使遮罩涵蓋棒狀構件的下面整體而密接，所以，棒狀構件可確實吸附保持遮罩。According to the invention of claim 3, since the movement of the rod-shaped member in the upward direction is not limited, when the mask is brought close to the lower surface of the rod-shaped member from the lower surface side and held, the rod-shaped member can be raised, so that the rod-shaped member can be raised. The mask is covered so as to cover the entire lower surface of the rod-shaped member, so that the rod-shaped member can surely adsorb and hold the mask.
依據申請項第4項所記載的發明，將棒狀構件加以定位的定位構件，因為於水平方向可改變位置，故在棒狀構件來到欲使光有效率地透過之位置時，可微調整棒狀構件的位置。According to the invention of the fourth aspect of the invention, the positioning member for positioning the rod member can be changed in the horizontal direction, so that the rod member can be finely adjusted when it comes to a position where the light is efficiently transmitted. The position of the rod member.
使用圖1～圖10來說明本發明的一實施形態。An embodiment of the present invention will be described with reference to Figs. 1 to 10 .
圖1係揭示具備關於本發明之遮罩保持手段的光照射裝置之概略構造的圖。Fig. 1 is a view showing a schematic configuration of a light irradiation device including a mask holding means according to the present invention.
如同圖所示般，於射出光的光照射部1內部，具備放射包含紫外線之光的複數棒狀的燈2，與反射從燈2放射之光的反射鏡3。遮罩保持手段4係具備於圖2中詳述之透光性的複數棒狀構件41，與支持複數棒狀構件41的支持框架44。於遮罩保持手段4的連接器43連接有配管7。於配管7，身為真空源的真空泵9與身為空氣源的壓縮空氣供給源10經由切換閥11而連接。對管路7之真空與空氣的供給係藉由切換閥11進行切換。真空係從配管7經由連接器43而被供給至形成於各棒狀構件41下側表面的真空吸附溝42，於棒狀構件41下面保持遮罩5。於遮罩5形成有進行曝光的圖案。在將遮罩5從遮罩保持手段4的棒狀構件41卸下時，藉由切換切換閥11，對配管7供給空氣來進行。As shown in the figure, inside the light-irradiating portion 1 that emits light, a plurality of rod-shaped lamps 2 that emit ultraviolet light and a mirror 3 that reflects light emitted from the lamps 2 are provided. The mask holding means 4 is provided with a plurality of light-transmissive rod-like members 41 as detailed in FIG. 2 and a support frame 44 that supports the plurality of rod-shaped members 41. A pipe 7 is connected to the connector 43 of the mask holding means 4. In the pipe 7, a vacuum pump 9 as a vacuum source and a compressed air supply source 10 as an air source are connected via a switching valve 11. The supply of vacuum and air to the line 7 is switched by the switching valve 11. The vacuum system is supplied from the pipe 7 to the vacuum suction groove 42 formed on the lower surface of each of the rod-shaped members 41 via the connector 43, and the mask 5 is held under the rod-shaped member 41. A pattern for performing exposure is formed on the mask 5. When the mask 5 is detached from the rod-shaped member 41 of the mask holding means 4, air is supplied to the piping 7 by switching the switching valve 11.
於工作台6係載置有進行作為被照射物的光照射之工件W。於工作台6的表面形成有用以保持工件W的真空吸附溝(未圖示)，從真空泵(未圖示)供給真空。於工作台6安裝有工作台移動機構8，藉由來自控制部(未圖示)的指令訊號，工作台6係往對於遮罩5接近或離開之方向(圖中上下方向)移動。工作台移動機構8係如後述般，為了將置於工作台6上之遮罩5，安裝於遮罩保持手段4，在使工作台6上升時，又，在將遮罩5與工件W的間設為隔預先設定之值，進行光照射處理時等動作。從光照射部1射出之光係經由遮罩5而照射至工作台6上的工件W，但是，也有通過透光性的棒狀構件41之後，經由遮罩5而照射工件W的成分。工件W係例如進行貼合的液晶面板，在形成於兩張玻璃基板之間的身為光(紫外線)硬化樹脂之包圍中挾持液晶。藉由將包含紫外線的光，經由遮罩5的透光部51照射至密封劑，使樹脂硬化而貼合兩張玻璃基板。於遮罩5因為在光照射時，紫外線照射至液晶的話會引起特性變化，故形成遮光部52使得密封部以外不會被照射紫外線。A workpiece W that is irradiated with light as an object to be irradiated is placed on the table 6 . A vacuum suction groove (not shown) for holding the workpiece W is formed on the surface of the table 6, and a vacuum is supplied from a vacuum pump (not shown). The table moving mechanism 8 is attached to the table 6, and the table 6 is moved in the direction in which the mask 5 approaches or leaves (up and down in the drawing) by a command signal from a control unit (not shown). The table moving mechanism 8 is attached to the mask holding means 4 in order to attach the mask 5 placed on the table 6, as will be described later, and when the table 6 is raised, the mask 5 and the workpiece W are again The operation is performed such that the light irradiation processing is performed at a predetermined value. The light emitted from the light-irradiating portion 1 is irradiated onto the workpiece W on the table 6 via the mask 5, but the component W is irradiated through the mask 5 after passing through the light-transmitting rod-shaped member 41. The workpiece W is, for example, a liquid crystal panel to be bonded, and the liquid crystal is sandwiched between the two glass substrates which are surrounded by a light (ultraviolet) curing resin. Light containing ultraviolet rays is irradiated to the sealant through the light transmitting portion 51 of the mask 5 to cure the resin and bond the two glass substrates. In the mask 5, when the ultraviolet ray is irradiated to the liquid crystal during light irradiation, the characteristic change occurs, so that the light shielding portion 52 is formed so that the ultraviolet ray is not irradiated outside the sealing portion.
圖2(a)係揭示圖1所示之遮罩保持手段4之構造的立體圖，圖2(b)係揭示從圖2(a)的A-A所視之棒狀構件41的剖面圖。Fig. 2(a) is a perspective view showing the structure of the mask holding means 4 shown in Fig. 1, and Fig. 2(b) is a cross-sectional view showing the rod member 41 as seen from A-A of Fig. 2(a).
如同圖所示，棒狀構件41係透光性之棒狀的構件，材質例如為石英，於下面形成有供給用以保持遮罩5之真空的真空吸附溝42。再者，真空吸附溝是真空吸附溝亦可。連接器43係安裝於棒狀構件41，連接真空供給路徑45與配管7。真空係從連接於連接器43之配管7，通過形成於棒狀構件41之真空供給路徑45，被供給至真空吸附溝42。As shown in the figure, the rod-shaped member 41 is a light-transmissive rod-shaped member made of, for example, quartz, and a vacuum suction groove 42 for supplying a vacuum for holding the mask 5 is formed on the lower surface. Furthermore, the vacuum adsorption groove may be a vacuum adsorption groove. The connector 43 is attached to the rod member 41, and connects the vacuum supply path 45 and the pipe 7. The vacuum is supplied from the pipe 7 connected to the connector 43 to the vacuum suction groove 42 through the vacuum supply path 45 formed in the rod member 41.
如圖2(a)所示，棒狀構件41雖然設置有複數個，但是，於所有的棒狀構件41形成有真空吸附溝42，各棒狀構件41連接配管7，供給真空。棒狀構件41係以比遮罩5之一方的長度(例如2m)長，厚度為本身重量所致之彎曲是遮罩之彎曲的允許範圍內(例如2mm以下)之方式設定。再者，使用於液晶面板之貼合的遮罩通常是長方形，前述遮罩之一方向長度大多表示遮罩之較短一方的長度(寬度方向的長度)。如圖2(b)所示，棒狀構件的剖面尺寸係例如高度為約32mm，寬度為約30mm。如此，為了減少棒狀構件41的本身重量所致之彎曲，剖面之高度方向的尺寸比寬度方向的尺寸長為佳。As shown in Fig. 2(a), although a plurality of the rod-shaped members 41 are provided, vacuum suction grooves 42 are formed in all of the rod-shaped members 41, and the rod-shaped members 41 are connected to the pipes 7 to supply a vacuum. The rod-shaped member 41 is set to be longer than one of the lengths (for example, 2 m) of the mask 5, and the thickness due to the weight of the mask is set within an allowable range of bending of the mask (for example, 2 mm or less). Further, the mask to be bonded to the liquid crystal panel is generally rectangular, and the length in one direction of the mask mostly indicates the length (length in the width direction) of the shorter one of the mask. As shown in Fig. 2(b), the cross-sectional dimension of the rod-shaped member is, for example, about 32 mm in height and about 30 mm in width. As described above, in order to reduce the bending due to the weight of the rod member 41, the dimension in the height direction of the cross section is preferably longer than the dimension in the width direction.
如圖2(a)所示，支持框架44係形成為四角框狀，從下面側支持複數棒狀構件41的兩端。棒狀構件41係基本上為載置於支持框架44上之狀態，往垂直上方向的移動並未被限制。As shown in Fig. 2(a), the support frame 44 is formed in a quadrangular frame shape, and supports both ends of the plurality of rod-shaped members 41 from the lower side. The rod member 41 is basically placed in a state of being placed on the support frame 44, and the movement in the vertical direction is not limited.
圖3係放大揭示棒狀構件41被支持於支持框架44上，藉由定位構件46定位之狀態的立體圖。3 is a perspective view showing a state in which the rod member 41 is supported on the support frame 44 by the positioning member 46.
如同圖所示，棒狀構件41的端部係嵌入至藉由支持框架44與定位構件46所形成之凹部47。凹部47的大小係因應棒狀構件41的寬度而形成。定位構件46係藉由螺絲48固定於支持框架44。棒狀構件41係藉由嵌入凹部47，水平方向的移動被限制，決定在支持框架44上之水平方向的位置。又，也可防止棒狀構件41發生位置偏離，從支持框架44落下之狀況。再者，定位構件46係如前述般，限制棒狀構件41之水平方向的移動，但是，並不限制上方向(垂直方向)的移動。As shown in the figure, the end of the rod member 41 is fitted into the recess 47 formed by the support frame 44 and the positioning member 46. The size of the recess 47 is formed in accordance with the width of the rod member 41. The positioning member 46 is fixed to the support frame 44 by screws 48. The rod-shaped member 41 is restrained in the horizontal direction by the fitting recess 47, and the position in the horizontal direction on the support frame 44 is determined. Further, it is also possible to prevent the rod member 41 from being displaced from the support frame 44 due to the positional deviation. Further, the positioning member 46 restricts the movement of the rod-shaped member 41 in the horizontal direction as described above, but does not restrict the movement in the upward direction (vertical direction).
形成進行曝光之圖案的遮罩5係被真空吸附保持於棒狀構件41的下面，遮罩5係被棒狀構件41吸附保持時，成為收容於支持框架44的四角框中之形態。如前述般，棒狀構件41的長度係因為比遮罩5之一方的長度長，故棒狀構件41橫跨遮罩5並加以保持。於圖2(a)中，揭示棒狀構件41有3條之狀況，但是，棒狀構件41的數量及間隔係以被保持之遮罩5的本身重量彎曲為允許範圍(例如2mm以下)之方式設計。實際上，遮罩5的1邊為2m以上時，棒狀構件41的數量則必須成為8條或其以上。The mask 5 forming the pattern for exposure is vacuum-sucked and held by the lower surface of the rod-shaped member 41, and when the mask 5 is sucked and held by the rod-shaped member 41, it is accommodated in the square frame of the support frame 44. As described above, since the length of the rod-shaped member 41 is longer than one of the lengths of the mask 5, the rod-shaped member 41 straddles the mask 5 and is held. In Fig. 2(a), three rod members 41 are disclosed. However, the number and spacing of the rod members 41 are curved to the allowable range (for example, 2 mm or less) by the weight of the mask 5 to be held. Way design. Actually, when one side of the mask 5 is 2 m or more, the number of the rod-shaped members 41 must be eight or more.
如前述般，棒狀構件41雖然是透光性之例如石英，但是，在棒狀構件41存在之位置與不存在之位置中，從遮罩5射出之光的量多少會變化。從遮罩5射出之光量的變化在棒狀構件41位於形成遮罩5的遮光部52之位置時並無特別的問題，但是，也有棒狀構件41位於遮罩5的透光部51上之狀況。為此，使棒狀構件41的位置，在不影響遮罩5之彎曲量的範圍內偏移。為此，如圖3所示，定位構件46的螺絲48通過之螺絲孔49為長孔。藉此，定位構件46係可多少移動於支持框架44上而固定，藉由移動定位構件46，可微調整相對於遮罩5的棒狀構件41之位置。As described above, although the rod-shaped member 41 is translucent, for example, quartz, the amount of light emitted from the mask 5 changes somewhat at a position where the rod-shaped member 41 exists and where it does not exist. The change in the amount of light emitted from the mask 5 is not particularly problematic when the rod-shaped member 41 is located at the position where the light-shielding portion 52 of the mask 5 is formed, but the rod-shaped member 41 is also located on the light-transmitting portion 51 of the mask 5. situation. For this reason, the position of the rod-shaped member 41 is shifted within a range that does not affect the amount of bending of the mask 5. To this end, as shown in FIG. 3, the screw 48 of the positioning member 46 passes through the screw hole 49 as a long hole. Thereby, the positioning member 46 can be fixed by being slightly moved on the support frame 44, and by moving the positioning member 46, the position of the rod-shaped member 41 with respect to the mask 5 can be finely adjusted.
圖4係揭示切合實施例之遮罩保持手段4(省略連接器43，配管7)與工作台6之關係的立體圖。Fig. 4 is a perspective view showing the relationship between the mask holding means 4 (the connector 43, the piping 7 omitted) of the embodiment and the table 6.
於同圖中，被遮罩保持手段4保持之遮罩係1邊為2m以上，棒狀構件41設置有8條。棒狀構件41的1條重量約6kg。即使8條總合也約為50kg，相對於先前所用之身為1張玻璃板的遮罩保持手段之重量(約300kg)，約為1/6的重量，可謀求光照射裝置整體的輕量化。又，全面吸附先前遮罩的遮罩保持手段係保持遮罩之面必須涵蓋遮罩大小的2m四方，平面高精度加工，包含材料費的話製作成本很高，但是，依據本案發明，因為遮罩保持手段4主要以棒狀構件41構成，故相較於先前易於加工，又，使用之玻璃材料也可減少許多，可使製作成本變便宜。In the same figure, the side of the mask 1 held by the mask holding means 4 is 2 m or more, and the number of the rod-shaped members 41 is 8. One bar of the rod member 41 weighs about 6 kg. Even if the total of eight pieces is about 50 kg, the weight of the mask holding means (about 300 kg) which is a single glass plate used previously is about 1/6, and the weight of the entire light irradiation device can be reduced. . Moreover, the mask holding means for fully absorbing the previous mask is to keep the surface of the mask to cover the size of the mask of 2 m square, and the plane is processed with high precision, and the material cost is high, but according to the invention, the mask is used. The holding means 4 is mainly constituted by the rod-shaped member 41, so that the glass material used can be reduced much more than the previous ease of processing, and the manufacturing cost can be made cheap.
接著，使用圖5～圖9說明於遮罩保持手段4的棒狀構件41，安裝遮罩5之工程。Next, the process of attaching the mask 5 to the rod-shaped member 41 of the mask holding means 4 will be described with reference to Figs. 5 to 9 .
首先，如圖5所示，於工作台6上放置安裝於遮罩保持手段4的遮罩5。對於遮罩保持手段4之各棒狀構件41的真空吸附溝42，供給來自真空泵9的真空。於藉由支持框架44支持之棒狀構件41，因為本身重量而產生1mm～2mm程度之允許範圍內的彎曲。First, as shown in FIG. 5, the mask 5 attached to the mask holding means 4 is placed on the table 6. The vacuum suction groove 42 of each of the rod-shaped members 41 of the mask holding means 4 is supplied with a vacuum from the vacuum pump 9. The rod-shaped member 41 supported by the support frame 44 has a bending within an allowable range of about 1 mm to 2 mm due to its own weight.
接著，如圖6所示，載置遮罩5的工作台6藉由工作台移動機構8上升。遮罩5係接觸棒狀構件41下面的一部份(因為本身重量而最彎曲之部份)。但是，在此狀態中，遮罩5係未被棒狀構件41吸附保持。Next, as shown in FIG. 6, the table 6 on which the mask 5 is placed is lifted by the table moving mechanism 8. The mask 5 is in contact with a portion of the lower portion of the rod member 41 (the portion that is most curved due to its own weight). However, in this state, the mask 5 is not adsorbed and held by the rod member 41.
接著，如圖7所示，使工作台6更上升。如前述般，棒狀構件41因為對於支持框架44並未限制上方向的移動，故棒狀構件41在載置於遮罩5上之狀態下從支持框架44離開而上升。如前述般，棒狀構件41係即使8條總合也僅50kg。為此，藉由工作台移動機構8，在載置棒狀構件41之狀態下，可使工作台6易於上升。棒狀構件41係因為藉由載置於工作台6之遮罩5支撐，故並無本身重量所致之彎曲。所以，形成棒狀構件41之真空吸附溝42的下面係接觸遮罩5整面。藉此，遮罩5係藉由棒狀構件41真空吸附保持。圖8係放大揭示此時之棒狀構件41一邊藉由定位構件46被定位於水平方向，一邊從支持框架44離開(上升)之狀態的立體圖。Next, as shown in FIG. 7, the table 6 is further raised. As described above, since the rod-shaped member 41 does not restrict the movement in the upward direction with respect to the support frame 44, the rod-shaped member 41 is lifted from the support frame 44 while being placed on the mask 5. As described above, the rod-shaped member 41 is only 50 kg even if eight pieces are combined. Therefore, the table moving mechanism 8 can easily raise the table 6 in a state where the rod-shaped member 41 is placed. Since the rod member 41 is supported by the mask 5 placed on the table 6, there is no bending due to its own weight. Therefore, the lower surface of the vacuum suction groove 42 forming the rod-shaped member 41 contacts the entire surface of the mask 5. Thereby, the mask 5 is held by vacuum suction by the rod member 41. FIG. 8 is a perspective view showing a state in which the rod-shaped member 41 at this time is separated from the support frame 44 by the positioning member 46 while being positioned in the horizontal direction.
接著，如圖9所示，工作台6會下降。藉此，棒狀構件41係可在吸附保持遮罩5之狀態下，載置於支持框架44上。Next, as shown in FIG. 9, the table 6 is lowered. Thereby, the rod-shaped member 41 can be placed on the support frame 44 in a state in which the mask 5 is adsorbed and held.
在此，使用圖10說明棒狀構件41對於支持框架44，不限制上方向的移動之理由。Here, the reason why the rod-shaped member 41 does not restrict the movement in the upward direction with respect to the support frame 44 will be described using FIG.
如圖10(a)所示，棒狀構件41藉由固定構件X，對於支持框架44限制上方向的移動的話，在使棒狀構件41吸附遮罩5時，棒狀構件41會有破損之狀況。亦即，如圖5所示，支持框架44上的棒狀構件41因為本身重量，雖然只有微量，但是有彎曲。為了吸附遮罩5，使遮罩5在載置於工作台6之狀態下上升時，遮罩5會接觸棒狀構件41下面的一部份(因為本身重量而最彎曲之部份)。但是，在此狀態中，如圖6所示，遮罩5係未被棒狀構件41吸附保持。在此，進而使工作台6上升時，如圖10(b)所示，棒狀構件41被工作台6推頂而沿著工作台6上的遮罩5之平面，彎曲會消失。但是此時，對於藉由棒狀構件41的固定構件X按壓之部份會被施加較強的應力。如前述般，棒狀構件41係例如為石英，部份性地被施加較強應力時，依據狀況會產生缺口或斷裂等之破損。對於為了防止此狀況來說，如圖10(c)所示，可考慮在遮罩5與工作台6之間，放置如緩衝墊之彈性構件Y，配合棒狀構件41的彎曲，也使遮罩5彎曲。但是，如本發明，棒狀構件41對於支持框架44不限制往上方向(垂直方向)移動的話，並不需要擔心棒狀構件41之破損，又，也不必要在遮罩5與工作台6之間配置彈性構件Y，就可使遮罩保持手段4的棒狀構件41吸附保持遮罩5。As shown in Fig. 10 (a), when the rod member 41 restricts the upward movement of the support frame 44 by the fixing member X, when the rod member 41 adsorbs the mask 5, the rod member 41 may be damaged. situation. That is, as shown in Fig. 5, the rod-like member 41 on the support frame 44 has a small amount but is curved because of its own weight. In order to adsorb the mask 5, when the mask 5 is raised in the state of being placed on the table 6, the mask 5 contacts a portion of the lower portion of the rod member 41 (the most curved portion due to its own weight). However, in this state, as shown in FIG. 6, the mask 5 is not adsorbed and held by the rod-shaped member 41. Here, when the table 6 is further raised, as shown in FIG. 10(b), the rod-shaped member 41 is pushed up by the table 6 and is bent along the plane of the mask 5 on the table 6, and the curve disappears. However, at this time, a strong stress is applied to the portion pressed by the fixing member X of the rod member 41. As described above, the rod-shaped member 41 is, for example, quartz, and when a strong stress is partially applied, damage such as a notch or breakage may occur depending on the situation. In order to prevent this, as shown in FIG. 10(c), it is conceivable to place an elastic member Y such as a cushion between the mask 5 and the table 6, and to fit the bending of the rod member 41, and also to cover The cover 5 is curved. However, according to the present invention, when the rod-shaped member 41 does not restrict the upward direction (vertical direction) from the support frame 44, there is no need to worry about the breakage of the rod-shaped member 41, and it is not necessary to cover the mask 5 and the table 6 at the same time. When the elastic member Y is disposed between them, the rod member 41 of the mask holding means 4 can be sucked and held by the mask 5.
1．．．光照射部1. . . Light irradiation department
2．．．棒狀的燈2. . . Rod light
3．．．反射鏡3. . . Reflector
4．．．遮罩保持手段4. . . Mask retention means
41．．．棒狀構件41. . . Rod member
42．．．真空吸附溝42. . . Vacuum adsorption ditch
43．．．連接器43. . . Connector
44．．．支持框架44. . . Support framework
45．．．真空供給路徑45. . . Vacuum supply path
46．．．定位構件46. . . Positioning member
47．．．凹部47. . . Concave
48．．．螺絲48. . . Screw
49．．．螺絲孔49. . . screw hole
5．．．遮罩5. . . Mask
51．．．透光部51. . . Translucent part
52．．．遮光部52. . . Shading
6．．．工作台6. . . Workbench
7．．．配管7. . . Piping
8．．．工作台移動機構8. . . Workbench moving mechanism
9．．．真空泵9. . . Vacuum pump
10．．．壓縮空氣供給源10. . . Compressed air supply
11．．．切換閥11. . . Switching valve
W．．．工件W. . . Workpiece
X．．．固定構件X. . . Fixed member
Y．．．彈性構件Y. . . Elastic member
[圖1]揭示具備關於本發明之遮罩保持手段的光照射裝置之概略構造的圖。Fig. 1 is a view showing a schematic configuration of a light irradiation device including a mask holding means according to the present invention.
[圖2]揭示圖1所示之遮罩保持手段之構造的立體圖及棒狀構件的剖面圖。Fig. 2 is a perspective view showing a structure of a mask holding means shown in Fig. 1 and a cross-sectional view of a rod-shaped member.
[圖3]放大揭示棒狀構件被支持於支持框架上，藉由定位構件定位之狀態的立體圖。[Fig. 3] A perspective view showing a state in which a rod-like member is supported on a support frame by positioning of a positioning member.
[圖4]揭示切合實施例之遮罩保持手段(省略連接器，配管)與工作台之關係的立體圖。Fig. 4 is a perspective view showing a relationship between a mask holding means (a connector, a pipe) and a table according to an embodiment.
[圖5]揭示於遮罩保持手段的棒狀構件，安裝遮罩之工程的圖。Fig. 5 is a view showing a process of attaching a mask to a rod-shaped member of a mask holding means.
[圖6]揭示於遮罩保持手段的棒狀構件，安裝遮罩之工程的圖。Fig. 6 is a view showing a process of attaching a mask to a rod-shaped member of a mask holding means.
[圖7]揭示於遮罩保持手段的棒狀構件，安裝遮罩之工程的圖。Fig. 7 is a view showing a process of attaching a mask to a rod-shaped member of a mask holding means.
[圖8]放大揭示棒狀構件離開支持框架，藉由定位構件定位之狀態的立體圖。[Fig. 8] A perspective view showing a state in which the rod-shaped member is separated from the support frame by the positioning member.
[圖9]揭示於遮罩保持手段的棒狀構件，安裝遮罩之工程的圖。Fig. 9 is a view showing a process of attaching a mask to a rod-shaped member of a mask holding means.
[圖10]說明棒狀構件對於支持框架，不限制上方向的移動之理由的圖。Fig. 10 is a view for explaining the reason why the rod-shaped member does not restrict the movement in the upward direction with respect to the support frame.
1．．．光照射部1. . . Light irradiation department
2．．．棒狀的燈2. . . Rod light
3．．．反射鏡3. . . Reflector
4．．．遮罩保持手段4. . . Mask retention means
41．．．棒狀構件41. . . Rod member
42．．．真空吸附溝42. . . Vacuum adsorption ditch
43．．．連接器43. . . Connector
44．．．支持框架44. . . Support framework
45．．．真空供給路徑45. . . Vacuum supply path
5．．．遮罩5. . . Mask
51．．．透光部51. . . Translucent part
52．．．遮光部52. . . Shading
6．．．工作台6. . . Workbench
7．．．配管7. . . Piping
8．．．工作台移動機構8. . . Workbench moving mechanism
9．．．真空泵9. . . Vacuum pump
10．．．壓縮空氣供給源10. . . Compressed air supply
11．．．切換閥11. . . Switching valve
W．．．工件W. . . Workpiece
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| JP2010015218A JP5472616B2 (en) | 2010-01-27 | 2010-01-27 | Light irradiation device |
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| TWI444784B true TWI444784B (en) | 2014-07-11 |
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| KR (1) | KR20110088362A (en) |
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| TW (1) | TWI444784B (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6663252B2 (en) * | 2016-03-01 | 2020-03-11 | 株式会社アドテックエンジニアリング | Exposure equipment for printed circuit boards |
| DE102016107001A1 (en) | 2016-04-15 | 2017-10-19 | Ist Metz Gmbh | Apparatus for exposing a substrate |
| JP6622661B2 (en) * | 2016-06-29 | 2019-12-18 | 東京応化工業株式会社 | Support body separating apparatus and support body separating method |
| JP6986317B2 (en) * | 2017-12-05 | 2021-12-22 | 株式会社アドテックエンジニアリング | Mask unit and exposure equipment |
| JP7383341B2 (en) * | 2019-11-27 | 2023-11-20 | 株式会社オーク製作所 | Direct exposure equipment and substrate exposure method |
| KR102394825B1 (en) * | 2020-04-23 | 2022-05-06 | 주식회사 프로텍 | Flip Chip Bonding Apparatus Using VCSEL Device |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4039174B2 (en) * | 2002-08-12 | 2008-01-30 | ウシオ電機株式会社 | Display panel bonding device |
| JP4572626B2 (en) * | 2004-08-26 | 2010-11-04 | ウシオ電機株式会社 | Light irradiation device |
| JP4400628B2 (en) * | 2007-02-01 | 2010-01-20 | ウシオ電機株式会社 | Bonding method of LCD panel |
| JP4949172B2 (en) * | 2007-08-30 | 2012-06-06 | 株式会社アルバック | Light irradiation device |
| JP5200622B2 (en) * | 2008-03-28 | 2013-06-05 | ウシオ電機株式会社 | Method for removing mask in light irradiation device |
| JP5112151B2 (en) * | 2008-04-08 | 2013-01-09 | 株式会社アルバック | Light irradiation device |
-
2010
- 2010-01-27 JP JP2010015218A patent/JP5472616B2/en active Active
- 2010-11-08 TW TW099138354A patent/TWI444784B/en active
- 2010-12-10 KR KR1020100126276A patent/KR20110088362A/en not_active Application Discontinuation
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2011
- 2011-01-26 CN CN201110027654.XA patent/CN102135732B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN102135732A (en) | 2011-07-27 |
| JP2011155108A (en) | 2011-08-11 |
| KR20110088362A (en) | 2011-08-03 |
| TW201126276A (en) | 2011-08-01 |
| JP5472616B2 (en) | 2014-04-16 |
| CN102135732B (en) | 2014-08-06 |
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